AMF-AUT-T2366 - Advanced Standard Products Packaging for the Automotive Market

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As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.