i.MX Processors Knowledge Base

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i.MX Processors Knowledge Base

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Hello! In this time, we will look how the i.MX93 GPIOs IRQs works, also I will focus on Cortex M33 side with SDK 2_16_0 but also tested on 2_15.   We can see in this other post, how the i.MX8M family works, but for i.MX93 this is a little different because there are a Secure/Non-Secure options and Privilege/Non-Privilege.   According to reference Manual and SDK LED example, we must to set the PCNS and ICNS registers to 0x00 to set in Secure access.    Materials Used: i.MX93EVK Jumper cable to connect GPIO2_IO02 with GPIO2_IO03 SDK 2_16_0 from MCUXpresso SDK Builder Source power for i.MX93EVK USB C Cable for serial debug USB C Cable to transfer .bin ro EVK   The Cortex-M33 processor supports Secure and Non-secure security states, Thread and Handler operating modes, and can run in either Thumb or Debug operating states. In addition, the processor can limit or exclude access to some resources by executing code in privileged or unprivileged mode. Code can execute as privileged or unprivileged. Unprivileged execution limits or excludes access to some resources appropriate to the current security state. Privileged execution has access to all resources available to the security state. Handler mode is always privileged. Thread mode can be privileged or unprivileged. You can find this information in the ARM documentation.   To resume this post, we will focus just in the necessary registers to configure properly a GPIO as IRQ input.   On this example, we will take the i.MX93EVK board. The GPIO2_IO02 will be configured as an output and the GPIO2_IO03 will be configured as an input with Rising edge IRQ. On each GPIO2_IO02 Rising edge, the software will detect an IRQ.     At first, we need to configure our IOMUX: void BOARD_InitPins(void) { IOMUXC_SetPinMux(IOMUXC_PAD_GPIO_IO02__GPIO2_IO02, 0U); IOMUXC_SetPinMux(IOMUXC_PAD_GPIO_IO03__GPIO2_IO03, 0U); IOMUXC_SetPinMux(IOMUXC_PAD_UART2_RXD__LPUART2_RX, 0U); IOMUXC_SetPinMux(IOMUXC_PAD_UART2_TXD__LPUART2_TX, 0U); IOMUXC_SetPinConfig(IOMUXC_PAD_GPIO_IO02__GPIO2_IO02, IOMUXC_PAD_DSE(15U) | IOMUXC_PAD_FSEL1(2U) | IOMUXC_PAD_PD_MASK); IOMUXC_SetPinConfig(IOMUXC_PAD_GPIO_IO03__GPIO2_IO03, IOMUXC_PAD_PD_MASK); IOMUXC_SetPinConfig(IOMUXC_PAD_UART2_RXD__LPUART2_RX, IOMUXC_PAD_PD_MASK); IOMUXC_SetPinConfig(IOMUXC_PAD_UART2_TXD__LPUART2_TX, IOMUXC_PAD_DSE(15U)); }   Then, we can start to code. Using as an starting point we can use the SDK/boards/mcimx93evk/driver_examples/rgpio/led_output example. Our definitions (PIN_OUT_RGPIO and PIN_IN_RGPIO are the same GPIO2 but it is just for good practice):😞 /******************************************************************************* * Definitions ******************************************************************************/ #define PIN_OUT_RGPIO GPIO2 #define PIN_IN_RGPIO GPIO2 #define PIN_OUT_RGPIO_PIN 2U #define PIN_IN_RGPIO_PIN 3U   Then, our IRQ handler: void Reserved73_IRQHandler(void) { RGPIO_ClearPinsInterruptFlags(PIN_IN_RGPIO, kRGPIO_InterruptOutput0, 1U << PIN_IN_RGPIO_PIN); PRINTF("\r\n IRQ.........\r\n"); SDK_ISR_EXIT_BARRIER; }   Why Reserved73_IRQHandler? That is the correspondent for GPIO2, you can look this on SDK/devices/MIMX9352/gcc in the file called startup_MIMX9352_cm33.S:   Basically, the interruption will clear the IRQ flag and print a little message.   Now, here we have the complete main function, we will break down the most important points. int main(void) { /* Define the init structure for the output pin*/ rgpio_pin_config_t pin_out_config = { kRGPIO_DigitalOutput, 0, }; rgpio_pin_config_t pin_in_config = { kRGPIO_DigitalInput, 0, }; /* Board pin, clock, debug console init */ /* clang-format off */ const clock_root_config_t rgpioClkCfg = { .clockOff = false, .mux = 0, // 24Mhz Mcore root buswake clock .div = 1 }; /* clang-format on */ BOARD_InitBootPins(); BOARD_BootClockRUN(); BOARD_InitDebugConsole(); CLOCK_SetRootClock(EXAMPLE_RGPIO_CLOCK_ROOT, &rgpioClkCfg); CLOCK_EnableClock(EXAMPLE_RGPIO_CLOCK_GATE); CLOCK_EnableClock(kCLOCK_Gpio2); /* Set PCNS register value to 0x0 to prepare the RGPIO initialization */ PIN_OUT_RGPIO->PCNS = 0x0; PIN_IN_RGPIO->ICNS = 0x0; /* Print a note to terminal. */ PRINTF("\r\n RGPIO Driver example\r\n"); PRINTF("\r\n An IRQ will happen each GPIO2_IO02 Rising edge\r\n"); /* Init output PIN GPIO. */ RGPIO_PinInit(PIN_OUT_RGPIO, PIN_OUT_RGPIO_PIN, &pin_out_config); /* Init Input with IRQ Pin GPIO*/ RGPIO_SetPinInterruptConfig(PIN_IN_RGPIO, PIN_IN_RGPIO_PIN, kRGPIO_InterruptOutput0, kRGPIO_InterruptRisingEdge); EnableIRQ(GPIO2_0_IRQn); RGPIO_PinInit(PIN_IN_RGPIO, PIN_IN_RGPIO_PIN, &pin_in_config); while (1) { SDK_DelayAtLeastUs(1000000U, SystemCoreClock); RGPIO_PortToggle(PIN_OUT_RGPIO, 1u << PIN_OUT_RGPIO_PIN); } }   As we can see, we need set the GPIO2 PCNS register to 0x00:   Pin Control Nonsecure (PCNS) Configures secure or nonsecure access protection for each pin. You can write to this register only in the Secure-Privilege state if it is not locked (LOCK[PCNS] = 0).   Also the ICNS register to 0x00.   Interrupt Control Nonsecure (ICNS) Configures secure and nonsecure access protection for each interrupt, or DMA request. You can update this register only in the Secure-Privilege state if it is not locked (LOCK[ICNS] = 0).   Now, we can compile and run the example. On each GPIO2_IO02 Rising edge, the CM33 will detect an IRQ in GPIO2_IO03 (short those pads as showed in the image at first of the post).     I will attach the full .c file.   I hope this information can helps to everyone.   Best regards, --... ...-- Salas.
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This document is about to build an image by Yocto , and it will disable a function that normal user can’t use command line of “ su ”.
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The purpose of this document is to provide a guide on how to export new symbols using the Bazel Android server instead of the build_abi.sh script. For a better reference how to build Android i.MX image please look at the next chapter 3 Building the Android Platform for i.MX in the Android User's Guide 1. Compile full AOSP or only kernel Build full AOSP: $ source build/envsetup.sh $ lunch evk_8mp-eng $ ./imx-make.sh -j8  Only build the kernel: $ ./imx-make.sh kernel -j8 2. Generic Kernel Image GKI Development Download GKI outside of android_build (MY_ANDROID). # Make sure MY_ANDROID is set to the android_build folder. $ export MY_ANDROID=`pwd` # mkdir gki && cd gki (Make sure folder gki is not inside of ${MY_ANDROID}) $ repo init -u https://android.googlesource.com/kernel/manifest -b common-android14-6.1 $ repo sync $ cd common 3. Export New Symbols Switch the kernel in this common folder from AOSP to its device, and apply the patches required for your project. In this case Android $ cd common $ git remote add device https://github.com/nxp-imx/linux-imx.git $ git remote update $ git fetch device --tags $ git checkout android-14.0.0_1.2.0 $ cd .. $ ln -s ${MY_ANDROID}/vendor/nxp-opensource/verisilicon_sw_isp_vvcam verisilicon_sw_isp_vvcam $ ln -s ${MY_ANDROID}/vendor/nxp-opensource/nxp-mwifiex nxp-mwifiex $ BUILD_FOR_GKI=yes BUILD_CONFIG=common/build.config.imx $ EXT_MODULES_MAKEFILE="verisilicon_sw_isp_vvcam/vvcam/v4l2/Kbuild" $ EXT_MODULES="nxp-mwifiex/mxm_wifiex/wlan_src" Note: Be sure that your Symbolic Link is pointing to the correct folder Open the Makefile in the following path ../gki/nxp-mwifiex/mxm_wifiex/wlan_src/ and erase some ifreq lines that will generate a No such file or directory error. #Automatically determine Android version from build information to streamline diff --git a/mxm_wifiex/wlan_src/Makefile b/mxm_wifiex/wlan_src/Makefile index 3ec5308..7b6ca47 100644 --- a/mxm_wifiex/wlan_src/Makefile +++ b/mxm_wifiex/wlan_src/Makefile @@ -139,20 +139,7 @@ CONFIG_ANDROID_KERNEL=y ifeq ($(ANDROID_PRODUCT_OUT),1) ccflags-y += -DANDROID_SDK_VERSION=$(ANDROID_SDK_VERSION) else -include $(ANDROID_BUILD_TOP)/build/make/core/build_id.mk -ifeq ($(shell echo "$(BUILD_ID)" | cut -c1),R) - ccflags-y += -DANDROID_SDK_VERSION=30 -else ifeq ($(shell echo "$(BUILD_ID)" | cut -c1),S) - ccflags-y += -DANDROID_SDK_VERSION=31 -else ifeq ($(shell echo "$(BUILD_ID)" | cut -c1),T) - ccflags-y += -DANDROID_SDK_VERSION=33 -else ifeq ($(shell echo "$(BUILD_ID)" | cut -c1),U) - ccflags-y += -DANDROID_SDK_VERSION=34 -else - # Default optimization or actions - ANDROID_SDK_VERSION := 0 - ccflags-y += -DANDROID_SDK_VERSION -endif +ccflags-y += -DANDROID_SDK_VERSION=34 endif endif endif -- Then you could update the symbol list by typing the following command. $ tools/bazel run //common:imx_abi_update_symbol_list After the build process is successful, you should get an output like the image below. Build GKI locally. $ tools/bazel run //common:kernel_aarch64_dist  You could follow the next chapters to update the GKI image to your boot image.
