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This patch series enables the external 3.3 V and 5 V power rails used by the Raspberry Pi expansion connector on the i.MX93-QSB, i.MX93-FRDM, and i.MX91-FRDM boards. These regulators were already defined in the device tree but left disabled by default. By activating them, the RPI-compatible expansion header can properly power external modules, HATs, and add‑on boards. Changes by board: i.MX93-QSB Enables the 3.3 V and 5 V external supply lines used by the RPI connector.   i.MX93-FRDM Enables the 3.3 V and 5 V external supply lines used by the RPI connector.   i.MX91-FRDM Enables the 3.3 V and 5 V external supply lines used by the RPI connector.   Purpose: Provide proper power to the Raspberry Pi compatible expansion port. Improve hardware compatibility for users attaching external HATs or modules. Align all i.MX9 reference boards to use a consistent power‑tree configuration for the RPI connector.
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The purpose of this document is to provide supportive information for selection of suitable LPDDR4, DDR4 and DDR3L devices that are supported by i.MX 8M family of processors to aid project feasibility assessment capabilities of customers that are evaluating the SoCs for usage in their products.  It is strongly recommended to consult with NXP and the memory vendor the final choice of the memory part number to ensure that the device meets all the compatibility, availability, longevity and pricing requirements. Please note that some of the LPDDR4 devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs available on NXP.com Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. For any questions related to specific DRAM part numbers please contact the respective DRAM vendor. For any questions regarding the i.MX SoC please contact your support representative or enter a support ticket.  LPDDR4 - maximum supported densities Please note that the SoCs only support memory devices that support either the LPDDR4 mode or support both LPDDR4 and LPDDR4X modes. Memory devices that support only the LPDDR4X mode are not supported. SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad 32-bit 32Gb/4GB dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8M Mini  32-bit 64Gb/8GB dual rank, dual-channel  device with 17-row addresses (R0-R16) 1, 2 i.MX 8M Nano  16-bit 32Gb/4GB dual rank, single-channel  device with 17-row addresses (R0-R16) 1, 2, 3, 12 i.MX 8M Plus  32-bit 64Gb/8GB dual rank, dual-channel  device with 17-row addresses (R0-R16)  1, 2   LPDDR4 - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required. SoC Density Validated part number  Vendor Notes i.MX 8M Quad  24Gb/3GB MT53B768M32D4NQ-062 WT:B     Micron 15 32Gb/4GB MT53D1024M32D4DT-046 AAT:D  Micron 14 4Gb/512MB IS43LQ16256B-062BLI  ISSI 5, 14 8Gb/1GB IS43LQ32256B-062BLI  ISSI 5, 14 i.MX 8M Mini 16Gb/2GB MT53D512M32D2DS-053 WT:D  Micron 15 16Gb/2GB M56Z16G32512A     ESMT 5, 14 32Gb/4GB MT53E1G32D2FW-046 WT:A  Micron 5, 14 64Gb/8GB MT53E2G32D4DT-046 AIT:A  Micron 5, 14 64Gb/8GB MT53E2G32D4DE-046 AUT:C Micron 5, 14 32Gb/4GB B3221PM3BDGUI -U Kingston 5 i.MX 8M Nano  16Gb / 2GB C1612PC2WDGTKR-U   Kingston 15 16Gb / 2GB  D1611PM3BDGUI-U  Kingston 5,14 32Gb / 4GB MT53E2G32D4DT-046 AIT:A  Micron 5, 13, 15 16Gb / 2GB IMAG16L4KBB Intelligent Memory (IM) 5,14 4Gb / 512MB NT6AN256M16AV-J2 Nanya 5,14 4Gb / 512MB W66CP6RBQAHJ  Winbond 5,14 8Gb / 1GB IS43LQ16512A-053BLI ISSI 5,14 8Gb / 1GB MT53D512M32D2DS-053 WT:D  Micron 13, 15   i.MX 8M Plus 48Gb/6GB MT53E1536M32D4DT-046 WT:A   Micron 15 64Gb/8GB MT53E2G32D4DE-046 AUT:C   Micron 5, 14 32Gb/4GB K4FBE3D4HB-KHCL  Samsung 5, 14 32Gb/4GB B3221PM3BDGVIW-U Kingston 5, 14 64Gb/8GB Q6422PM3BDGVK-U  Kingston 5, 14 8Gb/1GB W66DP2RQQAHJ  Winbond 5, 14 32Gb/4GB IS46LQ32K01S2A-046BLA2 ISSI 5, 14 32Gb/4GB IS43LQ32K01S2A-046BLI ISSI 5,14   LPDDR4 - list of incompatible devices Given the limitations mentioned in this document, the following memory devices were identified as incompatible with the particular SoCs as detailed in the following table:   Memory vendor Part Number Density Incompatible SoCs Incompatibility reason Samsung K4FHE3S4HA-KU(H/F)CL 24Gb/3Gb i.MX 8M Quad  The memory device requires 17th row address bit to function. Samsung K4UHE3S4AA-KU(H/F)CL K4UJE3D4AA-KU(H/F)CL 24Gb/3Gb 48Gb/6GB i.MX 8M Quad i.MX 8M Mini i.MX 8M Nano i.MX 8M Plus The memory device only supports the LPDDR4X mode. Samsung K4FCE3Q4HB-KU(H/F)CL K4UCE3Q4AB-KU(H/F)CL 64Gb/8GB i.MX 8M Quad i.MX 8M Mini i.MX 8M Nano i.MX 8M Plus A byte mode memory device. The memory device only supports the LPDDR4X mode.    DDR4 - maximum supported densities SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad  32-bit 32Gb/4GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 6 i.MX 8M Mini  32-bit 64Gb/8GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 7 i.MX 8M Nano  16-bit 64Gb/8GB x8, 16Gb device with 2 bank group addresses, 17-row addresses and 10 column addresses 1, 8 i.MX 8M Plus  32-bit 64Gb/8GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 7   DDR4 - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required.   SoC Density Vendor Validated part number  Notes i.MX 8M Quad 32Gb/4GB Micron 4x MT40A512M16JY-083EAAT  15 i.MX 8M Mini  16Gb/2GB Micron 2x MT40A512M16LY-075:E  15 i.MX 8M Nano 16Gb/2GB Micron 1x MT40A1G16RC-062E:B  15 8Gb/1GB Rayson 1x RS512M16Z2DD-62DT 14 8Gb/1GB UniIC SCB12Q8G160BF-06SI 14 i.MX 8M Plus 64Gb/8GB Micron 4x MT40A1G16RC-062E:B  15 16Gb/2GB Nanya NT5AD512M16C4-JRI  14   DDR3L - maximum supported densities SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad  32-bit 32Gb/4GB x16, 8Gb device with 16-row addresses and 10 column addresses 1, 9 i.MX 8M Mini  32-bit 64Gb/8GB x8, 8Gb device with 16-row addresses and 11 column addresses 1, 10 i.MX 8M Nano  16-bit 32Gb/4GB x8, 8Gb device with 16-row addresses and 11 column addresses 1, 11 i.MX 8M Plus  i.MX 8M Plus does not support DDR3L   DDR3L - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required. SoC Density Vendor Validated part number (vendor) Notes i.MX 8M Quad  16Gb/2GB Micron 4x MT41K256M16TW-107 AAT  14 i.MX 8M Mini  16Gb/2GB Micron 4x MT41K256M16TW-107 AAT  14              i.MX 8M Nano 8Gb/1GB Micron MT41K512M16VRN-107  15   Note 1: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standards JESD209-4/JESD209-4A (LPDDR4), JESD279-4/JESD279-4A (DDR4), and JESD79-3E/JESD79-3F/JESD79-3-1A (DDR3/DDR3L). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The memory vendors often do not offer so many variants of single-channel memory devices. As an alternative, a dual-channel device with only one channel connected may be used. For example: A dual-rank, single-channel device with 16-row address bits has a density of 16Gb. If such a device is not available at the chosen supplier, a dual-rank, dual-channel device with 16-row address bits can be used instead. This device has a density of 32 Gb however since only one channel can be connected to the SoC, only half of the density is available (16 Gb). Usage of more than one discrete memory chips to overcome market constraints is not supported since only point-to-point connections are assumed for LPDDR4. Note 4: Devices with 17-row addresses (R0-R16) are not supported by the DDR Controller Note 5: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 6: The density can be achieved by connecting 2 single-rank discrete devices with one 16Gb die each. Since the SoC supports x8 devices and also has connectivity for a second rank, usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 32Gb/4GB of address space dedicated for the DDR. Two x16 16Gb devices giving 32Gb/4GB in total is, therefore, the optimal choice that balances the maximum density aspects, the signal integrity aspects (only two discrete devices used), and bandwidth aspects (full data bus width used). Note 7: The density can be achieved by connecting 4 single rank discrete devices with one 16Gb die each, 2 devices connected to each chip select. Since the SoC supports x8 devices, the usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 64Gb/8GB of address space dedicated for the DDR. Four x16 16Gb devices giving 64Gb/8GB in total is the optimal choice that balances the maximum density aspects, the signal integrity aspects (only four discrete devices used), and the bandwidth aspects (full data bus width used). Note 8: The density can be achieved by connecting 4 single rank discrete devices with one 16Gb die each, 2 devices connected to each chip select.  Note 9: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select, or by connecting 2 dual rank discrete devices with two 8Gb dies each. Since the SoC supports x8 devices, the usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 32Gb/4GB of address space dedicated for the DDR. Four x16 8Gb devices giving 32Gb/4GB in total is, therefore, the optimal choice that balances the maximum density aspects, the signal integrity aspects (four discrete devices used), and bandwidth aspects (full data bus width used). Note 10: The density can be achieved by connecting 8 single rank discrete devices with one 8Gb die each, 4 devices connected to each chip select or by connecting 4 dual rank discrete devices with two 8Gb dies each. Note that the first option significantly exceeds the number of devices used on the validation board (4 discrete devices) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis. Practically, it is not recommended to use more than 4 discrete DDR3L devices. This corresponds to the maximum density of 32Gb/4GB in the case of the single rank devices containing one 8Gb die or 64Gb/8GB in case of the dual-rank devices, each containing two 8Gb dies. Note 11: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select or by connecting 2 dual rank discrete devices with two 8Gb dies each. Note 12: For single-channel (x16) memory devices, the current maximum available density in the market is 16Gb/2GB (Q1 2022). Note 13: Only one channel of the device (and hence, half of its density) was utilized due to the reduced data bus width (x16) of the SoC. Note 14: Part is active. Reviewed Jan 2026 Note 15: Part will either EoL or is not recommended for new designs by the respective vendor.   Additional Links https://community.nxp.com/t5/iMX-and-Vybrid-Support/i-MX-8-8X-8XL-maximum-supported-LPDDR4-and-DDR3L-densities/ta-p/1152715           
