Connects - Training Material

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Starting with the description of the differences between the many BLE standards, this presentation will provide a clear understanding of the NXP BLE roadmap from the MICR team. It will detail the HW and SW solutions that are in production today vs. the ones that are going to hit the market in the coming quarters. The presenter will also deliver the latest information regarding the validation of the KW35/36A program that specifically targets automotive and industrial applications. Indication of the future direction for wireless connectivity will close the presentation, providing a synergistic perspective with the AUTO developments.

As IC geometries continue to shrink and switching speeds increase, designing electromagnetic systems and printed circuit boards to meet the required signal integrity and EMC specifications has become even more challenging. A new design methodology is required. Specifically, the utilization of an electromagnetic physics-based design methodology to control the field energy in your design will be discussed. This training module will walk through the development process and provide you with guidelines for building successful, cost effective printed circuit boards.

This class will introduce/update on Android Things, the new version of Android designed for the IoT market. The when, what and how of Android Things will be explained and how NXP has worked with Google to enable certified boards based on NXP silicon and why IoT product developers should consider using Android Things for their next IoT project. Finally the relationship between Android Things, Google Voice Assistant and Chromecast built in will be explained and what NXP parts are most appropriate for optimal performance.

Secure designs begin with a security model consisting of policies, an understanding of the threat landscape and the methods used to enforce physical and logical security. This session introduces the basic concepts of security, the security threats faced by users, the security features of i.MX/MCU products, and how to use the security features to achieve secure boot, code protection, data protection, secure communication and so on.

This course will provide an in-depth system analysis of High Voltage (HV) Electric We review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using system block diagrams and oscilloscope screen shots of NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design considerations, layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring and advanced features achieve system ASIL level D and ISO26262 certification.

Fixed Wireless Access (FWA) emerged as an attractive option for high-speed broadband connectivity in urban/suburban areas as a solution to the ‘last mile problem’. 60 GHz wireless mesh systems are generating commercial interest due to the attractive cost and deployment logistics of unlicensed, high-bandwidth spectrum relative to optical fiber networks. NXP’s Layerscape products are designed into FWA systems conceived to exploit the many opportunities of wireless mesh networks. Learn how NXP's 64-bit Arm® platforms drive the next generation of FWA success.

This session will go into the detail of the software enablement around the BlueBox v2.0, aka “Blue Box Min”. From an engineering perspective, topics will include: The SoCs in the platform and it’s layout; Booting the individual SoCs; Linux options between and inter-communication between them; Discussion of middleware options (including ROS versions, Polysync and others); How ADAS vision perception is accomplished with Neusoft ADAS perception; Combined to achieve level 2/3 ADAS with AutonomouStuff; Extra topics: OpenCV, OpenSSL security between subsystems and more. Please expect a non-marketing lecture explaining the internals of this enablement.

Automotive Ethernet PHYs enable future driving scenarios by providing the necessary physical throughput power. While software brings added value for security, diagnosis, energy efficiency and safety. As the functional requirements for automotive PHY drivers differ from general purpose applications, additional functionality is needed to closely monitor and diagnose the device and to create advanced use cases like Layer-1 wake-up and sleep. In this session, these specific requirements for automotive Ethernet PHY SW are discussed. Existing PHY SW frameworks such as Linux or AUTOSAR are introduced and compared. Finally, the session will touch upon typical application scenarios which require interaction with PHY SW. This includes use cases like gPTP time synchronization and 802.1X Port-based Network Access Control (PNAC).

You innovate to make the vehicle autonomous & the most complex node in the Internet of Things. Increasingly functionality from consumer components is needed in your solutions. NXP, the leader in Automotive and high-end compute in Networking, highlights 66 critical differences that may generically exist between automotive and consumer components. Identified by a ZVEI industry workgroup (German Association of Electronics Industry) they impact reliability, quality and lifetime of vehicles. Examples demonstrate how NXP’s capabilities across all product segments and performance ranges reduce your hidden risks providing an excellent starting point towards your autonomous vehicle.

In designing cooking appliances, there is ample consideration given to power required from a home's wired electrical system as well as the performance needed to maintain safety and operating temperatures. NXP's solid state RF cooking team has developed a portable food heating appliance using solid state RF energy which is capable of operating on battery power. This session will cover the key challenges and approaches to delivering energy to heat food in a portable, on-the-go appliance.

What is USB Type-C and USB-Power Delivery? Why consumer electronics and mobile computing products is adopting this new Type-C connector? What are the advantages and disadvantages using this connector? What is the future for USB Type-C and PowerDelivery. In this section, NXP (SIP) will give a high level introduction on this new technology and the ecosystem. This section is market and ecosystem driven discussion, not technically intense discussion.

This class provides an introduction on the S32 Design Studio for Vision IDE with integrated Vision SDK in the development of vision processing applications for the S32V234 automotive vision processor. The lecture will overview the user interfaces of the S32DS IDE and the ISP and APEX2 Visual Graph Tools. The demonstration will cover the S32 Design Studio for Vision project development workflow including usage of the ISP and APEX2 Visual Graph Tools.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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