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Connects - Training Material

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This session will first provide an overview of the products, software and enablement that NXP's wireless connectivity MCU portfolio includes to address the IoT market. Then, it will provide a deeper dive and demo on the Thread™ networking technology and how to develop an application using NXP's Thread Stack and ZigBee® Dotdot application layer. This session will also introduce the NXP BLE product family including the latest QN9080/83 ultra low-power BLE WMCU and KW35/36 automotive and industrial BLE WMCU, detailing targeted use cases, the device features, highlighting BLE and stacks as well as supporting enablement.
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Understand the i.MX 8M family technical capabilities such as high-definition audio/video, 3D graphics and performance via a hands-on session. Attendees will be performing a series of labs using Linux® and Android® with the i.MX 8M Quad evaluation kit.
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NXP’s end-to-end solution for USB Type-C offers ease-of-use integration into customer designs and includes AC/DC converter for power supplies, PD PHY and CC Logic Controller, direct charging, signal re-drivers, signal switches, load switches and authentication.
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Learn how to develop a wireless connected product using BLE and/or Thread protocols.
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Motor control is moving to smart, reliability, high energy efficiency and high integration, digital control is the inevitable choice to meet the requirements. As old brand motor control MCU supplier, NXP provides the complete motor control MCU product portfolio and related reference solutions, covering from low end S08, dedicated 32-bit DSC, 32-bit Cortex M0+/M4/M7 based KE/KV to high performance 32-bit Cortex-M7 crossover i.MX RT. This session will introduce the market trend of motor control applications, basic motor control applications' requirements and NXP's offerings to meet these requirements. Finally, one dual stepper servo motors control demo is shown to better understand what NXP can provide to make motor control development easy.
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Security is critical to the growing market for IoT-enabled devices: There were already more than 5 billion connected devices in the world last year, and use is expected to grow to 12 billion by 2020. To support this rapid expansion, prominent internet players, including Alibaba, AWS, Google, IBM and Microsoft are establishing their own cloud services and industrial suppliers are moving quickly to broaden their private cloud offerings. At NXP, we believe strong security doesn't have to be hard to work with. Our "Plug & Trust" approach simplifies the implementation of strong security mechanisms in today's IoT devices. NXP's latest A71CH provides just this level of Plug & Trust IoT Security and delivers proven, chip-to-cloud security right out of the box, enabling every customer to secure IoT devices and safely connect to IoT clouds and services without writing security codes or exposing keys.
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Join this session to learn how to take advantage of the innovative features of LPC84x MCU family, the first of three LPC800 releases planned for 2017. Through product feature training and demonstrations, we will show how these low-power, ARM® Cortex®-M0+ based MCUs offer 8-bit simplicity for today’s entry-level 32-bit microcontroller market. We expect that you will leave this session with the right training and evaluation boards to get started immediately in your own embedded development.
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Along with industry leading performance and integration, the i.MX RT crossover processor family integrates strong security protections. With the latest NXP software and tools, every design can integrate boot authentication and encrypted execution. Join this session to use the MCUXpresso Tools to protect your design. Learn about the threats and attacks that can be mitigated for every embedded design.
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Designing automotive gateway applications using SDK drivers, software stacks and FreeRTOS.
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Low-power wearable/IoT applications are becoming more and more popular. In this session, we will go over some of the key aspects when considering the system-level power management solution for these application, pros and cons when choosing different topologies (for example, DC/DC regulator vs. LDO), overall system level power optimization, and key components selection consideration, etc.
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This class will cover basic operation and the internal mechanisms of DDR devices. The class will also cover available tools to enable and simplify bring-up and validation of a DDR subsystem.
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This session provides an overview of how to migrate to CAN FD. After a protocol overview, MCU initializations needed beyond CAN 2.0 are discussed. Implications of upgrading OEM topologies to CAN FD are presented including concepts of FDpassive and FD Shield to help ease migration.
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Show the importance of OTA updates and the requirements for a total system solution for FOTA.
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Product training of MC33771x ICs for HV BMS. 1- Short BMS market introduction (incl. key players, requirements, competitors); 2- Introduction to NXP BMS roadmap and key products (BCC14, BCC6 & TPL); 3-Key BMS applications (14V, 48V, HV Daisy Chain, HV CAN, Wireless) including differentiation and value proposition; 4- Market, application, reference design and product outlook; 5- Functional safety aspects - system safety goal and how to implement functional safety.
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High performance processing in systems with high functional safety requirements has historically been a small segment in the overall processing market. Aerospace, high-end industrial, train & power grid control are traditional applications requiring high computing power with high fault detection coverage, and this ‘niche’ is exploding due to highly autonomous vehicles. This session will review the use of NXP’s multicore processors in traditional safety critical applications, and the retroactive analysis of the Layerscape product family’s fault detection mechanisms and coverage.
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Deep dive into the vision processing architecture of the i.MX 8 family. Learn how to access the advanced processing features, the vision SDK, and the vision-based applications enabled by the i.MX 8 processor. This class provides an introduction to understanding the unique way in which machine vision is handled by i.MX 8. It forms a basic introduction class that is a precursor to the more advanced "Call Your Shot!" pool table demo class.
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Introduction and review of the latest family of Functional Safety System Basis Chips with integrated CAN FD PHY. Power Management and flexible safety features will be discussed as well as the operation and interconnection with MCUs. Also in this presentation, you’ll identify how the robustness of our design are verified in a real application environment to achieve a common goal of an excellent system reliability performance. From the ADAS to the drive train market that requires reliability, power scalability and safety, learn how our system Basis Chip solution can enable and simplify your design.
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Hands-on: How to build an automotive application using the S32 SDK for Power Architecture drivers and FreeRTOS. Integration with S32 Design Studio IDE, tips and tricks.
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This session will present the advantages of H-bridge based window lifters against relay based ones, new functionalities that can be implemented and how NXP MagniV S12ZVMB64 microcontroller provides a well-integrated solution for a window lifter end node. With integrated functionalities like: internal regulator, GDU, PMF, ADC, current sensing, input capture and LIN physical layer.
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Complexity is increasing abruptly in the IVI market, while TTM has decreased from 5 to 2-3 years over a few product generations. The entire ecosystem is moving from a close to an open system model, and from proprietary/close source to standard interfaces/open source components. NXP is committed to support you in this new reality, as well as providing help in leveraging the extensive BOM NXP typically has in IVI solutions. Through the IVI Platform, NXP offers a solid and complete base for fast product development, integrating productized and optimized BSP and middleware components, with out of the box security. Find out more during a one hour presentation, covering platform features, delivery mechanisms, roadmap and availability.
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