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There are two ways to enable support for the imx95-19x19-evk board:   1.  Directly replace the flash.bin from the Yocto release. 1). depoly LSDK2512 on imx95-15x15-evk board which is supported in Debian LSDK2512     A:    $ flex-installer -i pf -d /dev/sdX -F     B: $ flex-installer -i auto -m imx95evk -d /dev/sdX   2). Download prebuild flash.bin for imx95-19x19-evk board from Yocto release:     A: download: https://www.nxp.com/webapp/sps/download/license.jsp? colCode=L6.12.20-2.0.0_MX95&appType=file1&DOWNLOAD_ID=null     B: Extract the downloaded file to obtain the flash.bin file: imx-boot-imx95-19x19-lpddr5-evk-sd.bin-flash_all   3). Overwrite flash.bin     $ sudo umount /dev/sdX; sudo dd if=imx-boot-imx95-19x19-lpddr5-evk-sd.bin-flash_all of=/dev/sdX bs=1024 seek=32   4). Insert the prepared SD card into the board and power it on. After entering the U-Boot prompt, set the boot command:     => setenv bootcmd "setenv bootargs 'root=/dev/mmcblk1p3 rw rootwait console=ttyLP0,115200 earlycon';ext2load mmc 1:1 0x90400000 Image;ext2load mmc 1:1 0x93000000 imx95-19x19-evk.dtb;booti 0x90400000 - 0x93000000"; saveenv     => reset   The Debian system will start automatically.   2. Build the BSP image using FlexBuild: 1).  clone the Flexbuild source code and apply the patch as attached. 2). build the bsp and boot images:       $ bld bsp -m imx95evk       $ bld boot -m imx95evk or download the pre-built image at: http://sun.ap.freescale.net/images/debian/lsdk2512/firmware_imx95evk_19x19_sdboot.img 3). install the image:       $ ./flex-installer -f firmware_imx95evk_sdboot.img -d /dev/sdX -m imx95evk -b boot_IMX_arm64_lts_6.12.20.tar.zst -r rootfs_lsdk2512_debian_imx95evk.tar.zst 4).  Insert the prepared SD card into the board and power it on. After entering the U-Boot prompt, run the following command to boot board:       u-boot=> bootflow scan -lb
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Important: If you have any questions or would like to report any issues with the DDR tools or supporting documents please create a support ticket in the i.MX community. Please note that any private messages or direct emails are not monitored and will not receive a response. i.MX 6/7 Family DDR Stress Test  The i.MX6/7 DDR Stress Test Tool is a PC-based software to fine-tune DDR parameters and verify the DDR performance on a non-OS, single-task environment(it is a light-weight test tool to test DDR performance). It performs write leveling, DQS gating and read/write delay calibration features. The tool described on this page cover the following i.MX 6/7 series SoCs: i.MX 6DQP (Dual/Quad Plus) i.MX 6DQ (Dual/Quad) i.MX 6DL/S (Dual Lite/Solo) i.MX 6SoloX i.MX 6SL i.MX 6SLL i.MX 6UL i.MX 6ULL/ULZ i.MX 7D/S i.MX 7ULP Note that the DDR Stress test tool supports the all of the above i.MX SoCs, however, some of the supported i.MX SoCs named in the tool support multiple i.MX SoCs as follows: MX6DQ – when selected, this supports both i.MX 6DQ and i.MX 6DQP (Plus) MX6DL – when selected, this supports both i.MX 6DL and i.MX 6S (i.MX 6DLS family) MX6ULL – when selected, this supports both i.MX 6ULL and i.MX6 ULZ MX7D – when selected, this supports both i.MX 7D and i.MX 7S The purpose of the i.MX 6/7 series DDR Tools is to enable users to generate and test a custom DRAM initialization based on their device configuration (density, number of chip selects, etc.) and board layout (data bus bit swizzling, etc.). This process equips the user to then proceed with the bring-up of a boot loader and an OS. Once the OS is brought up, it is recommended to run an OS-based memory test (like Linux memtester) to further verify and test the DDR memory interface. The i.MX 6/7 series DDR Tools consist of: DDR Register Programming Aid (RPA): i.MX 6/7 Series DDR Tool Release DDR Stress test: Described below There are three options to run the DDR Stress test. Each of these options are provided in the attached zip files. The following is a high-level overview of each option along with the naming convention of the associated zip file: Option 1 GUI based: Run the GUI executable and connect your board to the host PC via USB Archive file: ddr_stress_tester_vX.xx.zip The tool will first need to run a DDR initialization script for the specified i.MX SoC (refer to Load Init Script in the GUI tool).  Example initialization scripts based on NXP's development boards can be found in this zip file under the script folder.  Note, these scripts may need to be modified for your custom board and memory.   Option 2 DDR Stress Tester: JTAG Interface A hardware debugger connected to the board via the JTAG interface is used to download an elf file into the i.MX SoC OCRAM (internal RAM) and then begin execution. Results are shown on the UART serial port (115200-8-n-1). Archive file: ddr_stress_tester_jtag_vX.xx.zip As with the GUI tool, the JTAG/debugger option will first need to run a DDR initialization script for the specified i.MX SoC. Refer to the GUI tool description above for the location of the example scripts (which are found in the ddr_stress_tester_vX.xx.zip file). Note that the scripts are available either in the RealView ICE format (.inc file) or the DS-5 DSTERAM format (.ds). For other debuggers, the user will have to modify the script's command syntax for their specific debugger. This is also true if converting from a RealView Ice (.inc) format to a DS-5 DSTREAM (.ds) format and vice versa. The DDR Stress Tester executable (starting with V2.20) has an auto UART detection feature. If a different UART port for the serial console has been chosen than used on the NXP development tool (EVK, SABRE) specific commands can be added to the DDR initialization script that allows you to configure for the specific UART and then load and run the elf executable. Refer to the FAQ section of this community post and the txt file found in the JTAG archive file for instructions.   Option 3 U-Boot: The boot loader u-boot is running and commands in u-boot are used to download the bin file into SoC OCRAM and begin execution. Results are shown on the UART serial port (115200-8-n-1) Archive file: ddr_stress_tester_uboot_vX.xx.zip When downloading the DDR Stress Test Tool by u-boot, please copy the ddr-test-uboot-jtag-mxxxx.bin to SD card and load it to IRAM using the 'fatload' u-boot command (see notes below when using newer versions of u-boot). For i.MX6, please load the binary to 0x00907000. For i.MX7D, please load the binary to 0x00910000.  It is imperative to first disable the I and D cache in u-boot as shown below as the DDR Stress Test re-configures and re-enables the cache and MMU page table. While this option allows the user to load and run the DDR stress test from u-boot, NXP highly recommends executing the GUI based version for system testing and debugging. The u-boot version is considered a “last resort” for systems in production which may not have USB or JTAG connectivity. The reasons behind this stance are: In the GUI version, the system starts “clean” and uninitialized, whereas u-boot initializes many SoC features outside the knowledge of the DDR stress test and may conflict with the stress test operation When running the u-boot version, the test will overwrite the contents of u-boot residing in DDR, hence the test will overwrite any data in DDR. Once the stress test is loaded and executed, u-boot itself will no longer be accessible. To return to the functionality of u-boot, a system re-boot is required. Newer versions on u-boot do not allow a direct loading of the DDR stress test code from the SD card (boot media) directly to the SoC internal OCRAM (aka IRAM). Hence, the procedure is updated to first load the DDR stress test code into DDR and then copy into OCRAM, as shown in the procedure below: u-boot> dcache off;icache off;fatload mmc 2:1 0x12000000 ddr-test-uboot-jtag-mx6dq.bin;cp.b 0x12000000 0x00907000 0x20000;go 0x00907000 As u-boot initializes many peripherals that may conflict with the operation of the DDR stress test, it is necessary to clock gate these peripherals prior to running the DDR stress test. Hence, it is highly recommended to augment the procedure above as follows: u-boot> dcache off;icache off;fatload mmc 2:1 0x12000000 ddr-test-uboot-jtag-mx6dq.bin;cp.b 0x12000000 0x00907000 0x20000; u-boot> mw 0x020c4068 0x00C0000F; u-boot> mw 0x020c406c 0x00000000; u-boot> mw 0x020c4074 0x3F300000; u-boot> mw 0x020c4078 0x0000F300; u-boot> mw 0x020c407c 0x0F000003; u-boot> mw 0x020c4080 0x000003FC; u-boot> go 0x00907000 Note, in the above procedure, it is recommended to write to each clock gate register in separate commands (refer to commands starting with “mw”). The SoC requires a finite amount of time to gate each clock hence performing this sequence with a new command line write ensures the SoC has time to gate the intended clocks.   Stress Test Revision Features Comments 3.00 Add i.MX 7ULP support in the GUI version Known issues: USB connection is unstable when under USB HUB or some PC environments 2.92 Minor correction with write leveling calibration code error check to avoid a corner case of flagging an error when none have occurred.    2.91 Resolved issue with write leveling calibration code where a race condition in the code may result in the calibration routine not being able to find any delay values.   Only applies to MX6 series SoCs that support DDR3.  2.90 Reserve write delay line register (MMDC_MPWRDLCTL) configuration as DDR script does when do write calibration. In previous releases, MMDC_MPWRDLCTL would be changed to 0x40404040 by default.      * Further details available in the release notes  _________________________________________________________________________________________________________________________________________    FAQ   Q. I see an error message that states "ERROR: DCD addr is out of valid range.", why is this and how do I resolve?   A. Sometimes, when using the register programming aid, there are registers writes that are not supported in the DCD range.  