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This presentation will present a simple EM physics and geometry based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed can be used to reduce power supply noise and improve EMC. New research presented on the impact of discrete components on radiated and conducted emissions, with an emphasis on cost analysis. Results of recent research on various power supply PCB topology will be discussed.

The automotive industry is rapidly evolving and the car is being transformed from a simple mode of transport to a personalized mobile information hub. All these new electronic functions bring great benefits to the driver, increasing comfort, convenience, safety and efficiency. But these features come with new risks, too. Modern vehicles feature wireless interfaces connect the in-vehicle systems of these ‘Connected Cars’ to external networks, which form entry points for hackers. This session will describe how a defense-in-depth security model can be supported through the full vehicle life cycle of design, build, use and scrap. Required elements include risk assessment, security by design, threat detection, incident response, and establishing a security culture.

This one hour session will introduce the architecture, block diagrams and products of NXP’s electric vehicles (EV) and hybrid electric vehicles (HEV) portfolio for electric drive trains. Areas of focus include battery management, microprocessors for drive control, system basis chips, IGBT and MOSFET gate drivers and power modules for high voltage and 48V inverters. A leader in functional safety, NXP’s safety case for EV and HEV will be discussed. How we enable the customer design through evaluation boards, software and reference designs will be reviewed.

Automotive Ethernet PHYs enable future driving scenarios by providing the necessary physical throughput power. While software brings added value for security, diagnosis, energy efficiency and safety. As the functional requirements for automotive PHY drivers differ from general purpose applications, additional functionality is needed to closely monitor and diagnose the device and to create advanced use cases like Layer-1 wake-up and sleep. In this session, these specific requirements for automotive Ethernet PHY SW are discussed. Existing PHY SW frameworks such as Linux or AUTOSAR are introduced. Finally, the session will touch upon typical application scenarios which require interaction with PHY SW.

A key challenge to the deployment of Edge compute IoT is management and security of 1000s to millions of Edge compute nodes. EdgeScale simplifies this by providing a cloud-based management framework leveraging the hardware security features of Layerscape processors. Learn how you can use EdgeScale to manage a heterogenious set of Edge compute nodes, and use it with your choice of Edge compute framework - AWS Greengrass, Azure IoT Edge and others.

As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

NXP has prepared a DroneCode.org compatible Vehicle management unit (VMU) running PX4Pro. The NXPhlite VMU is compatible with the full stack from Dronecode, including internal and external comms, planning and groundstation control. This can be used as the basis to coordinate with a higher level companion system running LINUX and ROS, or as a standalone vehicle such as a semi-autonomous Drone, Rover, boat or even a lawnmower. NXPhlite features multiple interfaces and includes 100BaseT1 2-wire Ethernet and dual CAN interfaces.

コネクト - トレーニング教材

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