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Customer requirement: Use NOR boot as a backup — boot from NOR, then mount kernel, DTB, and rootfs from NAND.   Test module: https://www.nxp.com/design/design-center/development-boards-and-designs/m2-nand-flash-daughter-card:M2-NAND-FLASH       1. Why Does U-Boot Source Need Modification on i.MX95? i.MX93's boot ROM initializes the SD3_XXX and SD1_XXX PADs. On the i.MX93 EVK design, SD3_XXX is routed to the M.2 connector, and SD1_XXX is connected to eMMC.   For i.MX95, the boot ROM only initializes the XSPI1_XXX PADs. The FlexSPI signals can be muxed out from SD3_XXX, but the boot ROM cannot boot from SD3_XXX.   Due to these differences, the uboot.bin flashed into NOR must have the ability to read NAND. However, the default BSP always reads from NOR, so U-Boot must be modified to activate the M.2 NAND module. 2. Flashing NAND To flash NAND, a custom UUU script must be used. Using the built-in UUU spinand flashing script is not recommended — the built-in script assumes NAND is accessible in U-Boot, but the default imx-boot uses NOR. 2.1 UUU Script uuu_version 1.2.39 # Please replace below item with actual name # @_flash_fw.bin | boot loader firmware, for i.MX8QM/QX, it's different from _flash.bin, for all other platforms, it's same as _flash.bin # @_flash.bin | boot loader file burn to NAND # @_Image | linux kernel image, zImage for arm32, Image for arm64 # @_board.dtb | board dtb file # @_initramfs.cpio.zst.uboot | initramfs # @_tee | optee image # @_rootfs.tar.zst | rootfs # This command will be run when i.MX6/7 i.MX8MM, i.MX8MQ SDP: boot -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi # This command will be run when ROM support stream mode # i.MX8QXP, i.MX8QM, skip QSPI header SDPS: boot -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi -skipfhdr # These commands will be run when use SPL and will be skipped if no spl # SDPU will be deprecated. please use SDPV instead of SDPU # { SDPU: delay 1000 SDPU: write -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi -offset 0x10000 -skipfhdr SDPU: jump # } # These commands will be run when use SPL and will be skipped if no spl # if (SPL support SDPV) # { SDPV: delay 1000 SDPV: write -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi -skipspl -skipfhdr SDPV: jump # } FB: ucmd setenv fastboot_buffer ${loadaddr} FB: download -f Image.bin FB: ucmd setenv fastboot_buffer ${fdt_addr} FB: download -f imx95-19x19-evk.dtb FB: ucmd setenv fastboot_buffer ${initrd_addr} FB: download -f fsl-image-mfgtool-initramfs-imx_mfgtools.cpio.zst.u-boot FB: ucmd setenv bootargs ${bootargs} ${mtdparts} FB: ucmd setenv fdtfile imx95-19x19-evk.dtb #FB: ucmd setenv bootargs console=ttymxc3,115200 ${mtdparts} FB: acmd ${kboot} ${loadaddr} ${initrd_addr} ${fdt_addr} FBK: ucmd cat /proc/mtd FBK: ucmd rm -f /tmp/mtd.sh FBK: ucmd cat /proc/mtd | while read dev size erase name; do mtd=`echo $dev | sed 's/mtd//;s/://'`; name=`echo $name | tr -d '"'`; echo export $name=$mtd >> /tmp/mtd.sh; done # mapping name FBK: ucmd . /tmp/mtd.sh; [ -n "${bootloader}" ] && echo export nandboot=${bootloader} >> /tmp/mtd.sh FBK: ucmd . /tmp/mtd.sh; [ -n "${kernel}" ] && echo export nandkernel=${kernel} >> /tmp/mtd.sh FBK: ucmd . /tmp/mtd.sh; [ -n "${dtb}" ] && echo export nanddtb=${dtb} >> /tmp/mtd.sh FBK: ucmd . /tmp/mtd.sh; [ -n "${rootfs}" ] && echo export nandrootfs=${rootfs} >> /tmp/mtd.sh FBK: ucmd chmod 755 /tmp/mtd.sh FBK: ucmd cat /tmp/mtd.sh FBK: ucmd mount -t debugfs debugfs /sys/kernel/debug || true # write boot loader — this partition was set to read-only in DTS during testing, skip erase for now # FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nandboot} 0 0 # FBK: ucp imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi t:/tmp/boot # FBK: ucmd . /tmp/mtd.sh; cd /tmp; soc=`cat /sys/devices/soc0/soc_id 2>/dev/null`; pad=""; case "$soc" in MX8Q*|MX8DXL*|MX8MN*|MX8MP*) ;; *) pad="-x" ;; esac; kobs-ng init $pad -v --chip_0_device_path=/dev/mtd${nandboot} /tmp/boot # burn kernel FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nandkernel} 0 0 FBK: acmd . /tmp/mtd.sh; nandwrite -p /dev/mtd${nandkernel} - FBK: ucp Image.bin t:- FBK: sync # burn dtb FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nanddtb} 0 0 FBK: ucp imx95-19x19-evk.dtb t:/tmp/dtb FBK: ucmd . /tmp/mtd.sh; nandwrite -p /dev/mtd${nanddtb} /tmp/dtb # burn uTee # FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nandtee} 0 0 # FBK: ucp _tee t:/tmp/tee # FBK: ucmd . /tmp/mtd.sh; nandwrite -p /dev/mtd${nandtee} /tmp/tee # burn rootfs FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nandrootfs} 0 0 FBK: ucmd ubidetach /dev/ubi_ctrl -m ${nandrootfs} || true FBK: ucmd . /tmp/mtd.sh; ubiattach /dev/ubi_ctrl -m ${nandrootfs} FBK: ucmd ubimkvol /dev/ubi0 -N nandrootfs -m FBK: ucmd mkdir -p /mnt/mtd FBK: ucmd mount -t ubifs ubi0:nandrootfs /mnt/mtd FBK: acmd export EXTRACT_UNSAFE_SYMLINKS=1; tar --zstd --warning=no-timestamp -x -C /mnt/mtd FBK: ucp core-image-base-imx95-19x19-lpddr5-evk.rootfs-20260429064745.tar.zst t:- FBK: sync FBK: ucmd umount /mnt/mtd FBK: done 2.2 Linux Patch diff --git a/arch/arm64/boot/dts/freescale/imx95-19x19-evk.dts b/arch/arm64/boot/dts/freescale/imx95-19x19-evk.dts index d21335d8af84..0db2cefbab01 100644 --- a/arch/arm64/boot/dts/freescale/imx95-19x19-evk.dts +++ b/arch/arm64/boot/dts/freescale/imx95-19x19-evk.dts @@ -388,17 +388,47 @@ &flexspi1 { pinctrl-0 = <&pinctrl_flexspi1>; status = "okay"; - mt35xu01gbba: flash@0 { - compatible = "jedec,spi-nor"; - reg = <0>; - pinctrl-names = "default"; - pinctrl-0 = <&pinctrl_flexspi1_reset>; - reset-gpios = <&gpio5 11 GPIO_ACTIVE_LOW>; + W25N02KWZEIR: flash@0 { + compatible = "spi-nand"; #address-cells = <1>; #size-cells = <1>; - spi-max-frequency = <200000000>; - spi-tx-bus-width = <8>; - spi-rx-bus-width = <8>; + reg = <0>; + spi-max-frequency = <104000000>; + spi-tx-bus-width = <4>; + spi-rx-bus-width = <4>; + + partitions { + compatible = "fixed-partitions"; + #address-cells = <1>; + #size-cells = <1>; + + partition@0 { + label = "bootloader"; + reg = <0x000000 0x800000>; // 8MB + // read-only;//if you hope imx-boot read only + }; + + partition@1 { + label = "config"; + reg = <0x800000 0x800000>; //8MB + }; + + partition@2 { + label = "kernel"; + reg = <0x1000000 0x2800000>; //40MB + }; + + partition@3 { + label = "dtb"; + reg = <0x3800000 0x20000>; //128K + }; + + partition@4 { + label = "rootfs"; + reg = <0x3820000 0xFFFFFFFF>; + linux,rootfs; + }; + }; }; }; @@ -887,17 +917,12 @@ IMX95_PAD_GPIO_IO27__CAN2_RX 0x39e pinctrl_flexspi1: flexspi1grp { fsl,pins = < - IMX95_PAD_XSPI1_SS0_B__FLEXSPI1_A_SS0_B 0x3fe - IMX95_PAD_XSPI1_SCLK__FLEXSPI1_A_SCLK 0x3fe - IMX95_PAD_XSPI1_DQS__FLEXSPI1_A_DQS 0x3fe - IMX95_PAD_XSPI1_DATA0__FLEXSPI1_A_DATA_BIT0 0x3fe - IMX95_PAD_XSPI1_DATA1__FLEXSPI1_A_DATA_BIT1 0x3fe - IMX95_PAD_XSPI1_DATA2__FLEXSPI1_A_DATA_BIT2 0x3fe - IMX95_PAD_XSPI1_DATA3__FLEXSPI1_A_DATA_BIT3 0x3fe - IMX95_PAD_XSPI1_DATA4__FLEXSPI1_A_DATA_BIT4 0x3fe - IMX95_PAD_XSPI1_DATA5__FLEXSPI1_A_DATA_BIT5 0x3fe - IMX95_PAD_XSPI1_DATA6__FLEXSPI1_A_DATA_BIT6 0x3fe - IMX95_PAD_XSPI1_DATA7__FLEXSPI1_A_DATA_BIT7 0x3fe + IMX95_PAD_SD3_CMD__FLEXSPI1_A_SS0_B 0x3fe + IMX95_PAD_SD3_CLK__FLEXSPI1_A_SCLK 0x3fe + IMX95_PAD_SD3_DATA0__FLEXSPI1_A_DATA_BIT0 0x3fe + IMX95_PAD_SD3_DATA1__FLEXSPI1_A_DATA_BIT1 0x3fe + IMX95_PAD_SD3_DATA2__FLEXSPI1_A_DATA_BIT2 0x3fe + IMX95_PAD_SD3_DATA3__FLEXSPI1_A_DATA_BIT3 0x3fe >; }; 2.3 Flashing Log 2:31-182BA9E87D9840BA>Start Cmd:SDPS: boot -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi -skipfhdr 100%2:31-182BA9E87D9840BA>Okay (5.364s) New USB Device Attached at 2:31-182BA9E87D9840BA 2:31-182BA9E87D9840BA>Start Cmd:SDPV: delay 1000 2:31-182BA9E87D9840BA>Okay (1.009s) 2:31-182BA9E87D9840BA>Start Cmd:SDPV: write -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi -skipspl -skipfhdr 100%2:31-182BA9E87D9840BA>Okay (3.165s) 2:31-182BA9E87D9840BA>Start Cmd:SDPV: jump 100%2:31-182BA9E87D9840BA>Okay (0.017s) New USB Device Attached at 2:31-182BA9E87D9840BA 2:31-182BA9E87D9840BA>Start Cmd:FB: ucmd setenv fastboot_buffer ${loadaddr} 2:31-182BA9E87D9840BA>Okay (0.014s) 2:31-182BA9E87D9840BA>Start Cmd:FB: download -f Image.bin 2:31-182BA9E87D9840BA>Okay (1.715s) 2:31-182BA9E87D9840BA>Start Cmd:FB: ucmd setenv fastboot_buffer ${fdt_addr} 2:31-182BA9E87D9840BA>Okay (0.011s) 2:31-182BA9E87D9840BA>Start Cmd:FB: download -f imx95-19x19-evk.dtb 2:31-182BA9E87D9840BA>Okay (0.026s) 2:31-182BA9E87D9840BA>Start Cmd:FB: ucmd setenv fastboot_buffer ${initrd_addr} 2:31-182BA9E87D9840BA>Okay (0.011s) 2:31-182BA9E87D9840BA>Start Cmd:FB: download -f fsl-image-mfgtool-initramfs-imx_mfgtools.cpio.zst.u-boot 2:31-182BA9E87D9840BA>Okay (0.702s) 2:31-182BA9E87D9840BA>Start Cmd:FB: ucmd setenv bootargs ${bootargs} ${mtdparts} 2:31-182BA9E87D9840BA>Okay (0.011s) 2:31-182BA9E87D9840BA>Start Cmd:FB: ucmd setenv fdtfile imx95-19x19-evk.dtb 2:31-182BA9E87D9840BA>Okay (0.011s) 2:31-182BA9E87D9840BA>Start Cmd:FB: acmd ${kboot} ${loadaddr} ${initrd_addr} ${fdt_addr} 2:31-182BA9E87D9840BA>Okay (0.007s) New USB Device Attached at 2:31-0000000000000000 2:31-0000000000000000>Start Cmd:FBK: ucmd cat /proc/mtd dev: size erasesize name mtd0: 00800000 00020000 "bootloader" mtd1: 00800000 00020000 "config" mtd2: 02800000 00020000 "kernel" mtd3: 00020000 00020000 "dtb" mtd4: 0c7e0000 00020000 "rootfs" 2:31-0000000000000000>Okay (0.015s) 2:31-0000000000000000>Start Cmd:FBK: ucmd rm -f /tmp/mtd.sh 2:31-0000000000000000>Okay (0.007s) 2:31-0000000000000000>Start Cmd:FBK: ucmd cat /proc/mtd | while read dev size erase name; do mtd=`echo $dev | sed 's/mtd//;s/://'`; name=`echo $name | tr -d '"'`; echo export $name=$mtd >> /tmp/mtd.sh; done 2:31-0000000000000000>Okay (0.077s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; [ -n "${bootloader}" ] && echo export nandboot=${bootloader} >> /tmp/mtd.sh 2:31-0000000000000000>Okay (0.006s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; [ -n "${kernel}" ] && echo export nandkernel=${kernel} >> /tmp/mtd.sh 2:31-0000000000000000>Okay (0.008s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; [ -n "${dtb}" ] && echo export nanddtb=${dtb} >> /tmp/mtd.sh 2:31-0000000000000000>Okay (0.006s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; [ -n "${rootfs}" ] && echo export nandrootfs=${rootfs} >> /tmp/mtd.sh 2:31-0000000000000000>Okay (0.008s) 2:31-0000000000000000>Start Cmd:FBK: ucmd chmod 755 /tmp/mtd.sh 2:31-0000000000000000>Okay (0.007s) 2:31-0000000000000000>Start Cmd:FBK: ucmd cat /tmp/mtd.sh export name=dev export bootloader=0 export config=1 export kernel=2 export dtb=3 export rootfs=4 export nandboot=0 export nandkernel=2 export nanddtb=3 export nandrootfs=4 2:31-0000000000000000>Okay (0.007s) 2:31-0000000000000000>Start Cmd:FBK: ucmd mount -t debugfs debugfs /sys/kernel/debug || true 2:31-0000000000000000>Okay (0.01s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nandkernel} 