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Preface With i.MX android, it is often infeasible to directly build an OTA package with a newer android version and apply that OTA package to a device running old version of Android. For example, the OTA package buit with i.MX android-13.0.0_2.0.0 release for evk_8mm cannot be direclty applied on the evk_8mm board running the image built with i.MX android-11.0.0_1.0.0. In this article, the reason why directly cross-version OTA is infeasible in i.mx android is firstly explained. Then what should be takein into consideration and done before cross-version OTA are described.   The way Google update the system for its device Once Google first time releases a device, it is called a "launch device". it has: codename. Take pixel 3a xl as an example, the codename is bonito Android version. For pixel 3a xl, it's Android 9.0 kernel version. For pixel 3a xl, it's 4.9 PRODUCT_SHIPPING_API_LEVEL. For pixel 3a xl, it is set to be 28, the same as the SDK version of that Android version. FCM target level. For pixel 3a xl, it's 3 After the system code is updated to a new version, an OTA package can be built with the lunch target aosp_bonito-user or aosp_bonito-userdebug for pixel 3a xl, let's call the updated device "retrofit device" codename is not changed. its device configuration still can be found in "device/google/bonito/" Android version. it is the version the OTA updated to. Four android versions are supported, here they are android 9, 10, 11, 12, which means pixel 3a xl can at most upgraded to android12. "device/google/bonito/" is introduced in android9, and removed in android13. kernel version. not changed after OTA PRODUCT_SHIPPING_API_LEVEL. Not changed in OTA, so after the OTA, the value of property "ro.product.first_api_level" is different from the SDK version. FCM target level. not changed after OTA. The FCM target level is in the device manifest.xml, corresponds to a specific version of system compatibility.matrix.xml, so HALs provided by this device does not need to have much changes if the FCM target level is not changed. This is the way Google maintains the system for their devices. This is not the way i.MX Android devices are maintained. The way i.MX Android update the system to a new version for maintained device when the code is upaded to a new version for maintained imx devices, all the device are taken as "launch device", so compaired to the previous version, in the new system for the device: the kernel version is changed PRODUCT_SHIPPING_API_LEVEL is changed FCM target level is changed. Physical partitions may also be changed The FCM target level change means there may be some big changes in the HALs provided by this device. The PRODUCT_SHIPPING_API_LEVEL change means quite many code logic based on the property "ro.product.first_api_level" execute in different flow. Fro the partition changes, the OTA package directly build with this updated code often cannot be applied, for example, a new image for the new partition cannot be applied on the board running old system, as it does not have the partition for the image. Things cannot be changed during OTA To make things more clear that why direct cross-version OTA is infeasible, it is necessary to know that there are things cannot be changed during OTA. 1. physical partitions cannot be changed during OTA. related features are: * dynamic partition * gki * boot header version 2. user data on theuserdata partition should not be changed, or data loss may occur during OTA. the related features are: * encryption options encryption options should not be changed, to make new version of android can recognize the data encrypted by the old version of android. For some  fs_mgr encrypt options, the product_shipping_api_level impacts on the final encryption parameters passed to the kernel. take a look at the following code, even with the same fs_mgr encryption option, if the first_api_level is different, the final encryption parameter is different in different android version. android10 system/extras/libfscrypt/fscrypt.cpp if (filenames_encryption_mode == FS_ENCRYPTION_MODE_AES_256_CTS) { // Use legacy padding with our original filenames encryption mode. return FS_POLICY_FLAGS_PAD_4; } else if (filenames_encryption_mode == FS_ENCRYPTION_MODE_ADIANTUM) { // ...snip... return (FS_POLICY_FLAGS_PAD_16 | FS_POLICY_FLAG_DIRECT_KEY); } // ...snip... return FS_POLICY_FLAGS_PAD_16; android11 system/extras/libfscrypt/fscrypt.cpp if (!is_gki && options->version == 1 && options->filenames_mode == FSCRYPT_MODE_AES_256_CTS) { options->flags |= FSCRYPT_POLICY_FLAGS_PAD_4; } else { options->flags |= FSCRYPT_POLICY_FLAGS_PAD_16; } android12 system/extras/libfscrypt/fscrypt.cpp if (first_api_level <= __ANDROID_API_Q__ && options->version == 1 && options->filenames_mode == FSCRYPT_MODE_AES_256_CTS) { options->flags |= FSCRYPT_POLICY_FLAGS_PAD_4; } else { options->flags |= FSCRYPT_POLICY_FLAGS_PAD_16; }  The fscrypt version will also impact the result. If not sepcified, the default "version" would be "v1" if the "product_shipping_api_level <= 29" or the default "version" would be "v2". Some fscrypt functions like "casefold" and "project id" will depend on fscrypt "v2", these functions are enabled by including the "$(call inherit-product, $(SRC_TARGET_DIR)/product/emulated_storage.mk)" in "device/nxp". The "emulated_storage.mk" must not be included if fscrypt "v1" is used.  * the userdata partition filesystem type ext4 (used before i.mx android 13.0.0) f2fs (used from i.mx android 13.0.0) * The filesystem for the emulated storage on the userdata partition sdcardfs fuse 3. The boot control info in misc partition should be able to be recognized before and after OTA related feature is: * bootcontrol HAL 4. The bootargs passed by u-boot to kernel cannot be changed if the bootloader is not updated The related feature is: * bootconfig is used to pass boot args from android12.0.0_1.0.0. used with vendor boot header v4.   it should be known that if dual bootloader of postinstall is used, bootloader can be updated.   For these related features. Google does not implement or change them for a "retrofit device", just imlement for change the features for a "launch device", makes direct cross-version OTA feasible for them, because things cannot be changed during OTA are the same between different android versions. For i.mx android, to implement new features for all maintaied devices, things can be changed during OTA are often changed when update to a new version of android. which makes direct cross-version OTA infeasible.    For the ease of reference, list some feature change history here: * physical partition change history   P9.0.0_2.3.0 10.0.0_1.0.0 10.0.0_2.0.0 11.0.0_1.0.0 12.0.0_1.0.0 12.1.0_1.0.0 13.0.0_1.0.0 14.0.0_1.0.0 bootloader_a/b 4MB 4MB 4MB 4MB 4MB 16MB 16MB 16MB dtbo_a/b 4MB 4MB 4MB 4MB 4MB 4MB 4MB 4MB boot_a/b 48MB 48MB 64MB 64MB 64MB 64MB 64MB 64MB init_boot_a/b - -   -   - 8MB 8MB vendor_boot_a/b - -   64MB 64MB 64MB 64MB 64MB misc 4MB 4MB 4MB 4MB 4MB 4MB 4MB 4MB metadata 2MB 2MB 2MB 2MB 16MB 16MB 64MB 64MB presistdata 1MB 1MB 1MB 1MB 1MB 1MB 1MB 1MB super - - 7168MB 3584MB 4096MB 4096MB 4096MB 4096MB fbmisc 1MB 1MB 1MB 1MB 1MB 1MB 1MB 1MB vbmeta_a/b 1MB 1MB 1mb 1MB 1MB 1MB 1MB 1MB system_a/b 2560MB 1536MB - -   - - - vendor_a/b 256MB 512MB - -   - - - product_a/b - 1792MB - -   - - -   boot_a/b: 48MB → 64MB, Image becames bigger ater enabling some debug options vendor_boot_a/b: boot header v3. Vendor boot and boot header v3 are MUST to enable GKI feature.  init_boot_a/b: The init binary in ramdisk is moved from boot.img to init_boot.img. flash gki image from Google does not impact on the vendor modifications on init.   for the metadata partition: 2MB → 16MB, requirement of vts "-m vts_gsi_boot_test -t MetadataPartition#MinimumSize" 16MB → 64MB, to make the partition be formated as f2fs, 32MB is not enough, 64MB is used. metadata partition was firstly mounted in android11, when enable the user data checkpoint feature * gki feature history Firstly introduced in android11. Some codes are built into modules, put the modules in vendor_boot_a/b partition. vendor_boot_a/b partitions are also firstly introduced in android11 GKI prebuilt binary was integrated from android12   The way to handle cross-version OTA for i.mx android Here are the steps align the partitions within the OTA base code and the OTA target code if the product may be in the development stage, and the OTA base  code can be modified: reserve partitions in OTA base code. for example, OTA from 10 to 11, reserver the vendor_boot partition in android10 partitiont able although there is not vendor_boot.img. change the selinux rules to have update_engine to be able to update this partition. enlarge some partitions in the OTA base code as in the OTA target code. for examples, the bootloader partitions is 16MB in android13. if OTA from android12 to android13 and the android 12 code can be modified, enlarge the bootloader partition to 16MB. as data in userdata and metadata partition is not touched during OTA, modify the mount options of userdata and metadata partitions in OTA target code to be the same as the one in OTA base code. if the product partitions are already shipped, only the OTA target code can be modified:  as data in userdata and metadata partition is not touched during OTA, modify the mount options of userdata and metadata partitions in OTA target code to be the same as the one in the OTA base code. change the partition size to align with the OTA base code partitions like vendor_boot and/or init_boot may need to be removed. remove/change the features related to the removed or changed partitions if dual bootloader is not used: recently in android version update, vendor_boot and init_boot partitions are added, this is related to boot image header version, the images in these partitions are loaded and verified by uboot, so if dual bootloader is not used, uboot code related to these things need to be changed. check the code related to "struct boot_img_hdr" in uboot. the a/b slot metadata format may be changed between the OTA base code and the OTA target code , this a/b slot metadata is accessed by both Android bootctrl HAL and uboot, as dual bootloader is not used, uboot is not upaded, the updated Android bootctrl HAL should also use the same format to access the file. a postinstall mechanism can be used to update the uboot images, but as there is no fallback for the update failure, the risks need to be evaluated. check whether the OTA package can be applied and whether the updated system can boot up an failure example: OTA from android10 to android12, the system fail to boot up because of the PRODUCT_SHIPPING_API_LEVEL/"ro.product.first_api_level" value difference, different encryption options are used for userdata partitions. so the PRODUCT_SHIPPING_API_LEVEL value need to be changed to be the same as the one in the OTA base code. as PRODUCT_SHIPPING_API_LEVEL is changed, the FCM target version and related HALs may also need to be changed, including changes in device manifest.xml and compatibility_matrix.xml. need to check the commit history about what is changed together with the FCM target version change.   For dynamic partitions, there are something to be noticed: OTA from the image without dynamic partitions to use dynamic partitions: Refer to the code in android10.0.0_2.0.0, there is a demonstration to update 10.0.0_1.0.0 to 10.0.0_2.0.0. In 0.0.0_1.0.0, dynamic partition is not enabled. check the variable "TARGET_USE_RETROFIT_DYNAMIC_PARTITION" and related configurations. OTA from dynamic partitions to virtual A/B, for example, OTA from android10 to android11 inherit the file "build/make/target/product/virtual_ab_ota_retrofit.mk" the first time when update from android10 to android11 with OTA, inherit the "build/make/target/product/virtual_ab_ota_retrofit.mk", the BOARD_NXP_DYNAMIC_PARTITIONS_SIZE is set as dynamic paritition is used. the second time, the device is runing android11 with retrofit virtual A/B feature, this time OTA again, but not cross version, inherit "build/make/target/product/virtual_ab_ota.mk" instead, and the BOARD_NXP_DYNAMIC_PARTITIONS_SIZE  can be set as virtual A/B feature is used. Devices that were upgraded to dynamic partitions can’t retrofit virtual A/B. if there are new dynamic partitions in OTA target code, like vendor_dlkm, no additional changes need to be made for it. Then the customers need to do full xTS test to guarantee the quality.  