Try looking for the following items and comment them out from the DDR initialization script: wait = on setmem /16 0x020bc000 = 0x30 // disable watchdog (note the address for this may be different between i.MX6x devices)  Q. How do I select the "DDR Density" pull-down menu and what is the purpose of this?   A. The DDR Density pull-down menu gives the user the option of testing a DDR density smaller than what they actually have on their board.  The advantage of doing this is to speed up test time to allow the user to perform a "quick test" of their system.  IMPORTANT: it is imperative that the user not set this value higher than the supported density on their board, doing so will cause the stress test to fail and/or lock up. The DDR Density has a different meaning depending on the memory type being tested (DDR3 or LPDDR2): For DDR3, this is the density per CHIP SELECT.  So if your board has two chip selects, and each chip select has 512MB, you would simply select 512MB or lower.  The default setting will simply set this to the detected density per chip select. For LPDDR2, this is the density per CHANNEL.  This is only relevant for MX6 devices that support 2 channel LPDDR2 memories (MX6DQ, MX6DL).  For other MX6 devices that support only one LPDDR2 channel, then this is the total density (for the maximum setting) for that channel. Note that for LPDDR2, the number of chip selects (per channel) is irrelevant when selecting the density to test as the stress test combines both chip-selects into one combined density per channel.  For example, lets say you have a 2GB LPDDR2 device, which 2 channels and 2 chip-selects per channel.  That means you have 512MB per chip select, per channel.  Or, it also means you have 1GB per channel when combining both chip selects per channel.  In this case, you would choose (a maximum setting of) 1GB in the DDR Density drop down menu.  However, this is also the same setting as the default setting (which you are welcome to still choose 1GB to convince yourself that 1GB per channel is indeed being tested). Now let's assume you have only one channel (LPDDR2) and one chip select, with a density of 128MB; in this case, the maximum DDR Density you can select is 128MB. Let's assume you have one channel and two chip selects, each chip select is 128MB;  in this case, the maximum DDR Density you can select is 256MB (a combination of both chip selects).   Note, for the MX7D, an actual density needs to be entered. For the MX6x series, simply leaving this field as Default will cause the DDR stress test to ascertain the supported density from the DDR init script. As the MX7D DDR controller is different, this feature is not supported, hence it is required for the user to enter an actual density (for more details regarding MX7D usage of density and number of chip-selects, see the next FAQ on the DDR CS setting).   Q.  What is the purpose of the "DDR CS" pull-down option?   A.  The answer depends on which processor you are testing:   For the i.MX 6x series: This pull down menu gives you the option of testing one chip select (CS0) or ALL (both) chip selects *IF* you have a two-chip select configuration.  If you have a two-chip select configuration, then this allows you to test only one chip select for faster test time; else you can choose to test both chip selects.  Note that if you have a one-chip select configuration and you choose "ALL", the stress test will return an error.   For the iMX 7D: Because the MX7D DDR controller is different, the DDR stress test will need the user to supply the entire supported density found on their board. The chip select field should be left as is (0) as the test will naturally test one chip select to the next. For example, let’s assume you are using two chip selects, with each chip select being 512MB. In this case, you would enter 1GB for the DDR Density field ensuring that both chip selects will be tested. The user is allowed to enter a density less than the density found on their board (for quicker testing), but keeping in mind both chip selects may not be tested in this case.   Q. I run DDR calibration using the DDR Stress Test Tool to obtain the calibration results.  Are these calibration parameters are written to the uboot flash_header.S automatically or manually?   A. The calibration values obtained from the DDR Stress Test Tool will need to be manually updated in the flash_header.S file or any other DDR initialization script.   Q. When running the DDR stress test on MX7D and I try to perform calibration, I get an error stating that calibration is not supported, is this expected?   A. Yes, calibration is not supported or needed when using MX7.  The reason is, MX7 uses a different memory controller than the MX6 series.  The MX6 series memory controller has built-in support for calibration where the MX7 memory controller does not.   Q. When running the GUI version of the DDR stress test, on MX7 and I leave DDR Density as default, I get an error in the tool stating I must supply a density.  Why is this?   A. This is due to the fact that MX7 uses a different memory controller than the MX6 series.  In the MX6 series, it was possible to calculate the memory density from the memory controller register settings.  The MX7 memory controller is different and does not lend itself to easily calculate the supported density based on the register settings.  Instead, the user should verify the density on their board and selected this value in the DDR Density pull-down menu.    Q. I noticed that when I run write-leveling calibration I sometimes see a note that due to the write-leveling calibration value being greater than 1/8 clock cycle that WALAT must be set to 1.  What does this mean?   A. In the MMDC chapter of the reference manual for the specific i.MX 6 device, the need to set WALAT is described in the MDMISC register as follows: "The purpose of WALAT is to add time delay at the end of a burst write operation to ensure that the JEDEC time specification for Write Post Amble Delay (tWPST) is met (DQS strobe is held low at the end of a write burst for > 30% a clock cycle before it is released). If the value of any of the WL_DL_ABS_OFFSETn register fields are greater than ‘1F’, WALAT should be set to ‘1’ (cycle additional delay). WALAT should be further increased for any full-cycle delays added by the WL_CYC_DELn register fields." Therefore, if the write-leveling calibration routine detects any write-leveling delay value greater than 0x1F, it will note to the user that WALAT must be set and the user should update their DDR3 init script to ensure WALAT is set.  Sometimes, a user may find that the write-leveling delay value may fluctuate from one run to the next, which is quite normal.  If it is found that this delay is "borderline" meaning sometimes it is greater than 0x1F and sometimes it might be slightly less, then it is ok to go ahead and set WALAT permanently in your init script as there is no harm in doing so and will ensure you will stay within JEDEC's tWPST.   Q. I sometimes see that after running write-leveling calibration that delay values being reported back are zero'd out (0x00), and then at times I see a non-zero value being reported, why is this? A. It is quite normal to see slight variations in the delay value between write-leveling calibration runs.  The write-leveling calibration routine assumes a majority of users have designed their board such that the DDR3 memories are placed close to the i.MX 6 SoC. There’s a mechanism in NXP’s DDR Stress test write leveling calibration code that checks the returned write leveling value. If the write-leveling calibration routine detects that the returned delay value is greater than ¾ of a clock cycle, it will "zero out" the delay value. It does this because it assumes that such a large delay result is due to the fact that the DQS signal is already delayed relative to the SDCLK, and to align DQS with SDCLK requires the calibration routine to delay DQS even further to align it to the next SDCLK edge, something we ideally would like to avoid.  JEDEC specs that the DQS edge must be within 25% of a SDCLK cycle with respect to the SDCLK edge, so having DQS initially slightly delayed from SDCLK is actually ok, hence why the calibration routine “zero’s” this out when the returned value exceeds ¾ of a clock cycle.  In cases like this, the DQS edge and SDCLK edge are so close together that in some calibration runs, the DQS edge may slightly precede SDCLK (resulting in a very small write-leveling delay value) and other runs, it may be slightly delayed relative to the SDCLK (resulting in a very large write-leveling delay value that will try to align DQS to the next SDCLK edge, hence needs to be zero’d out).   Q. When using the JTAG version of the DDR stress test, how can I select a different UART port for my serial port?   A. Under the folder ddr_stress_tester_jtag_v2.52, there's a text file that describes how to add a different UART port by adding a few additional commands to your DDR init script.  The following is an outline of these commands: 1. Ungate UART module clocks (most NXP scripts ungate all of the peripheral clocks at the beginning of the script, so this part is already done) 2. Configure the IOMUX options for the pins you wish the UART to use (normally an IOMUX option for UART_TX and UART_RX, and a daisy chain option for the UART_RX input) 3. Enable the desired UART module via the register UCR1, bit UART_EN 4. Disable other UART modules (UCR1[UART_EN] = 0).  Normally disabling UART1 should be sufficient, but it doesn't hurt to disable all of the other un-used UART options for the purpose of the stress test.   Here's an example in the .ds file vernacular of a set up as follows: MX6DQ, UART4 on KEY_COL0 and KEY_ROW0 (assume clock is ungated to all peripherals): mem set 0x020E01F8 32 0x00000004   #// config_pad_mode(KEY_COL0, ALT4) mem set 0x020E01FC 32 0x00000004   #// config_pad_mode(KEY_ROW0, ALT4); mem set 0x020E0938 32 0x00000001   #// Pad KEY_ROW0 is involved in Daisy Chain. mem set 0x02020080 32 0x00000000   #//disable UART1 in UART1_UCR1 (Note, you can disable other UART modules as well) mem set 0x021F0080 32 0x00000001   #//enable UART4 in UART4_UCR1   Here's another example in the .inc file vernacular of a set up as follows: MX6SX, UART5 on SD4_DATA4 abd SD4_DATA5 (assume clock is ungated to all peripherals): setmem /32 0x020E0294 = 0x2 //IOMUXC_SW_MUX_CTL_PAD_SD4_DATA5, ALT2; UART5_TX_DATA setmem /32 0x020E0290 = 0x2 //IOMUXC_SW_MUX_CTL_PAD_SD4_DATA4, ALT2; UART5_RX_DATA setmem /32 0x020E0850 = 0x00000000 // IOMUXC_UART5_IPP_UART_RXD_MUX_SELECT_INPUT, daisy chain for UART5_RX input to use SD4_DATA4 setmem /32 0x021F4080 = 0x00000001 // Enable UART_EN in UCR1 of UART5 // Disable UART_EN in UCR1 of UART1, UART2, UART3, and UART4 setmem /32 0x02020080 = 0x00000000 // UART1 setmem /32 0x021F0080 = 0x00000000 // UART2 setmem /32 0x021EC080 = 0x00000000 // UART3 setmem /32 0x021E8080 = 0x00000000 // UART4     Related Resources Links: iMX 8M Mini Register Programming Aid DRAM PLL setting  i.MX 8/8X Series DDR Tool Release  i.MX 8M Family DDR Tool Release 
