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ARM® mbed™ OS is an open source embedded operating system designed specifically for simplifying the development of scalable Internet of Things (IoT) devices. It includes all of the features you need to develop a connected-product based on ARM Cortex®-M microcontrollers such as Kinetis and LPC MCUs. In this hands on workshop you will get familiar with the features of mbed OS and learn how to develop and debug mbed OS applications with a traditional IDE.

As connected edge devices gain momentum with consumers, the security approaches and assumptions of the past will fail and create new threats and vulnerabilities to consumer safety and privacy. Additionally, the cost for security in mobile phones, tablets, and PCs will present a challenge for applications such as occupant sensors and heart rate monitoring patches. Lastly, the teams of security experts in connected industries do not yet exist at suppliers who are connecting products to the network. Join this session to learn how industries are providing cost effective, highly secure, certified hardware that can hasten the learning cycle for emerging edge node applications, bring solutions for security, drive down costs, and limit the supplier specific required expertise.

Starting with the description of the differences between the many BLE standards, this presentation will provide a clear understanding of the NXP BLE roadmap from the MICR team. It will detail the HW and SW solutions that are in production today vs. the ones that are going to hit the market in the coming quarters. The presenter will also deliver the latest information regarding the validation of the KW35/36A program that specifically targets automotive and industrial applications. Indication of the future direction for wireless connectivity will close the presentation, providing a synergistic perspective with the AUTO developments.

NXP’s latest i.MX 8M processors require the latest memories to keep them running efficiently. As a system designer, your memory choices can impact the performance, size, cost, power reliability and longevity of your end product. We will discuss the latest memories supported on the new i.MX 8M processor family. This includes DDR3, DDR4 and LPDDR4. We will show designers how they can prioritize performance, power or price to develop the most optimum system. We will also provide details on eMMC 5.1 storage products. This includes high performance features including command queueing, and several new Cache operations. We will also highlight a new MCP that includes LPDDR4 and eMMC in a single space saving package. This session will provide designers with the tools necessary to create state-of-the-art i.MX 8M systems.

The session will introduce an upcoming xEV traction motor power inverter platform system-play solution featuring a new MCU, new IGBT gate driver, and new safe SBC bound together with system enablement software and ASIL-D compliant safety support. A fully functional traction motor reference design being designed by partner Vepco will also be introduced based on a Power IGBT Module from Fuji Electric. The session will describe the platform’s components, software structure, value proposition, enablement support and go-to-market approach to help enhance understanding of the application and NXP solution as well as how to sell the system platform.

Security is critical to the growing market for IoT-enabled devices: There were already more than 5 billion connected devices in the world last year, and use is expected to grow to 12 billion by 2020. To support this rapid expansion, prominent internet players, including Alibaba, AWS, Google, IBM and Microsoft are establishing their own cloud services and industrial suppliers are moving quickly to broaden their private cloud offerings. At NXP, we believe strong security doesn't have to be hard to work with. Our "Plug & Trust" approach simplifies the implementation of strong security mechanisms in today's IoT devices. NXP's latest A71CH provides just this level of Plug & Trust IoT Security and delivers proven, chip-to-cloud security right out of the box, enabling every customer to secure IoT devices and safely connect to IoT clouds and services without writing security codes or exposing keys.

NXP offers a wide range of powerful microprocessors for the automotive and industrial markets. The memory selection of these systems can impact the performance, size, cost, power, reliability and longevity of your design. During this session we will discuss the new memories supported on the latest i.MX 8 Quad Max processor which is focused on automotive and industrial markets. For DRAM, this will include LPDDR4. For non-volatile memory, this will include Micron’s recently announced XccelaTM Octal SPI-NOR Flash and our newer e.MMC devices. These devices provide higher performance and are offered with automotive temperature and quality ratings. This session will provide designers with the information necessary to develop i.MX 8 systems for state-of-the-art automotive solutions.

Fixed Wireless Access (FWA) emerged as an attractive option for high-speed broadband connectivity in urban/suburban areas as a solution to the ‘last mile problem’. 60 GHz wireless mesh systems are generating commercial interest due to the attractive cost and deployment logistics of unlicensed, high-bandwidth spectrum relative to optical fiber networks. NXP’s Layerscape products are designed into FWA systems conceived to exploit the many opportunities of wireless mesh networks. Learn how NXP's 64-bit Arm® platforms drive the next generation of FWA success.

What is USB Type-C and USB-Power Delivery? Why consumer electronics and mobile computing products is adopting this new Type-C connector? What are the advantages and disadvantages using this connector? What is the future for USB Type-C and PowerDelivery. In this section, NXP (SIP) will give a high level introduction on this new technology and the ecosystem. This section is market and ecosystem driven discussion, not technically intense discussion.

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