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Overview The purpose of this document is to provide a guide on how to enable Dual Ethernet with the GKI Development. Reference: How to enable dual ethernet on Android 11 For a better reference how to build Android i.MX image please look at the next chapter 3 Building the Android Platform for i.MX in the Android User's Guide 1. Build the Android Image with the next modifications The 2nd ethernet port is DWMAC from synopsys and phy used is realtek RTL8211F. To add them into the SharedBoardConfig.mk and remove the camera drivers. diff --git a/imx8m/evk_8mp/SharedBoardConfig.mk b/imx8m/evk_8mp/SharedBoardConfig.mk index f68eb49e..3e95708e 100644 --- a/imx8m/evk_8mp/SharedBoardConfig.mk +++ b/imx8m/evk_8mp/SharedBoardConfig.mk @@ -82,7 +82,12 @@ BOARD_VENDOR_KERNEL_MODULES += \ $(KERNEL_OUT)/drivers/rtc/rtc-snvs.ko \ $(KERNEL_OUT)/drivers/pci/controller/dwc/pci-imx6.ko \ $(KERNEL_OUT)/drivers/net/phy/realtek.ko \ - $(KERNEL_OUT)/drivers/net/ethernet/freescale/fec.ko + $(KERNEL_OUT)/drivers/net/ethernet/freescale/fec.ko \ + $(KERNEL_OUT)/drivers/net/phy/micrel.ko \ + $(KERNEL_OUT)/drivers/net/pcs/pcs_xpcs.ko \ + $(KERNEL_OUT)/drivers/net/ethernet/stmicro/stmmac/dwmac-imx.ko \ + $(KERNEL_OUT)/drivers/net/ethernet/stmicro/stmmac/stmmac.ko \ + $(KERNEL_OUT)/drivers/net/ethernet/stmicro/stmmac/stmmac-platform.ko ifeq ($(POWERSAVE),true) BOARD_VENDOR_KERNEL_MODULES += \ $(KERNEL_OUT)/drivers/soc/imx/lpa_ctrl.ko \ @@ -219,15 +224,12 @@ BOARD_VENDOR_RAMDISK_KERNEL_MODULES += \ $(KERNEL_OUT)/drivers/perf/fsl_imx8_ddr_perf.ko \ $(KERNEL_OUT)/drivers/cpufreq/cpufreq-dt.ko \ $(KERNEL_OUT)/drivers/cpufreq/imx-cpufreq-dt.ko \ - $(KERNEL_OUT)/drivers/media/i2c/ov5640.ko \ $(KERNEL_OUT)/drivers/staging/media/imx/imx8-capture.ko \ $(KERNEL_OUT)/drivers/staging/media/imx/imx8-isi-capture.ko \ $(KERNEL_OUT)/drivers/staging/media/imx/imx8-isi-hw.ko \ $(KERNEL_OUT)/drivers/staging/media/imx/imx8-isi-mem2mem.ko \ $(KERNEL_OUT)/drivers/staging/media/imx/imx8-mipi-csi2-sam.ko \ $(KERNEL_OUT)/drivers/dma/imx-sdma.ko \ - $(TARGET_OUT_INTERMEDIATES)/VVCAM_OBJ/basler-camera-driver-vvcam.ko \ - $(TARGET_OUT_INTERMEDIATES)/VVCAM_OBJ/os08a20.ko \ $(KERNEL_OUT)/drivers/staging/media/imx/imx8-media-dev.ko \ $(TARGET_OUT_INTERMEDIATES)/VVCAM_OBJ/vvcam-dwe.ko \ $(TARGET_OUT_INTERMEDIATES)/VVCAM_OBJ/vvcam-isp.ko \​ To let the Android framework's EthernetTracker and EthernetNetworkFactory know which interfaces to manage, the framework level configure config_ethernet_iface_regex config_ethernet_interfaces must be overlay in device/nxp/imx8m/evk_8mp/overlay/frameworks/base/core/res/res/values/config.xml: diff --git a/imx8m/evk_8mp/overlay/frameworks/base/core/res/res/values/config.xml b/imx8m/evk_8mp/overlay/frameworks/base/core/res/res/values/config.xml index 298d50cc..63f6787e 100644 --- a/imx8m/evk_8mp/overlay/frameworks/base/core/res/res/values/config.xml +++ b/imx8m/evk_8mp/overlay/frameworks/base/core/res/res/values/config.xml @@ -22,7 +22,12 @@ <resources> <!--For Android we support eth0 now --> - <string translatable="false" name="config_ethernet_iface_regex">eth0</string> + <string translatable="false" name="config_ethernet_iface_regex">eth\\d</string> + + <string-array translatable="false" name="config_ethernet_interfaces"> + <item>eth0;12,13,14,15,16,18,19</item> + <item>eth1;12,13,14,15,16,18,19</item> + </string-array> <!-- List of regexpressions describing the interface (if any) that represent tetherable USB interfaces. If the device doesn't want to support tething over USB this should -- Apply the patch 0001-PATCH-Add-defines-for-ETH-support-drivers.patch Build the Android Image # Change to the MY_ANDROID Directory $ source build/envsetup.sh $ lunch evk_8mp-userdebug $ ./imx-make.sh -j4 2>&1 | tee build-log.txt​   GKI Development Follow and apply the next community post: Export new symbols of GKI development Android 14 Set the GKI repo $ repo init -u https://android.googlesource.com/kernel/manifest -b common-android14-6.1 $ repo sync $ git remote add device https://github.com/nxp-imx/linux-imx.git $ git remote update $ git fetch device --tags $ git checkout android-14.0.0_1.2.0 $ cd .. #Be sure that symbolic links are created correctly $ ln -s ${MY_ANDROID}/vendor/nxp-opensource/verisilicon_sw_isp_vvcam verisilicon_sw_isp_vvcam $ ln -s ${MY_ANDROID}/vendor/nxp-opensource/nxp-mwifiex nxp-mwifiex $ BUILD_FOR_GKI=yes $ BUILD_CONFIG=common/build.config.imx $ tools/bazel run //common:imx_abi_update_symbol_list Apply the following changes in the GKI Kernel tree: gki/common: Patch: 0001-PATCH-GKI-Kernel-tree-Drivers-for-the-ETH1-Interface.patch Build the GKI Image tools/bazel run //common:kernel_aarch64_dist​ Follow the build android boot.img and system_dlkm.img $ cp out/kernel_aarch64/dist/boot.img ${MY_ANDROID}/vendor/nxp/fsl-proprietary/ gki/boot.img $ cd ${MY_ANDROID} $ TARGET_IMX_KERNEL=true make bootimage # Change directory to the gki folder $ cp out/kernel_aarch64/dist/system_dlkm_staging_archive.tar.gz ${MY_ANDROID}/vendor/nxp/fsl-proprietary/gki/system_dlkm_staging_archive.tar.gz $ cd ${MY_ANDROID}/vendor/nxp/fsl-proprietary/gki $ tar -xzf system_dlkm_staging_archive.tar.gz -C system_dlkm_staging $ cd ${MY_ANDROID} $ make system_dlkmimag​e Create the tar.gz file for flash the android image (*.img, *.bat, *.sh, *.bin, *.imx) Boot the image and type lsmod to ensure the drivers are installed. Regards, Mario    
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Debian is a free to use and redistribute Linux distribution that is widely used by the community for industrial and desktop applications.  This distribution started in 1993 as Debian Project with Ian Murdock inviting developers to contribute in one of the first Linux distributions.  Debian takes an important role in Linux world with a clear idea about be a full featured and free distribution with over than 59,000 packages provided as a free to use and distribute that supports a wide range of functionalities.  Currently, Debian 12 supports 9 architectures which makes it in a universal operating system that can be implemented in embedded systems, desktops or servers.  Finally, Debian has been an inspiration for well-known Linux distributions such as Kali and Ubuntu.  In this guide we will check the installation process of Debian 12 for NXP microprocessors i.MX family, specifically for i.MX8M Mini, i.MX8M Nano, i.MX8M Plus and i.MX93.  For this purpose, we divided the document in the following topics: Hardware Requirements Software Requirements Host Preparation SD Card Preparation Copying Bootloader  Copying Kernel and DTB files Debian Installation Configure Base System Boot your target References   Hardware Requirements Linux Host computer (Ubuntu 20.04 or later) USB Card reader or Micro SD to SD adapter SD Card Evaluation Kit Board for the i.MX8M Nano, i.MX8M Mini, i.MX8M Plus or i.MX93   Software Requirements Linux Ubuntu (20.04 and 24.04 tested) or Debian for host BSP version 6.1.55 for your specific target (Embedded Linux for i.MX Applications Processors | NXP Semiconductors)   Host Preparation For Debian installation we will require some specific packages for host.  You can download the packages using the following command: $ sudo apt install debian-archive-keyring debootstrap qemu-user-static We must validate the key to verify the archive using the command: $ sudo apt-key add /usr/share/keyrings/debian-archive-keyring.gpg If running an older release you need to get the unstable keyring package (because the version in your release is probably too old to have the current key) $ wget http://ftp.debian.org/debian/pool/main/d/debian-archive-keyring/debian-archive-keyring_2023.4_all.deb $ sudo dpkg -i debian-archive-keyring_2023.4_all.deb   SD Card Preparation The Linux kernel running on the Linux host assigns a device node to the SD/MMC card reader. The kernel might decide the device node name or udev rules might be used. In the following instructions, it is assumed that udev is not used. To identify the device node assigned to the SD/MMC card, carry out the following command: $ cat /proc/partitions   Partitioning the SD card On most Linux host operating systems, the SD card is mounted automatically upon insertion. Therefore, before running fdisk, make sure that the SD card is unmounted if it was previously mounted (through sudo umount /dev/sdx). Start by running fdisk with root permissions. Use the instructions above to determine the card ID. We are using sdx as an example. $ sudo fdisk /dev/sdx  Type the following parameters (each followed by <ENTER>): $fdisk: p # lists the current partitions $fdisk: d # to delete existing partitions. Repeat this until no unnecessary partitions $fdisk: n # create a new partition $fdisk: p # create a primary partition - use for both partitions $fdisk: 1 # the first partition $fdisk: 20480 # starting at offset sector $fdisk: 1024000 # ending position of the first partition to be used for the boot Images $fdisk: p # to check the partitions $fdisk: n # create a new partition $fdisk: p # create a primary partition $fdisk: 2 # the second partition $fdisk: 1228800 # starting at offset sector, which leaves enough space for the kernel, the bootloader and its configuration data $fdisk: <enter> # using the default value will create a partition that extends to the last sector of the media $fdisk: p # to check the partitions $fdisk: w # this writes the partition table to the media and fdisk exits   Copying Bootloader and Kernel In this section we will copy the bootloader and kernel image to SD card.  