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SW : uboot-imx lf_v2025.04 HW : i.MX 8MP EVK board, Oscilloscope   1. Introduction This guide explains the concept of DDR clock spread spectrum on the i.MX 8MP EVK platform. Note that the official NXP BSP does not enable this feature by default. Additionally, this guide provides an example code patch and verification steps to enable the LPDDR4 clock spread spectrum feature on the NXP i.MX 8MP EVK board.   2. What is Spread Spectrum? Spread Spectrum (SS) is a technique used to reduce electromagnetic interference (EMI) by slightly modulating the clock frequency around its nominal value. Instead of operating at a fixed frequency (e.g., 800 MHz), the clock signal is varied within a small range (e.g., ±0.5%). This modulation spreads the energy of the clock signal over a wider frequency band, reducing the peak energy at any single frequency. In other words, SS does not change the average clock speed significantly, but it helps to distribute the spectral energy, making the system less likely to violate EMI regulations.   3. Why Enable Spread Spectrum on DDR Clock? Enabling Spread Spectrum on the DDR clock helps reduce electromagnetic interference (EMI) by slightly modulating the clock frequency, lowering peak emissions and making it easier to meet regulatory standards such as FCC and CE. This approach improves system reliability by minimizing interference with other components, offers a cost-effective alternative to hardware changes like shielding or PCB redesign, and is widely adopted in high-speed interfaces such as DDR, PCIe, and SATA to ensure compliance without additional hardware complexity.   4. Related registers CCM_ANALOG_DRAM_PLL_SSCG_CTRL                             Note :  PLL_MFREQ_CTL[19 : 12] : Value of modulation frequency control The larger the mfr value, the lower the MF value (the slower the modulation); the smaller the mfr value, the higher the MF value. MF : The frequency of spread spectrum modulation is the speed at which the triangular/sawtooth modulated wave travels back and forth once per second, measured in Hz (commonly in the tens of kHz range). The speed of the spread spectrum "jitter" is determined. Usually, around 20–50 kHz is chosen to make the energy "swipe evenly" within the bandwidth of the EMI test receiver, thereby reducing the peak radiation at a certain frequency point. PLL_MRAT_CTL[9 : 4] : Value of modulation rate control The larger mrr is, the larger MR is (the wider the range); similarly, MR is also directly proportional to mfr and inversely proportional to m. MR : Peak-to-peak percentage of spread spectrum (the percentage of the total range of the clock frequency swinging around the center value). For example, MR = 0.5% means that the frequency swings around the center value by a total of 0.5% (if it is center-spread spectrum, it is usually ±0.25%).The MR determines the depth (width) of the spread spectrum. The larger the MR, the wider the spectral energy distribution and the lower the peak value, but it comes at the cost of jitter/timing margin (timing should be carefully selected for DDR, SerDes, etc.). 5. About Uboot code patch. Please refer the attachment patch file. At high DRAM frequency, Enable SS may cause not stable problem. So, in this case, I will choose 2400Mbps data clock run the test. Firstly, we should make sure that our code include the 2400Mbps PLL setting. DRAM data speed is 2400Mbps, the DRAM clock is 1200MHz. So the DDRC PLL clock should set up with 600MHz. For example, refer the below code. static struct imx_int_pll_rate_table imx8mm_fracpll_tbl[] = {     PLL_1443X_RATE(1000000000U, 250, 3, 1, 0),     PLL_1443X_RATE(933000000U, 311, 4, 1, 0),     PLL_1443X_RATE(900000000U, 300, 2, 2, 0),     PLL_1443X_RATE(800000000U, 200, 3, 1, 0),     PLL_1443X_RATE(750000000U, 250, 2, 2, 0),     PLL_1443X_RATE(650000000U, 325, 3, 2, 0),     PLL_1443X_RATE(600000000U, 300, 3, 2, 0), // 2400Mbps     PLL_1443X_RATE(594000000U, 99, 1, 2, 0),     PLL_1443X_RATE(400000000U, 400, 3, 3, 0),     PLL_1443X_RATE(266000000U, 266, 3, 3, 0),     PLL_1443X_RATE(167000000U, 334, 3, 4, 0),     PLL_1443X_RATE(100000000U, 200, 3, 4, 0), }; PLL output calculator formula is : PLL_out = 24MHz*mdiv/pdiv/(2^sdiv) So, 2400MHz * 300 / 3 / 2^2 = 600MHz   6. Test result Non Enable SS Enable SS with 1% MR and Down spread Enable SS with 2% MR and Down spread Enable SS with 2% MR and Center spread  
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Some customer need to run Zephyr on i.MX8QXP CM4, but there is no support on Zephyr mainline(v4.3.0) This article will share the porting based on Zephyr v4.3.0. For i.MX8QM CM4, please refer this link: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8QM-CM4-0-support-on-Zephyr-v4-3-0/ta-p/2296962   samples/hello_world/ samples/synchronization TODO: Update patch....
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Some customer need to run Zephyr on i.MX8QM CM4, but there is no support on Zephyr mainline(v4.3.0). This article will share the i.MX8QM CM4_0 porting based on Zephyr v4.3.0.  For i.MX8QXP CM4, please refer this link: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8QXP-CM4-support-on-Zephyr-v4-3-0/ta-p/2296957   samples/hello_world/ samples/synchronization TODO: Update patch....
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Platform supported Kinara Ara2: imx95frdm imx8mpfrdm In this article, let's take imx8mpfrdm as example.   1. Create a Debian LSDK2512 release system for SD boot using the command below: $ ./flex-installer -i pf -d /dev/sdX $./flex-installer -b boot_IMX_arm64_lts_6.12.20.tar.zst -f firmware_imx8mpfrdm_sdboot.img -d /dev/sdX -m imx8mpfrdm -r rootfs_lsdk2512_debian_imx8mpevk.tar.zst note: if Debian base rootfs is used, please upgrade to full function Debian rootfs first. 2. Insert SD card on imx8mpfrdm and boot the system. Once the system has completed booting and you reach the kernel prompt: $ date -s "20260101 1100" // set date $ set proxy if needed 3. download rt-sdk-ara2.deb at: https://nxp1.sharepoint.com/:u:/r/teams/ext1081/Shared%20Documents/LF_v6.12.34/Debian%20Packages/r1.3/Package%201/rt-sdk-ara2.deb?csf=1&web=1&e=i4x1zD 4. Get the uiodma.ko kernel module for Debian from NXP. 5. Disable sleep when install package: $ systemctl mask sleep.target suspend.target hibernate.target hybrid-sleep.target 6. Prepare the packages ARA2 needed: $ apt update $ apt install --reinstall -y libc6-dev $ ln -sf /usr/include/aarch64-linux-gnu/sys /usr/include/sys $ apt install -y python3-dev build-essential $ e2fsck -f /dev/mmcblk1p2 7. install Ara2 package: $ dpkg -i rt-sdk-ara2.deb The tail of successful log as follows: ... [ 783.892116] Adding 2097148k swap on /swapfile. Priority:-2 extents:17 across:35913728k SS /swapfile none swap sw 0 0 Swap file of 2G configured and enabled successfully. Enable rt-sdk-ara2.service service... Created symlink '/etc/systemd/system/multi-user.target.wants/rt-sdk-ara2.service' → '/etc/systemd/system/rt-sdk-ara2.service'. rt-sdk-ara2.service has been enabled. To stop the service from starting automatically on boot run: systemctl disable rt-sdk-ara2.service Post-install script completed successfully. 8. overwrite the kernel module: $ cp /root/uiodma.ko /root/kinara/rt_sdk_r1.3/art/linux/drivers/uiodma_cache_management/uiodma.ko $ systemctl unmask sleep.target suspend.target hibernate.target hybrid-sleep.target // re-enable sleep 9. reboot the system: $ reboot You will see the log as bellow: ... [ 57.855988] bash[1492]: +----------+-----------------+ [ 57.856188] bash[1492]: | Product | Current Version | [ 57.856297] bash[1492]: +----------+-----------------+ [ 57.856397] bash[1492]: | firmware | 1.1.2.0 | [ 57.856501] bash[1492]: | proxy | 1.3.0.0 | [ 57.856593] bash[1492]: | sysapi | 1.1.61.0 | [ 57.856695] bash[1492]: +----------+-----------------+ [ 57.856788] bash[1492]: [I:20260109:09:02:44:636750] [DeviceManager] [kinara_main_1479][DeviceManager] [ 57.856894] bash[1492]: +------------+--------------------+ [ 57.857019] bash[1492]: | Product | Supported Versions | [ 57.857124] bash[1492]: +------------+--------------------+ [ 57.857227] bash[1492]: | client_lib | 1.0.0.0 | [ 57.857327] bash[1492]: | client_lib | 1.1.1.0 | [ 57.857419] bash[1492]: | client_lib | 1.1.2.0 | [ 57.857525] bash[1492]: | client_lib | 1.3.0.0 | [ 57.857642] bash[1492]: | cnn_model | 2.0.0.0 | [ 57.857741] bash[1492]: | cnn_model | 2.1.0.0 | [ 57.857833] bash[1492]: | firmware | 0.5.2.0 | [ 57.857931] bash[1492]: | firmware | 1.1.2.0 | [ 57.858030] bash[1492]: | llm_model | 3.0.0.0 | [ 57.858129] bash[1492]: | llm_model | 3.1.0.0 | [ 57.858222] bash[1492]: | pci_driver | 1.0.4.0 | [ 57.858322] bash[1492]: | pci_driver | 1.0.6.6 | [ 57.858421] bash[1492]: | proxy | 0.8.0.0 | [ 57.858533] bash[1492]: | proxy | 0.9.0.0 | [ 57.858633] bash[1492]: | proxy | 1.1.1.0 | [ 57.858732] bash[1492]: | proxy | 1.3.0.0 | [ 57.858823] bash[1492]: +------------+--------------------+ [ 57.858930] bash[1492]: 2026-01-09 09:02:44 - Proxy launched succesfully [ 58.752944] bash[1514]: 2026-01-09 09:02:45 - Hardware bringup is done (1 device(s) configured) and proxy is launched successfully in the background. [ 58.755142] bash[392]: Logs saved in: /root/kinara/rt_sdk_r1.3/saved_logs/rt-sdk-ara2_logs.txt Now, enjoy your AI journey.