0 0 Erasing 40960 Kibyte @ 0 -- 100 % complete 2:31-0000000000000000>Okay (0.856s) 2:31-0000000000000000>Start Cmd:FBK: acmd . /tmp/mtd.sh; nandwrite -p /dev/mtd${nandkernel} - 2:31-0000000000000000>Okay (0.051s) 2:31-0000000000000000>Start Cmd:FBK: ucp Image.bin t:- 33%Writing data to block 0 at offset 0x0 Writing data to block 1 at offset 0x20000 Writing data to block 2 at offset 0x40000 Writing data to block 3 at offset 0x60000 Writing data to block 4 at offset 0x80000 Writing data to block 5 at offset 0xa0000 Writing data to block 6 at offset 0xc0000 Writing data to block 7 at offset 0xe0000 Writing data to block 8 at offset 0x100000 Writing data to block 9 at offset 0x120000 Writing data to block 10 at offset 0x140000 Writing data to block 11 at offset 0x160000 Writing data to block 12 at offset 0x180000 Writing data to block 13 at offset 0x1a0000 Writing data to block 14 at offset 0x1c0000 Writing data to block 15 at offset 0x1e0000 Writing data to block 16 at offset 0x200000 Writing data to block 17 at offset 0x220000 Writing data to block 18 at offset 0x240000 Writing data to block 19 at offset 0x260000 Writing data to block 20 at offset 0x280000 Writing data to block 21 at offset 0x2a0000 Writing data to block 22 at offset 0x2c0000 Writing data to block 23 at offset 0x2e0000 Writing data to block 24 at offset 0x300000 Writing data to block 25 at offset 0x320000 Writing data to block 26 at offset 0x340000 Writing data to block 27 at offset 0x360000 Writing data to block 28 at offset 0x380000 Writing data to block 29 at offset 0x3a0000 Writing data to block 30 at offset 0x3c0000 Writing data to block 31 at offset 0x3e0000 Writing data to block 32 at offset 0x400000 Writing data to block 33 at offset 0x420000 Writing data to block 34 at offset 0x440000 Writing data to block 35 at offset 0x460000 Writing data to block 36 at offset 0x480000 Writing data to block 37 at offset 0x4a0000 Writing data to block 38 at offset 0x4c0000 Writing data to block 39 at offset 0x4e0000 Writing data to block 40 at offset 0x500000 Writing data to block 41 at offset 0x520000 Writing data to block 42 at offset 0x540000 Writing data to block 43 at offset 0x560000 Writing data to block 44 at offset 0x580000 Writing data to block 45 at offset 0x5a0000 Writing data to block 46 at offset 0x5c0000 Writing data to block 47 at offset 0x5e0000 Writing data to block 48 at offset 0x600000 Writing data to block 49 at offset 0x620000 Writing data to block 50 at offset 0x640000 Writing data to block 51 at offset 0x660000 Writing data to block 52 at offset 0x680000 Writing data to block 53 at offset 0x6a0000 Writing data to block 54 at offset 0x6c0000 Writing data to block 55 at offset 0x6e0000 Writing data to block 56 at offset 0x700000 Writing data to block 57 at offset 0x720000 Writing data to block 58 at offset 0x740000 Writing data to block 59 at offset 0x760000 Writing data to block 60 at offset 0x780000 Writing data to block 61 at offset 0x7a0000 Writing data to block 62 at offset 0x7c0000 Writing data to block 63 at offset 0x7e0000 Writing data to block 64 at offset 0x800000 Writing data to block 65 at offset 0x820000 Writing data to block 66 at offset 0x840000 Writing data to block 67 at offset 0x860000 Writing data to block 68 at offset 0x880000 Writing data to block 69 at offset 0x8a0000 Writing data to block 70 at offset 0x8c0000 Writing data to block 71 at offset 0x8e0000 Writing data to block 72 at offset 0x900000 Writing data to block 73 at offset 0x920000 Writing data to block 74 at offset 0x940000 Writing data to block 75 at offset 0x960000 Writing data to block 76 at offset 0x980000 Writing data to block 77 at offset 0x9a0000 Writing data to block 78 at offset 0x9c0000 Writing data to block 79 at offset 0x9e0000 Writing data to block 80 at offset 0xa00000 Writing data to block 81 at offset 0xa20000 Writing data to block 82 at offset 0xa40000 Writing data to block 83 at offset 0xa60000 Writing data to block 84 at offset 0xa80000 Writing data to block 85 at offset 0xaa0000 Writing data to block 86 at offset 0xac0000 Writing data to block 87 at offset 0xae0000 Writing data to block 88 at offset 0xb00000 Writing data to block 89 at offset 0xb20000 Writing data to block 90 at offset 0xb40000 Writing data to block 91 at offset 0xb60000 Writing data to block 92 at offset 0xb80000 65%t offset 0xba0000k 93 a Writing data to block 94 at offset 0xbc0000 Writing data to block 95 at offset 0xbe0000 Writing data to block 96 at offset 0xc00000 Writing data to block 97 at offset 0xc20000 Writing data to block 98 at offset 0xc40000 Writing data to block 99 at offset 0xc60000 Writing data to block 100 at offset 0xc80000 Writing data to block 101 at offset 0xca0000 Writing data to block 102 at offset 0xcc0000 Writing data to block 103 at offset 0xce0000 Writing data to block 104 at offset 0xd00000 Writing data to block 105 at offset 0xd20000 Writing data to block 106 at offset 0xd40000 Writing data to block 107 at offset 0xd60000 Writing data to block 108 at offset 0xd80000 Writing data to block 109 at offset 0xda0000 Writing data to block 110 at offset 0xdc0000 Writing data to block 111 at offset 0xde0000 Writing data to block 112 at offset 0xe00000 Writing data to block 113 at offset 0xe20000 Writing data to block 114 at offset 0xe40000 Writing data to block 115 at offset 0xe60000 Writing data to block 116 at offset 0xe80000 Writing data to block 117 at offset 0xea0000 Writing data to block 118 at offset 0xec0000 Writing data to block 119 at offset 0xee0000 Writing data to block 120 at offset 0xf00000 Writing data to block 121 at offset 0xf20000 Writing data to block 122 at offset 0xf40000 Writing data to block 123 at offset 0xf60000 Writing data to block 124 at offset 0xf80000 Writing data to block 125 at offset 0xfa0000 Writing data to block 126 at offset 0xfc0000 Writing data to block 127 at offset 0xfe0000 Writing data to block 128 at offset 0x1000000 Writing data to block 129 at offset 0x1020000 Writing data to block 130 at offset 0x1040000 Writing data to block 131 at offset 0x1060000 Writing data to block 132 at offset 0x1080000 Writing data to block 133 at offset 0x10a0000 Writing data to block 134 at offset 0x10c0000 Writing data to block 135 at offset 0x10e0000 Writing data to block 136 at offset 0x1100000 Writing data to block 137 at offset 0x1120000 Writing data to block 138 at offset 0x1140000 Writing data to block 139 at offset 0x1160000 Writing data to block 140 at offset 0x1180000 Writing data to block 141 at offset 0x11a0000 Writing data to block 142 at offset 0x11c0000 Writing data to block 143 at offset 0x11e0000 Writing data to block 144 at offset 0x1200000 Writing data to block 145 at offset 0x1220000 Writing data to block 146 at offset 0x1240000 Writing data to block 147 at offset 0x1260000 Writing data to block 148 at offset 0x1280000 Writing data to block 149 at offset 0x12a0000 Writing data to block 150 at offset 0x12c0000 Writing data to block 151 at offset 0x12e0000 Writing data to block 152 at offset 0x1300000 Writing data to block 153 at offset 0x1320000 Writing data to block 154 at offset 0x1340000 Writing data to block 155 at offset 0x1360000 Writing data to block 156 at offset 0x1380000 Writing data to block 157 at offset 0x13a0000 Writing data to block 158 at offset 0x13c0000 Writing data to block 159 at offset 0x13e0000 Writing data to block 160 at offset 0x1400000 Writing data to block 161 at offset 0x1420000 Writing data to block 162 at offset 0x1440000 Writing data to block 163 at offset 0x1460000 Writing data to block 164 at offset 0x1480000 Writing data to block 165 at offset 0x14a0000 Writing data to block 166 at offset 0x14c0000 Writing data to block 167 at offset 0x14e0000 Writing data to block 168 at offset 0x1500000 Writing data to block 169 at offset 0x1520000 Writing data to block 170 at offset 0x1540000 Writing data to block 171 at offset 0x1560000 Writing data to block 172 at offset 0x1580000 Writing data to block 173 at offset 0x15a0000 Writing data to block 174 at offset 0x15c0000 Writing data to block 175 at offset 0x15e0000 Writing data to block 176 at offset 0x1600000 Writing data to block 177 at offset 0x1620000 Writing data to block 178 at offset 0x1640000 Writing data to block 179 at offset 0x1660000 Writing data to block 180 at offset 0x1680000 Writing data to block 181 at offset 0x16a0000 Writing data to block 182 at offset 0x16c0000 97%3 at offset 0x16e0000 Writing data to block 184 at offset 0x1700000 Writing data to block 185 at offset 0x1720000 Writing data to block 186 at offset 0x1740000 Writing data to block 187 at offset 0x1760000 Writing data to block 188 at offset 0x1780000 Writing data to block 189 at offset 0x17a0000 Writing data to block 190 at offset 0x17c0000 Writing data to block 191 at offset 0x17e0000 Writing data to block 192 at offset 0x1800000 Writing data to block 193 at offset 0x1820000 Writing data to block 194 at offset 0x1840000 Writing data to block 195 at offset 0x1860000 Writing data to block 196 at offset 0x1880000 Writing data to block 197 at offset 0x18a0000 Writing data to block 198 at offset 0x18c0000 Writing data to block 199 at offset 0x18e0000 Writing data to block 200 at offset 0x1900000 Writing data to block 201 at offset 0x1920000 Writing data to block 202 at offset 0x1940000 Writing data to block 203 at offset 0x1960000 Writing data to block 204 at offset 0x1980000 Writing data to block 205 at offset 0x19a0000 Writing data to block 206 at offset 0x19c0000 Writing data to block 207 at offset 0x19e0000 Writing data to block 208 at offset 0x1a00000 Writing data to block 209 at offset 0x1a20000 Writing data to block 210 at offset 0x1a40000 Writing data to block 211 at offset 0x1a60000 Writing data to block 212 at offset 0x1a80000 Writing data to block 213 at offset 0x1aa0000 Writing data to block 214 at offset 0x1ac0000 Writing data to block 215 at offset 0x1ae0000 Writing data to block 216 at offset 0x1b00000 Writing data to block 217 at offset 0x1b20000 Writing data to block 218 at offset 0x1b40000 Writing data to block 219 at offset 0x1b60000 Writing data to block 220 at offset 0x1b80000 Writing data to block 221 at offset 0x1ba0000 Writing data to block 222 at offset 0x1bc0000 Writing data to block 223 at offset 0x1be0000 Writing data to block 224 at offset 0x1c00000 Writing data to block 225 at offset 0x1c20000 Writing data to block 226 at offset 0x1c40000 Writing data to block 227 at offset 0x1c60000 Writing data to block 228 at offset 0x1c80000 Writing data to block 229 at offset 0x1ca0000 Writing data to block 230 at offset 0x1cc0000 Writing data to block 231 at offset 0x1ce0000 Writing data to block 232 at offset 0x1d00000 Writing data to block 233 at offset 0x1d20000 Writing data to block 234 at offset 0x1d40000 Writing data to block 235 at offset 0x1d60000 Writing data to block 236 at offset 0x1d80000 Writing data to block 237 at offset 0x1da0000 Writing data