First, we can create a new directory to unzip the BSP downloaded from the NXP site.  $ mkdir debian-imx $ cd debian-imx $ unzip ~/Downloads/LF_v6.1.55-2.2.0_images_<board>.zip Where board is: IMX8MPEVK IMX8MNEVK IMX8MMEVK IMX93EVK Then, copy the U-Boot image. $ sudo dd if=<U-Boot_image> of=/dev/sdx bs=1k seek=<offset> conv=fsync Where offset is: 33 - for i.MX 8M Mini 32 - for i.MX 8M Nano, i.MX 8M Plus, and i.MX 9 The sectors of SD/eMMC before the “offset” KB are reserved. It may include the partition table.   Copying Kernel image and DTB files This section describes how to load the kernel image and DTB. The pre-built SD card image uses the VFAT partition for storing kernel image and DTB, which requires a VFAT partition that is mounted as a Linux drive, and the files are copied into it. This is the preferred method. Default: VFAT partition Format partition 1 on the card as VFAT with this command: $ sudo mkfs.vfat /dev/sdx1 Mount the formatted partition with this command: $ mkdir mountpoint $ sudo mount /dev/sdx1 mountpoint Copy the zImage and *.dtb files to the mountpoint by using cp. The device tree names should match $ sudo cp *.dtb mountpoint/ $sudo cp Image-<board_name>.bin mountpoint/Image Where board_name is: imx8mpevk imx8mnevk imx8mmevk imx93evk the one used by the variable specified by U-Boot. Unmount the partition with this command: $ sudo umount mountpoint   Debian Installation For Debian installation we will use the official tool debootstrap. This tool allows us to install Debian without a disk and run the system using qemu in a different architecture.  Before using debootstrap tool we need to format and mount the second partition of the SD card with the commands below: $ sudo mkfs.ext4 /dev/sdx2 $ sudo mount /dev/sdx2 mountpoint/ debootstrap can download the needed files directly from the archive when you run it. You can substitute any Debian archive mirror for http.us.debian.org/debian in the command below, preferably a mirror close to you network-wise. Mirrors are listed at http://www.debian.org/mirror/list $ sudo debootstrap --arch arm64 --foreign bookworm mountpoint/ http://ftp.debian.org/debian This step takes a while and depends on the resources of your host machine.   Configure Base System Now you’ve got a real Debian system, though rather lean, on disk. chroot into it: $ sudo cp /usr/bin/qemu-aarch64-static mountpoint/usr/bin $ sudo LANG=C.UTF-8 chroot mountpoint/ qemu-aarch64-static /bin/bash After chrooting you may need to set the terminal definition to be compatible with the Debian base system, for example: $ export TERM=xterm-color we need to finish the multi-stage boot strap $ /debootstrap/debootstrap --second-stage At this point /dev/ only contains very basic device files. For the next steps of the installation, additional device files may be needed. There are different ways to go about this and which method you should use depends on the host system you are using for the installation, whether you intend to use a modular kernel or not, and whether you want to use dynamic (e.g. using udev) or static device files for the new system. A few of the available options are: install the makedev package, and create a default set of static device files using (after chrooting) $ apt install makedev $ mount none /proc -t proc $ cd /dev $ MAKEDEV generic With these next steps we will be setting up the Debian system:   Setting fstab FSTAB is a configuration table designed to ease the burden of mounting and unmounting file systems to a machine. $ nano /etc/fstab # stock fstab - you probably want to override this with a machine specific one /dev/root / auto defaults 1 1 proc /proc proc defaults 0 0 devpts /dev/pts devpts mode=0620,ptmxmode=0666,gid=5 0 0 tmpfs /run tmpfs mode=0755,nodev,nosuid,strictatime 0 0 tmpfs /var/volatile tmpfs defaults 0 0 # uncomment this if your device has a SD/MMC/Transflash slot #/dev/mmcblk0p1 /media/card auto defaults,sync,noauto 0 0   Setting Timezone The following command allows you to choose your timezone. $ dpkg-reconfigure tzdata   Configure apt Debootstrap will have created a very basic /etc/apt/sources.list that will allow installing additional packages. However, you may want to add some additional sources, for example for source packages and security updates: $ nano /etc/apt/sources.list deb http://deb.debian.org/debian bookworm main non-free-firmware deb-src http://deb.debian.org/debian bookworm main non-free-firmware deb http://deb.debian.org/debian-security/ bookworm-security main non-free-firmware deb-src http://deb.debian.org/debian-security/ bookworm-security main non-free-firmware deb http://deb.debian.org/debian bookworm-updates main non-free-firmware deb-src http://deb.debian.org/debian bookworm-updates main non-free-firmware Make sure to run the apt update after you have made changes to the sources list   Configure locales and keyboard To configure your locale settings to use a language other than English, install the locales support package and configure it. Currently, the use of UTF-8 locales is recommended. $ apt install locales $ dpkg-reconfigure locales To configure your keyboard (if needed): $ apt install console-setup $ dpkg-reconfigure keyboard-configuration Note that the keyboard cannot be set while in the chroot, but will be configured for the next reboot   Adding Users $ apt install sudo $ adduser imx $ usermod -aG sudo imx $ nano /etc/sudoers imx ALL=(ALL:ALL) ALL   Tasksel Installation As mentioned earlier, the installed system will be very basic. If you would like to make the system a bit more mature, there is an easy method to install all packages with “standard” priority: $ tasksel install standard $ apt clean $ exit $ sudo umount mountpoint/ $sync   Boot your target Now, you can boot your target from your SD Card. (Review your specific target documentation)   Configure Networking (after booting target) Based on Debian official documentation for new systems the common names for network interfaces such as eth0 or wlan0 are not used. Therefore, we will need to list the interfaces using: $ ls /sys/class/net To have ethernet connection we will need to create a file in the path etc/network/. $ sudo nano etc/network/interfaces Type the following commands on the file: auto lo iface lo inet loopback auto end0 iface end0 inet dhcp   Install Neofetch (Optional) $ apt install neofetch   Outputs  Debian 12 running on i.MX8MP Debian 12 running on i.MX93   References Chapter 1. Definitions and overview. (2021, January). Retrieved May 30, 2024, from https://www.debian.org/doc/manuals/debian-faq/basic-defs.en.html Debian GNU/Linux Installation Guide. (2024). https://www.debian.org/releases/stable/i386/install.en.pdf Arm64Port. (n.d.). https://wiki.debian.org/Arm64Port i.MX Linux User's Guide (nxp.com)
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The document will cover three parts, which include: A brief introduction to RSA algorithm How to compile boot image including OP-TEE-OS for Boot media - QSPI The steps to sign and verification The SoC for this experiment is based on i.MX8MP-EVK
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Hello, on this post I will explain how to record separated audio channels using an 8MIC-RPI-MX8 Board. As background about how to setup the board to record and play audio using i.MX boards, I suggest you take a look on the next post: How to configure, record and play audio using an 8MIC-RPI-MX8 Board. Requirements: I.MX 8M Mini EVK. Linux Binary Demo Files - i.MX 8MMini EVK. 8MIC-RPI-MX8 Board. Serial console emulator (Tera Term, Putty, etc.). Headphones/speakers. Waveform Audio Format WAV, known for WAVE (Waveform Audio File Format), is a subset of Microsoft’s Resource Interchange File Format (RIFF) specification for storing digital audio files. This format does not apply compression to the information and stores the audio with different sampling rates and bitrates. WAV files are larger in size compared to other formats such as MP3 which uses compression to reduce the file size while maintaining a good audio quality but, there is always some lose on quality since audio information is too random to be compressed with conventional methods, the main advantage of this format is provide an audio file without losses that is also widely used on studio. This files starts with a file header with data chunks. A WAV file consists of two sub-chunks: fmt chunk: data format. data chunk: sample data. So, is structured by a metadata that is called WAV file header and the actual audio information. The header of a WAV (RIFF) file is 44 bytes long and has the following format: How to separate the channels? To separate each audio channel from the recording we need to use the next command that will record raw data of each channel. arecord -D plughw:<audio device> -c<number of chanels> -f <format> -r <sample rate> -d <duration of the recording> --separate-channels <output file name>.wav arecord -D plughw:2,0 -c8 -f s16_le -r 48000 -d 10 --separate-channels sample.wav This command will output raw data of recorded channels as is showed below. This raw data cannot be used as a “normal” .wav file because the header information is missing. It is possible to confirm it if import raw data to a DAW and play recorded samples: So, to use this information we need to create the header for each file using WAVE library on python. Here the script that I used: import wave import os name = input("Enter the name of the audio file: ") os.system("arecord -D plughw:2,0 -c8 -f s16_le -r 48000 -d 10 --separate-channels " + name + ".wav") for i in range (0,8): with open(name + ".wav." + str(i), "rb") as in_file: data = in_file.read() with wave.open(name + "_channel_" + str(i) +".wav", "wb") as out_file: out_file.setnchannels(1) out_file.setsampwidth(2) out_file.setframerate(48000) out_file.writeframesraw(data) os.system("mkdir output_files") os.system("mv " + name + "_channel_" + "* " + "output_files") os.system("rm " + name + ".wav.