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We are pleased to announce that Config Tools for i.MX v25.12 are now available. Downloads & links To download the installer for all platforms, please login to our download site via:  https://www.nxp.com/design/designs/config-tools-for-i-mx-applications-processors:CONFIG-TOOLS-IMX Please refer to  Documentation  for installation and quick start guides. For further information about DDR config and validation, please go to this  blog post. Release Notes Full details on the release (features, known issues...) DDR tool – Support for detecting multiple boards connected to the host system is added. – Automatic detection and selection of newly connected COM ports is implemented. – A Connection Test option to validate connectivity before running tests on the target is introduced. – i.MX 93 EVK LP4 configuration is added. – Training execution time information for i.MX 95 and i.MX 943 is included in logs. – Bus signal naming in the UI to align with i.MX pin naming conventions is consolidated. – CA bus values for i.MX943 with LPDDR4 are updated. – DRAM density calculation for i.MX 95 and i.MX 943 with LP4/4x is corrected. – Incorrect calculation of number of banks for i.MX 8M with DDR3L is fixed. – CS1_BNDs calculation for i.MX 91 is corrected. SerDes tool – i.MX 943 RFP support is added. System Manager – The ability to export user configuration in the CFG format is added. – Information about atomic resources to the Details view is added. – Generation and configuration of the config_fusa.h file is supported. – Resource and template assignment is improved. – Grayed-out resource assignments for unavailable configuration parameters in the Resources view are implemented. – Validation of configuration and user input is improved. – Problem decorators to the System and Boot view are added. – Design of the Boot and Details view is improved. – 5600 MT/s for i.MX 95 and i.MX 943 with LPDDR5 is enabled. – LP4/4x settings for DDR_SDRAM_ZQ_CNTL for i.MX 95 and i.MX 943 are updated. – Dual-rank configurations for i.MX 91 and i.MX 93 are updated. – LP4/4x configuration to support non-binary densities for i.MX 95 and i.MX 943 is updated. – Support for non-binary aligned LP4 density for i.MX 91 is added. – FRDM board support (LPDDR4X 15x15 at 4000 MT/s) for i.MX 95 is added. – Timing file discrepancies for i.MX 8MN with DDR3L are fixed. – Issue where changing PHY log level did not update generated code is fixed.
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The following is a guide on training a simple model in Pytorch and Tensorflow and deploying it on an application using the i.MX93 Ethos-65 Neural Processing Unit (NPU) and the i.MX95 eIQ Neutron NPU.
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The purpose of this document is to provide extended guidance for the selection of compatible LPDDR4/4X memory devices that are supported by the i.MX 93 series of processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. The i.MX 93 series of processors supports different packages, and each have their own maximum supported LPDDR4/4x data rates. Please refer to the respective datasheets. Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. NOTE: Some of the LPDDR4/4X devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low-speed operation is planned in the use case, please consult with the memory vendor about the configuration aspects and possible customization of the memory device so correct functionality is ensured. LPDDR4/4X - Maximum Supported Densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 93 (i.MX 93xx) 16-bit 16 Gb / (2 GB) single rank, single channel device with 17-row addresses (R0 - R16) 1, 2, 3   LPDDR4/4X - List of Validated Memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 93 16 Gb/ (2 GB) Micron LPDDR4/4x: MT53E1G16D1FW-046 AAT:A  (Z32N) MT53E1G16D1ZW-046 AAT:C (Z42N) 7   4, 8 8 Gb/ (1 GB) Micron LPDDR4/4x: MT53D512M16D1DS-046 AAT (Z11M) 4, 10 16 Gb/ (2 GB) Micron LPDDR4/4x: MT53E1G32D2FW-046 AUT:B (Z42M) 4, 5, 10 8 Gb/ (1 GB) Nanya LPDDR4: NT6AN512M16AV-J1I LPDDR4x: NT6AP512M16BV-J1I 4, 8 4 Gb/ (512 MB) Nanya LPDDR4x: NT6AP256M16AV  4, 8 16 Gb/ (2 GB) Kingston LPDDR4: D1611PM3BDGUI-U 4, 8 16 Gb/ (2 GB) Kingston LPDDR4: C1612PC2WDGTKR-U  7, 9 8 Gb/ (1 GB) ISSI LPDDR4: IS43LQ16512A-053BLI 4, 8 4 Gb/ (512 MB) ISSI LPDDR4: IS43LQ16256B-062BLI 4, 8 2Gb / (256 MB) ISSI LPDDR4: IS46LQ16128A-062BSLI 4, 6, 8   8 Gb/ (1 GB) CXMT LPDDR4/4x: CXDB4CBAM-EA-M 4, 9 16 Gb/ (2 GB) JSC LPDDR4x: JSL4BAG167ZAMF  4, 8 8 Gb/ (1 GB) JSC LPDDR4x: JSL4B8G168ZAMF-05x  4, 8 4 Gb/ (512 MB) JSC LPDDR4x: JSL4A4G168ZAMF-05 4, 8 2Gb / (256 MB) Winbond  LPDDR4x: W66BQ6NBHAGJ 4, 6, 8 8Gb / (1 GB) IM (Intelligent Memory) LPDDR4x: IM8G16L4JCB-046I 4, 11 16Gb / (2 GB) IM (Intelligent Memory) LPDDR4/4x: IMAG16L4KBBG 4, 8 4Gb / (512 MB) Samsung LPDDR4: K4F4E164HD-THCL 4, 8 8 Gb / (1 GB) AM (Alliance Memory) LPDDR4X: AS4C512M16MD4V-053BIN 4, 8 4 Gb / (512 MB) ISSI LPDDR4/4X: IS46LQ16256B-053BLI 4, 8   Note 1: The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-4B/JESD209-4-1 (LPDDR4/4X). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4/4X devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The SoC also supports dual rank single channel devices therefore, 16Gb/2GB density can be also achieved by using a dual rank single channel device with 16-row addresses (R0 - R15). Note 4: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 5: This is a dual channel x32 device. Since i.MX93 only supports 16-bit LPDDR4/X data bus, it can only interface with one of the channels and therefore, utilize only half of the device's density. As indicated in the table - the device has 32Gb/4GB density however, only 16Gb/2GB can be used. There is no functional problem with using only one channel of a dual channel device as the channels are independent in LPDDR4/4X.  Note 6: This is a new JEDEC 100 ball package, half the size of the standard 200 ball package. This 100 ball package has the same performance and functionality as the 200 ball package, and has the added advantage of being smaller and cheaper than the standard package. Note 7: This device has been EoLed by the manufacturer and has been updated by a new memory part number  Note 8: Part is active. Reviewed Nov 2025 Note 9: Part is obsolete. Note 10: This device will be EoLed in Q2 24 by the manufacturer and will not be updated by a new memory part number Note 11: DQ eye marginalities were identified during TSA analysis. vTSA and stability testing did not identify any issues.
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In some applications, we need to shift frequencies to avoid interference from certain frequencies, such as shifting to avoid Wi-Fi interference. The document is a guide for shifting DDR3 frequency.   The document uses the iMX8M Nano DDR3 as an example, but the process is the same for the iMX8M mini, iMX8M Plus, LPDDR4, etc. The main issue is resolving the DDR pll configuration. Before reading this article, we assume you are already familiar with using the DDR stress tool and DDR config rpa, or the DDR tool of the config tools.   pll_to_table_entry_rates.py can help you to find the settings. 