to block 238 at offset 0x1dc0000 Writing data to block 239 at offset 0x1de0000 Writing data to block 240 at offset 0x1e00000 Writing data to block 241 at offset 0x1e20000 Writing data to block 242 at offset 0x1e40000 Writing data to block 243 at offset 0x1e60000 Writing data to block 244 at offset 0x1e80000 Writing data to block 245 at offset 0x1ea0000 Writing data to block 246 at offset 0x1ec0000 Writing data to block 247 at offset 0x1ee0000 Writing data to block 248 at offset 0x1f00000 Writing data to block 249 at offset 0x1f20000 Writing data to block 250 at offset 0x1f40000 Writing data to block 251 at offset 0x1f60000 Writing data to block 252 at offset 0x1f80000 Writing data to block 253 at offset 0x1fa0000 Writing data to block 254 at offset 0x1fc0000 Writing data to block 255 at offset 0x1fe0000 Writing data to block 256 at offset 0x2000000 Writing data to block 257 at offset 0x2020000 Writing data to block 258 at offset 0x2040000 Writing data to block 259 at offset 0x2060000 Writing data to block 260 at offset 0x2080000 Writing data to block 261 at offset 0x20a0000 Writing data to block 262 at offset 0x20c0000 Writing data to block 263 at offset 0x20e0000 Writing data to block 264 at offset 0x2100000 Writing data to block 265 at offset 0x2120000 Writing data to block 266 at offset 0x2140000 Writing data to block 267 at offset 0x2160000 Writing data to block 268 at offset 0x2180000 Writing data to block 269 at offset 0x21a0000 Writing data to block 270 at offset 0x21c0000 Writing data to block 271 at offset 0x21e0000 100%2:31-0000000000000000>Okay (13.24s) 2:31-0000000000000000>Start Cmd:FBK: sync at offset 0x2200000 Writing data to block 273 at offset 0x2220000 Writing data to block 274 at offset 0x2240000 Writing data to block 275 at offset 0x2260000 Writing data to block 276 at offset 0x2280000 2:31-0000000000000000>Okay (0.038s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nanddtb} 0 0 Erasing 128 Kibyte @ 0 -- 100 % complete 2:31-0000000000000000>Okay (0.015s) 2:31-0000000000000000>Start Cmd:FBK: ucp imx95-19x19-evk.dtb t:/tmp/dtb 100%2:31-0000000000000000>Okay (0.015s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; nandwrite -p /dev/mtd${nanddtb} /tmp/dtb Writing data to block 0 at offset 0x0 2:31-0000000000000000>Okay (0.047s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; flash_erase /dev/mtd${nandrootfs} 0 0 Erasing 204672 Kibyte @ 0 -- 100 % complete 2:31-0000000000000000>Okay (4.231s) 2:31-0000000000000000>Start Cmd:FBK: ucmd ubidetach /dev/ubi_ctrl -m ${nandrootfs} || true 2:31-0000000000000000>Okay (0.019s) 2:31-0000000000000000>Start Cmd:FBK: ucmd . /tmp/mtd.sh; ubiattach /dev/ubi_ctrl -m ${nandrootfs} UBI device number 0, total 1599 LEBs (203034624 bytes, 193.6 MiB), available 1555 LEBs (197447680 bytes, 188.3 MiB), LEB size 126976 bytes (124.0 KiB) 2:31-0000000000000000>Okay (0.384s) 2:31-0000000000000000>Start Cmd:FBK: ucmd ubimkvol /dev/ubi0 -N nandrootfs -m Set volume size to 197447680 Volume ID 0, size 1555 LEBs (197447680 bytes, 188.3 MiB), LEB size 126976 bytes (124.0 KiB), dynamic, name "nandrootfs", alignment 1 2:31-0000000000000000>Okay (0.051s) 2:31-0000000000000000>Start Cmd:FBK: ucmd mkdir -p /mnt/mtd 2:31-0000000000000000>Okay (0.008s) 2:31-0000000000000000>Start Cmd:FBK: ucmd mount -t ubifs ubi0:nandrootfs /mnt/mtd 2:31-0000000000000000>Okay (0.204s) 2:31-0000000000000000>Start Cmd:FBK: acmd export EXTRACT_UNSAFE_SYMLINKS=1; tar --zstd --warning=no-timestamp -x -C /mnt/mtd 2:31-0000000000000000>Okay (0.052s) 2:31-0000000000000000>Start Cmd:FBK: ucp core-image-base-imx95-19x19-lpddr5-evk.rootfs-20260429064745.tar.zst t:- 100%2:31-0000000000000000>Okay (192.3s) 2:31-0000000000000000>Start Cmd:FBK: sync   3. Flashing NOR The bootloader flashed to NOR must use the newly added imx95_19x19_evk_spinand_defconfig . Therefore, imx95-evk.inc must be modified to enable this. 3.1 UUU Script uuu_version 1.2.39 # @_flexspi.bin | bootloader # @_image [_flexspi.bin] | image burn to flexspi, default is the same as bootloader # This command will be run when i.MX6/7 i.MX8MM, i.MX8MQ SDP: boot -f .\imx-boot-nor.bin-flash_a55_flexspi # This command will be run when ROM support stream mode # i.MX8QXP, i.MX8QM, skip QSPI header SDPS: boot -f .\imx-boot-nor.bin-flash_a55_flexspi -skipfhdr # These commands will be run when use SPL and will be skipped if no spl # SDPU will be deprecated. please use SDPV instead of SDPU # { SDPU: delay 1000 SDPU: write -f .\imx-boot-nor.bin-flash_a55_flexspi -offset 0x10000 -skipfhdr SDPU: jump # } # These commands will be run when use SPL and will be skipped if no spl # if (SPL support SDPV) # { SDPV: delay 1000 SDPV: write -f .\imx-boot-nor.bin-flash_a55_flexspi -skipspl -skipfhdr SDPV: jump # } #######################second################################# FB: ucmd setenv fastboot_buffer ${loadaddr} FB: download -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi FB: ucmd if test ! -n "$fastboot_bytes"; then setenv fastboot_bytes $filesize; else true; fi # Check Image if include flexspi header FB: ucmd if qspihdr dump ${fastboot_buffer}; then setenv qspihdr_exist yes; else setenv qspihdr_exist no; fi; # Check Image size if larger than 16M, then use uboot command to write image FB: ucmd if itest ${fastboot_bytes} -gt 1000000; then setenv qspihdr_large yes; else setenv qspihdr_large no; fi; FB[-t 60000]: ucmd if test ${qspihdr_exist} = yes -a ${qspihdr_large} = no; then qspihdr init ${fastboot_buffer} ${fastboot_bytes} safe; else true; fi; #if uboot can't support qspihdr command, use uboot image to write qspi image, which require image include qspi flash header FB: ucmd if test ${qspihdr_exist} = no; then sf probe; else true; fi; FB[-t 40000]: ucmd if test ${qspihdr_exist} = no; then sf erase 0 +${fastboot_bytes}; else true; fi; FB[-t 20000]: ucmd if test ${qspihdr_exist} = no; then sf write ${fastboot_buffer} 0 ${fastboot_bytes}; else true; fi; # if Image is larger than 16M, use uboot command to write image FB: ucmd if test ${qspihdr_large} = yes; then sf probe; else true; fi; FB: write -f .\imx-boot-imx95-19x19-lpddr5-evk-fspi.bin-flash_a55_flexspi -format "if test ${qspihdr_large} = yes; then sf erase @off +@size; sf write ${fastboot_buffer} @off @size; else true; fi;" -blksz 1 -each 0x100000 FB: done   3.2 U-Boot Patches The functionality implemented is: in the SPL stage, activate NOR FLASH (this is the default code setting), so that uboot.bin can be read from NOR during the SPL stage; then upon entering U-Boot, override the pinctrl settings in the DTB so that the FlexSPI driver uses the NAND pins, and then bring up the NAND on the M.2 connector during U-Boot initialization. imx95_19x19_evk_spinand_defconfig is based on the FSPI defconfig with MTD NAND configuration enabled in U-Boot. diff --git a/arch/arm/dts/imx95-19x19-evk-spinand.dtsi b/arch/arm/dts/imx95-19x19-evk-spinand.dtsi new file mode 100644 index 00000000000..20f77d3300b --- /dev/null +++ b/arch/arm/dts/imx95-19x19-evk-spinand.dtsi @@ -0,0 +1,16 @@ +// SPDX-License-Identifier: (GPL-2.0+ OR MIT) +/* + * Copyright 2023 NXP + */ + +&flexspi1 { + flash1: mt29f4g01abbfd12@0 { + reg = <0>; + #address-cells = <1>; + #size-cells = <1>; + compatible = "spi-nand"; + spi-max-frequency = <80000000>; + spi-tx-bus-width = <4>; + spi-rx-bus-width = <4>; + }; +}; diff --git a/arch/arm/dts/imx95-19x19-evk-u-boot.dtsi b/arch/arm/dts/imx95-19x19-evk-u-boot.dtsi index 3c0c2d7b0f2..0d8fb0c3978 100644 --- a/arch/arm/dts/imx95-19x19-evk-u-boot.dtsi +++ b/arch/arm/dts/imx95-19x19-evk-u-boot.dtsi @@ -182,3 +182,7 @@ assigned-clock-parents = <0>, <&scmi_clk IMX95_CLK_HSIOPLL_VCO>, <&scmi_clk IMX95_CLK_SYSPLL1_PFD1_DIV2>; }; + +#ifdef CONFIG_MTD_SPI_NAND +#include "imx95-19x19-evk-spinand.dtsi" +#endif \ No newline at end of file diff --git a/board/freescale/imx95_evk/imx95_evk.c b/board/freescale/imx95_evk/imx95_evk.c index 9790c610ac7..147782e94b9 100644 --- a/board/freescale/imx95_evk/imx95_evk.c +++ b/board/freescale/imx95_evk/imx95_evk.c @@ -453,6 +453,78 @@ void lvds_backlight_on(void) dm_i2c_write(dev, 0x8, &reg, 1); } + +static int fdt_switch_flexspi_pinctrl_to_nand(void *fdt) +{ + int off; + const void *prop; + int len; + int ret; + const char *flexspi_path = "/soc/bus@42000000/spi@425e0000"; + + off = fdt_path_offset(fdt, flexspi_path); + if (off < 0) { + printf("FDT: failed to find flexspi node %s, err=%d\n", + flexspi_path, off); + return off; + } + + prop = fdt_getprop(fdt, off, "pinctrl-1", &len); + if (!prop || len <= 0) { + printf("FDT: no pinctrl-1 found under %s\n", flexspi_path); + return -FDT_ERR_NOTFOUND; + } + + ret = fdt_setprop(fdt, off, "pinctrl-0", prop, len); + if (ret < 0) { + printf("FDT: failed to overwrite pinctrl-0, err=%d\n", ret); + return ret; + } + + printf("FDT: switched %s pinctrl-0 <- pinctrl-1 (NAND)\n", + flexspi_path); + + return 0; +} + +static void delete_fdt_flash0(void *fdt) +{ + int i = 0; + int nodeoff, ret; + static const char * const spi_nodes[] = { + "/soc/bus@42000000/spi@425e0000/flash@0" + }; + + printf("delete_fdt_flash0\n"); + + for (i = 0; i < ARRAY_SIZE(spi_nodes); i++) { + nodeoff = fdt_path_offset(fdt, spi_nodes[i]); + if (nodeoff >= 0) { +delete_node: + ret = fdt_del_node(fdt, nodeoff); + if (ret == -FDT_ERR_NOSPACE) { + ret = fdt_increase_size(fdt, 512); + if (!ret) { + nodeoff = fdt_path_offset(fdt, spi_nodes[i]); + if (nodeoff >= 0) + goto delete_node; + } + } + + if (ret) + printf("failed to delete node %s, ret=%d\n", + spi_nodes[i], ret); + else + printf("deleted node %s\n", spi_nodes[i]); + } + } +} +static void fdt_fixup_flexspi(void *fdt) +{ + delete_fdt_flash0(fdt); + fdt_switch_flexspi_pinctrl_to_nand(fdt); +} + int board_init(void) { int ret; @@ -475,17 +547,53 @@ int board_init(void) netc_init(); - flexspi_nor_steup(); + // flexspi_nor_steup(); power_on_m7("mx95evkrpmsg"); + printf("board_init\n"); + lvds_backlight_on(); return 0; } +#include <dm.h> +#include <dm/device.h> +#include <dm/uclass.h> + +static void debug_probe_fspi_nand(void) +{ + struct udevice *bus; + struct udevice *child; + int ret; + + printf("debug_probe_fspi_nand: start\n"); + + ret = uclass_get_device_by_name(UCLASS_SPI, "spi@425e0000", &bus); + printf("get spi bus ret=%d, bus=%p\n", ret, bus); + if (ret) + return; + + ret = device_probe(bus); + printf("probe spi bus ret=%d\n", ret); + + child = NULL; + device_find_first_child(bus, &child); + while (child) { + printf("child name=%s\n", child->name); + ret = device_probe(child); + printf("probe child %s ret=%d\n", child->name, ret); + device_find_next_child(&child); + } + + printf("debug_probe_fspi_nand: done\n"); +} + int board_late_init(void) { + printf("board_late_init\n"); + debug_probe_fspi_nand(); if (IS_ENABLED(CONFIG_ENV_IS_IN_MMC)) board_late_mmc_env_init(); @@ -645,6 +753,8 @@ static int board_fix_19x19_evk(void *fdt) int ret; const char *netcfg = "mx95netc"; + fdt_fixup_flexspi(fdt); + ret = scmi_misc_cfginfo(&msel, cfgname); if (!ret) { debug("SM: %s\n", cfgname); diff --git a/configs/imx95_19x19_evk_spinand_defconfig b/configs/imx95_19x19_evk_spinand_defconfig new file mode 100644 index 00000000000..77077341412 --- /dev/null +++ b/configs/imx95_19x19_evk_spinand_defconfig @@ -0,0 +1,264 @@ +CONFIG_ARM=y +CONFIG_ARCH_IMX9=y +CONFIG_TEXT_BASE=0x90200000 +CONFIG_SYS_MALLOC_LEN=0x2000000 +CONFIG_SYS_MALLOC_F_LEN=0x10000 +CONFIG_SPL_LIBCOMMON_SUPPORT=y +CONFIG_SPL_LIBGENERIC_SUPPORT=y +CONFIG_NR_DRAM_BANKS=3 +CONFIG_ENV_SOURCE_FILE="imx95_evk" +CONFIG_SF_DEFAULT_SPEED=200000000 +CONFIG_ENV_SIZE=0x4000 +CONFIG_ENV_OFFSET=0x700000 +CONFIG_ENV_SECT_SIZE=0x20000 +CONFIG_IMX_CONFIG="arch/arm/mach-imx/imx9/scmi/imximage.cfg" +CONFIG_DM_GPIO=y +CONFIG_DEFAULT_DEVICE_TREE="imx95-19x19-evk-rm692c9-adv7535" +CONFIG_USB_TCPC=y +CONFIG_TARGET_IMX95_19X19_EVK=y +CONFIG_OF_LIBFDT_OVERLAY=y +CONFIG_SYS_MONITOR_LEN=524288 +CONFIG_SPL_SERIAL=y +CONFIG_SPL_DRIVERS_MISC=y +CONFIG_SPL_STACK=0x204d6000 +CONFIG_SPL_TEXT_BASE=0x20480000 +CONFIG_SPL_HAS_BSS_LINKER_SECTION=y +CONFIG_SPL_BSS_START_ADDR=0x204d6000 +CONFIG_SPL_BSS_MAX_SIZE=0x2000 +CONFIG_SYS_LOAD_ADDR=0x90400000 +CONFIG_SPL=y +CONFIG_SPL_RECOVER_DATA_SECTION=y +CONFIG_PCI=y +CONFIG_SYS_MEMTEST_START=0x90000000 +CONFIG_SYS_MEMTEST_END=0xA0000000 +CONFIG_REMAKE_ELF=y +CONFIG_FIT=y +CONFIG_FIT_VERBOSE=y +CONFIG_OF_SYSTEM_SETUP=y +# CONFIG_BOOTCOMMAND="bootflow scan -l; run bsp_bootcmd" +CONFIG_DEFAULT_FDT_FILE="imx95-19x19-evk-adv7535-ap1302.dtb" +CONFIG_SYS_CBSIZE=2048 +CONFIG_SYS_PBSIZE=2074 +CONFIG_ARCH_MISC_INIT=y +CONFIG_BOARD_EARLY_INIT_F=y +CONFIG_BOARD_LATE_INIT=y +CONFIG_SPL_MAX_SIZE=0x30000 +CONFIG_SPL_BOARD_INIT=y +CONFIG_SPL_LOAD_IMX_CONTAINER=y +CONFIG_IMX_CONTAINER_CFG="arch/arm/mach-imx/imx9/scmi/container.cfg" +# CONFIG_SPL_SHARES_INIT_SP_ADDR is not set +CONFIG_SPL_SYS_MALLOC=y +CONFIG_SPL_HAS_CUSTOM_MALLOC_START=y +CONFIG_SPL_CUSTOM_SYS_MALLOC_ADDR=0x93200000 +CONFIG_SPL_SYS_MALLOC_SIZE=0x80000 +CONFIG_SPL_SYS_MMCSD_RAW_MODE=y +CONFIG_SYS_MMCSD_RAW_MODE_U_BOOT_SECTOR=0x1040 +CONFIG_SPL_I2C=y +CONFIG_SPL_DM_MAILBOX=y +CONFIG_SPL_DM_SEQ_ALIAS=y +CONFIG_SPL_DM_SPI=y +CONFIG_SPL_DM_SPI_FLASH=y +CONFIG_SPL_SPI_FLASH_SUPPORT=y +CONFIG_SPL_SPI=y +CONFIG_SPL_SPI_LOAD=y +CONFIG_SPL_SPI_FLASH_TINY=n +CONFIG_SYS_SPI_U_BOOT_OFFS=0x200000 +CONFIG_SPL_GPIO=y +CONFIG_SPL_POWER=y +CONFIG_SPL_POWER_DOMAIN=y +CONFIG_SPL_USB_GADGET=y +CONFIG_SPL_USB_SDP_SUPPORT=y +CONFIG_SDP_LOADADDR=0x90400000 + +CONFIG_SPL_WATCHDOG=y +CONFIG_SYS_PROMPT="u-boot=> " +CONFIG_CMD_ERASEENV=y +CONFIG_CMD_NVEDIT_EFI=y +CONFIG_CMD_CRC32=y +CONFIG_CRC32_VERIFY=y +CONFIG_CMD_MEMTEST=y +CONFIG_CMD_CLK=y +CONFIG_CMD_DFU=y +CONFIG_CMD_FUSE=y +CONFIG_CMD_GPIO=y +CONFIG_CMD_GPT=y +CONFIG_CMD_I2C=y +CONFIG_CMD_MMC=y +CONFIG_CMD_PCI=y +CONFIG_CMD_PART=y +CONFIG_CMD_POWEROFF=y +CONFIG_CMD_USB=y +CONFIG_CMD_DHCP=y +CONFIG_CMD_MII=y +CONFIG_CMD_PING=y +CONFIG_CMD_SNTP=y +CONFIG_CMD_CACHE=y +CONFIG_CMD_EFIDEBUG=y +CONFIG_CMD_RTC=y +CONFIG_CMD_TIME=y +CONFIG_CMD_GETTIME=y +CONFIG_CMD_TIMER=y +CONFIG_CMD_REGULATOR=y +CONFIG_CMD_HASH=y +CONFIG_CMD_EXT2=y +CONFIG_CMD_EXT4=y +CONFIG_CMD_EXT4_WRITE=y +CONFIG_CMD_FAT=y +CONFIG_CMD_FS_GENERIC=y +CONFIG_CMD_USB_SDP=y +CONFIG_CMD_USB_MASS_STORAGE=y +CONFIG_OF_BOARD_FIXUP=y +CONFIG_OF_CONTROL=y +CONFIG_SPL_OF_CONTROL=y +CONFIG_ENV_OVERWRITE=y +CONFIG_ENV_IS_NOWHERE=y +# CONFIG_ENV_IS_IN_MMC=y +# CONFIG_ENV_IS_IN_SPI_FLASH=y +###################NAND########################### +CONFIG_ENV_IS_IN_UBI=y +CONFIG_MTD_UBI=y +CONFIG_CMD_UBI=y +CONFIG_CMD_MTD=y +CONFIG_CMD_MTDPARTS=y +CONFIG_MTDIDS_DEFAULT="spi-nand0=spi-nand0" +CONFIG_MTDPARTS_DEFAULT="mtdparts=spi-nand0:8m(bootloader)ro,8m(config),40m(kernel),128k(dtb),-(rootfs)" +CONFIG_ENV_UBI_PART="config" +CONFIG_ENV_UBI_VOLUME="uboot-env" +CONFIG_USE_BOOTARGS=y +CONFIG_BOOTARGS="console=ttyLP0,115200 earlycon ubi.mtd=4 root=ubi0:nandrootfs rootfstype=ubifs rootwait rw mtdparts=spi0.0:8m(bootloader)ro,8m(config),40m(kernel),128k(dtb),-(rootfs)" +CONFIG_BOOTCOMMAND="mtd read kernel $loadaddr 0 0x2400000 && mtd read dtb $fdt_addr 0 0x20000 && booti $loadaddr - $fdt_addr" +################################################### +CONFIG_ENV_VARS_UBOOT_RUNTIME_CONFIG=y +CONFIG_USE_ETHPRIME=y +CONFIG_ETHPRIME="eth0" +CONFIG_NET_RANDOM_ETHADDR=y +CONFIG_SYS_RX_ETH_BUFFER=8 +CONFIG_SPL_DM=y +CONFIG_REGMAP=y +CONFIG_SYSCON=y +CONFIG_SPL_OF_TRANSLATE=y +CONFIG_CLK=y +CONFIG_SPL_CLK=y +CONFIG_SPL_CLK_CCF=y +CONFIG_CLK_CCF=y +CONFIG_CLK_SCMI=y +CONFIG_SPL_CLK_SCMI=y +CONFIG_DFU_MMC=y +CONFIG_DFU_RAM=y +CONFIG_SPL_FIRMWARE=y +# CONFIG_SCMI_AGENT_SMCCC is not set +CONFIG_IMX_RGPIO2P=y + +CONFIG_SPL_SPI_FLASH_SFDP_SUPPORT=y +CONFIG_SPI_FLASH_SFDP_SUPPORT=y +CONFIG_SPI_FLASH_SOFT_RESET=y +CONFIG_SPI_FLASH_SOFT_RESET_ON_BOOT=y + +CONFIG_CMD_FASTBOOT=y +CONFIG_USB_FUNCTION_FASTBOOT=y +CONFIG_FASTBOOT_UUU_SUPPORT=y +CONFIG_FASTBOOT=y +CONFIG_FASTBOOT_BUF_ADDR=0x92800000 +CONFIG_FASTBOOT_BUF_SIZE=0x20000000 +CONFIG_FASTBOOT_FLASH=y +CONFIG_EFI_PARTITION=y +CONFIG_FASTBOOT_USB_DEV=0 +CONFIG_USB_PORT_AUTO=y + +CONFIG_DM_PCA953X=y +CONFIG_ADP5585_GPIO=y +CONFIG_DM_I2C=y +CONFIG_SYS_I2C_IMX_LPI2C=y +CONFIG_IMX_MU_MBOX=y +CONFIG_SUPPORT_EMMC_BOOT=y +CONFIG_MMC_IO_VOLTAGE=y +CONFIG_MMC_UHS_SUPPORT=y +CONFIG_MMC_HS400_ES_SUPPORT=y +CONFIG_MMC_HS400_SUPPORT=y +CONFIG_FSL_USDHC=y +CONFIG_CMD_NAND=y +CONFIG_MTD=y +CONFIG_DM_MTD=y +CONFIG_MTD_SPI_NAND=y +# CONFIG_SPI_FLASH_WINBOND=y +CONFIG_DM_SPI_FLASH=y +CONFIG_SPI_FLASH_STMICRO=y +CONFIG_SPI_FLASH_MT35XU=y +CONFIG_PHYLIB=y +CONFIG_PHYLIB_10G=y +CONFIG_PHY_AQUANTIA=y +CONFIG_PHY_REALTEK=y +CONFIG_DM_MDIO=y +CONFIG_MII=y +CONFIG_FSL_ENETC=y +CONFIG_PCIE_ECAM_GENERIC=y +CONFIG_PHY=y +CONFIG_PHY_IMX8MQ_USB=y +CONFIG_PINCTRL=y +CONFIG_SPL_PINCTRL=y +CONFIG_PINCTRL_IMX_SCMI=y +CONFIG_POWER_DOMAIN=y +CONFIG_SCMI_POWER_DOMAIN=y +CONFIG_DM_REGULATOR=y +CONFIG_DM_REGULATOR_FIXED=y +CONFIG_DM_REGULATOR_GPIO=y +CONFIG_DM_RTC=y +CONFIG_DM_SERIAL=y +CONFIG_FSL_LPUART=y +CONFIG_SPI=y +CONFIG_DM_SPI=y +CONFIG_NXP_FSPI=y +CONFIG_USB=y +CONFIG_DM_USB=y +CONFIG_USB_XHCI_HCD=y +CONFIG_USB_XHCI_DWC3=y +CONFIG_USB_DWC3=y +CONFIG_USB_EHCI_HCD=y +CONFIG_USB_MAX_CONTROLLER_COUNT=2 +CONFIG_USB_STORAGE=y +CONFIG_USB_GADGET=y +CONFIG_USB_GADGET_MANUFACTURER="FSL" +CONFIG_USB_GADGET_VENDOR_NUM=0x1fc9 +CONFIG_USB_GADGET_PRODUCT_NUM=0x0152 +CONFIG_USB_HOST_ETHER=y +CONFIG_USB_ETHER_ASIX=y +CONFIG_USB_ETHER_RTL8152=y +CONFIG_ULP_WATCHDOG=y +CONFIG_LZO=y +CONFIG_BZIP2=y +CONFIG_OF_BOARD_SETUP=y + +CONFIG_IMX_SNPS_DDR_PHY_QB_GEN=y +CONFIG_SAVED_QB_STATE_BASE=0x4aaf0000 + +CONFIG_DM_THERMAL=y +CONFIG_SCMI_THERMAL=y +CONFIG_SPL_THERMAL=y + +CONFIG_VIDEO_IMX95_DPU=y +CONFIG_VIDEO_IMX95_DW_DSI=y +CONFIG_VIDEO_IMX95_PIXEL_LINK=y +CONFIG_VIDEO_IMX95_PIXEL_INTERLEAVER=y +CONFIG_VIDEO=y +CONFIG_BMP_16BPP=y +CONFIG_BMP_24BPP=y +CONFIG_BMP_32BPP=y +CONFIG_VIDEO_LOGO=y +CONFIG_VIDEO_LCD_RAYDIUM_RM692C9=y +CONFIG_VIDEO_ADV7535=y +CONFIG_SYS_WHITE_ON_BLACK=y +CONFIG_SPLASH_SCREEN=y +CONFIG_SPLASH_SCREEN_ALIGN=y +CONFIG_CMD_BMP=y +CONFIG_DISPLAY=y +CONFIG_MIPI_DPHY_HELPERS=y + +CONFIG_BOOTDEV_ETH=n +CONFIG_DM_RNG=y +CONFIG_IMX_ELE_RNG=y +CONFIG_ELE_SHARED_BUFFER=0x98000000 + +CONFIG_PCIE_DW_IMX=y +CONFIG_NVME=y +CONFIG_NVME_PCI=y +CONFIG_CMD_NVME=y +CONFIG_CLK_IMX95_BLKCTRL=y diff --git a/drivers/spi/nxp_fspi.c b/drivers/spi/nxp_fspi.c index 078b97f6544..07fb96cbfcc 100644 --- a/drivers/spi/nxp_fspi.c +++ b/drivers/spi/nxp_fspi.c @@ -1177,6 +1177,7 @@ static int nxp_fspi_default_setup(struct nxp_fspi *f) static int nxp_fspi_probe(struct udevice *bus) { + printf("------------>nxp_fspi_probe\n"); struct nxp_fspi *f = dev_get_priv(bus); f->devtype_data = @@ -1241,6 +1242,7 @@ static int nxp_fspi_of_to_plat(struct udevice *bus) #if CONFIG_IS_ENABLED(CLK) int ret; #endif + printf("------------>nxp_fspi_of_to_plat\n"); fdt_addr_t iobase; fdt_addr_t iobase_size; diff --git a/dts/upstream/src/arm64/freescale/imx95-19x19-evk.dts b/dts/upstream/src/arm64/freescale/imx95-19x19-evk.dts index 6086cb7fa5a..7d5fd3500ff 100644 --- a/dts/upstream/src/arm64/freescale/imx95-19x19-evk.dts +++ b/dts/upstream/src/arm64/freescale/imx95-19x19-evk.dts @@ -194,11 +194,12 @@ }; &flexspi1 { - pinctrl-names = "default"; + pinctrl-names = "default", "nand"; pinctrl-0 = <&pinctrl_flexspi1>; + pinctrl-1 = <&pinctrl_flexspi1_nand>; status = "okay"; - flash@0 { + flash0: flash@0 { compatible = "jedec,spi-nor"; reg = <0>; pinctrl-names = "default"; @@ -445,6 +446,17 @@ >; }; + pinctrl_flexspi1_nand: flexspi1nandgrp { + fsl,pins = < + IMX95_PAD_SD3_CMD__FLEXSPI1_A_SS0_B 0x3fe + IMX95_PAD_SD3_CLK__FLEXSPI1_A_SCLK 0x3fe + IMX95_PAD_SD3_DATA0__FLEXSPI1_A_DATA_BIT0 0x3fe + IMX95_PAD_SD3_DATA1__FLEXSPI1_A_DATA_BIT1 0x3fe + IMX95_PAD_SD3_DATA2__FLEXSPI1_A_DATA_BIT2 0x3fe + IMX95_PAD_SD3_DATA3__FLEXSPI1_A_DATA_BIT3 0x3fe + >; + }; + pinctrl_flexspi1_reset: flexspi1-reset-grp { fsl,pins = < IMX95_PAD_XSPI1_SS1_B__GPIO5_IO_BIT11 0x3fe   3.3 imx95-evk.inc Content require conf/machine/include/imx-base.inc require conf/machine/include/arm/armv8-2a/tune-cortexa55.inc MACHINE_FEATURES += "pci wifi bluetooth optee" MACHINE_FEATURES:append:use-nxp-bsp = " nxpwifi-all-pcie nxpwifi-all-sdio jailhouse dpdk xen" KERNEL_DEVICETREE = " \ freescale/${KERNEL_DEVICETREE_BASENAME}.dtb \ " UBOOT_DTB_NAME = "${KERNEL_DEVICETREE_BASENAME}.dtb" IMX_DEFAULT_BOOTLOADER:use-nxp-bsp = "u-boot-imx" IMX_DEFAULT_BOOTLOADER:use-mainline-bsp = "u-boot-fslc" LOADADDR = "" UBOOT_SUFFIX = "bin" UBOOT_MAKE_TARGET = "" SPL_BINARY = "spl/u-boot-spl.bin" UBOOT_CONFIG ??= "sd" UBOOT_CONFIG[sd] = "${UBOOT_CONFIG_BASENAME}_defconfig,sdcard" UBOOT_CONFIG[sd-ecc] = "${UBOOT_CONFIG_BASENAME}_defconfig,sdcard" UBOOT_CONFIG[fspi] = "${UBOOT_CONFIG_BASENAME}_spinand_defconfig"///////////////////here UBOOT_CONFIG[spinand] = "${UBOOT_CONFIG_BASENAME}_spinand_defconfig"////////////////here ATF_PLATFORM = "imx95" OEI_CORE = "m33" OEI_SOC = "mx95" OEI_BOARD ?= "mx95lp5" DDR_TYPE ?