*") If we run the script, will generate a directory with the eight audio channels in .wav format. Now, we will be able to play each channel individually using an audio player. References IBM, Microsoft Corporation. (1991). Multimedia Programming Interface and Data Specifications 1.0. Microsoft Corporation. (1994). New Multimedia Data Types and Data Techniques. Standford University. (2024, January 30). Retrieved from WAVE PCM sound file format: http://hummer.stanford.edu/sig/doc/classes/SoundHeader/WaveFormat/
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  Introduction   MATTER chip-tool android APK is a very useful tool for commission, control the MATTER network by smart phone. Vendor can add various features into the APK. It supports build by Android Studio and command line. The official build steps can be found here: https://github.com/project-chip/connectedhomeip/blob/master/docs/guides/android_building.md But the official guide does not cover how to build in a non-GUI linux distribution (without Android Studio installed). This article describes how to build under Ubuntu server. Install Android SDK  Install SDK command line from: https://developer.android.com/studio, And follow the steps: https://developer.android.com/tools/sdkmanager to install.  Install the Android-26 SDK and 23 NDK: $./sdkmanager "platforms;android-26" "ndk;23.2.8568313"  Export env  $export ANDROID_HOME=<SDK path>  $export ANDROID_NDK_HOME=<SDK path>/ndk/23.2.8568313/   Install kotlin (1.8.0)  $curl -s https://get.sdkman.io | bash  $sdk install kotlin 1.8.0  $whereis kotlin  $export PATH=$PATH:<patch of bin of kotlin>    Configure proxy for gradle  $ cat ~/.gradle/gradle.properties  # Set the socket timeout to 5 minutes (good for proxies)  org.gradle.internal.http.socketTimeout=300000  # the number of retries (initial included) (default 3)  org.gradle.internal.repository.max.retries=10  # the initial time before retrying, in milliseconds (default 125)  org.gradle.internal.repository.initial.backoff=500  systemProp.http.proxyHost=apac.nics.nxp.com  systemProp.http.proxyPort=8080  systemProp.http.nonProxyHosts=localhost|*.nxp.com  systemProp.https.proxyHost=apac.nics.nxp.com  systemProp.https.proxyPort=8080  systemProp.https.nonProxyHosts=localhost|*.nxp.com    Configure proxy  Configure proxy for download packages during build export FTP_PROXY="http://apac.nics.nxp.com:8080"  export HTTPS_PROXY="http://apac.nics.nxp.com:8080"  export HTTP_PROXY="http://apac.nics.nxp.com:8080"  export NO_PROXY="localhost,*.nxp.com"  export ftp_proxy="http://apac.nics.nxp.com:8080"  export http_proxy="http://apac.nics.nxp.com:8080"  export https_proxy="http://apac.nics.nxp.com:8080"  export no_proxy="localhost,*.nxp.com"    Patch for gradle java option  This step can be skipped if using OpenJDK16.  Otherwise if you're using OpenJDK 17 (Java 61), you have to upgrade the gradle from 7.1.1 to 7.3, and add java.io open to ALL-UNNAMED:  diff --git a/examples/android/CHIPTool/gradle.properties b/examples/android/CHIPTool/gradle.properties  index 71f72db8c8..5bce4b4528 100644  --- a/examples/android/CHIPTool/gradle.properties  +++ b/examples/android/CHIPTool/gradle.properties  @@ -6,7 +6,8 @@  # http://www.gradle.org/docs/current/userguide/build_environment.html  # Specifies the JVM arguments used for the daemon process.  # The setting is particularly useful for tweaking memory settings.  -org.gradle.jvmargs=-Xmx4096m -XX:MaxPermSize=2048m -XX:+HeapDumpOnOutOfMemoryError -Dfile.encoding=UTF-8  +#org.gradle.jvmargs=-Xmx4096m -XX:MaxPermSize=2048m -XX:+HeapDumpOnOutOfMemoryError -Dfile.encoding=UTF-8  +org.gradle.jvmargs=-Xmx4096m -XX:+HeapDumpOnOutOfMemoryError -Dfile.encoding=UTF-8  --add-opens=java.base/java.io=ALL-UNNAMED  # When configured, Gradle will run in incubating parallel mode.  # This option should only be used with decoupled projects. More details, visit  # http://www.gradle.org/docs/current/userguide/multi_project_builds.html#sec:decoupled_projects  diff --git a/examples/android/CHIPTool/gradle/wrapper/gradle-wrapper.properties b/examples/android/CHIPTool/gradle/wrapper/gradle-wrapper.properties  index 05679dc3c1..e750102e09 100644  --- a/examples/android/CHIPTool/gradle/wrapper/gradle-wrapper.properties  +++ b/examples/android/CHIPTool/gradle/wrapper/gradle-wrapper.properties  @@ -1,5 +1,5 @@  distributionBase=GRADLE_USER_HOME  distributionPath=wrapper/dists  -distributionUrl=https\://services.gradle.org/distributions/gradle-7.1.1-bin.zip  +distributionUrl=https\://services.gradle.org/distributions/gradle-7.3-bin.zip  zipStoreBase=GRADLE_USER_HOME  zipStorePath=wrapper/dists    Build & Install Clone all the modules from github: $git clone --single-branch --recurse-submodules https://github.com/project-chip/connectedhomeip.git Enviroment setup: $source scripts/bootstrap.sh Build: ./scripts/build/build_examples.py --target android-arm64-chip-tool build Install built apk into phone: $adb install out/android-arm64-chip-tool/outputs/apk/debug/app-debug.apk  
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Hello everyone! In this document you'll find an example on how to setup your own recipe for Yocto Project to add your own custom changes, such as custom device tree, patches, custom drivers, etc. Linux kernel used in this guide 6.1.36_2.1.0 At least 120(250)GB HDD in the host PC Ubuntu 20.04 or later host PC ##Host Setup $ sudo apt install gawk wget git diffstat unzip texinfo gcc build-essential chrpath socat cpio python3 python3-pip python3-pexpect xz-utils debianutils iputils-ping python3-git python3-jinja2 libegl1-mesa libsdl1.2-dev python3-subunit mesa-common-dev zstd liblz4-tool file locales -y $ sudo locale-gen en_US.UTF-8 ##Setup Repo utility $ mkdir ~/bin (this step may not be needed if the bin folder already exists) $ curl https://storage.googleapis.com/git-repo-downloads/repo > ~/bin/repo $ chmod a+x ~/bin/repo $ export PATH=~/bin:$PATH ##Git Setup $ git config --global user.name "Your Name" $ git config --global user.email "Your Email" $ git config --list ##Yocto Setup $ mkdir imx-yocto-bsp $ cd imx-yocto-bsp $ repo init -u https://github.com/nxp-imx/imx-manifest -b imx-linux-mickledore -m imx-6.1.36-2.1.0.xml $ repo sync $ DISTRO=fsl-imx-wayland MACHINE=imx8mp-lpddr4-evk source imx-setup-release.sh -b buildwayland ##Create the new layer $ cd ../sources $ bitbake-layers create-layer meta-newlayer ##Add the new layer to the bblayers.conf in the build directory $ bitbake-layers add-layer meta-newlayer ##Check that it has been added correctly $ tree -L 4 ./meta-newlayer ##Edit the new layer and delete the samples created by yocto $ cd meta-newlayer $ rm -r recipes-example $ rm conf/layer.conf ##Use any text editor to create the layer configuration $ nano conf/layer.conf ##Add the following to the layer configuration file BBPATH .= ":${LAYERDIR}" BBFILES += "${LAYERDIR}/recipes-*/*/*.bb \             ${LAYERDIR}/recipes-*/*/*.bbappend" BBFILE_COLLECTIONS += "meta-newlayer" BBFILE_PATTERN_meta-newlayer := "^${LAYERDIR}/" BBFILE_PRIORITY_meta-newlayer = "8" LAYERSERIES_COMPAT_meta-newlayer = "mickledore" ##Prepare bbappend files so the patches get applied $ mkdir -p recipes-kernel/linux $ cd recipes-kernel/linux $ nano linux-imx_%.bbappend ##Add the following to the .bbappend file FILESEXTRAPATHS:prepend := "${THISDIR}/files:" SRC_URI += "file://001-add-imx8mp-dts-test.patch" PACKAGE_ARCH = "${MACHINE_ARCH}" KERNEL_DEVICETREE:append = " freescale/imx8mp-evk-test.dtb" ##Copy the patches to the layer file path, for this example I have created a simple patch to just rename the default device tree. $ mkdir files $ cp ~/patches/001-add-imx8mp-dts-test.patch files ##Make sure that the layers is created correctly $ bitbake-layers show-layers  ##Finally we bitbake our image $ cd ~/imx-yocto-bsp/buildwayland $ bitbake imx-image-multimedia #All the images built should appear at  <build directory>/tmp/deploy/images/<machine> Hope everyone finds this useful! For any question regarding this document, please create a community thread and tag me if needed. Saludos/Regards, Aldo.  