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  Just sharing some experiences during the development and studying.   Although, it appears some hardwares, it focuses on software to speed up your developing on your  hardware.     杂记共享一下在开发和学习过程中的经验。    虽然涉及一些硬件,但其本身关注软件,希望这些能加速您在自己硬件上的开发。   12/16/2025 iMX8MN DDR3 Frequency Shifting iMX8MN DDR3 Frequency Shifting - NXP Community   3/4/2025 GPIO USB ID GPIO USB ID - NXP Community   1/20/2025 MDIO on GPIOs MDIO on GPIOs - NXP Community   12/09/2024 GPIO LEDs https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/GPIO-LEDs/ta-p/2009743     10/22/2024 iMX93-EVK PWM LED https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/iMX93-EVK-PWM-LED/ta-p/1978047   07/25/2024 iMX secondary boot collection https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/iMX-secondary-boot-collection/ta-p/1916915   07/25/2024 HSM Code-Signing Journey https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/HSM-Code-Signing-Journey/ta-p/1882244 25JUL2024 - add pkcs11 proxy                         HSM Code-Signing Journey_25JUL2024.pdf                          HSM Code-Signing Journey_25JUL2024.txt   06/06/2024 HSM Code-Signing Journey https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/HSM-Code-Signing-Journey/ta-p/1882244     02/07/2024 Device Tree Standalone Compile under Windows https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/Device-Tree-Standalone-Compile-under-Windows/ta-p/1855271   02/07/2024 i.MX8X security overview and AHAB deep dive i.MX8X security overview and AHAB deep dive - NXP Community   11/23/2023 “Standalone” Compile Device Tree https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/Standalone-Compile-Device-Tree/ta-p/1762373     10/26/2023 Linux Dynamic Debug https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/Linux-Dynamic-Debug/ta-p/1746611   08/10/2023 u-boot environment preset for sdcard mirror u-boot environment preset for sdcard mirror - NXP Community   06/06/2023 all(bootloader, device tree, Linux kernel, rootfs) in spi nor demo imx8qxpc0 mek all(bootloader, device tree, Linux kernel, rootfs)... - NXP Community     09/26/2022 parseIVT - a script to help i.MX6 Code Signing parseIVT - a script to help i.MX6 Code Signing - NXP Community   Provide  run under windows   09/16/2022   create sdcard mirror under windows create sdcard mirror under windows - NXP Community     08/03/2022   i.MX8MM SDCARD Secondary Boot Demo https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8MM-SDCARD-Secondary-Boot-Demo/ta-p/1500011     02/16/2022 mx8_ddr_stress_test without UI   https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/mx8-ddr-stress-test-without-UI/ta-p/1414090   12/23/2021 i.MX8 i.MX8X Board Reset https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8-i-MX8X-Board-Reset/ta-p/1391130       12/21/2021 regulator userspace-consumer https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/regulator-userspace-consumer/ta-p/1389948     11/24/2021 crypto af_alg blackkey demo crypto af_alg blackkey demo - NXP Community   09/28/2021 u-boot runtime modify Linux device tree(dtb) u-boot runtime modify Linux device tree(dtb) - NXP Community     08/17/2021 gpio-poweroff demo https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/gpio-poweroff-demo/ta-p/1324306         08/04/2021 How to use gpio-hog demo https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/How-to-use-gpio-hog-demo/ta-p/1317709       07/14/2021 SWUpdate OTA i.MX8MM EVK / i.MX8QXP MEK https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/SWUpdate-OTA-i-MX8MM-EVK-i-MX8QXP-MEK/ta-p/1307416     04/07/2021 i.MX8QXP eMMC Secondary Boot https://community.nxp.com/t5/i-MX-Community-Articles/i-MX8QXP-eMMC-Secondary-Boot/ba-p/1257704#M45       03/25/2021 sc_misc_board_ioctl to access the M4 partition from A core side sc_misc_board_ioctl to access the M4 partition fr... - NXP Community     03/17/2021 How to Changei.MX8X MEK+Base Board  Linux Debug UART https://community.nxp.com/t5/i-MX-Community-Articles/How-to-Change-i-MX8X-MEK-Base-Board-Linux-Debug-UART/ba-p/1246779#M43     03/16/2021 How to Change i.MX8MM evk Linux Debug UART https://community.nxp.com/t5/i-MX-Community-Articles/How-to-Change-i-MX8MM-evk-Linux-Debug-UART/ba-p/1243938#M40       05/06/2020 Linux fw_printenv fw_setenv to access U-Boot's environment variables Linux fw_printenv fw_setenv to access U-Boot's env... - NXP Community     03/30/2020 i.MX6 DDR calibration/stress for Mass Production https://community.nxp.com/docs/DOC-346065     03/25/2020 parseIVT - a script to help i.MX6 Code Signing https://community.nxp.com/docs/DOC-345998     02/17/2020 Start your machine learning journey from tensorflow playground Start your machine learning journey from tensorflow playground      01/15/2020 How to add  iMX8QXP PAD(GPIO) Wakeup How to add iMX8QXP PAD(GPIO) Wakeup    01/09/2020 Understand iMX8QX Hardware Partitioning By Making M4 Hello world Running Correctly https://community.nxp.com/docs/DOC-345359   09/29/2019 Docker On i.MX6UL With Ubuntu16.04 https://community.nxp.com/docs/DOC-344462   09/25/2019 Docker On i.MX8MM With Ubuntu https://community.nxp.com/docs/DOC-344473 Docker On i.MX8QXP With Ubuntu https://community.nxp.com/docs/DOC-344474     08/28/2019 eMMC5.0 vs eMMC5.1 https://community.nxp.com/docs/DOC-344265     05/24/2019 How to upgrade  Linux Kernel and dtb on eMMC without UUU How to upgrade Linux Kernel and dtb on eMMC without UUU     04/12/2019 eMMC RPMB Enhance and GP https://community.nxp.com/docs/DOC-343116   04/04/2019 How to Dump a GPT SDCard Mirror(Android O SDCard Mirror) https://community.nxp.com/docs/DOC-343079   04/04/2019 i.MX Create Android SDCard Mirror https://community.nxp.com/docs/DOC-343078   04/02/2019: i.MX Linux Binary_Demo Files Tips  https://community.nxp.com/docs/DOC-343075   04/02/2019:       Update Set fast boot        eMMC_RPMB_Enhance_and_GP.pdf   02/28/2019: imx_builder --- standalone build without Yocto https://community.nxp.com/docs/DOC-342702   08/10/2018: i.MX6SX M4 MPU Settings For RPMSG update    Update slide CMA Arrangement Consideration i.MX6SX_M4_MPU_Settings_For_RPMSG_08102018.pdf   07/26/2018 Understand ML With Simplest Code https://community.nxp.com/docs/DOC-341099     04/23/2018:     i.MX8M Standalone Build     i.MX8M Standalone Build.pdf     04/13/2018:      i.MX6SX M4 MPU Settings For RPMSG  update            Add slide CMA Arrangement  Consideration     i.MX6SX_M4_MPU_Settings_For_RPMSG_04132018.pdf   09/05/2017:       Update eMMC RPMB, Enhance  and GP       eMMC_RPMB_Enhance_and_GP.pdf 09/01/2017:       eMMC RPMB, Enhance  and GP       eMMC_RPMB_Enhance_and_GP.pdf 08/30/2017:     Dual LVDS for High Resolution Display(For i.MX6DQ/DLS)     Dual LVDS for High Resolution Display.pdf 08/27/2017:  L3.14.28 Ottbox Porting Notes:         L3.14.28_Ottbox_Porting_Notes-20150805-2.pdf MFGTool Uboot Share With the Normal Run One:        MFGTool_Uboot_share_with_NormalRun_sourceCode.pdf Mass Production with programmer        Mass_Production_with_NAND_programmer.pdf        Mass_Production_with_emmc_programmer.pdf AndroidSDCARDMirrorCreator https://community.nxp.com/docs/DOC-329596 L3.10.53 PianoPI Porting Note        L3.10.53_PianoPI_PortingNote_151102.pdf Audio Codec WM8960 Porting L3.10.53 PianoPI        AudioCodec_WM8960_Porting_L3.10.53_PianoPI_151012.pdf TouchScreen PianoPI Porting Note         TouchScreen_PianoPI_PortingNote_151103.pdf Accessing GPIO From UserSpace        Accessing_GPIO_From_UserSpace.pdf        https://community.nxp.com/docs/DOC-343344 FreeRTOS for i.MX6SX        FreeRTOS for i.MX6SX.pdf i.MX6SX M4 fastup        i.MX6SX M4 fastup.pdf i.MX6 SDCARD Secondary Boot Demo        i.MX6_SDCARD_Secondary_Boot_Demo.pdf i.MX6SX M4 MPU Settings For RPMSG        i.MX6SX_M4_MPU_Settings_For_RPMSG_10082016.pdf Security        Security03172017.pdf    NOT related to i.MX, only a short memo
