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Hands-on workshop using the low cost KIT-HGDRONEK66 HoverGames drone reference platform for small autonomous vehicles. Learn about the open source PX4 flight stack vehicle manangement unit, NuttX RTOS, Mavlink, DDS RTPS services, associated Linux companion computer and Qgroundcontrol groundstation for vehicle configuration and flight logging and planning. Learn by example compiling the code and adding new functions within the PX4 modular software framework. Discover interfacing to Rapid-IOT via MAVLINK.

i.MX RT product is the most popular crossover MCU products in market this year. Positioning as MCU product, i.MX RT can certainly reuse the traditional Arm MCU ecosystem. Besides, this session will provide an overview introduction of i.MX RT series and their target market applications, then share the existing hardware/software/tools/documentation enablements for overall picture. Finally typical reference solutions on i.MX RT are introduced for better understanding what NXP offers to support customer for quick project development.

Ensuring secure deployment of the billions of end nodes is a key enabler for the Internet of Tomorrow. The Kinetis K8x and Kinetis KL8x families are designed to deliver unsurpassed security for multi-application MCUs with hardware features such as Trust, Cryptographic acceleration, and Anti-Tamper to deliver a scalable, secure platform for embedded developers. This hands-on session will cover the needs of secure embedded applications, performing encrypted firmware updates, utilizing hardware cryptographic accelerators and extending trusted execution to external memories using an on-the-fly AES decryption module. Join this session to learn how your customers can get started creating their next secure node design.

Security is becoming a quintessential topic for any OEM, and possibly for the entire industry, as evolutions of Autonomous drive capabilities are inexorably tied to the ability to secure the car. A number of components in the security architecture of nodes in any vehicle are very close to the SoC, exploiting hardware capabilities to achieve intended functionality. Answering customer needs, NXP is providing a Trusted Execution Environment (TEE) stack, which provides a significant number of security features required by the Automotive needs. Get an introduction to the basis of NXP’s TEE stack, capabilities, and how does this integrates in the typical secure node architecture.

With the very public hacks of some major vehicle brands in 2015, there is a renewed focus on vehicle security. There is a large range of vehicle electrical architectures, with significant regional variations, but there is an acceleration towards a domain orientated secure network. This presentation will look at the growing importance of the central gateway in a world of increased connectivity and security. As Ethernet becomes more prevalent, the topic of IP routing & firewall will be introduced and its role in adding another security layer. Finally, the role of the central gateway in enabling OTA software updated beyond the telematics unit, to the entire network will be presented.

Secure designs begin with a security model consisting of policies, an understanding of the threat landscape and the methods used to enforce physical and logical security. To protect firmware execution given today’s threat landscape, there must be a policy to only allow execution of authenticated firmware. The methods used to enforce this policy rely on MCU security technology to create a protected boot flow. The boot firmware can contain public key cryptography to authenticate application code. In addition to these components integrated in the end device, there are tools and steps that must be taken in the manufacturing environment. Join this session to explore the design and implementation of a secure boot by making use of the Arm® mbed TLS open source software and protect against firmware attacks. This class will use the recently launched K32W (K3S) for the hands-on portion.

This course will provide an in-depth system analysis of high voltage (HV) electric vehicle (EV) and hybrid electric vehicle (HEV) power conversion. We will review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient, and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design and layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring, and advanced features provides monitoring and reporting of key safety functions to achieve system ASIL level D and ISO26262 certification.

Bluetooth speakers and headsets, printers, cameras, projectors, set-top-boxes, TVs, Wi-Fi routers and a variety of home appliances like fridges, washing machines, air purifiers, coffee machines, blenders all have one thing in common: Near Field Communication (NFC) allows new features and easier handling. Just bringing two NFC-enabled devices close together is all it takes to create a connection. Accessories and consumables can be authenticated and configured without any user interaction, and without power supply. And commissioning an IoT node into a wireless network has never been as easy as it is now with NFC. We will share the latest status of NFC support in iOS and present the brand new NFC Tandem module.

This session will focus on the memory choices for several of the more popular i.MX 6 and i.MX 7 series as well as NXP’s newest and most powerful microprocessor, the i.MX 8 series. Most processors can support different types of volatile (DRAM) and non-volatile (Flash) memories. For example, the i.MX 7 can support low power DRAM (LPDDR), LPDDR2 and LPDDR3 as well as the standard DDR3 memory. For flash memories, the i.MX 7 supports parallel NOR, serial NOR or NAND Flash. Each of these memory choices has technical advantages and disadvantages as well as the overall market acceptance and expected longevity. The session will also discuss two new high performance memory technologies that the i.MX 8 plans to support, LPDDR4 and XTRMFlash. This session will allow you, the designer to make an informed decision when it comes to selecting memory for your design.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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