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The user interface has limited the use of the tool GUI Guider. Getting an interaction only through a mouse or touchscreen can be enough for some use cases. However, sometimes the use case requires to go beyond its limitations. This video/appnote explores the possibility of integrating voice by creating a bridge between a speech recognition technology, such as VIT, and the interface creator GUI Guider. It uses a universal way to link all the voice recognition commands and a wakeword to any interaction created by GUI Guider. The following video shows the steps necessary to create that connection by creating the voice recognition using VIT voice commands and wakewords, create an interface of GUI Guider using a template, how to connect between them using the board i.MX 93 evk and testing it. For more information consult the following links AppNote HTML: https://docs.nxp.com/bundle/AN14270/page/topics/abstract.html?_gl=1*1glzg9k*_ga*NDczMzk4MDYuMTcxNjkyMDI0OA..*_ga_WM5LE0KMSH*MTcxNjkyMDI0OC4xLjEuMTcxNjkyMDcyMy4wLjAuMA AppNote PDF: https://www.nxp.com/docs/en/application-note/AN14270.pdf Associated File: AN14270SW  
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-- DTS for gpio wakeup   // SPDX-License-Identifier: (GPL-2.0+ OR MIT) /*  * Copyright 2022 NXP  */   #include "imx93-11x11-evk.dts"   / {         gpio-keys {                 compatible = "gpio-keys";                 pinctrl-names = "default";                 pinctrl-0 = <&pinctrl_gpio_keys>;                   power {                   label = "GPIO Key Power";                   linux,code = <KEY_POWER>;                   gpios = <&gpio2 7 GPIO_ACTIVE_LOW>;                   wakeup-source;                   debounce-interval = <20>;                   interrupt-parent = <&gpio2>;                   interrupts = <7 IRQ_TYPE_LEVEL_LOW>;                 };         }; };   &iomuxc {         pinctrl_gpio_keys: gpio_keys_grp {                 fsl,pins = <                         MX93_PAD_GPIO_IO07__GPIO2_IO07  0x31e                 >;         }; }; -- testing the switch GPIO  First check if your gpio dts configuration to make it act as a switch works or not After executing the command - 'evtest /dev/input/event1' Trigger an interrupt by connecting GPIO2 7 to GND, as soon as you do that, you will receive Event logs such as below:- This shows that your dts configuration for GPIO works.     -- Verify the interrupt         -- Go to sleep and then connect the GPIO to GND to trigger a wakeup, in the logs we see that kernel exits the suspend mode    
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The purpose of this document is to provide supportive information for selection of suitable LPDDR4 and DDR3L devices that are supported by i.MX 8/8X/8XLite family of processors to aid project feasibility assessment capabilities of customers that are evaluating the SoCs for usage in their products.  It is strongly recommended to consult with NXP and the respective memory vendor, the final choice of the memory part number to ensure that the device meets all the compatibility, availability, longevity and pricing requirements. Please note that some of the LPDDR4 devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the respective NXP i.MX 8 Hardware Developer's Guide available on NXP.com The i.MX8/8X/8XL Reference manuals declare that there are 16GB allocated for the DDR. Please note that this is only the address space, which is reserved for the DDR memory in the memory map. This specification does not guarantee that the entire region can be utilized as the maximum achievable densities listed below in the tables are restricted mainly by the addressing capabilities of the DDR controller, width of the data bus and other implementation-specific parameters as well as availability of supported devices on the market. For any questions related to specific DRAM part numbers please contact the respective DRAM vendor. For any questions regarding the i.MX SoC please contact your support representative or enter a support ticket.    LPDDR4 - maximum supported densities Please note that the SoCs only support memory devices that support either the LPDDR4 mode or support both LPDDR4 and LPDDR4X modes. Memory devices that support only the LPDDR4X mode are not supported. SoC Package Max data bus width Maximum density Assumed memory organization Notes i.MX 8QM/8QP 29x29 mm 32-bit (per controller) 32Gb/4GB (per controller) dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8QXP/8DXP 21x21 mm 32-bit 32Gb/4GB dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8QXP/8DXP 17x17 mm 16-bit 16Gb/2GB dual rank, single-channel  device with 16-row addresses (R0-R15) 1, 2, 3, 4, 9 i.MX 8XLite 15x15 mm 16-bit 32Gb/4GB dual rank, single channel  device with 17-row addresses (R0-R16) 1, 2, 3, 9   LPDDR4 - list of validated memories The validation process is an ongoing effort - updates of the table are expected. SoC Package Maximum validated density Validated part number (vendor) Notes i.MX 8QM/8QP 29x29 mm 24Gb/3GB (per controller) MT53B768M32D4NQ-062 AIT:B (Micron)  12 32Gb/4GB (per controller) K4FBE3D4HB-KHCL (Samsung) 10,11 32Gb/4GB (per controller) MT53E1G32D2FW-046 AUT:B (Micron, Z42M) 10, 11 32Gb/4GB (per controller) MT53D1024M32D4DT-046 AAT:D (Micron)  12 16Gb/2GB (per controller) MT53D512M32D2DS-046 WT:D (Micron) 10, 12 16Gb/2GB (per controller) NT6AN512T32AC-J1J (Nanya) 10, 11 16Gb/2GB (per controller) NT6AN512T32AC-J1H (Nanya) 10, 11 32Gb/4GB (per controller) NT6AN1024F32AC-J2J (Nanya) 10, 11 32Gb/4GB (per controller) NT6AN1024F32AC-J2H (Nanya) 10, 11 i.MX 8QXP/8DXP 21x21 mm 24Gb/3GB MT53B768M32D4NQ-062 AIT:B (Micron)  12 32Gb/4GB NT6AN1024F32AC-J2J (Nanya) 10, 11 32Gb/4GB NT6AN1024F32AC-J2H (Nanya) 10, 11 16Gb/2GB NT6AN512T32AC-J2J (Nanya) 10, 11 16Gb/2GB NT6AN512T32AC-J2H (Nanya) 10, 11 32Gb/4GB MT53D1024M32D4DT-046 AAT:D (Micron)  11 i.MX 8XLite 15x15 mm 8Gb/1GB MT53D512M16D1DS 046 AAT ES:D & Z9XGG (Micron)  12 4Gb/0.5GB K4F4E164HD-THCL (Samsung) 10, 11 8Gb/1GB NT6AN512M16AV-J1I (Nanya) 10, 11   LPDDR4 - list of incompatible devices Given the limitations mentioned in this document, the following memory devices were identified as incompatible with the particular SoCs as detailed in the following table:   Memory vendor Part Number Density Incompatible SoCs Incompatibility reason Samsung K4FHE3S4HA-KU(H/F)CL 24Gb/3Gb i.MX8QM/8QP, i.MX8QXP/8DXP The memory device requires 17th row address bit to function. Samsung K4UHE3S4AA-KU(H/F)CL 24Gb/3Gb i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL The memory device only supports the LPDDR4X mode. Samsung K4UJE3D4AA-KU(H/F)CL 48Gb/6GB i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL The memory device only supports the LPDDR4X mode. Samsung K4FCE3Q4HB-KU(H/F)CL 64Gb/8GB i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL A byte mode memory device. Samsung K4UCE3Q4AB-KU(H/F)CL 64Gb/8GB i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL A byte mode memory device. The device only supports the LPDDR4X mode.    DDR3L - maximum supported densities SoC Package Max data bus width Maximum density Assumed memory organization Notes i.MX 8QXP/8DXP 21x21 mm 32-bit 64Gb/8GB x8, 8Gb device with 16-row addresses and 11 column addresses 5, 6 i.MX 8QXP/8DXP 17x17 mm 16-bit 32Gb/4GB x8, 8Gb device with 16-row addresses and 11 column addresses 5, 7 i.MX 8XLite 15x15 mm 16-bit 16Gb/2GB x8, 8Gb device with 16-row addresses and 11 column addresses 5, 8   DDR3L - list of validated memories The validation process is an ongoing effort -  updates of the table are expected. SoC Package Density Validated part number (vendor) Notes i.MX 8QXP/8DXP 21x21 mm 8Gb/1GB 2x MT41K256M16TW-093 IT:P (Micron) 12 i.MX 8XLite 15x15 mm           4Gb/512MB MT41K256M16TW-093 IT:P (Micron) 12   Note 1: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standard JESD209-4A. Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that a DRAM with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The memory vendors often do not offer so many variants of single-channel memory devices. As an alternative, a dual-channel device with only one channel connected may be used. For example: A dual-rank, single-channel device with 16-row address bits has a density of 16Gb. If such a device is not available at the chosen supplier, a dual-rank, dual-channel device with 16-row address bits can be used instead. This device has a density of 32 Gb however since only one channel can be connected to the SoC, only half of the density is available (16 Gb). Usage of more than one discrete memory chip to overcome market constraints is not supported since only point-to-point connections are assumed for LPDDR4. Note 4: Devices with 17-row addresses (R0-R16) are not supported by the SoCs.  Note 5: The numbers are based purely on the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standard JESD79-3E/JESD79-3F. Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that a DRAM with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 6: The density can be achieved by connecting 8 single rank discrete devices with one 8Gb die each, 4 devices connected to each chip select, or by connecting 4 dual rank discrete devices with two 8Gb dies each. Note that this number of discrete devices significantly exceeds the number of devices used on the validation board (2 discrete devices, not taking into account the device used for ECC) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis hence practically, it is not recommended to use more than 2 discrete DDR3L devices. This corresponds to the maximum density of 16Gb/2GB in the case of the single rank devices containing one 8Gb die or 32Gb/4GB in the case of the dual-rank devices containing two 8Gb dies (x16 8Gb devices with 16-row addresses and 10 column addresses assumed instead of x8 devices in such case). Note 7: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select, or by connecting 2 dual rank discrete devices with two 8Gb dies each. Note that the first option exceeds the number of devices used on the validation board (2 discrete devices) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis, hence practically, it is not recommended to use more than 2 discrete DDR3L devices. This corresponds to the maximum density of 16Gb/2GB in the case of the single rank devices containing one 8Gb die or 32Gb/4GB in the case of the dual-rank devices containing two 8Gb dies. Note 8: The density can be achieved by connecting 2 single rank discrete devices with one 8Gb die each to the i.MX. 8XLite supports only one chip select for DDR3L therefore, dual-rank systems are not supported. Note 9: For single-channel (x16) memory devices, the current maximum available density in the market is 16Gb/2GB (Q2 2022). Note 10: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 11: Part is active. Reviewed May 16th 2024 Note 12: Part is obsolete. Additional Links i.MX 8M Quad/8M Mini/8M Nano/8M Plus - LPDDR4, DDR4 and DDR3L memory compatibility guide 
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We are pleased to announce that Config Tools for i.MX v15.1 are now available. Downloads & links To download the installer for all platforms, please login to our download site via:  https://www.nxp.com/design/designs/config-tools-for-i-mx-applications-processors:CONFIG-TOOLS-IMX Please refer to  Documentation  for installation and quick start guides. For further information about DDR config and validation, please go to this  blog post. Release Notes Full details on the release (features, known issues...)   Version 15.1 • On MacOS aarch64, the missing Overview is fixed. • TEE – Pin tables now only contain items for specific configuration (mask/security/interrupts).
