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No other company has the breadth and diversity of embedded solutions for addressing the challenge of IoT Security. From secure element ICs to advanced multimedia and networking processors, NXP delivers the technology needed for securing the entire Lifecycle of the end or edge node. In addition, with Edgescale Cloud services software, devices can be maintained from deployment until decomissioning. Join this class for an overview of NXP's security solution.

This hands-on workshop provides a detailed architecture description of Thread technology and wireless mesh networking. The main Thread concepts will be reviewed and analyzed thoroughly. The attendee will have a deep understanding of the main concepts and how these are mapped to the NXP software API. The session will close with hands-on training to enable the attendee to understand software usage and configuration, low-power features and security concepts.

In electronic systems, it is typical to have a central processing unit that interfaces with other peripheral devices, other sub-systems or the user. Often, the signals from these interconnects may be incompatible on both ends. Therefore, various semiconductor devices such as analog switches, voltage level translators and GPIO expanders are often used to bridge between the interconnects on the board. In this session, we will explore the application of these interface devices from NXP and discuss their applications in various customer systems.

Edge computing puts cloud-computing software infrastructure on embedded-class processing platforms to reduce latency and uplink bandwidth consumption. Ranging from 1-core to 16-core devices, integrating important I/O features and integrating a hardware root of trust, the Layerscape family is ideal for edge-computing platforms. Complementary software like EdgeScale increases these platforms ease of use and accelerates customers' time to market. This session provides an overview of running Edge compute applications on Layerscape family of processors. It covers the concept of Edge computing and why it is needed, and goes on to elaborate the various use-cases where it can be used. It explains how customers can use the Layerscape SDK to run container based Edge compute applications, and leverage popular Edge Compute frameworks from AWS, Azure, Alibaba amongst others.

This presentation will present a simple EM physics and geometry based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed can be used to reduce power supply noise and improve EMC. New research presented on the impact of discrete components on radiated and conducted emissions, with an emphasis on cost analysis. Results of recent research on various power supply PCB topology will be discussed.

Product training of MC33771x ICs for HV BMS. 1- Short BMS market introduction (incl. key players, requirements, competitors); 2- Introduction to NXP BMS roadmap and key products (BCC14, BCC6 & TPL); 3-Key BMS applications (14V, 48V, HV Daisy Chain, HV CAN, Wireless) including differentiation and value proposition; 4- Market, application, reference design and product outlook; 5- Functional safety aspects - system safety goal and how to implement functional safety.

As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

Autonomous vehicles are able to drive themselves without human supervision or input. Vehicles can also operate semi-autonomously - taking some control of aspects of driving, whilst a human driver retains control of others. In order to do this, the vehicle must be able to perceive its environment and make decisions about where it is safe and desirable to move, and do so. This session will go through various aspects of the algorithms for sensor fusion to build perception, map building and path planning with particular reference to the Blue Box development platform.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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