Connects - Training Material

Discussions

You innovate to make the vehicle autonomous & the most complex node in the Internet of Things. Increasingly functionality from consumer components is needed in your solutions. NXP, the leader in Automotive and high-end compute in Networking, highlights 66 critical differences that may generically exist between automotive and consumer components. Identified by a ZVEI industry workgroup (German Association of Electronics Industry) they impact reliability, quality and lifetime of vehicles. Examples demonstrate how NXP’s capabilities across all product segments and performance ranges reduce your hidden risks providing an excellent starting point towards your autonomous vehicle.

This session will address how S12 MagniV mixed-signal MCUs can help customers design more compact and cost-effective electronic control units. The S12 MagniV devices are built on proven S12 technology, enabling software and tool compatibility across the entire portfolio. With the right blend of digital programmability and high-precision analog, plus a portfolio of scalable memory options, the S12 MagniV portfolio streamlines automotive design.

Every Linux distribution provides features useful in product development - each SoC provides features necessary to a product's success. If you can't take advantage of the distribution of your choice or the SoC of your choice - product development is hampered or stopped altogether. NXP provides technology easing the adoption of SoC specific components into the distribution of your choice. Learn more about this technology, and practical tips and tricks on how to build and use selected components from LSDK at the component isolated level. Topics include building and deploying PPA and boot loaders, building and booting the Linux kernel, and building and deploying select user space components. Emphasis is on native building because it's easier. This will be a two hour session to leave time for Q&A.

Wireless (802.11) deployments are slated to overtake Ethernet switching revenue by the later part of the decade. Along with that volume, the new 802.11ax standard will deliver a 300% increase in useable performance along with higher density access for schools, airports, stadiums etc. Another driver is the demand for high bandwidth wireless within the home. Come learn about NXP's new Layerscape LA1575 and other innovative, integrated, programmable solutions available to address these increasing demands for wireless performance.

The NFC market is exploding - ABI Research forecasts more than 2 billion NFC-enabled devices to shipped yearly by 2019. While the first product generations focused on standards and reading distance, the newest products also allow for fast design-in and certification thanks to features such as Dynamic Power Control, microcontroller integration or energy harvesting. Today we see three full NFC product categories to adress the growing number of use cases: (1) Connected NFC tag solutions with field-detection function and an NFC Forum-compliant RF or an I²C interface, (2) standalone NFC frontend solutions for the most flexible way to add NFC to a system and (3) NFC controller solutions to enable higher integration by combining an NFC frontend with an advanced 32-bit microcontroller, available with integrated firmware.

The continued growth of processing capabilities and new features introduced with the ARM®v8 based System-on-Chip has made virtualization a realistic option for embedded system developers. With virtualization, system architects can design solutions that reduce the size, weight, power, and cost of legacy systems by consolidating disparate software functions onto a single chip, even if those different software functions require different operating systems or otherwise incompatible software stacks. Virtualization allows architects to partition and isolate software components with different safety, security, or licensing requirements. The virtual machine manager, or hypervisor, is the key piece of software technology enabling virtualization. Open source hypervisor, Xen, supports the ARMv8 processor family.

Wi-Fi 6 is the latest standard in WLAN technology also known as 802.11ax. This enables almost four times faster speed over the previous technology 802.11ac. NXP has been developing front end IC to support this upcoming technology and have won the reference design with a leading SoC vendor. In this course, participants will learn the key features of Wi-Fi 6 and how NXP FEIC will solve those challenges to deliver a cutting edge solution.

The vehicle becomes the most complex node in the Internet of Things and driver assistance functions will ultimately merge in the autonomous vehicle. On the way more and more consumer components make it into vehicles and the need for unprecedented compute performance is redefining “high-end” in cars. NXP is a leader in Automotive since decades and the leader in highest-end compute Networking solutions. This session will highlight 66 critical differences that may generically exist between automotive and consumer components as identified by a ZVEI industry workgroup (German Association of Electronics Industry) e.g. impacting reliability, quality and lifetime of vehicles. We will demonstrate how NXP’s capabilities across all product segments and performance ranges might address many of your hidden risks providing an excellent starting point towards your autonomous vehicle.

This session will first provide an overview of the products, software and enablement that NXP's wireless connectivity MCU portfolio includes to address the IoT market. Then, it will provide a deeper dive and demo on the Thread™ networking technology and how to develop an application using NXP's Thread Stack and ZigBee® Dotdot application layer. This session will also introduce the NXP BLE product family including the latest QN9080/83 ultra low-power BLE WMCU and KW35/36 automotive and industrial BLE WMCU, detailing targeted use cases, the device features, highlighting BLE and stacks as well as supporting enablement.

As connected edge devices gain momentum with consumers, the security approaches and assumptions of the past will fail and create new threats and vulnerabilities to consumer safety and privacy. Additionally, the cost for security in mobile phones, tablets, and PCs will present a challenge for applications such as occupant sensors and heart rate monitoring patches. Lastly, the teams of security experts in connected industries do not yet exist at suppliers who are connecting products to the network. Join this session to learn how industries are providing cost effective, highly secure, certified hardware that can hasten the learning cycle for emerging edge node applications, bring solutions for security, drive down costs, and limit the supplier specific required expertise.

V2X technology has the potential to drastically reduce road accidents and improve the traffic flow by fusing in-car sensor data with data obtained from other road users and from the surrounding infrastructure - visibly or unvisbily and far beyond the driver's line of sight. Vehicle to cloud data communication provides a pathway for anonymous data collection and dissemination. When the true potential for V2X is realized and it becomes a true part of the vehicle safety system it is vital that the authenticity and security of data are guaranteed. In addition, the vehicle control units that coordinate active stability systems must be protected against external influences that might subvert the mechanisms design. This presentation will explore the various security countermeasures needed to make V2X a safe and secure technology for the future.

NXP offers a wide range of powerful microprocessors for the automotive and industrial markets. The memory selection of these systems can impact the performance, size, cost, power, reliability and longevity of your design. During this session we will discuss the new memories supported on the latest i.MX 8 Quad Max processor which is focused on automotive and industrial markets. For DRAM, this will include LPDDR4. For non-volatile memory, this will include Micron’s recently announced XccelaTM Octal SPI-NOR Flash and our newer e.MMC devices. These devices provide higher performance and are offered with automotive temperature and quality ratings. This session will provide designers with the information necessary to develop i.MX 8 systems for state-of-the-art automotive solutions.

The session will introduce an upcoming xEV traction motor power inverter platform system-play solution featuring a new MCU, new IGBT gate driver, and new safe SBC bound together with system enablement software and ASIL-D compliant safety support. A fully functional traction motor reference design being designed by partner Vepco will also be introduced based on a Power IGBT Module from Fuji Electric. The session will describe the platform’s components, software structure, value proposition, enablement support and go-to-market approach to help enhance understanding of the application and NXP solution as well as how to sell the system platform.

Connects - Training Material

Connects - Training Material

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