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P3T1755DP is a ±0.5°C accurate temperature-to-digital converter with a -40 °C to +125 °C range. It uses an on-chip band gap temperature sensor and an A-to-D conversion technique with overtemperature detection. The temperature register always stores a 12-bit two's complement data, giving a temperature resolution of 0.0625 °C P3T1755DP which can be configured for different operation conditions: continuous conversion, one-shot mode, or shutdown mode.   The device has very good features but, unfortunately, is not supported by Linux yet!   The P31755 works very similarly to LM75, pct2075, and other compatibles.   We can add support to P3T1755 in the LM75.c program due to the process to communicate with the device is the same as LM75 and equivalents.   https://github.com/nxp-imx/linux-imx/blob/lf-6.1.55-2.2.0/drivers/hwmon/lm75.c route: drivers/hwmon/lm75.c   The modifications that we have to do are the next:    1. We have to add the configurations to the kernel on the imx_v8_defconfig file CONFIG_SENSORS_ARM_SCMI=y CONFIG_SENSORS_ARM_SCPI=y CONFIG_SENSORS_FP9931=y +CONFIG_SENSORS_LM75=m +CONFIG_HWMON=y +CONFIG_I2C=y +CONFIG_REGMAP_I2C=y CONFIG_SENSORS_LM90=m CONFIG_SENSORS_PWM_FAN=m CONFIG_SENSORS_SL28CPLD=m    2. Add the part on the list of parts compatible with the driver LM75.c enum lm75_type { /* keep sorted in alphabetical order */ max6626, max31725, mcp980x, + p3t1755, pct2075, stds75, stlm75,   3. Add the configuration in the structure lm75_params device_params[]. .default_resolution = 9, .default_sample_time = MSEC_PER_SEC / 18, }, + [p3t1755] = { + .default_resolution = 12, + .default_sample_time = MSEC_PER_SEC / 10, + }, [pct2075] = { .default_resolution = 11, .default_sample_time = MSEC_PER_SEC / 10,   Notes: You can change the configuration of the device using .set_mask and .clear_mask, see more details on LM75.c lines 57 to 78   4. Add the ID to the list in the structure i2c_device_id lm75_ids and of_device_id __maybe_unused lm75_of_match    { "max31725", max31725, }, { "max31726", max31725, }, { "mcp980x", mcp980x, }, + { "p3t1755", p3t1755, }, { "pct2075", pct2075, }, { "stds75", stds75, }, { "stlm75", stlm75, },   + { + .compatible = "nxp,p3t1755", + .data = (void *)p3t1755 + },   5. In addition to all modifications, I modify the device tree of my iMX8MP-EVK to connect the Sensor in I2C3 of the board.  https://github.com/nxp-imx/linux-imx/blob/lf-6.1.55-2.2.0/arch/arm64/boot/dts/freescale/imx8mp-evk.dts   }; }; + + p3t1755: p3t1755@48 { + compatible = "nxp,p3t1755"; + reg = <0x48>; + }; + };   Connections: We will use the expansion connector of the iMX8MP-EVK and J9 of the P3T1755DP-ARD board.   P3T1755DP-ARD board   iMX8MP-EVK   P3T1755DP-ARD ----> iMX8MP-EVK J9              ---------->            J21 +3v3 (Pin 9) ---> +3v3 (Pin 1) GND(Pin 7) ---> GND (PIN 9) SCL (Pin 4) ---> SCL (Pin 5) SDA (Pin 3) ---> SDA (Pin 3)     Reading the Sensor We can read the sensor using the next commands:   Read Temperature: $ cat /sys/class/hwmon/hwmon1/temp1_input Reading maximum temperature: $ cat /sys/class/hwmon/hwmon1/temp1_max Reading hysteresis: $ cat /sys/class/hwmon/hwmon1/temp1_max_hyst   https://www.nxp.com/design/design-center/development-boards-and-designs/analog-toolbox/arduino-shields-solutions/p3t1755dp-arduino-shield-evaluation-board:P3T1755DP-ARD    
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    The meta layer is designed for those guys who want to use i.MX8M series SOC and Yocto system to develop AGV and Robot.    The platform includes some key components: 1, ROS1 (kinetic, melodic) and ROS2(dashing, eloquent, foxy) 2, Real-time Linux solution : Xenomai 3.1 with ipipe 5.4.47 patch 3, Industrial protocol : libmodbus, linuxptp, ros-canopen, EtherCAT(TBD) 4, Security: Enhanced OpenSSL, Enhanced GmSSL, Enhanced eCryptfs, secure key store, secure boot(TBD), SE-Linux(TBD),  Dm-verity(TBD) The first release bases on i.MX Yocto release L5.4.47 2.2.0 and You need download Linux 5.4.47_2.2.0 according to​​ https://www.nxp.com/docs/en/user-guide/IMX_YOCTO_PROJECT_USERS_GUIDE.pdf  firstly. And then you can follow the below guide to build and test ROS and Xenomai. A, clone meta-robot-platform from gitee.com git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v0.1-L5.4.47-2.2.0 B, Adding the meta-robot-platform layer to your build 1,  copy meta-robot-platform into <i.MX Yocto folder>/source 2, You should create a symbol link: setup-imx-robot.sh -> sources/meta-robot-platform/imx/meta-robot/tools/setup-imx-robot.sh C, How to build Robot image (example for i.MX8MQ EVK board) $ DISTRO=imx-robot-xwayland MACHINE=imx8mqevk source setup-imx-robot.sh -r kinetic -b imx8mqevk-robot-kinetic [or DISTRO=imx-robot-xwayland MACHINE=imx8mqevk source setup-imx-robot.sh -r melodic -b imx8mqevk-robot-melodic ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mqevk source setup-imx-robot.sh -r dashing -b imx8mqevk-robot-dashing ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mqevk source setup-imx-robot.sh -r eloquent -b imx8mqevk-robot-eloquent ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mqevk source setup-imx-robot.sh -r foxy -b imx8mqevk-robot-foxy ] $ bitbake imx-robot-core [or bitbake imx-robot-system ] [or bitbake imx-robot-sdk ] And if you add XENOMAI_KERNEL_MODE = "cobalt" or XENOMAI_KERNEL_MODE = "mercury" in local.conf, you also can build real-time image with Xenomai by the below command: $ bitbake imx-robot-core-rt [or bitbake imx-robot-system-rt ] D, Robot image sanity testing //ROS1 Sanity Test #source /opt/ros/kinetic/setup.sh [or # source /opt/ros/melodic/setup.sh ] #echo $LD_LIBRARY_PATH #roscore & #rosnode list #rostopic list #only kinetic #rosmsg list #rosnode info /rosout //ROS2 Sanity Test #source ros_setup.sh #echo $LD_LIBRARY_PATH #ros2 topic list #ros2 msg list #only dashing #ros2 interface list #(sleep 5; ros2 topic pub /chatter std_msgs/String "data: Hello world") & #ros2 topic echo /chatter E, Xenomai sanity testing #/usr/xenomai/demo/cyclictest -p 50 -t 5 -m -n -i 1000 F, vSLAM demo You can find orb-slam2 demo under <i.MX Yocto folder>/sources/meta-robot-platform/imx/meta-robot/recipes-demo/orb-slam2. You should choose DISTRO=imx-robot-xwayland due to it depends on OpenCV with gtk+.   //////////////////////////////////////// update for Yocto L5.4.70 2.3.0  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v0.2-L5.4.70-2.3.0 for Yocto release L5.4.70 2.3.0 and it supports i.MX8M series (8MQ,8MM,8MN and 8MP) and i.MX8QM/QXP.  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v0.2-L5.4.70-2.3.0 Updating: 1, Support i.MX8QM and i.MX8QXP 2, Add ROS driver of RPLIDAR and Orbbec 3D cameras in ROS1 3, Upgrade OpenCV to 3.4.13. 4, Add imx-robot-agv image with orb-slam2 demo 5, Fix the issue which failed to create image when adding orb-slam2 6, Fix the issue which failed to create imx-robot sdk image when add package ISP and ML Note: Currently, orb-slam2 demo don't run on i.MX8MM platform due to its GPU don't support OpenGL ES3. imx-robot-sdk image is just for building ROS package on i.MX board, not  for cross-compile. You can try "bitbake imx-robot-system -c populate_sdk" to create cross-compile sdk without gmssl-bin. diff --git a/imx/meta-robot/recipes-core/images/imx-robot-system.bb b/imx/meta-robot/recipes-core/images/imx-robot-system.bb index 1991ab10..68f9ad31 100644 --- a/imx/meta-robot/recipes-core/images/imx-robot-system.bb +++ b/imx/meta-robot/recipes-core/images/imx-robot-system.bb @@ -35,7 +35,7 @@ CORE_IMAGE_EXTRA_INSTALL += " \ ${@bb.utils.contains('DISTRO_FEATURES', 'x11 wayland', 'weston-xwayland xterm', '', d)} \ ${ISP_PKGS} \ " -IMAGE_INSTALL += " clblast openblas libeigen opencv gmssl-bin" +IMAGE_INSTALL += " clblast openblas libeigen opencv" IMAGE_INSTALL += " \ ${ML_PKGS} \   //////////////////////////////////////// Update for Yocto L5.4.70 2.3.2  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v0.3-L5.4.70-2.3.2 for Yocto release L5.4.70 2.3.2 .  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v0.3-L5.4.70-2.3.2 Updated: 1, Upgrade to L5.4.70-2.3.2 2, Enable xenomai rtdm driver 3, Add NXP Software Content Register and BSP patches of i.MX8M Plus AI Robot board. Note: How to build for AI Robot board 1, DISTRO=imx-robot-wayland MACHINE=imx8mp-ddr4-ipc source setup-imx-robot.sh -r melodic -b imx8mp-ddr4-ipc-robot-melodic 2, Add BBLAYERS += " ${BSPDIR}/sources/meta-robot-platform/imx/meta-imx8mp-ai-robot " in bblayers.conf 3, bitbake imx-robot-sdk or bitbake imx-robot-agv   //////////////////////////////////////// Update for v1.0-L5.4.70-2.3.2  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v1.0-L5.4.70-2.3.2 .  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v1.0-L5.4.70-2.3.2 Updated: 1, Upgrade ROS1 Kinetic Kame to Release 2021-05-11 which is final sync. 2, Add IgH EtherCAT Master for Linux in i.MX Robot platform. //////////////////////////////////////// Update for v1.1-L5.4.70-2.3.2  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v1.1-L5.4.70-2.3.2 .  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v1.1-L5.4.70-2.3.2 Updated: 1, Add more packages passed building in ROS1 Kinetic Kame. 2, Change the board name (From IPC to AI-Robot) in Uboot and kernel for i.MX8M Plus AI Robot board. You can use the below setup command to build ROS image for AI Robot board: DISTRO=imx-robot-xwayland MACHINE=imx8mp-ai-robot source setup-imx-robot.sh -r kinetic -b imx8mp-ai-robot-robot-kinetic DISTRO=imx-robot-xwayland MACHINE=imx8mp-ai-robot source setup-imx-robot.sh -r melodic -b imx8mp-ai-robot-robot-melodic DISTRO=imx-robot-xwayland MACHINE=imx8mp-ai-robot source setup-imx-robot.sh -r dashing -b imx8mp-ai-robot-robot-dashing DISTRO=imx-robot-xwayland MACHINE=imx8mp-ai-robot source setup-imx-robot.sh -r eloquent -b imx8mp-ai-robot-robot-eloquent DISTRO=imx-robot-xwayland MACHINE=imx8mp-ai-robot source setup-imx-robot.sh -r foxy -b imx8mp-ai-robot-robot-foxy BTW, you should add BBLAYERS += " ${BSPDIR}/sources/meta-robot-platform/imx/meta-imx8mp-ai-robot " in conf/bblayers.conf.   //////////////////////////////////////// Update for v1.2-L5.4.70-2.3.3  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v1.2-L5.4.70-2.3.3 .  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v1.2-L5.4.70-2.3.3 Updated: 1, Update to Yocto release L5.4.70-2.3.3 2, Enable RTNet FEC driver, test on i.MX8M Mini EVK and i.MX8M Plus EVK. For the detailed information,  Please refer to the community post 移植实时Linux方案Xenomai到i.MX ARM64平台 (Enable Xenomai on i.MX ARM64 Platform)    //////////////////////////////////////// Update for v2.1-L5.10.52-2.1.0  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v2.1-L5.10.52-2.1.0 .  