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Hello everyone! In this document you'll find an example on how to build your Cortex-M33 code where some parts of the code runs from DDR, for this changes on ATF where the M33 core can visit DRAM in early stage. For this we will take advantage of RPROC framework, RPROC (Remote Processor Framework) is a Linux kernel and U-Boot subsystem that manages secondary, embedded processors (like Cortex-M cores), where we will use the A55 to load the M33 firmware. This will require changes on Linux device tree, ATF and M33 linker file. Requirements: Ubuntu 20.04 or later host PC i.MX93 QSB UUU Tool ARM GNU Toolchain (arm-gnu-toolchain-12.3.rel1-x86_64-aarch64-none-linux-gnu) SDK package (SDK_25_09_00_MCIMX93-QSB) Prebuild Linux Image (LF_v6.12.34-2.1.0_images_IMX93EVK) ### Clone imx-mkimage, it is better to download the same version of the sw we are working with ### $ git clone https://github.com/nxp-imx/imx-mkimage -b lf-6.12.34-2.1.0 ### Decompress the GNU toolchain into a path in local disk, in this test would be /opt/ ### $ sudo tar -xvJf arm-gnu-toolchain-12.3.rel1-x86_64-aarch64-none-linux-gnu.tar.xz -C /opt ### Clone and build Uboot ### $ git clone https://github.com/nxp-imx/uboot-imx -b lf-6.12.34-2.1.0 $ cd uboot-imx $ make -j $(nproc --all) clean $ make -j$(nproc --all) ARCH=arm CROSS_COMPILE=/opt/arm-gnu-toolchain-12.3.rel1-x86_64-aarch64-none-linux-gnu/bin/aarch64-none-linux-gnu- imx93_11x11_evk_defconfig $ make -j $(nproc --all) ARCH=arm CROSS_COMPILE=/opt/arm-gnu-toolchain-12.3.rel1-x86_64-aarch64-none-linux-gnu/bin/aarch64-none-linux-gnu- ### Download and extract ELE firmware ### $ cd .. $ wget https://www.nxp.com/lgfiles/NMG/MAD/YOCTO/firmware-ele-imx-2.0.3-286c884.bin $ chmod +x firmware-ele-imx-2.0.3-286c884.bin $ ./firmware-ele-imx-2.0.3-286c884.bin --auto-accept ### Optional if using i.MX FW ### $ wget https://www.nxp.com/lgfiles/NMG/MAD/YOCTO/firmware-imx-8.29-8741a3b.bin $ chmod +x firmware-imx-8.29-8741a3b.bin $ ./firmware-imx-8.29-8741a3b.bin --auto-accept ### Clone ATF ### $ git clone https://github.com/nxp-imx/imx-atf -b lf-6.12.34-2.1.0 $ cd imx-atf ### Modify ATF for the M33 to be able to access DDR ###   --- a/plat/imx/imx93/trdc_config.h +++ b/plat/imx/imx93/trdc_config.h struct trdc_mrc_config trdc_n_mrc[] = { { 0, 0, 0, 0x80000000, 0x80000000, 0, false }, /* MRC0 DRAM for S400 DID0 */ { 0, 1, 0, 0x80000000, 0x80000000, 0, false }, /* MRC0 DRAM for MTR DID1 */ - { 0, 2, 0, 0x80000000, 0x80000000, 0, true }, /* MRC0 DRAM for M33 DID2 */ + { 0, 2, 0, 0x80000000, 0x80000000, 1, true }, /* MRC0 DRAM for M33 DID2 */ { 0, 3, 0, 0x80000000, 0x80000000, 1, false }, /* MRC0 DRAM for A55 DID3 */ { 0, 5, 0, 0x80000000, 0x80000000, 0, false }, /* MRC0 DRAM for USDHC1 DID5 */ { 0, 6, 0, 0x80000000, 0x80000000, 0, false }, /* MRC0 DRAM for USDHC2 DID6 */ ### Build modified ATF ### $ make -j $(nproc --all) PLAT=imx93 bl31 CROSS_COMPILE=/opt/arm-gnu-toolchain-12.3.rel1-x86_64-aarch64-none-linux-gnu/bin/aarch64-none-linux-gnu- ### Modify linker file and build M33 code, in this example we are using hello world SDK example ### $ cd .. $ tar -xvzf SDK_25_09_00_MCIMX93-QSB.tar.gz $ cd SDK_25_09_00_MCIMX93-QSB/boards/mcimx93qsb/demo_apps/hello_world/armgcc --- a/boards/mcimx93autoevk/demo_apps/hello_world/armgcc/MIMX9352_cm33_ram.ld +++ b/boards/mcimx93autoevk/demo_apps/hello_world/armgcc/MIMX9352_cm33_ram.ld m_a55_suspend_ram (RW) : ORIGIN = 0x20002000, LENGTH = 0x00001000 m_data (RW) : ORIGIN = 0x20003000, LENGTH = 0x0001B000 m_rsc_tbl (RW) : ORIGIN = 0x2001E000, LENGTH = 0x00001000 + m_text_dram (RW) : ORIGIN = 0x8F000000, LENGTH = 0x00001000 + m_data_dram (RW) : ORIGIN = 0x8F001000, LENGTH = 0x00001000 } /* Define output sections */ . = ALIGN(4); } > m_text + .dram_text : + { + . = ALIGN(32); + *(.myDRAM) + . = ALIGN(32); + } > m_text_dram + .ARM.extab : { *(.ARM.extab* .gnu.linkonce.armextab.*) .ARM.attributes 0 : { *(.ARM.attributes) } ASSERT(__StackLimit >= __HeapLimit, "region m_data overflowed with stack and heap") + + .dram_data : + { + . = ALIGN(32); + *(.myDRAM_data) + . = ALIGN(32); + } > m_data_dram } a/boards/mcimx93autoevk/demo_apps/hello_world/hello_world.c +++ b/boards/mcimx93autoevk/demo_apps/hello_world/hello_world.c * Definitions ******************************************************************************/ +#define _RET_IP_ (unsigned long)__builtin_return_address(0) +#define _THIS_IP_ ({ __label__ __here; __here: (unsigned long)&&__here; }) /******************************************************************************* * Prototypes /******************************************************************************* * Variables ******************************************************************************/ - +const char myString[] __attribute__((section(".myDRAM_data"))) = "Hello, World!"; /******************************************************************************* * Code ******************************************************************************/ +__attribute__ ((section(".myDRAM"))) +void Dram_test(void) { + PRINTF("Dram_test!!\r\n"); + + PRINTF("%s!!\r\n", myString); + + PRINTF("function %p\n",_THIS_IP_); +} + /*! * @brief Main function */ BOARD_BootClockRUN(); BOARD_InitDebugConsole(); - PRINTF("hello world.\r\n"); + PRINTF("hello world from DRAM.\r\n"); while (1) { ch = GETCHAR(); PUTCHAR(ch); + if(ch == 'a'){ + Dram_test(); + } } } $ export ARMGCC_DIR=~/gcc-arm-none-eabi-10.3-2021.10 $ export PATH=$PATH:~/gcc-arm-none-eabi-10.3-2021.10 $ ./build_release.sh ### Copy the resulting binaries to imx-mkimage ### $ cp ~/imx-atf/build/imx93/release/bl31.bin ~/imx-mkimage/iMX93 $ cp ~/uboot-imx/u-boot.bin ~/imx-mkimage/iMX93 $ cp ~/uboot-imx/spl/u-boot-spl.bin ~/imx-mkimage/iMX93 ### Copy i.MX firmware ### $ cd .. $ cp firmware-imx-8.29-8741a3b/firmware/ddr/synopsys/lpddr4_dmem_* ~/imx-mkimage/iMX93 $ cp firmware-imx-8.29-8741a3b/firmware/ddr/synopsys/lpddr4_imem_* ~/imx-mkimage/iMX93 $ cpfirmware-ele-imx-2.0.3-286c884/mx93a1-ahab-container.img ~/imx-mkimage/iMX93 ### Build the flash.bin using mkimage $ cd imx-mkimage $ make SOC=iMX93 flash_singleboot ### Clone, modify and build device tree for Linux to be able to use RPROC to load M33 Firmware ### $ git clone https://github.com/nxp-imx/linux-imx -b lf-6.12.34-2.1.0 --- a/arch/arm64/boot/dts/freescale/imx93-9x9-qsb.dts +++ b/arch/arm64/boot/dts/freescale/imx93-9x9-qsb.dts no-map; }; + dram: dram@20480000 { + reg = <0 0x8f000000 0 0x20000>; + no-map; + }; + rsc_table: rsc-table@2021e000 { reg = <0 0x2021e000 0 0x1000>; no-map; <&mu1 1 1>, <&mu1 3 1>; - memory-region = <&vdevbuffer>, <&vdev0vring0>, <&vdev0vring1>, + memory-region = <&dram>, <&vdevbuffer>, <&vdev0vring0>, <&vdev0vring1>, <&vdev1vring0>, <&vdev1vring1>, <&rsc_table>; fsl,startup-delay-ms = <500>; status = "okay"; $ export ARCH=arm64 $ export CROSS_COMPILE=/opt/arm-gnu-toolchain-12.3.rel1-x86_64-aarch64-none-linux-gnu/bin/aarch64-none-linux-gnu- $ make imx_v8_defconfig $ make freescale/imx93-9x9-qsb.dtb Set SW for serial download on the QSB (0001), connect debug, download and power cables and turn on the QSB, for this test we will flash the demo image and just replace Linux device tree, flash.bin and M33 firmware into the QSB board. $ uuu -b sd_all flash.bin imx-image-full-imx93evk.wic Once it is done change SW to the respective bootmedia SD boot (0011) and boot the board and stop at uboot, to enter fastboot mode to load modified device tree and M33 firmware > fastboot 1 After this just run UUU tool on the host computer and fatload the files $ uuu -b fat_write imx93-9x9-qsb.dtb mmc 1:1 $ uuu -b fat_write hello_world.elf mmc 1:1 When the tool finish, stop fastboot mode by typing CTRL+C and then boot into Linux > boot Login with default password "root" and run the following commands to load M33 firmware $ root $ modprobe imx_rpmsg_tty $ cp /run/media/boot-mmcblk1p1/hello_world.elf /lib/firmware/ $ echo hello_world.elf > /sys/class/remoteproc/remoteproc0/firmware $ echo start >/sys/class/remoteproc/remoteproc0/state   Once done we can verify that the M33 firmware is running on DDR Hope everyone finds this useful! For any question regarding this document, please create a community thread and tag me if needed. Saludos/Regards, Aldo.
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The purpose of this page is to provide supportive information for the selection of suitable camera modules that are supported by the i.MX 8M Plus (i.MX8MP). The guide is attached in this page. This helps customers evaluate project feasibility and integration aspects when considering i.MX 8MP SoCs for their products. It is strongly recommended to consult with NXP and the camera module vendor before finalizing the choice of the camera part number to ensure compatibility, availability, longevity, and pricing requirements.
