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Ensuring secure deployment of the billions of end nodes is a key enabler for the Internet of Tomorrow. The Kinetis K8x and Kinetis KL8x families are designed to deliver unsurpassed security for multi-application MCUs with hardware features such as Trust, Cryptographic acceleration, and Anti-Tamper to deliver a scalable, secure platform for embedded developers. This hands-on session will cover the needs of secure embedded applications, performing encrypted firmware updates, utilizing hardware cryptographic accelerators and extending trusted execution to external memories using an on-the-fly AES decryption module. Join this session to learn how your customers can get started creating their next secure node design.

Secure designs begin with a security model consisting of policies, an understanding of the threat landscape and the methods used to enforce physical and logical security. To protect firmware execution given today’s threat landscape, there must be a policy to only allow execution of authenticated firmware. The methods used to enforce this policy rely on MCU security technology to create a protected boot flow. The boot firmware can contain public key cryptography to authenticate application code. In addition to these components integrated in the end device, there are tools and steps that must be taken in the manufacturing environment. Join this session to explore the design and implementation of a secure boot by making use of the Arm® mbed TLS open source software and protect against firmware attacks. This class will use the recently launched K32W (K3S) for the hands-on portion.

This course will provide an in-depth system analysis of high voltage (HV) electric vehicle (EV) and hybrid electric vehicle (HEV) power conversion. We will review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient, and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design and layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring, and advanced features provides monitoring and reporting of key safety functions to achieve system ASIL level D and ISO26262 certification.

The automotive market is moving towards electrification and autonomous driving. This trend needs ADAS electronic systems capable of making decisions. To manage the risk of operations, the development of these systems follows the highest ISO26262 Automotive Safety Integrity Level (ASIL D). All safety electronic systems require a safety microcontroller and a reliable, safe source of power management connected to the car battery: this is the System Basis Chip (SBC). Safety microcontrollers and safety system basis chips are the backbone of embedded system architectures. In this presentation, you’ll review the latest functional safety innovations at the power management level (SBC), from the development phase to system design, underscoring the link to reliability and how to enable hardware that is safety ready. A short introduction to the fault tolerant system will be also presented.

As we race through the age of ubiquitous connectivity with insatiable demand for data, the need for high-speed connectivity solutions is more evident than ever. 60 GHz or 802.11ad Wi-Fi is the new kid taking over the block - be it in homes or in offices, high density indoor or outdoor spaces, fronthaul or backhaul applications, it's everywhere! What's more is that this space is being primarily influenced by a lot of new tier 2 players who have innovative approaches to make the best use of this multi-gigabit rate spectrum. Come join NXP to learn how our SoCs are integral to furthering this ecosystem.

This session will provide a deep-dive technical session on how to develop, simulate and test machine vision algorithms with MATLAB toolsets like Computer Vision System and Image Processing on NXP S32V microprocessors. The MATLAB automatic generated code will be executed on the S32V234 SBC boards on Arm and APEX cores simultaneous to squeeze the best performance. The session will concentrate on feature detection for driver monitoring and will showcase various concepts like object detection using Viola-Jones, tracking a ROI using Kalman filters and various feature detection using Haar cascades classifiers. At the end of the session the participants will be able to develop from scratch complex algorithms for detecting various feature like: pedestrians, traffic signs, lane departure, etc. and do all these from a simple and user friendly environment like MATLAB.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

Introduction and review of the latest family of Functional Safety System Basis Chips with integrated CAN FD PHY. Power Management and flexible safety features will be discussed as well as the operation and interconnection with MCUs. Also in this presentation, you’ll identify how the robustness of our design are verified in a real application environment to achieve a common goal of an excellent system reliability performance. From the ADAS to the drive train market that requires reliability, power scalability and safety, learn how our system Basis Chip solution can enable and simplify your design.

This session introduces the MCUXpresso suite of tools (IDE, SDK, Config Tools) and shows users how to rapidly start development with thousands of Kinetis and LPC MCUs. Using either Kinetis, LPC or i.MX RT development hardware, attendees will watch how to build a custom SDK, configure pins and clocks settings, generate a project, import and debug an application, as well as the advanced debugging capabilities of the MCUXpresso IDE, including trace, profiling, coverage, watch points and more.

This session will address how S12 MagniV mixed-signal MCUs can help customers design more compact and cost-effective electronic control units. The S12 MagniV devices are built on proven S12 technology, enabling software and tool compatibility across the entire portfolio. With the right blend of digital programmability and high-precision analog, plus a portfolio of scalable memory options, the S12 MagniV portfolio streamlines automotive design.

The self driving car has a major impact on ECUs power and complexity and the network architecture connecting them together. The sheer fact that the driver is now a mere passenger with potentially limited options of taking back control raises significant functional safety questions that cannot be addressed with conventional approaches. In this presentation, we discuss how autonomous driving is impacting the functional safety requirements for automotive Ethernet switches and PHYs. We will review what functional safety for a component really means, going beyond marketing figures and ticking off feature lists. Finally, we will discuss how NXP is attacking this challenge in our current portfolio with a hint to the products to come.

Connects - Training Material

Connects - Training Material

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