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v2.1.1-L5.10.52-2.1.0 Updated: 1, Update to Yocto release L5.10.52-2.1.0 2, Add ROS1 noetic, ROS2 galactic and rolling 3, Upgrade Xenomai to v3.2 4, Add vSLAM demo orb-slam3 5, Upgrade OpenCV to 3.4.15 for ROS1 A, Adding the meta-robot-platform layer to your build 1,  copy meta-robot-platform into <i.MX Yocto folder>/source 2, You should create a symbol link: setup-imx-robot.sh -> sources/meta-robot-platform/imx/meta-robot/tools/setup-imx-robot.sh B, How to build Robot image (example for i.MX8M Plus EVK board) $ DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r kinetic -b imx8mpevk-robot-kinetic [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r melodic -b imx8mpevk-robot-melodic ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r noetic-b imx8mpevk-robot-noetic] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r dashing -b imx8mpevk-robot-dashing ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r eloquent -b imx8mpevk-robot-eloquent ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r foxy -b imx8mpevk-robot-foxy ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r galactic -b imx8mpevk-robot-galactic ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r rolling -b imx8mpevk-robot-rolling ] $ bitbake imx-robot-agv [or bitbake imx-robot-core ] [or bitbake imx-robot-system ] [or bitbake imx-robot-sdk ]   //////////////////////////////////////// Update for v2.2-L5.10.72-2.2.0  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v2.2-L5.10.72-2.2.0 .  git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v2.2.0-L5.10.72-2.2.0 Updated: 1, Update to Yocto release L5.10.72-2.2.0   //////////////////////////////////////// Update for v2.2.3-L5.10.72-2.2.3  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v2.2.3-L5.10.72-2.2.3.  repo init -u https://github.com/nxp-imx/imx-manifest -b imx-linux-hardknott -m imx-5.10.72-2.2.3.xml git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v2.2.3-L5.10.72-2.2.3 1,  copy meta-robot-platform into <i.MX Yocto folder>/source 2, You should create a symbol link: setup-imx-robot.sh -> sources/meta-robot-platform/imx/meta-robot/tools/setup-imx-robot.sh Updated: 1, Update to Yocto release L5.10.72-2.2.3 2, Update ISP SDK (isp-imx) patch for Github changing.   //////////////////////////////////////// Update for v3.1-L5.15.71-2.2.0  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v3.1-L5.15.71-2.2.0.  repo init -u https://github.com/nxp-imx/imx-manifest -b imx-linux-kirkstone -m imx-5.15.71-2.2.0.xml git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v3.1-L5.15.71-2.2.0 1,  copy meta-robot-platform into <i.MX Yocto folder>/source 2, You should create a symbol link: setup-imx-robot.sh -> sources/meta-robot-platform/imx/meta-robot/tools/setup-imx-robot.sh Updated: 1, Update to Yocto release L5.15.71-2.2.0 and ROS1 Noetic and ROS2 Foxy to last version 2, Add ROS2 Humble and remove EOL distributions (ROS1 Kinetic, Melodic and ROS2 Dashing, Eloquent and Galactic). How to build Robot image (example for i.MX8M Plus EVK board) $DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r noetic-b imx8mpevk-robot-noetic [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r foxy -b imx8mpevk-robot-foxy ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r humble -b imx8mpevk-robot-humble ] $ bitbake imx-robot-sdk [or bitbake imx-robot-core ] [or bitbake imx-robot-system ] [or bitbake imx-robot-agv ]   //////////////////////////////////////// Update for v3.3-L5.15.71-2.2.0  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v3.3-L5.15.71-2.2.0.  repo init -u https://github.com/nxp-imx/imx-manifest -b imx-linux-kirkstone -m imx-5.15.71-2.2.0.xml git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout v3.3-L5.15.71-2.2.0 1,  copy meta-robot-platform into <i.MX Yocto folder>/source 2, You should create a symbol link: setup-imx-robot.sh -> sources/meta-robot-platform/imx/meta-robot/tools/setup-imx-robot.sh Updated: 1, Add vSLAM ROS demo based on i.MX vSLAM SDK and i.MX AIBot. The demo video is here: Autonomous Navigation with vSLAM, Based on the i.MX 8M Plus Applications Processor   2, Enable DDS Security and SROS2 for ROS 2’s security features. How to build Robot image (example for i.MX8M Plus EVK board) $DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r noetic-b imx8mpevk-robot-noetic [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r foxy -b imx8mpevk-robot-foxy ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r humble -b imx8mpevk-robot-humble ] $ bitbake imx-robot-sdk [or bitbake imx-robot-agv ] [or bitbake imx-robot-system ] [or bitbake imx-robot-core ]   //////////////////////////////////////// Update for v4.0-L6.1.55-2.2.0  /////////////////////////////////////////////////////////// New release package meta-robot-platform-v4.0-L6.1.55-2.2.0.  repo init -u https://github.com/nxp-imx/imx-manifest -b imx-linux-mickledore -m imx-6.1.55-2.2.0.xml git clone https://gitee.com/zxd2021-imx/meta-robot-platform.git git checkout mickledore-6.1.55 1,  copy meta-robot-platform into <i.MX Yocto folder>/source 2, You should create a symbol link: setup-imx-robot.sh -> sources/meta-robot-platform/imx/meta-robot/tools/setup-imx-robot.sh Updated: 1, Migrate i.MX Robot platform to Yocto mickledore with L6.1.55. 2, Add ROS2 iron. How to build Robot image (example for i.MX8M Plus EVK board) $DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r humble -b imx8mpevk-robot-humble [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r iron -b imx8mpevk-robot-iron ] [or DISTRO=imx-robot-xwayland MACHINE=imx8mpevk source setup-imx-robot.sh -r noetic-b imx8mpevk-robot-noetic] $ bitbake -k imx-robot-sdk [or bitbake imx-robot-agv ] [or bitbake imx-robot-system ] [or bitbake imx-robot-core ]  
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What is LGVL? LVGL is a graphics library to run on devices with limited resources. LVGL is fully open-source and has no external dependencies, works with any modern MCU or MPU, and can be used with any (RT)OS or bare metal setup. https://lvgl.io/   What is Framebuffer? The Linux framebuffer (fbdev) is a Linux subsystem used to show graphics on a display, typically manipulated on the system console   How to write on the frame buffer? The device is listed on de device list typically "fb0" on iMX.   1. Stop the window manager (Weston in our BSP) $ systemctl stop weston   2. Write random data on the frame buffer with the next command: $ cat /dev/urandom > /dev/fb0   You should see colored pixels on the screen   3. Restart the window manager. $ systemctl start weston     Cross-compiling the application   1. On the host computer we will clone the LGVL repo: $ git clone https://github.com/lvgl/lv_port_linux_frame_buffer.git -b release/v8.2 $ cd lv_port_linux_frame_buffer $ git submodule update --init --recursive 2. Configure the screen resolution, rotation, and the touch input.       2.1 The resolution is configured in lines 33 and 34 of the main.c disp_drv.hor_res = 1080; disp_drv.ver_res = 1920;           2.2 Rotation configured is on lines 32 and 57 of main.c. disp_drv.sw_rotate = 3; lv_disp_set_rotation(NULL, LV_DISP_ROT_270);     2.3 The touch input is configured on line 450 of lv_drv_conf.h # define EVDEV_NAME "/dev/input/event2"   Note: In my case is on /dev/input/event2 to check the inputs use the command "evtest"   3. Compile the application using the command "make"   Note: To compile the application on your host computer you have to set the environment.   4. Share the file called "demo" with your board and execute it on the board with the command $ ./demo   Note: You have to stop the weston service to run the application.     Notes: Tested on iMX8MN EVK with BSP 6.1.36 Works on Multimedia and Full image.
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Sometime need standalone compile device tree. Only Linux headers and device tree directory are needed.         
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This article is rather short that only mentions the script that is needed to make an iMX93EVK act as a USB mass storage device so that whenever you connect your iMX device to a windows/linux system via USB, it should get enumerated something like a usb drive.  The storage that is used in this example is mmc so the expectation is that you have inserted a mmc card in the slot. Below is the script:- #!/bin/sh   # This composite gadget include function: # - MASS STORAGE     # # Exit status is 0 for PASS, nonzero for FAIL # STATUS=0   # Check if there is udc available, if not, return fail UDC_DIR=/sys/class/udc if test "$(ls -A "$UDC_DIR")"; then echo "The available udc:" for entry in "$UDC_DIR"/* do echo "$entry" done else STATUS=1 echo "No udc available!" exit $STATUS; fi   id=1; udc_name=ci_hdrc.0 #back_file=/dev/mmcblk1 back_file=/tmp/lun0.img   mkdir /sys/kernel/config/usb_gadget/g$id cd /sys/kernel/config/usb_gadget/g$id   # Use NXP VID, i.MX8QXP PID echo 0x1fc9 > idVendor echo 0x12cf > idProduct   mkdir strings/0x409 echo 123456ABCDEF > strings/0x409/serialnumber echo NXP > strings/0x409/manufacturer echo "NXP iMX USB Composite Gadget" > strings/0x409/product   mkdir configs/c.1 mkdir configs/c.1/strings/0x409   echo 5 > configs/c.1/MaxPower echo 0xc0 > configs/c.1/bmAttributes   mkdir functions/mass_storage.1 echo $back_file > functions/mass_storage.1/lun.0/file ln -s functions/mass_storage.1 configs/c.1/   echo $udc_name > UDC First execute the script. After that insert the g_mass_storage module in the kernel by executing :- modprobe g_mass_storage file=/dev/mmcblk1 removable=1 In the dmesg output, you will see something like below:-   After that you can connect a C type USB cable to the USB1 port of imx93evk and the other end to any USB ports of a laptop. The moment it is connected, you would be able to see a USB drive similar to what you get when we connect a pen-drive. 
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This article introduces the overall functionality of i.MX8X security. Simulate the process of i.MX8X signature through OpenSSL provides readers with a deeper understanding of this process.   Because lots of limitation for attachments. Have to do following.  1. download                       T4549-i.MX8X security overview and AHAB deep dive.zip.001.zip                      T4549-i.MX8X security overview and AHAB deep dive.zip.002.zip                      T4549-i.MX8X security overview and AHAB deep dive.zip.003.zip 2. decompress                T4549-i.MX8X security overview and AHAB deep dive.zip.001.zip                T4549-i.MX8X security overview and AHAB deep dive.zip.002.zip                T4549-i.MX8X security overview and AHAB deep dive.zip.003.zip 3. Put together and decompress         T4549-i.MX8X security overview and AHAB deep dive.zip.001    T4549-i.MX8X security overview and AHAB deep dive.zip.002    T4549-i.MX8X security overview and AHAB deep dive.zip.003  
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