Connects - Training Material

Discussions

In electronic systems, it is typical to have a central processing unit that interfaces with other peripheral devices, other sub-systems or the user. Often, the signals from these interconnects may be incompatible on both ends. Therefore, various semiconductor devices such as analog switches, voltage level translators and GPIO expanders are often used to bridge between the interconnects on the board. In this session, we will explore the application of these interface devices from NXP and discuss their applications in various customer systems.

Autonomous vehicles are able to drive themselves without human supervision or input. Vehicles can also operate semi-autonomously - taking some control of aspects of driving, whilst a human driver retains control of others. In order to do this, the vehicle must be able to perceive its environment and make decisions about where it is safe and desirable to move, and do so. This session will go through various aspects of the algorithms for sensor fusion to build perception, map building and path planning with particular reference to the Blue Box development platform.

Product training of MC33771x ICs for HV BMS. 1- Short BMS market introduction (incl. key players, requirements, competitors); 2- Introduction to NXP BMS roadmap and key products (BCC14, BCC6 & TPL); 3-Key BMS applications (14V, 48V, HV Daisy Chain, HV CAN, Wireless) including differentiation and value proposition; 4- Market, application, reference design and product outlook; 5- Functional safety aspects - system safety goal and how to implement functional safety.

Design, Software & Services DES-N1954 Hands-On Workshop ARM mbed OS the Open Source IoT Operating System DES-N2084 & DES-N1956 Hands-On Workshop: FreeRTOS Solutions for Kinetis MCUs DES-N1973 Hands-On Workshop Master Development on the LPCXpresso Toolchain with Our LPCOpen Development Kit Hands-On Workshop: Securing the IoT One Edge Node at a Time with Kinetis VIDEO PRESENTATION: FTF-DES-N1931 - i.MX 6QuadPlus and i.MX 6DualPlus Applications Processors-Performance-Tier Multicores for Visually Stunning Graphics-Centric Applications DES-N1936 i.MX 6UltraLite DDR Tools Overview and Hardware Design Considerations DES-N1940 i.MX 8 Graphics Architecture DES-N1957 Kinetis Enablement Industry's Most Comprehensive Software Tool Portfolio DES-N1967 Leveraging NXP LPC Microcontrollers to Maximize Energy Efficiency in Always-On Applications AMF-DES-T2001 - Power Distribution Made Easy DES-N1939 Teaching Things to See: Introduction to i.MX 8 Vision Architecture Insight & Innovation INS-N1981 Wireless MCU Overview Secure Connected & Automated Vehicles AUT-N1775 - Enabling Hybrid CAN Networks CAN FD Shield AUT-N1793 Hands-On Workshop S32 Design Studio and SDK AUT-N1797 MagniV Integrated Solutions for Motor Control VIDEO PRESENTATION: FTF-AUT-N1794 - S32K Scalable Next-Generation MCU Family with Advanced Features Secure Mobile, Healthcare & Wearables MHW-N1921 Digital High Efficiency AC/DC Resonant Supplies MHW-N1990 Enabling Ultimate Miniaturization and Customization with the Latest Single Chip System Module Technology MHW-N1988 Hands-on Workshop- Designing with NXP Bluetooth Smart Solution for Wearables and IoT Applications FTF-MHW-N1987 NXP Wearables & Fitness Platform and Solutions Roadmap Smart Networks NET-N1865 Introduction to QorIQ LS1012A - the Worlds Smallest and Lowest Power 64-bit Processor NET-N1868 Market Drivers and Time Sensitive Networks https://community.nxp.com/docs/DOC-331664 NET-N1863 What's Next for QorIQ - Portfolio and Roadmap

NXP offers a wide range of powerful microprocessors for the automotive and industrial markets. The memory selection of these systems can impact the performance, size, cost, power, reliability and longevity of your design. During this session we will discuss the new memories supported on the latest i.MX 8 Quad Max processor which is focused on automotive and industrial markets. For DRAM, this will include LPDDR4. For non-volatile memory, this will include Micron’s recently announced XccelaTM Octal SPI-NOR Flash and our newer e.MMC devices. These devices provide higher performance and are offered with automotive temperature and quality ratings. This session will provide designers with the information necessary to develop i.MX 8 systems for state-of-the-art automotive solutions.

In recent years, automotive cybersecurity has become a top priority for OEMs as several well publicized attacks on production vehicles stirred up public and government concern over both security and safety of connected vehicle systems. In this talk we will: Review major milestones and headlines related to automotive cybersecurity for 2016; Compare and contrast security techniques used in traditional IT infrastructure versus automotive computing systems; Examine where these traditional techniques fall short for automotive applications.

Learn how to move from physical to virtual network functions (VNFs) on ARM QorIQ platforms using KVM virtual machines and Docker containers with native DPAA2 and virtual virtio devices. Leverage packet processing, crypto acceleration and advanced offloads from DPDK/ODP and Linux native guest applications. Connect VNFs through virtual switching either using optimized user space implementations or offloading datapath into DPAA2 Advanced IO Processor. Make use of the switching functions provided by DPAA2 integrated Edge Virtual Bridge and L2 Switch. Leverage OPNFV integration and take advantage of distributed VNFs via Service Function Chaining.

Artificial intelligence and machine learning (AI/ML) are revolutionizing the industrial world. For maximal impact, AI/ML must be done close to where data is generated and the output of analysis used. It's an ideal workload for edge computing and complements NXP’s EdgeScale cloud-based device-management platform. Layerscape processors are well suited to hosting AI/ML workloads. Software from NXP and third parties helps enable developers to create industrial applications using AI/ML technology. These applications can be distributed, Layerscape-based edge nodes with endpoints performing multiple tasks including: addressing condition monitoring or first-level classification; running popular edge frameworks to deliver cloud-like services on premises, aggregating data from multiple endpoints or performing additional analysis; running cloud-based software analyzing data for long-term trends.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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