= "lpddr5" IMXBOOT_VARIANTS = "alt jailhouse netc rpmsg sof" # Multiple system manager configs by IMXBOOT_VARIANT SYSTEM_MANAGER_CONFIG = \ "${@bb.utils.contains('IMXBOOT_VARIANT', 'alt', 'mx95alt', \ bb.utils.contains('IMXBOOT_VARIANT', 'jailhouse', 'mx95evkjailhouse', \ bb.utils.contains('IMXBOOT_VARIANT', 'netc', 'mx95netc', \ bb.utils.contains('IMXBOOT_VARIANT', 'rpmsg', 'mx95evkrpmsg', \ bb.utils.contains('IMXBOOT_VARIANT', 'sof', 'mx95evksof', \ 'mx95evk', d), d), d), d), d)}" # imx-boot (flash.bin) targets based on UBOOT_CONFIG and IMXBOOT_VARIANT IMXBOOT_TARGETS_SD = " \ ${@bb.utils.contains('IMXBOOT_VARIANT', 'alt', '${IMXBOOT_TARGETS_BASENAME}_alt', \ bb.utils.contains('IMXBOOT_VARIANT', 'jailhouse', '${IMXBOOT_TARGETS_BASENAME}_jailhouse', \ bb.utils.contains('IMXBOOT_VARIANT', 'netc', '${IMXBOOT_TARGETS_BASENAME}_netc', \ bb.utils.contains('IMXBOOT_VARIANT', 'rpmsg', '${IMXBOOT_TARGETS_BASENAME}_lpboot_sm_a55', \ bb.utils.contains('IMXBOOT_VARIANT', 'sof', '${IMXBOOT_TARGETS_BASENAME}_a55', \ '${IMXBOOT_TARGETS_BASENAME}_all ${IMXBOOT_TARGETS_BASENAME}_a55', d), d), d), d), d)} \ " IMXBOOT_TARGETS = " \ ${@bb.utils.contains('UBOOT_CONFIG', 'fspi', '${IMXBOOT_TARGETS_BASENAME}_a55_flexspi', \ bb.utils.contains('UBOOT_CONFIG', 'sd-ecc', '${IMXBOOT_TARGETS_BASENAME}_all', \ '${IMXBOOT_TARGETS_SD}', d), d)} \ " IMX_BOOT_SOC_TARGET = "iMX95" IMX_BOOT_SEEK = "32" # We have to disable SERIAL_CONSOLE due to auto-serial-console SERIAL_CONSOLES = "115200;ttyLP0" IMX_DEFAULT_BSP = "nxp"   4. NOR Boot Test After NOR boot, U-Boot activates the NAND on the M.2 connector, successfully reads the kernel and device tree from NAND. After entering the kernel, the rootfs is successfully mounted. U-Boot SPL 2025.04-g4ddbad60eff3-dirty (Mar 19 2026 - 03:13:58 +0000) SYS Boot reason: por, origin: -1, errid: -1 SYS shutdown reason: por, origin: -1, errid: -1 Normal Boot Trying to boot from SPI ------------>nxp_fspi_of_to_plat ------------>nxp_fspi_probe Boot stage: Primary Image set: 0, offset: 0x1000 Load image from QSPI 0xde400------------------------------->NOR BOOT NOTICE: BL31: v2.12.0(release):lf-6.12.49-2.2.0 NOTICE: BL31: Built : 10:35:59, Apr 21 2026 U-Boot 2025.04-g4ddbad60eff3-dirty (Mar 19 2026 - 03:13:58 +0000) CPU: i.MX9596 rev2.0 at 1800MHz CPU: Extended Industrial temperature grade (-40C to 125C) at 28C LM Boot reason: por, origin: -1, errid: -1 LM shutdown reason: por, origin: -1, errid: -1 Model: NXP i.MX95 19X19 board DRAM: delete_fdt_flash0 deleted node /soc/bus@42000000/spi@425e0000/flash@0 FDT: switched /soc/bus@42000000/spi@425e0000 pinctrl-0 <- pinctrl-1 (NAND) 15.8 GiB TCPC: Vendor ID [0x1fc9], Product ID [0x5110], Addr [I2C6 0x50] PCIE-2: Link down PCIE-3: Link down cfg name not match mx95evkrpmsg:mx95evk, ignore board_init Core: 317 devices, 38 uclasses, devicetree: separate MMC: FSL_SDHC: 0, FSL_SDHC: 1 Loading Environment from nowhere... OK [*]-Video Link 0clk disp1pix already disabled adv7535_mipi2hdmi hdmi@3d: Can't find cec device id=0x3c fail to probe panel device hdmi@3d probe video device failed, ret -19 [0] display-controller@4b400000, video [1] channel@0, video_bridge [2] bridge@8, video_bridge [3] dsi@4acf0000, video_bridge [4] hdmi@3d, panel clk disp1pix already disabled adv7535_mipi2hdmi hdmi@3d: Can't find cec device id=0x3c fail to probe panel device hdmi@3d probe video device failed, ret -19 In: serial Out: serial Err: serial BuildInfo: - SM firmware Build 763, Commit de30901b, Apr 15 2026 01:18:07 - ELE firmware version 2.0.4-9ca4d997 board_late_init debug_probe_fspi_nand: start ------------>nxp_fspi_of_to_plat ------------>nxp_fspi_probe get spi bus ret=0, bus=00000000fd4a13d0 probe spi bus ret=0 child name=mt29f4g01abbfd12@0 probe child mt29f4g01abbfd12@0 ret=0----------------->SWITCH TO NAND debug_probe_fspi_nand: done UID: 182ba9e87d9840babd9d12161b48e82d Net: eth0: enetc-0 [PRIME], eth1: enetc-2 Fastboot: Normal Normal Boot Hit any key to stop autoboot: 0 u-boot=> setenv bootargs 'console=ttyLP0,115200 earlycon ubi.mtd=rootfs root=ubi0:nandrootfs rootfstype=ubifs rootwait rw' u-boot=> mtd read kernel ${loadaddr} 0 0x2800000 Reading 41943040 byte(s) (20480 page(s)) at offset 0x00000000 u-boot=> mtd read dtb ${fdt_addr} 0 0x20000 Reading 131072 byte(s) (64 page(s)) at offset 0x00000000 u-boot=> booti ${loadaddr} - ${fdt_addr} ------------------>read kernel, dtb in NAND ## Flattened Device Tree blob at 93000000 Booting using the fdt blob at 0x93000000 Working FDT set to 93000000 Loading Device Tree to 000000009ffe5000, end 000000009ffffeaf ... OK Working FDT set to 9ffe5000 clk disp1pix already disabled adv7535_mipi2hdmi hdmi@3d: Can't find cec device id=0x3c fail to probe panel device hdmi@3d probe video device failed, ret -19 Starting kernel ... [ 0.000000] Booting Linux on physical CPU 0x0000000000 [0x412fd050] [ 0.000000] Linux version 6.18.2-1.0.0-gf49f45233f7b-dirty (oe-user@oe-host) (aarch64-poky-linux-gcc (GCC) 15.2.0, GNU ld (GNU Binutils) 2.45.0.20250908) #1 SMP PREEMPT Tue Apr 28 08:20:17 UTC 2026 [ 0.000000] KASLR enabled [ 0.000000] Machine model: NXP i.MX95 19X19 board [ 0.000000] efi: UEFI not found. [ 0.000000] Reserved memory: created CMA memory pool at 0x00000000c3000000, size 960 MiB [ 0.000000] OF: reserved mem: initialized node linux,cma, compatible id shared-dma-pool [ 0.000000] OF: reserved mem: 0x00000000c3000000..0x00000000feffffff (983040 KiB) map reusable linux,cma [ 0.000000] earlycon: lpuart32 at MMIO32 0x0000000044380000 (options '') ................... [ 2.416067] spi-nand spi1.0: Winbond SPI NAND was found. [ 2.428075] spi-nand spi1.0: 256 MiB, block size: 128 KiB, page size: 2048, OOB size: 128 [ 2.450050] 5 fixed-partitions partitions found on MTD device spi1.0 [ 2.450059] Creating 5 MTD partitions on "spi1.0": [ 2.463548] 0x000000000000-0x000000800000 : "bootloader" [ 2.529065] 0x000000800000-0x000001000000 : "config" [ 2.543539] 0x000001000000-0x000003800000 : "kernel" [ 2.580906] 0x000003800000-0x000003820000 : "dtb" [ 2.586513] 0x000003820000-0x00010381ffff : "rootfs" [ 2.591493] mtd: partition "rootfs" extends beyond the end of device "spi1.0" -- size truncated to 0xc7e0000 [ 2.748893] mtd: setting mtd4 (rootfs) as root device [ 4.909898] ubi0: attaching mtd4 [ 5.406361] ubi0: scanning is finished [ 5.454338] ubi0: attached mtd4 (name "rootfs", size 199 MiB) [ 5.460134] ubi0: PEB size: 131072 bytes (128 KiB), LEB size: 126976 bytes [ 5.467131] ubi0: min./max. I/O unit sizes: 2048/2048, sub-page size 2048 [ 5.473950] ubi0: VID header offset: 2048 (aligned 2048), data offset: 4096 [ 5.480935] ubi0: good PEBs: 1599, bad PEBs: 0, corrupted PEBs: 0 [ 5.487037] ubi0: user volume: 1, internal volumes: 1, max. volumes count: 128 [ 5.494255] ubi0: max/mean erase counter: 10/1, WL threshold: 4096, image sequence number: 2909496578 [ 5.503473] ubi0: available PEBs: 0, total reserved PEBs: 1599, PEBs reserved for bad PEB handling: 40 [ 5.512840] ubi0: background thread "ubi_bgt0d" started, PID 135 [ 5.594576] UBIFS (ubi0:0): Mounting in unauthenticated mode [ 5.600411] UBIFS (ubi0:0): background thread "ubifs_bgt0_0" started, PID 141 [ 5.617312] UBIFS (ubi0:0): recovery needed [ 5.801795] UBIFS (ubi0:0): recovery completed [ 5.806343] UBIFS (ubi0:0): UBIFS: mounted UBI device 0, volume 0, name "nandrootfs" [ 5.814101] UBIFS (ubi0:0): LEB size: 126976 bytes (124 KiB), min./max. I/O unit sizes: 2048 bytes/2048 bytes [ 5.824021] UBIFS (ubi0:0): FS size: 195923968 bytes (186 MiB, 1543 LEBs), max 1555 LEBs, journal size 9777152 bytes (9 MiB, 77 LEBs) [ 5.836024] UBIFS (ubi0:0): reserved for root: 4952683 bytes (4836 KiB) [ 5.842640] UBIFS (ubi0:0): media format: w5/r0 (latest is w5/r0), UUID 02E616B2-3C31-4F48-A886-9B4D26DB37C1, small LPT model [ 5.854616] VFS: Mounted root (ubifs filesystem) on device 0:23. [ 5.860973] devtmpfs: mounted [ 5.864349] Freeing unused kernel memory: 2112K [ 5.868991] Run /sbin/init as init process [ 5.874243] Run /etc/init as init process [ 5.879058] Run /bin/init as init process [ 5.884114] Run /bin/sh as init process  
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The purpose of this document is to provide extended guidance for the selection of compatible LPDDR4/4X memory devices that are supported by the i.MX 93 series of processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. The i.MX 93 series of processors supports different packages, and each have their own maximum supported LPDDR4/4x data rates. Please refer to the respective datasheets. Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. NOTE: Some of the LPDDR4/4X devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low-speed operation is planned in the use case, please consult with the memory vendor about the configuration aspects and possible customization of the memory device so correct functionality is ensured. LPDDR4/4X - Maximum Supported Densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 93 (i.MX 93xx) 16-bit 16 Gb / (2 GB) single rank, single channel device with 17-row addresses (R0 - R16) 1, 2, 3   LPDDR4/4X - List of Validated Memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 93 16 Gb/ (2 GB) Micron LPDDR4/4x: MT53E1G16D1FW-046 AAT:A  (Z32N) MT53E1G16D1ZW-046 AAT:C (Z42N) 7   4, 8 8 Gb/ (1 GB) Micron LPDDR4/4x: MT53D512M16D1DS-046 AAT (Z11M) 4, 10 16 Gb/ (2 GB) Micron LPDDR4/4x: MT53E1G32D2FW-046 AUT:B (Z42M) 4, 5, 10 8 Gb/ (1 GB) Nanya LPDDR4: NT6AN512M16AV-J1I LPDDR4x: NT6AP512M16BV-J1I 4, 8 4 Gb/ (512 MB) Nanya LPDDR4x: NT6AP256M16AV  4, 8 16 Gb/ (2 GB) Kingston LPDDR4: D1611PM3BDGUI-U 4, 8 16 Gb/ (2 GB) Kingston LPDDR4: C1612PC2WDGTKR-U  7, 9 4 Gb/ (512 MB) ISSI LPDDR4: IS43LQ16256B-062BLI 4, 8 2Gb / (256 MB) ISSI LPDDR4: IS43LQ16128A-062BSLI 4, 6, 8   8 Gb/ (1 GB) CXMT LPDDR4/4x: CXDB4CBAM-EA-M 4, 9 16 Gb/ (2 GB) JSC LPDDR4x: JSL4BAG167ZAMF  4, 8 8 Gb/ (1 GB) JSC LPDDR4x: JSL4B8G168ZAMF-05x  4, 8 4 Gb/ (512 MB) JSC LPDDR4x: JSL4A4G168ZAMF-05 4, 8 2Gb / (256 MB) Winbond  LPDDR4x: W66BQ6NBHAGJ 4, 6, 8 8Gb / (1 GB) IM (Intelligent Memory) LPDDR4x: IM8G16L4JCB-046I 4, 11 16Gb / (2 GB) IM (Intelligent Memory) LPDDR4/4x: IMAG16L4KBBG 4, 8 4Gb / (512 MB) Samsung LPDDR4: K4F4E164HD-THCL 4, 8 8 Gb / (1 GB) AM (Alliance Memory) LPDDR4X: AS4C512M16MD4V-053BIN 4, 8 4 Gb / (512 MB) ISSI LPDDR4/4X: IS43LQ16256B-053BLI 4, 8 8 Gb / (1 GB) ISSI LPDDR4/4X: IS46LQ16512B-046BLA2 4, 8 32 Gb / (4GB) 16 Gb / (2Gb) usable by i.MX93 ISSI LPDDR4/4X: IS46LQ32K01B-046BLI 4, 8   Note 1: The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-4B/JESD209-4-1 (LPDDR4/4X). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4/4X devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The SoC also supports dual rank single channel devices therefore, 16Gb/2GB density can be also achieved by using a dual rank single channel device with 16-row addresses (R0 - R15). Note 4: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 5: This is a dual channel x32 device. Since i.MX93 only supports 16-bit LPDDR4/X data bus, it can only interface with one of the channels and therefore, utilize only half of the device's density. As indicated in the table - the device has 32Gb/4GB density however, only 16Gb/2GB can be used. There is no functional problem with using only one channel of a dual channel device as the channels are independent in LPDDR4/4X.  Note 6: This is a new JEDEC 100 ball package, half the size of the standard 200 ball package. This 100 ball package has the same performance and functionality as the 200 ball package, and has the added advantage of being smaller and cheaper than the standard package. Note 7: This device has been EoLed by the manufacturer and has been updated by a new memory part number  Note 8: Part is active. Reviewed Nov 2025 Note 9: Part is obsolete. Note 10: This device will be EoLed in Q2 24 by the manufacturer and will not be updated by a new memory part number Note 11: DQ eye marginalities were identified during TSA analysis. vTSA and stability testing did not identify any issues.
