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This presentation will present a simple EM physics and geometry based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed can be used to reduce power supply noise and improve EMC. New research presented on the impact of discrete components on radiated and conducted emissions, with an emphasis on cost analysis. Results of recent research on various power supply PCB topology will be discussed.

This one hour session will introduce the architecture, block diagrams and products of NXP’s electric vehicles (EV) and hybrid electric vehicles (HEV) portfolio for electric drive trains. Areas of focus include battery management, microprocessors for drive control, system basis chips, IGBT and MOSFET gate drivers and power modules for high voltage and 48V inverters. A leader in functional safety, NXP’s safety case for EV and HEV will be discussed. How we enable the customer design through evaluation boards, software and reference designs will be reviewed.

As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

Automotive Ethernet PHYs enable future driving scenarios by providing the necessary physical throughput power. While software brings added value for security, diagnosis, energy efficiency and safety. As the functional requirements for automotive PHY drivers differ from general purpose applications, additional functionality is needed to closely monitor and diagnose the device and to create advanced use cases like Layer-1 wake-up and sleep. In this session, these specific requirements for automotive Ethernet PHY SW are discussed. Existing PHY SW frameworks such as Linux or AUTOSAR are introduced. Finally, the session will touch upon typical application scenarios which require interaction with PHY SW.

The automotive industry is rapidly evolving and the car is being transformed from a simple mode of transport to a personalized mobile information hub. All these new electronic functions bring great benefits to the driver, increasing comfort, convenience, safety and efficiency. But these features come with new risks, too. Modern vehicles feature wireless interfaces connect the in-vehicle systems of these ‘Connected Cars’ to external networks, which form entry points for hackers. This session will describe how a defense-in-depth security model can be supported through the full vehicle life cycle of design, build, use and scrap. Required elements include risk assessment, security by design, threat detection, incident response, and establishing a security culture.

NXP has prepared a DroneCode.org compatible Vehicle management unit (VMU) running PX4Pro. The NXPhlite VMU is compatible with the full stack from Dronecode, including internal and external comms, planning and groundstation control. This can be used as the basis to coordinate with a higher level companion system running LINUX and ROS, or as a standalone vehicle such as a semi-autonomous Drone, Rover, boat or even a lawnmower. NXPhlite features multiple interfaces and includes 100BaseT1 2-wire Ethernet and dual CAN interfaces.

As the US Government prepares to mandate Car-to-Car communication in the US, the car industry is gearing up to provide cars which support this Dedicated Short Range Communications technology. We look at what benefits this will bring to road users, how the ITS-G5 standard is being deployed around the globe, and the challenges faced by the car industry in bringing this to market, and NXP’s leadership role in this deployment.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

Learn how to move from physical to virtual network functions (VNFs) on ARM QorIQ platforms using KVM virtual machines and Docker containers with native DPAA2 and virtual virtio devices. Leverage packet processing, crypto acceleration and advanced offloads from DPDK/ODP and Linux native guest applications. Connect VNFs through virtual switching either using optimized user space implementations or offloading datapath into DPAA2 Advanced IO Processor. Make use of the switching functions provided by DPAA2 integrated Edge Virtual Bridge and L2 Switch. Leverage OPNFV integration and take advantage of distributed VNFs via Service Function Chaining.

This presentation provides an overview of the new toolchain to support the S32 platform of MCUs and application processors, this includes an IDE with new project generation, extensive collateral for ease of use and getting started as well as the next-generation Debugger tools, a new Flash tool specifically design for the S32 platform, the S32 configuration tool plus numerous software products integarted into the toolchain for ease of customer use.

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