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Connects - Training Material

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Electronic system designers typically have a central processing unit that interfaces with other peripheral devices, other sub-systems or the user. Often, the signals from these interconnects may be incompatible on both ends. Therefore, various semiconductor devices such as analog switches, high speed switches, voltage level translators and GPIO expanders are often used to bridge between the interconnects on the board. In this session, we will present the broad portfolio of NXP’s interface and connectivity solutions that go around the processor. These solutions include signal switches, voltage translation, I2C interface devices, real time clocks, and temperature sensors. We will also present some solutions for managing the power to the system.
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This session will introduce the concept of firmware Over The Air (OTA) updates in the automotive market place. It will show why this feature will bring huge cost saving to OEMs and will be a must have feature in future car generations. It will discuss the challenges faced in in implementing an end to end solution and show how NXP is the leader in providing solutions to make it a reality.
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This class will provide an overview of NXP's broad and scalable MCU portfolio and give details on which product families are available for different markets and use cases. It will also give an overview of the unified tools, software and solutions that enable the portfolio.
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Introduction into secure element and use case overview secure element complementing secure µCs inside a car security infrastructure. Overview on tool chain including applet and secure gateway demonstrator.
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Join this session to understand the breakthrough security features integrated in the recently launched LPC5500 MCU Family. Along with Arm® TrustZone technology the LPC5500 SRAM PUF based key management makes security easy to use and easy to deploy. This session will start off by introducing the scope of securing a smart connected device. It will explain the need for addressing device life cycle in a scalable way that is easy to use and easy to deploy. Then it will detail the protected key management achievable when using LPC5500 with MCUXpresso Software & Tools.  
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Join us to learn how to develop PCBs of all kinds and the complexity to perform well in harsh environments.
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This session will present the advantages of H-bridge based window lifters against relay based ones, new functionalities that can be implemented and how NXP MagniV S12ZVMB64 microcontroller provides a well-integrated solution for a window lifter end node. With integrated functionalities like: internal regulator, GDU, PMF, ADC, current sensing, input capture and LIN physical layer.
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Complexity is increasing abruptly in the IVI market, while TTM has decreased from 5 to 2-3 years over a few product generations. The entire ecosystem is moving from a close to an open system model, and from proprietary/close source to standard interfaces/open source components. NXP is committed to support you in this new reality, as well as providing help in leveraging the extensive BOM NXP typically has in IVI solutions. Through the IVI Platform, NXP offers a solid and complete base for fast product development, integrating productized and optimized BSP and middleware components, with out of the box security. Find out more during a one hour presentation, covering platform features, delivery mechanisms, roadmap and availability.
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In this session you will learn how to design and what to expect from our free software tools.
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Using our product demonstration and reference design, this class will teach you how to build your own cloud connected end node with our latest power-efficient LPC54018 flashless MCU. We will use Amazon Web Services (AWS).
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This session covers NXP virtualization offering on Arm based platforms. The following will be covered: KVM; DPAA2 direct assignment; PCI direct assignment; VIRTIO I/O virtualization; DPDK/ODP enablement in Virtual Machine; VIRTIO IOMMU support for enhanced isolation in Virtual Machine; Linux Containers, Dockers; Libvirt; Performance analysis and optimization; Debugging support; Future plans; Universal CPE devices and SD-WAN forwarders and branch routers.
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Introducing our new radio middleware that will help accelerating customers time-to-market.
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This session will introduce NXP differentiated GaN technology for cellular band high power applications, including full cellular portfolio RF Power products.
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This course provides a system analysis of High Voltage Electric Inverter systems. It is a good session for everyone who wants to know more about NXP's electrification solutions. It reviews the architecture and functional safety of electric vehicle powertrain. Focus is on MC33GD3100 overview, key features and design support.
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This session will introduce the NXP mature and widely accepted solutions of RF products serve the DAS and small cell applications from 0.5W, 10W to 20W and 40W.
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This session will focus on tire localization: Dual axis sensors enable rotation rate detection and determination of drivers / passenger side in seconds. NogaroE: Enhanced features added to a proven volume production TPMS sensor. Gen 4x4: Next-generation of ultra-low power TPMS sensors in smallest package features increased accuracy and processing power.
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Learn how to develop a wireless connected product using BLE and/or Thread protocols.
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This session will provide an insight into all the sensor hardware and software tools, enabling customers to reduce their time to market. Find out about all the latest sensor tools and reference designs for IoT (Industrial/Medical) applications.
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NXP’s end-to-end solution for USB Type-C offers ease-of-use integration into customer designs and includes AC/DC converter for power supplies, PD PHY and CC Logic Controller, direct charging, signal re-drivers, signal switches, load switches and authentication.
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