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The purpose of this document is to provide extended guidance for selection of compatible LPDDR5 and LPDDR4x memory devices that are supported by the i.MX 95 and i.MX 952 processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. Please note that some of the LPDDR4x devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. LPDDR5 - maximum supported densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 95 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses and x8 (byte mode) organization 1, 3, 7 i.MX 952 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses and x8 (byte mode) organization 1, 3, 7, 9   LPDDR5 - list of validated memories Note: The memory vendors often list their devices as LPDDR5x in their high-level product information while in fact, they are in most cases backward compatible with the LPDDR5 mode. This may lead to the false impression that there are not so many LPDDR5 devices on the market. In such cases, it is strongly recommended to check the full datasheet to confirm if the device is in fact LPDDR5/LPDDR5x or LPDDR5x only. The SoC cannot be used with devices that only support the LPDDR5X mode. The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor  Validated Memory Part#  Notes i.MX 95 128Gb/16GB Micron MT62F4G32D8DV-023 FAAT:C - 64Gb/8GB  Samsung K3KL9L90QM-MHCT - 32Gb/4GB  Samsung K3KL8L80QM-MHCT 2 32Gb/4GB  Samsung K3KL8L80EM-MUCV 2        64Gb/8GB  SK HYNIX H58G66DK9VX067N 2 64Gb/8GB Micron MT62F2G32D4DS-023 FAAT:C 2, 6 32Gb/4GB Micron MT62F1G32D2DS-020 WT:D 2 16Gb/2GB Micron MT62F1G16D1DS-023 IT:B 2 64Gb / 8GB Rayson RS2G32LO5D24DB-31BT 2 64Gb / 8GB CXMT CXDB6CCBM-MA-A 2 i.MX 952 128Gb/16GB Micron MT62F4G32D8DV-023 FAAT:C 9 32Gb/4GB Micron MT62F1G32D2DS-020 WT:D 2   LPDDR5 - list of incompatible devices The SoC cannot be used with memory devices that only support the LPDDR5x mode. LPDDR4x - maximum supported densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 95 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses 1 i.MX 952 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses 1, 9   LPDDR4x - list of validated memories   The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 95 64Gb/8GB Micron   MT53E2G32D4DE-046 AUT:C  5 8Gb/1GB Micron MT53E256M32D1KS-046 IT:L 2 128Gb/16GB Micron MT53E4G32D8GS-046 2 64Gb/8GB SK Hynix H54G66BYYVPX104 2 32Gb/4GB Intelligent Memory IMBG32L4KBB_V10 2 48Gb/6GB Micron MT53E1536M32D4DT-046 WT:A 3, 8 24Gb/3GB Micron MT53E768M32D4DT-053 AIT:E 3, 8 8Gb/1GB Samsung K4U8E3S4ADGHCL  2 32Gb/4GB Intelligent Memory IMBG32LK4BBG-046I 2 32Gb/4GB Alliance Memory AS4C1G32MD4V-046BIN 2 64Gb/8GB Rayson ATL4X8G32M2D-46IT 2 64Gb/8GB Rayson ATL4X8G32M2D-46AIT 2 64Gb/8GB DW DWCTB36HLC0 2 i.MX 952 64Gb/8GB Micron   MT53E2G32D4DE-046 AUT:C  9   LPDDR4/4X - list of incompatible devices Note: This SoC supports LPDDR4x memory devices. This SoC is not compatible with memories that only support LPDDR4. Combo Devices that support both LPDDR4x and LPDDR4 are compatible with the SoC. Note 1: The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-5 (LPDDR5) and JESD209-4C/JESD209-4-1 (LPDDR4/4X). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 3: Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. Note 4: All memory parts are available at vendors unless stated otherwise. Checked Q2 2026 Note 5: Memory device supports both LPDDR4x and LPDDR4, however can only be used in LPDDR4x mode Note 6: Not validated by NXP but confirmed working on a non NXP Board Note 7: The maximum density supported may change in the future when DRAM vendors make higher density options available Note 8: This DRAM part number is not recommended for new designs Note 9: This SoC is in Pre-Production
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This article describe some bring up tips during i.MX95 board debug, including HW and SW aspects.  
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The purpose of this page is to provide supportive information for the selection of suitable camera modules that are supported by the i.MX95. The guide is attached in this page. This helps customers evaluate project feasibility and integration aspects when considering i.MX95 SoCs for their products. It is strongly recommended to consult with NXP and the camera module vendor before finalizing the choice of the camera part number to ensure compatibility, availability, longevity, and pricing requirements.   NXP Supported Sensors: Sensor Vendor Image Sensor Max Resolution Camera Module OmniVision OS08A20 8MP IMX95-OS08A20 | NXP Semiconductors EXPI-OS08A20 OmniVision OX05B1S 5MP   OmniVision OX03C10 3MP   Onsemi AR0144 1MP AR0144   Partner Enabled Sensors: Partner Sensor Vendor Image Sensor Max Resolution ISP Tuning Camera Module Location FRAMOS Sony IMX662 2MP ✔ FSM:GO Munich, Germany/ Canada/USA Sony IMX678 8MP Sony IMX900 3.2MP Sony IMX676 12MP Onsemi Onsemi AR2020 19MP   Module available through Future Electronics   Entron OmniVision OS08A20 8MP ✔ EXPI-OS08A20 China Onsemi AR0820 8MP Order with Entron Onsemi AR0823 8MP Technexion Onsemi AR0144 1MP       Onsemi AR0145 1MP     Onsemi AR0234 2MP     Onsemi AR0235 2MP     Onsemi AR0236 2MP     Onsemi AR0521 5MP     Onsemi AR0522 5MP     Onsemi AR0544 5MP     Onsemi AR0821 8MP       Onsemi AR0822 8MP     Onsemi AR0830 8MP     Onsemi AR1335 13MP     PHYTEC Onsemi AR0144 1MP     Germany/ China/India/ USA Onsemi AR0234 2.3MP   Onsemi AR0521 5MP   E-consystems Sony IMX662 2.4MP     Riverside, CA, USA/India Sony IMX900 3.2MP    
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The purpose of this document is to specify the maximum LPDDR3, LPDDR4, & LPDDR4X densities that are supported by i.MX 8ULP processor along with a running list of tested memories to aid project feasibility assessment capabilities of customers that are evaluating the SoCs for usage in their products.  It is strongly recommended to consult with NXP and the memory vendor the final choice of the memory part number to ensure that the device meets all the compatibility, availability, longevity and pricing requirements. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. For any questions related to specific DRAM part numbers please contact the respective DRAM vendor. For any questions regarding the i.MX SoC please contact your support representative or enter a support ticket.  LPDDR4/LPDDR4X Maximum Support Density Please note that the SoC limits the addressable DDR memory map range to 2GB. SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8ULP 32-bit 16Gb/2GB single-rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 6,11   LPDDR4 - list of validated memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part#  Notes i.MX 8ULP 16Gb/2GB Micron MT53D512M32D2DS-053 WT:D  10 16Gb/2GB Micron MT53E512M32D1ZW-046 WT:B  8 64Gb/8GB Micron MT53E2G32D4DE-046 WT:A  3, 4, 8 32Gb/4GB Micron MT53E1G32D2FW-046 AUT:B  3, 4, 10 16Gb/2GB Nanya NT6AN512T32AV-J2 3, 7, 8 8Gb/1GB Forsee FL4C2001G-D9  3, 10   LPDDR4x - list of validated memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Mamory Vendor Validated Memory Part# Notes i.MX 8ULP 16Gb/ 2GB Nanya NT6AP512T32AV-J2  3, 7, 8 2Gb/ 256MB Fidelix FMF2D32VAC-4CDIR 3 4Gb/ 512MB Winbond W66CQ2NQUAFJ  3, 8 8Gb/1GB Alliance Memory AS4C256M32MD4V-062BAN  3, 8 32Gb/4GB Micron MT53E1G32D2FW-046 AUT:B (Z42M) 3, 4, 10 16Gb/ 2GB Micron MT53D512M32D2DS-053 WT:D  10 16Gb/ 2GB Micron MT53E512M32D1ZW-046 WT:B  9   LPDDR3 Maximum Support Density Please note that the SoC limits the addressable DDR memory map range to 2GB. SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8ULP 32-bit 16Gb/2GB Single Channel, Dual Chip Select 5,11   LPDDR3 - list of validated memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part#  Notes i.MX 8ULP 16Gb/2GB Micron  MT52L512M32D2PF-107 WT:B  8   Note 1: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC and on the memory device used on NXP evaluation boards, and on the JEDEC standards JESD209-4/JESD209-4B (LPDDR4/4X). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 4: As the i.MX 8ULP DDR memory map is limited to 2GB, only up to 2GB of the device can be utilized even though the device density exceeds the 2GB range. Note 5: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC and on the memory device used on NXP evaluation boards, and on the JEDEC standards JESD209-3C (LPDDR3). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk.  Note 6: The SoC supports also LPDDR4/4X devices with 17-row address bits however, given the SoC's memory map constraints (see Note 4), full density of those devices cannot be utilized since the dual channel (x32) 17-row address memory devices have the density of 4GB and higher. Note 7: By default, LPDDR4/4X devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity. Please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. Note 8: Part is active. Reviewed Jan 2026 Note 9: Part is active as MT53E512M32D1ZW-046BWT:B.  Note 10: Part is obsolete. Note 11: i.MX 8ULP does not support Non-Power of 2 Memory densities (e.g. 3,6,12 Gb).
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The purpose of this document is to provide supportive information for selection of suitable LPDDR4, DDR4 and DDR3L devices that are supported by i.MX 8M family of processors to aid project feasibility assessment capabilities of customers that are evaluating the SoCs for usage in their products.  It is strongly recommended to consult with NXP and the memory vendor the final choice of the memory part number to ensure that the device meets all the compatibility, availability, longevity and pricing requirements. Please note that some of the LPDDR4 devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs available on NXP.com Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. For any questions related to specific DRAM part numbers please contact the respective DRAM vendor. For any questions regarding the i.MX SoC please contact your support representative or enter a support ticket.  LPDDR4 - maximum supported densities Please note that the SoCs only support memory devices that support either the LPDDR4 mode or support both LPDDR4 and LPDDR4X modes. Memory devices that support only the LPDDR4X mode are not supported. SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad 32-bit 32Gb/4GB dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8M Mini  32-bit 64Gb/8GB dual rank, dual-channel  device with 17-row addresses (R0-R16) 1, 2 i.MX 8M Nano  16-bit 32Gb/4GB dual rank, single-channel  device with 17-row addresses (R0-R16) 1, 2, 3, 12 i.MX 8M Plus  32-bit 64Gb/8GB dual rank, dual-channel  device with 17-row addresses (R0-R16)  1, 2   LPDDR4 - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required. SoC Density Memory Vendor Validated Memory Part#  Notes i.MX 8M Quad  24Gb/3GB    Micron MT53B768M32D4NQ-062 WT:B  15 32Gb/4GB Micron MT53D1024M32D4DT-046 AAT:D  14 4Gb/512MB ISSI IS43LQ16256B-062BLI  5, 14 8Gb/1GB ISSI IS43LQ32256B-062BLI  5, 14 i.MX 8M Mini 16Gb/2GB Micron MT53D512M32D2DS-053 WT:D  15 16Gb/2GB    ESMT M56Z16G32512A-SMBIG 5, 14 32Gb/4GB Micron MT53E1G32D2FW-046 WT:A  5, 14 64Gb/8GB Micron MT53E2G32D4DT-046 AIT:A  5, 14 64Gb/8GB Micron MT53E2G32D4DE-046 AUT:C 5, 14 32Gb/4GB Intelligent Memory IMBG32L4KBB 5,14 32Gb/4GB Kingston B3221PM3BDGUI -U 5 i.MX 8M Nano  16Gb / 2GB  Kingston C1612PC2WDGTKR-U  15 16Gb / 2GB  Kingston  D1611PM3BDGUI-U 5,14 32Gb / 4GB Micron MT53E2G32D4DT-046 AIT:A  5, 13, 15 16Gb / 2GB Intelligent Memory  IMAG16L4KBB 5,14 4Gb / 512MB Nanya NT6AN256M16AV-J2 5,14 4Gb / 512MB  Winbond W66CP6RBQAHJ 5,14 8Gb / 1GB ISSI IS43LQ16512A-053BLI 5,14 8Gb / 1GB  Micron MT53D512M32D2DS-053 WT:D 13, 15   i.MX 8M Plus   48Gb/6GB  Micron MT53E1536M32D4DT-046 WT:A  15 64Gb/8GB  Micron MT53E2G32D4DE-046 AUT:C  5, 14 32Gb/4GB Samsung K4FBE3D4HB-KHCL  5, 14 32Gb/4GB Kingston B3221PM3BDGVIW-U 5, 14 64Gb/8GB Kingston Q6422PM3BDGVK-U  5, 14 8Gb/1GB Winbond W66DP2RQQAHJ  5, 14 32Gb/4GB ISSI IS46LQ32K01S2A-046BLA2 5, 14 16Gb/2GB ISSI IS46LQ32512A-046BLA3 5 32Gb/4GB ISSI IS43LQ32K01S2A-046BLI 5, 14 32Gb/4GB IM IMBG32LK4BBG-046I 5, 14   LPDDR4 - list of incompatible devices Given the limitations mentioned in this document, the following memory devices were identified as incompatible with the particular SoCs as detailed in the following table:   Memory Vendor Memory Part# Density Incompatible SoCs Incompatibility reason Samsung K4FHE3S4HA-KU(H/F)CL 24Gb/3Gb i.MX 8M Quad  The memory device requires 17th row address bit to function. Samsung K4UHE3S4AA-KU(H/F)CL K4UJE3D4AA-KU(H/F)CL 24Gb/3Gb 48Gb/6GB i.MX 8M Quad i.MX 8M Mini i.MX 8M Nano i.MX 8M Plus The memory device only supports the LPDDR4X mode. Samsung K4FCE3Q4HB-KU(H/F)CL K4UCE3Q4AB-KU(H/F)CL 64Gb/8GB i.MX 8M Quad i.MX 8M Mini i.MX 8M Nano i.MX 8M Plus A byte mode memory device. The memory device only supports the LPDDR4X mode.    DDR4 - maximum supported densities SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad  32-bit 32Gb/4GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 6 i.MX 8M Mini  32-bit 64Gb/8GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 7 i.MX 8M Nano  16-bit 64Gb/8GB x8, 16Gb device with 2 bank group addresses, 17-row addresses and 10 column addresses 1, 8 i.MX 8M Plus  32-bit 64Gb/8GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 7   DDR4 - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required.   SoC Density Memory Vendor Validated Memory Part#  Notes i.MX 8M Quad 32Gb/4GB Micron 4x MT40A512M16JY-083EAAT  15 i.MX 8M Mini  16Gb/2GB Micron 2x MT40A512M16LY-075:E  15 i.MX 8M Nano 16Gb/2GB Micron 1x MT40A1G16RC-062E:B  15 8Gb/1GB Rayson 1x RS512M16Z2DD-62DT 14 8Gb/1GB UniIC SCB12Q8G160BF-06SI 14 i.MX 8M Plus 64Gb/8GB Micron 4x MT40A1G16RC-062E:B  15 16Gb/2GB Nanya NT5AD512M16C4-JRI  14   DDR3L - maximum supported densities SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad  32-bit 32Gb/4GB x16, 8Gb device with 16-row addresses and 10 column addresses 1, 9 i.MX 8M Mini  32-bit 64Gb/8GB x8, 8Gb device with 16-row addresses and 11 column addresses 1, 10 i.MX 8M Nano  16-bit 32Gb/4GB x8, 8Gb device with 16-row addresses and 11 column addresses 1, 11 i.MX 8M Plus  i.MX 8M Plus does not support DDR3L   DDR3L - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required. SoC Density Vendor Validated Memory Part#  Notes i.MX 8M Quad  16Gb/2GB Micron 4x MT41K256M16TW-107 AAT  14 i.MX 8M Mini  16Gb/2GB Micron 4x MT41K256M16TW-107 AAT  14              i.MX 8M Nano 8Gb/1GB Micron MT41K512M16VRN-107  15   Note 1: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standards JESD209-4/JESD209-4A (LPDDR4), JESD279-4/JESD279-4A (DDR4), and JESD79-3E/JESD79-3F/JESD79-3-1A (DDR3/DDR3L). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The memory vendors often do not offer so many variants of single-channel memory devices. As an alternative, a dual-channel device with only one channel connected may be used. For example: A dual-rank, single-channel device with 16-row address bits has a density of 16Gb. If such a device is not available at the chosen supplier, a dual-rank, dual-channel device with 16-row address bits can be used instead. This device has a density of 32 Gb however since only one channel can be connected to the SoC, only half of the density is available (16 Gb). Usage of more than one discrete memory chips to overcome market constraints is not supported since only point-to-point connections are assumed for LPDDR4. Note 4: Devices with 17-row addresses (R0-R16) are not supported by the DDR Controller Note 5: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 6: The density can be achieved by connecting 2 single-rank discrete devices with one 16Gb die each. Since the SoC supports x8 devices and also has connectivity for a second rank, usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 32Gb/4GB of address space dedicated for the DDR. Two x16 16Gb devices giving 32Gb/4GB in total is, therefore, the optimal choice that balances the maximum density aspects, the signal integrity aspects (only two discrete devices used), and bandwidth aspects (full data bus width used). Note 7: The density can be achieved by connecting 4 single rank discrete devices with one 16Gb die each, 2 devices connected to each chip select. Since the SoC supports x8 devices, the usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 64Gb/8GB of address space dedicated for the DDR. Four x16 16Gb devices giving 64Gb/8GB in total is the optimal choice that balances the maximum density aspects, the signal integrity aspects (only four discrete devices used), and the bandwidth aspects (full data bus width used). Note 8: The density can be achieved by connecting 4 single rank discrete devices with one 16Gb die each, 2 devices connected to each chip select.  Note 9: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select, or by connecting 2 dual rank discrete devices with two 8Gb dies each. Since the SoC supports x8 devices, the usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 32Gb/4GB of address space dedicated for the DDR. Four x16 8Gb devices giving 32Gb/4GB in total is, therefore, the optimal choice that balances the maximum density aspects, the signal integrity aspects (four discrete devices used), and bandwidth aspects (full data bus width used). Note 10: The density can be achieved by connecting 8 single rank discrete devices with one 8Gb die each, 4 devices connected to each chip select or by connecting 4 dual rank discrete devices with two 8Gb dies each. Note that the first option significantly exceeds the number of devices used on the validation board (4 discrete devices) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis. Practically, it is not recommended to use more than 4 discrete DDR3L devices. This corresponds to the maximum density of 32Gb/4GB in the case of the single rank devices containing one 8Gb die or 64Gb/8GB in case of the dual-rank devices, each containing two 8Gb dies. Note 11: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select or by connecting 2 dual rank discrete devices with two 8Gb dies each. Note 12: For single-channel (x16) memory devices, the current maximum available density in the market is 16Gb/2GB (Q1 2022). Note 13: Only one channel of the device (and hence, half of its density) was utilized due to the reduced data bus width (x16) of the SoC. Note 14: Part is active. Reviewed Jan 2026 Note 15: Part will either EoL or is not recommended for new designs by the respective vendor.   Additional Links https://community.nxp.com/t5/iMX-and-Vybrid-Support/i-MX-8-8X-8XL-maximum-supported-LPDDR4-and-DDR3L-densities/ta-p/1152715           
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The purpose of this document is to provide supportive information for selection of suitable LPDDR4 and DDR3L devices that are supported by i.MX 8/8X/8XLite family of processors to aid project feasibility assessment capabilities of customers that are evaluating the SoCs for usage in their products.  It is strongly recommended to consult with NXP and the respective memory vendor, the final choice of the memory part number to ensure that the device meets all the compatibility, availability, longevity and pricing requirements. Please note that some of the LPDDR4 devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the respective NXP i.MX 8 Hardware Developer's Guide available on NXP.com The i.MX8/8X/8XL Reference manuals declare that there are 16GB allocated for the DDR. Please note that this is only the address space, which is reserved for the DDR memory in the memory map. This specification does not guarantee that the entire region can be utilized as the maximum achievable densities listed below in the tables are restricted mainly by the addressing capabilities of the DDR controller, width of the data bus and other implementation-specific parameters as well as availability of supported devices on the market. Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. For any questions related to specific DRAM part numbers please contact the respective DRAM vendor. For any questions regarding the i.MX SoC please contact your support representative or enter a support ticket.  LPDDR4 - maximum supported densities Please note that the SoCs only support memory devices that support either the LPDDR4 mode or support both LPDDR4 and LPDDR4X modes. Memory devices that support only the LPDDR4X mode are not supported. SoC Package Max data bus width Maximum density Assumed memory organization Notes i.MX 8QM/8QP 29x29 mm 32-bit (per controller) 32Gb/4GB (per controller) dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8QXP/8DXP 21x21 mm 32-bit 32Gb/4GB dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8QXP/8DXP 17x17 mm 16-bit 16Gb/2GB dual rank, single-channel  device with 16-row addresses (R0-R15) 1, 2, 3, 4, 9 i.MX 8XLite 15x15 mm 16-bit 32Gb/4GB dual rank, single channel  device with 17-row addresses (R0-R16) 1, 2, 3, 9   LPDDR4 - list of validated memories The validation process is an ongoing effort - updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 8QM/8QP 24Gb/3GB (per controller) Micron MT53B768M32D4NQ-062 AIT:B   12, 13 32Gb/4GB (per controller)  Samsung K4FBE3D4HB-KHCL  10, 11 32Gb/4GB (per controller) Micron MT53E1G32D2FW-046 AUT:B (Z42M) 10, 11 32Gb/4GB (per controller) Micron MT53D1024M32D4DT-046 AAT:D   12 16Gb/2GB (per controller) Micron MT53D512M32D2DS-046 WT:D  10, 12 16Gb/2GB (per controller) Nanya NT6AN512T32AC-J1J  10, 11 16Gb/2GB (per controller) Nanya NT6AN512T32AC-J1H  10, 11 32Gb/4GB (per controller) Nanya NT6AN1024F32AC-J2J  10, 11 32Gb/4GB (per controller) Nanya NT6AN1024F32AC-J2H  10, 11 i.MX 8QXP/8DXP 24Gb/3GB Micron MT53B768M32D4NQ-062 AIT:B   12, 13 32Gb/4GB Nanya NT6AN1024F32AC-J2J  10, 11 32Gb/4GB Nanya NT6AN1024F32AC-J2H  10, 11 16Gb/2GB Nanya NT6AN512T32AC-J2J  10, 11 16Gb/2GB Nanya NT6AN512T32AC-J2H  10, 11 32Gb/4GB Micron MT53D1024M32D4DT-046 AAT:D   11 i.MX 8XLite 8Gb/1GB Micron MT53D512M16D1DS 046 AAT ES:D & Z9XGG   12 12Gb/1.5GB Micron MT53E768M16D1ZW-046 AAT:C 10, 11, 13 4Gb/0.5GB Samsung K4F4E164HD-THCL  10, 11 8Gb/1GB ISSI IS43LQ16512A-053BLI 10, 11 8Gb/1GB Nanya NT6AN512M16AV-J1I  10, 11   LPDDR4 - list of incompatible devices Given the limitations mentioned in this document, the following memory devices were identified as incompatible with the particular SoCs as detailed in the following table:   Memory vendor Part Number Density Incompatible SoCs Incompatibility reason Samsung K4FHE3S4HA-KU(H/F)CL 24Gb/3Gb i.MX8QM/8QP, i.MX8QXP/8DXP The memory device requires 17th row address bit to function. Samsung K4UHE3S4AA-KU(H/F)CL 24Gb/3Gb i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL The memory device only supports the LPDDR4X mode. Samsung K4UJE3D4AA-KU(H/F)CL 48Gb/6GB i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL The memory device only supports the LPDDR4X mode. Samsung K4FCE3Q4HB-KU(H/F)CL 64Gb/8GB i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL A byte mode memory device. Samsung K4UCE3Q4AB-KU(H/F)CL 64Gb/8GB i.MX8QM/QP, i.MX8QXP/8DXP, i.MX8DXL, i.MX8SXL A byte mode memory device. The device only supports the LPDDR4X mode.    DDR3L - maximum supported densities SoC Package Max data bus width Maximum density Assumed memory organization Notes i.MX 8QXP/8DXP 21x21 mm 32-bit 64Gb/8GB x8, 8Gb device with 16-row addresses and 11 column addresses 5, 6 i.MX 8QXP/8DXP 17x17 mm 16-bit 32Gb/4GB x8, 8Gb device with 16-row addresses and 11 column addresses 5, 7 i.MX 8XLite 15x15 mm 16-bit 16Gb/2GB x8, 8Gb device with 16-row addresses and 11 column addresses 5, 8   DDR3L - list of validated memories The validation process is an ongoing effort -  updates of the table are expected. SoC Density Memory Vendor Validated Mamory Part#  Notes i.MX 8QXP/8DXP 8Gb/1GB Micron 2x MT41K256M16TW-093 IT:P 12 i.MX 8XLite 4Gb/512MB Micron MT41K256M16TW-093 IT:P 12   Note 1: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standard JESD209-4A. Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that a DRAM with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The memory vendors often do not offer so many variants of single-channel memory devices. As an alternative, a dual-channel device with only one channel connected may be used. For example: A dual-rank, single-channel device with 16-row address bits has a density of 16Gb. If such a device is not available at the chosen supplier, a dual-rank, dual-channel device with 16-row address bits can be used instead. This device has a density of 32 Gb however since only one channel can be connected to the SoC, only half of the density is available (16 Gb). Usage of more than one discrete memory chip to overcome market constraints is not supported since only point-to-point connections are assumed for LPDDR4. Note 4: Devices with 17-row addresses (R0-R16) are not supported by the SoCs.  Note 5: The numbers are based purely on the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standard JESD79-3E/JESD79-3F. Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that a DRAM with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 6: The density can be achieved by connecting 8 single rank discrete devices with one 8Gb die each, 4 devices connected to each chip select, or by connecting 4 dual rank discrete devices with two 8Gb dies each. Note that this number of discrete devices significantly exceeds the number of devices used on the validation board (2 discrete devices, not taking into account the device used for ECC) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis hence practically, it is not recommended to use more than 2 discrete DDR3L devices. This corresponds to the maximum density of 16Gb/2GB in the case of the single rank devices containing one 8Gb die or 32Gb/4GB in the case of the dual-rank devices containing two 8Gb dies (x16 8Gb devices with 16-row addresses and 10 column addresses assumed instead of x8 devices in such case). Note 7: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select, or by connecting 2 dual rank discrete devices with two 8Gb dies each. Note that the first option exceeds the number of devices used on the validation board (2 discrete devices) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis, hence practically, it is not recommended to use more than 2 discrete DDR3L devices. This corresponds to the maximum density of 16Gb/2GB in the case of the single rank devices containing one 8Gb die or 32Gb/4GB in the case of the dual-rank devices containing two 8Gb dies. Note 8: The density can be achieved by connecting 2 single rank discrete devices with one 8Gb die each to the i.MX. 8XLite supports only one chip select for DDR3L therefore, dual-rank systems are not supported. Note 9: For single-channel (x16) memory devices, the current maximum available density in the market is 16Gb/2GB (2025). Note 10: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 11: Part is active. Reviewed Aug 2025 Note 12: Part is being End Of Life'd (EoL) by Vendor or obsolete. Note 13: Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. Additional Links i.MX 8M Quad/8M Mini/8M Nano/8M Plus - LPDDR4, DDR4 and DDR3L memory compatibility guide 
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   Memory Compatibility Guides   Processor/Family Link to Guide i.MX 8/8X/8XLite DDR3L and LPDDR4 i.MX 8M Quad/8M Mini/8M Nano/8M Plus DDR3L, DDR4, LPDDR4 i.MX 8ULP  LPDDR3, LPDDR4 & LPDDR4x i.MX 93 LPDDR4/LPDDR4x i.MX 95 LPDDR5/LPDDR4x - New Other Processor Families Please contact NXP Support or Sales   Additional Resources i.MX Memory Fact Sheet DDR memory selection & enablement for i.MX platforms Smarter World Blog Building Resilient Embedded Systems: NXP’s Approach to DDR Memory Selection and Support DDR Configuration Tools DDR Configuration tool for i.MX  Developer Resources i.MX Developer Resources SW & Tools
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This blog enables support of Qemu emulation for iMX8MM EVK.  Imagine not having the hardware but still you want to test the software. Qemu gives you exactly that. 1. Booting uboot, linux and user-space application even when you do not possess a real hardware. 2. Early firmware development when the silicon doesn’t yet exist. 3. Linux driver development, debugging and testing.