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System Manager configuration via Config tools for i.MX. Create a new project, modify, view or edit available resources for your specific core. What will you learn How to create a new System Manager project Viewing and managing resources Creating and assigning templates Configuration of System Manager Tip: you can skip to a specific chapter   Introduction   New System Manager project     System Manager views   System Manager templates   Assigning a resource   Creating custom template   Exporting code     Download the tools here: https://www.nxp.com/design/design-center/development-boards-and-designs/i-mx-evaluation-and-development-boards/config-tools-for-i-mx-applications-processors:CONFIG-TOOLS-IMX   https://www.nxp.com/products/i.MX95
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Legacy Interrupts in PCI have become a thing of the past in the PCI world, now that we have more efficient MSI interrupts in PCI Express, being used extensively across applications. However they are still used primarily for backward compatibility and boot-up support. Legacy Interrupts[INTx] used to be physical signals in PCI, however PCIe devices do not have physical INTx pins. So to support these legacy interrupts, PCIe emulates them logically. Almost like a virtual INTx mechanism. We shall see how these interrupts are realized in PCI Express, in such a way that developers/enthusiasts can get a hands-on following this guide. This blog has the following agendas:- 1. Why do we need to care about Legacy INTx style interrupts in PCIe? 2. System Overview 3. How are INTx legacy interrupts realized in PCIe? 4. Enabling and testing INTx emulation on iMX8MM
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This document explains how to enable and test Bluetooth 6LoWPAN (IPv6 over Low-power Wireless Personal Area Networks) in the i.MX Linux BSP.   Environment   i.MX Linux BSP 6.6.52-2.2.0 (based on Yocto scrathgap) i.MX 93 EVK (2 units) An Embedded Artists 2EL M.2 module with the Murata LBES5PL2EL module (containing NXP IW612) is inserted into the i.MX 93 EVK's M.2 slot and connected to the onboard Wi-Fi/BT antenna. One i.MX 93 EVK will serve as the Peripheral device, while the other will act as the Central device. It should also work with i.MX 8 and 9 series evaluation kit equipped with Bluetooth LE modules.   Configurations   Although the Linux kernel includes a Bluetooth 6LoWPAN driver, it is disabled in the i.MX Linux BSP. Therefore, we will modify the kernel configuration to enable it. Add 2 settings below in kernel configuration file (imx_v8_defconfig) to build the required drivers as modules: CONFIG_6LOWPAN=m CONFIG_BT_6LOWPAN=m These settings can be found in the following section of the Linux kernel menuconfig. CONFIG_6LOWPAN: Depends on: NET [=y] && IPV6 [=y] Location: -> Networking support (NET [=y]) -> Networking options -> 6LoWPAN Support (6LOWPAN [=m]) CONFIG_6LOWPAN  CONFIG_BT_6LOWPAN: Depends on: NET [=y] && BT_LE [=y] && 6LOWPAN [=y] Location: -> Networking support (NET [=y]) -> Bluetooth subsystem support (BT [=y]) -> Bluetooth Low Energy (LE) features (BT_LE [=y]) -> Bluetooth 6LoWPAN support (BT_6LOWPAN [=m]) Rebuild the image containing the Linux kernel and make sure that the required drivers are present in the following paths. /lib/modules/6.6.52-ge0f9e2afd4cf-dirty/kernel/net/6lowpan/6lowpan.ko /lib/modules/6.6.52-ge0f9e2afd4cf-dirty/kernel/net/bluetooth/bluetooth_6lowpan.ko   Operations for Peripheral device   Boot the Peripheral device EVK and log in as the root user. NXP i.MX Release Distro 6.6-scarthgap imx93-11x11-lpddr4x-evk ttyLP0 imx93-11x11-lpddr4x-evk login: root Load the NXP Bluetooth UART driver to enable Bluetooth. # modprobe btnxpuart Start the Bluetooth hci0 interface with the hciconfig command. # hciconfig hci0 up Type hciconfig command to check the BD Address of the Bluetooth hci0 interface and confirm that its status is "UP RUNNING". # hciconfig -a hci0: Type: Primary Bus: UART BD Address: D0:17:69:12:34:56 ACL MTU: 1021:7 SCO MTU: 120:6 UP RUNNING RX bytes:862 acl:0 sco:0 events:59 errors:0 TX bytes:1085 acl:0 sco:0 commands:58 errors:0 Features: 0xbf 0xfe 0x8f 0xfe 0xdb 0xff 0x7b 0x87 Packet type: DM1 DM3 DM5 DH1 DH3 DH5 HV1 HV2 HV3 Link policy: RSWITCH SNIFF Link mode: PERIPHERAL ACCEPT Name: 'imx93-11x11-lpddr4x-evk' Class: 0x200000 Service Classes: Audio Device Class: Miscellaneous, HCI Version: 5.4 (0xd) Revision: 0x8300 LMP Version: 5.4 (0xd) Subversion: 0x1015 Manufacturer: NXP Semiconductors (formerly Philips Semiconductors) (37) Load the Bluetooth 6LoWPAN driver. # modprobe bluetooth_6lowpan Enable Bluetooth 6LoWPAN. # echo 1 > /sys/kernel/debug/bluetooth/6lowpan_enable Start Bluetooth advertising and waits for a connection request from the Central device. # bluetoothctl advertise on   Operations for Central device   Boot the Central device EVK and log in as the root user. NXP i.MX Release Distro 6.6-scarthgap imx93-11x11-lpddr4x-evk ttyLP0 imx93-11x11-lpddr4x-evk login: root Load the NXP Bluetooth UART driver to enable Bluetooth. # modprobe btnxpuart Start the Bluetooth hci0 interface with the hciconfig command. # hciconfig hci0 up Type hciconfig command to check the BD Address of the Bluetooth hci0 interface and confirm that its status is "UP RUNNING". # hciconfig -a hci0: Type: Primary Bus: UART BD Address: D0:17:69:AB:CD:EF ACL MTU: 1021:7 SCO MTU: 120:6 UP RUNNING RX bytes:862 acl:0 sco:0 events:59 errors:0 TX bytes:1085 acl:0 sco:0 commands:58 errors:0 Features: 0xbf 0xfe 0x8f 0xfe 0xdb 0xff 0x7b 0x87 Packet type: DM1 DM3 DM5 DH1 DH3 DH5 HV1 HV2 HV3 Link policy: RSWITCH SNIFF Link mode: PERIPHERAL ACCEPT Name: 'imx93-11x11-lpddr4x-evk' Class: 0x200000 Service Classes: Audio Device Class: Miscellaneous, HCI Version: 5.4 (0xd) Revision: 0x8300 LMP Version: 5.4 (0xd) Subversion: 0x1015 Manufacturer: NXP Semiconductors (formerly Philips Semiconductors) (37) Load the Bluetooth 6LoWPAN driver. # modprobe bluetooth_6lowpan Enable Bluetooth 6LoWPAN. # echo 1 > /sys/kernel/debug/bluetooth/6lowpan_enable Send a connection request to the Peripheral device. (In this example, the BD address of the Peripheral device is D0:17:69:12:34:56.) # echo "connect D0:17:69:12:34:56 1" > /sys/kernel/debug/bluetooth/6lowpan_control After waiting for a few tens of seconds, the bt0 network interface will appear. (At the same time, the bt0 network interface will appear on the Peripheral device that accepted the connection.) # ifconfig bt0 bt0: flags=4161<UP,RUNNING,MULTICAST> mtu 1280 inet6 fe80::d017:69ff:feab:cdef prefixlen 64 scopeid 0x20<link> unspec D0-17-69-AB-CD-EF-00-00-00-00-00-00-00-00-00-00 txqueuelen 1000 (UNSPEC) RX packets 9 bytes 884 (884.0 B) RX errors 0 dropped 4 overruns 0 frame 0 TX packets 13 bytes 1069 (1.0 KiB) TX errors 0 dropped 0 overruns 0 carrier 0 collisions 0 The Central device and Peripheral device are now connected via Bluetooth 6LoWPAN.   Testing Send a ping from the Central device to the Peripheral device. (In this example, the IPV6 address of the Peripheral device is fe80::d017:69ff:fe12:3456.) # ping6 fe80::d017:69ff:fe12:3456%bt0 PING fe80::d017:69ff:fe12:3456%bt0 (fe80::d017:69ff:fe12:3456%bt0) 56 data bytes 64 bytes from fe80::d017:69ff:fe12:3456%bt0: icmp_seq=1 ttl=64 time=181 ms 64 bytes from fe80::d017:69ff:fe12:3456%bt0: icmp_seq=2 ttl=64 time=125 ms 64 bytes from fe80::d017:69ff:fe12:3456%bt0: icmp_seq=3 ttl=64 time=67.7 ms 64 bytes from fe80::d017:69ff:fe12:3456%bt0: icmp_seq=4 ttl=64 time=56.1 ms ...   Benchmarking   Run the iperf3 server on the Peripheral device. # iperf3 -s Run the iperf3 benchmark on the Central device. For example, check the TCP connections. # iperf3 -V -c fe80::d017:69ff:fe12:3456%bt0 You can also check UDP connections. For example, the following example sends UDP 200Kbps bandwidth. # iperf3 -V -c fe80::d017:69ff:fe12:3456%bt0 -u -b 200K   Disclaimer   This document is provided as a reference for utilizing NXP products. Please refer to the official product manuals and application notes for formal specifications. Due to differences in software versions and other conditions, actual behavior may differ from the descriptions provided. This document does not verify all functions, so please be sure to conduct appropriate validation and testing to ensure suitability for your intended use.  
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  This is a detailed programming aid for the registers associated with i.MX 8M Plus DDR initialization. LPDDR4 DDR4  For more details, refer to the main mScale DDR tools page: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Please note that this page is only intended to store the RPA spreadsheets. For questions, please create a new community thread.  
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This is a detailed programming aid for the registers associated with i.MX 8MNano (m815S) DDR initialization.  For more details, refer to the main mScale DDR tools page: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Please note that this page is only intended to store the RPA spreadsheets. For questions, please create a new community thread.
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