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We are pleased to announce that Config Tools for i.MX 26.03 are now available. Downloads & links To download the installer for all platforms, please login to our download site via:  https://www.nxp.com/design/designs/config-tools-for-i-mx-applications-processors:CONFIG-TOOLS-IMX Please refer to  Documentation  for installation and quick start guides. For further information about DDR config and validation, please go to this  blog post. Release Notes Full details on the release (features, known issues...) Version 26.03 System Manager Memory sector information for resources with memory configuration is added to the Resources overview. Support for memory sectors splitting. Memory configuration input for resources using MBC/MRC is improved. Support for macOS (aarch64 and x86_64) is added. Clocks Hierarchy for local configuration element settings is supported. TEE Multicore Interrupt Handling for Single Security Domain is supported. Option to filter only user-defined memory regions is added. Interrupts are now separated into groups based on the core.
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This page serves as a hub to gather the links to all the currently available ISP supported camera lists for the i.MX Applications processors.  Camera Compatibility Guides Processor/Family Link to Guide i.MX8M PLUS i.MX8M Plus ISP Camera Compatibility Guide i.MX95 i.MX95 ISP Camera Compatibility Guide   Additional Resources i.MX Camera Software Pack AN AN14376: i.MX Camera Software Pack | NXP Semiconductors
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The purpose of this page is to provide supportive information for the selection of suitable camera modules that are supported by the i.MX 8M Plus (i.MX8MP). The guide is attached in this page. This helps customers evaluate project feasibility and integration aspects when considering i.MX 8MP SoCs for their products. It is strongly recommended to consult with NXP and the camera module vendor before finalizing the choice of the camera part number to ensure compatibility, availability, longevity, and pricing requirements. NXP Supported Sensors: Sensor Vendor Image Sensor Max Resolution Camera Module OmniVision OS08A20 8MP IMX-OS08A20 EXPI-OS08A20 OmniVision OV2775 2MP   Sony IMX219 8MP   Sony IMX477 12.3MP   Onsemi AR0144 1MP AR0144 Onsemi AR1335 13MP     Partner Enabled Sensors:   Partner Sensor Vendor Image Sensor Max Resolution ISP Tuning Camera Module Location FRAMOS Sony IMX415 8MP ✔   Munich, Germany/ Canada/USA Sony IMX662 2MP FSM:GO Sony IMX678 8MP Sony IMX900 3.2MP Sony IMX676 12MP Innowave Onsemi AR1335 13MP ✔   Austin, Texas, USA/Israel Sony IMX258 13MP Camera Modules Sony IMX219 8MP OmniVision OV5645 5MP   OmniVision OV2710 2MP   Basler Onsemi AR0821 8MP   Basler   Onsemi AR0521 5MP   Onsemi Onsemi AR0830 8MP   Image Sensors, Module available through Future Electronics   Onsemi AR0544 5MP Onsemi AR0821 8MP Onsemi AR0822 8MP Onsemi AR0145 1MP Onsemi AR0235 2MP Onsemi AR1335 13MP PHYTEC Onsemi AR0144 1MP     Germany/ China/India/ USA Onsemi AR0234 2.3MP   Onsemi AR0521 5MP   E-consystems Sony IMX662 2.4MP     Riverside, CA, USA/India Sony IMX900 3.2MP   Onsemi AR0234 2.3MP   CIS Corporation Sony IMX715 12MP ✔   Japan Sony IMX570 0.32MP   Onsemi AR0234CS 2MP   Sony Sony IMX500 12MP     Japan HINO Engg Sony IMX415 8MP ✔   Japan Sony IMX662 2MP   Leopard Imaging Sony IMX500 12MP ✔   Fremont, CA, USA/China   Note: CIS Corporation and HINO Engg currently only support customers in Japan market.
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Use Raspberry Pi Debug Probe with OpenOCD and i.MX93 FRDM   This document explains the integration process of the Raspberry Pi Debug Probe (Very low cost debugger) with the OpenOCD (On Chip Debugger) tool with the i.MX93 FRDM board.   Also, we will use GDB (GNU DeBugger) to interact with the OpenOCD.   1. Install and Configure OpenOCD   Update and install dependencies sudo apt update sudo apt install build-essential libtool automake pkg-config libusb-1.0-0-dev libhidapi-dev libftdi1-dev libjim-dev jimsh   Clone the OpenOCD repo git clone https://github.com/openocd-org/openocd.git cd openocd   Run ./bootstrap to create the configuration file git submodule update --init --recursive ./bootstrap ./configure --enable-cmsis-dap --enable-hidapi   Make OpenOCD make -j$(nproc) sudo make install   Download the configuration file for i.MX93 You can dowload the  imx93.cfg  in the Table 2. Software requirements on Ubuntu PC of the AN14367 Then, copy the downloaded file to the openocd/tcl/target/ as below: cp ../imx93_new-b42b7c4cac18508442d3df035cec1c6d.cfg tcl/target/imx93.cfg   2. Create UDEV rules   sudo nano /etc/udev/rules.d/99-openocd.rules Add the below in that file: ATTRS{idVendor}=="2e8a", ATTRS{idProduct}=="000c", MODE="660", GROUP="plugdev", TAG+="uaccess"   Reload rules sudo udevadm control --reload-rules && sudo udevadm trigger   3. Connecting the Hardware   To make the DAP works in the i.MX93 FRDM, we must rework the board removing the resistors R3017 and R3018:     Now, we need to connect the Raspberry Pi Debug Probe with the SWD (P14) of our i.MX93 FRDM board:       4. Running the Debug Session   In this moment, with the RP Debug Probe connected, we can Boot the i.MX93 FRDM board and run the below command to start the OpenOCD: $ openocd -s tcl -f interface/cmsis-dap.cfg -c "adapter speed 1000" -f target/imx93.cfg   tic-mpu@tic-mpu:~/Debug_test/openocd$ openocd -s tcl -f interface/cmsis-dap.cfg -c "adapter speed 1000" -f target/imx93.cfg Open On-Chip Debugger 0.12.0+dev-02429-ge4c49d860 (2026-03-21-23:05) Licensed under GNU GPL v2 For bug reports, read http://openocd.org/doc/doxygen/bugs.html adapter speed: 1000 kHz Warn : DEPRECATED: auto-selecting transport "swd". Use 'transport select swd' to suppress this message. Info : Listening on port 6666 for tcl connections Info : Listening on port 4444 for telnet connections Info : Using CMSIS-DAPv2 interface with VID:PID=0x2e8a:0x000c, serial=E6633861A33A1B2C Info : CMSIS-DAP: SWD supported Info : CMSIS-DAP: Atomic commands supported Info : CMSIS-DAP: Test domain timer supported Info : CMSIS-DAP: FW Version = 2.0.0 Info : CMSIS-DAP: Interface Initialised (SWD) Info : SWCLK/TCK = 0 SWDIO/TMS = 0 TDI = 0 TDO = 0 nTRST = 0 nRESET = 0 Info : CMSIS-DAP: Interface ready Info : clock speed 1000 kHz Info : SWD DPIDR 0x5ba02477 Info : imx93.a55.0: hardware has 6 breakpoints, 4 watchpoints Info : [imx93.a55.0] external reset detected Info : [imx93.a55.0] Examination succeed Info : [imx93.m33] Cortex-M33 r1p0 processor detected Info : [imx93.m33] target has 8 breakpoints, 4 watchpoints Info : [imx93.m33] Examination succeed Info : [imx93.ahb] Examination succeed Info : [imx93.a55.0] starting gdb server on 3333 Info : Listening on port 3333 for gdb connections Info : [imx93.m33] starting gdb server on 3334 Info : Listening on port 3334 for gdb connections Info : [imx93.ahb] gdb port disabled   From the Logs, we can see we have two ports: 3333 for Cortex A55 [imx93.a55.0] 3334 for Cortex M33 [imx93.m33]   Install gdb-multiarch   Now, we can install GDB: sudo apt install gdb-multiarch And start a Debug session: $ gdb-multiarch ~/linux-imx/vmlinux   $ gdb-multiarch ~/linux-development/linux-imx/vmlinux GNU gdb (Ubuntu 15.1-1ubuntu1~24.04.1) 15.1 Copyright (C) 2024 Free Software Foundation, Inc. License GPLv3+: GNU GPL version 3 or later <http://gnu.org/licenses/gpl.html> This is free software: you are free to change and redistribute it. There is NO WARRANTY, to the extent permitted by law. Type "show copying" and "show warranty" for details. This GDB was configured as "x86_64-linux-gnu". Type "show configuration" for configuration details. For bug reporting instructions, please see: <https://www.gnu.org/software/gdb/bugs/>. Find the GDB manual and other documentation resources online at: <http://www.gnu.org/software/gdb/documentation/>. For help, type "help". Type "apropos word" to search for commands related to "word"... Reading symbols from /home/tic-mpu/linux-development/linux-imx/vmlinux... (gdb) target extended-remote localhost:3333 Remote debugging using localhost:3333 0x00000000fff118fc in ?? ()   A simple example of how to read a register with GDB: (gdb) x/xw 0x43810000 0x43810000: 0x02010001     Happy debugging!     Best regards, Salas. 
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Tested in FRDM-i.MX91 Written in C LF-6.12.49
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Updated for "phase 3" after a 3rd software lockup symptom found and fixed. Updated doc/patch: Software-lockup-issue-phase3_20260318-public.pdf 0001-clk-fix-sleeping-function-called-from-invalid-contex.patch 0001-ddr-perf-fix-sleeping-function-called-from-invalid-c.patch 0001-gpu-imx-dpu-Access-ExtDst-FetchUnit-Hscaler-Vscaler-new_L4.14.98.patch (this patch will depends on https://github.com/nxp-imx/linux-imx/commit/70744429841f08efc42a63380198cdae7f9a602f) --- 20260318   This is a summary for the software lockup issue found in the following platform: −i.MX8/8X −Linux 4.14.98_2.3.3   Issue description: •Issue happens during the boot procedure, at the systemd stage. •The symptom of the issue: −From user perspective, the symptom varies, but mainly fall into several types: §At the console, there may be login prompt, but no response (only echo) when input user/password. Unable to login. §Some user service in systemd failed to start. E.g. weston. −When checking the task status using sysrq (w/t), many tasks, including some kernel core tasks stays in “D” (uninterruptable sleep) state. E.g. agetty, login, chvt, etc. •Kernel itself is still alive. This can be verified by triggering some drivers, such as plugin a USB device. Issue can be reproduced on MEK through long time stress.   Please refer to the doc/patch attached for details.
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There are currently no additional test programs in I.MX Jailhouse program. This demo shares how to test RM67199 MIPI panel in Jailhouse inmate.   Please refer run.sh in attachments. modprobe jailhouse insmod jailhouse_clk.ko # adjust pixel clock for MIPI PANEL RMP67199 echo 129937500 > /sys/bus/platform/devices/jailhouse_clk/rate_pix export PATH=$PATH:/usr/share/jailhouse/tools/ jailhouse enable /root/imx8mm.cell jailhouse cell linux /root/imx8mm-inmate-demo.cell /root/Image.bin -d /root/imx8mm-evk-inmate.dtb -c "clk_ignore_unused console=ttymxc3,115200 earlycon=ec_imx6q,0x30890000,115200 root=/dev/mmcblk2p2 rootwait rw"  
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There are currently no additional test programs in I.MX Jailhouse program. This demo shares how to test USB function in Jailhouse inmate. Inmate boot log: root@imx8mmevk:~# dmesg | grep usb [ 0.312280] usbcore: registered new interface driver usbfs [ 0.317206] usbcore: registered new interface driver hub [ 0.322279] usbcore: registered new device driver usb [ 0.911649] usbcore: registered new device driver r8152-cfgselector [ 0.917711] usbcore: registered new interface driver r8152 [ 0.994200] usbcore: registered new interface driver uas [ 0.999359] usbcore: registered new interface driver usb-storage [ 1.005192] usbcore: registered new interface driver usbserial_generic [ 1.011486] usbserial: USB Serial support registered for generic [ 1.017274] usbcore: registered new interface driver ftdi_sio [ 1.022813] usbserial: USB Serial support registered for FTDI USB Serial Device [ 1.029852] usbcore: registered new interface driver usb_serial_simple [ 1.036148] usbserial: USB Serial support registered for carelink [ 1.042016] usbserial: USB Serial support registered for flashloader [ 1.048144] usbserial: USB Serial support registered for funsoft [ 1.053931] usbserial: USB Serial support registered for google [ 1.059643] usbserial: USB Serial support registered for hp4x [ 1.065185] usbserial: USB Serial support registered for kaufmann [ 1.071051] usbserial: USB Serial support registered for libtransistor [ 1.077334] usbserial: USB Serial support registered for moto_modem [ 1.083371] usbserial: USB Serial support registered for motorola_tetra [ 1.089745] usbserial: USB Serial support registered for nokia [ 1.095368] usbserial: USB Serial support registered for novatel_gps [ 1.101486] usbserial: USB Serial support registered for siemens_mpi [ 1.107612] usbserial: USB Serial support registered for suunto [ 1.113316] usbserial: USB Serial support registered for vivopay [ 1.119111] usbserial: USB Serial support registered for zio [ 1.124578] usbcore: registered new interface driver usb_ehset_test [ 1.215499] usbcore: registered new interface driver usbhid [ 1.220879] usbhid: USB HID core driver [ 1.396384] usb_phy_generic usbphynop1: dummy supplies not allowed for exclusive requests [ 42.414253] usb 1-1: new high-speed USB device number 2 using ci_hdrc [ 42.577822] usb-storage 1-1:1.0: USB Mass Storage device detected [ 42.579492] scsi host0: usb-storage 1-1:1.0  
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Some customer need to run Zephyr on i.MX8QXP CM4, but there is no support on Zephyr mainline(v4.3.0) This article will share the porting based on Zephyr v4.3.0. For i.MX8QM CM4, please refer this link: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8QM-CM4-0-support-on-Zephyr-v4-3-0/ta-p/2296962   samples/hello_world/ samples/synchronization Add pd_ignore_unused in bootargs before entering Linux. For the OpenAMP communication, need to refer this Zephyr application. https://github.com/nxp-real-time-edge-sw/heterogeneous-multicore/blob/main/apps/rpmsg_str_echo/zephyr/main.c
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Some customer need to run Zephyr on i.MX8QM CM4, but there is no support on Zephyr mainline(v4.3.0). This article will share the i.MX8QM CM4_0 porting based on Zephyr v4.3.0.  For i.MX8QXP CM4, please refer this link: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8QXP-CM4-support-on-Zephyr-v4-3-0/ta-p/2296957   samples/hello_world/ samples/synchronization   Add pd_ignore_unused in bootargs before entering Linux. For the OpenAMP communication, need to refer this Zephyr application. https://github.com/nxp-real-time-edge-sw/heterogeneous-multicore/blob/main/apps/rpmsg_str_echo/zephyr/main.c
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