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A key challenge to the deployment of Edge compute IoT is management and security of 1000s to millions of Edge compute nodes. EdgeScale simplifies this by providing a cloud-based management framework leveraging the hardware security features of Layerscape processors. Learn how you can use EdgeScale to manage a heterogenious set of Edge compute nodes, and use it with your choice of Edge compute framework - AWS Greengrass, Azure IoT Edge and others.

In this class, participants will learn how to leverage model-based design technology (MATLAB/Simulink) to quickly develop motor control algorithms for BLDC, ACIM, and PMSM motors using NXP S32K MCUs on the S32K144 automotive reference platform. Learn the basics of the motor control toolbox to generate C-code from simulation models. The toolbox will be utilized demonstrating peripheral driver blocks, optimized automotive math/motor control blocks, software and processor in the loop techniques for algorithm verification, as well as other utilities for MCU profiling and algorithm development.

i.MX RT has a flexible external SPI Flash interface, which supports all existing SPI protocols. However, Serial Flash products may vary in READ performance due to the number of I/O, command protocols and the maximum frequency. Serial Flash Read performance has a direct impact on the system bootup time as well as code execution efficiency. In an advanced system design where system code is shadowed from Flash to DRAM, the initial boot time depends on the data transfer time from Flash to DRAM. In a cost-efficient system design, DRAM is reduced or eliminated since the processor will be able to fetch execution instructions directly from the Flash to the internal cache. During code fetching, a fixed length of data (typically 32- or 64-Byte) is read out from the flash. Shortening the overall 32-Byte or 64-Byte Read time will greatly reduce processor’s wait cycle, leading to improvement on XiP efficiency.

The hottest topic in automotive design today is the concept of the eCockpit -- where all visual functions in the car are controlled across multiple screens and fully integrated for the driver’s convenience. The key technology that enables eCockpit to run on a single processor also offers new capabilities in industrial, embedded and consumer products such as drones, manufacturing HMI interfaces and smart displays. This class will cover the fundamental technologies and architectural techniques in the i.MX 8 processor which enables rich eCockpit functionality, how NXP has implemented the world’s most significant full chip virtualization capabilities in an ARM-based processor and breaks down the eCockpit demo from the Tech Lab.

This session will go into the detail of the software enablement around the BlueBox v2.0, aka “BlueBox Mini” or “BLBX2”. Suited for level 2/3 autonomous drive. From an engineering perspective topics will include: 1. The BlueBox v2.0 hardware layout. 2. BSP content with middleware; Linux config and Ubuntu rootfs; Linux options between and inter-communication between them; Discussion of middleware options (including ROS versions, and others). 3. How ADAS is supported. 4. Combined to achieve level 2/3 ADAS with AutonomouStuff. 5. Apollo versions ported and benchmarking of the planning module. 6. Future offerings with hardware support and systems-level safety and orchestration. 7. Technical lecture explaining the internals of this enablement.

The self driving car has a major impact on ECUs power and complexity and the network architecture connecting them together. The sheer fact that the driver is now a mere passenger with potentially limited options of taking back control raises significant functional safety questions that cannot be addressed with conventional approaches. In this presentation, we discuss how autonomous driving is impacting the functional safety requirements for automotive Ethernet switches and PHYs. We will review what functional safety for a component really means, going beyond marketing figures and ticking off feature lists. Finally, we will discuss how NXP is attacking this challenge in our current portfolio with a hint to the products to come.

This one hour session will introduce the architecture, block diagrams and products of NXP’s electric vehicles (EV) and hybrid electric vehicles (HEV) portfolio for electric drive trains. Areas of focus include battery management, microprocessors for drive control, system basis chips, IGBT and MOSFET gate drivers and power modules for high voltage and 48V inverters. A leader in functional safety, NXP’s safety case for EV and HEV will be discussed. How we enable the customer design through evaluation boards, software and reference designs will be reviewed.

This session will address how S12 MagniV mixed-signal MCUs can help customers design more compact and cost-effective electronic control units. The S12 MagniV devices are built on proven S12 technology, enabling software and tool compatibility across the entire portfolio. With the right blend of digital programmability and high-precision analog, plus a portfolio of scalable memory options, the S12 MagniV portfolio streamlines automotive design.

In this presentation, we are going to highlight the use of Model-Based Design processes for Vehicle Dynamics and Body Controller that involves electric drives which are typically used by OEM and Tiers 1 for product development. The primary benefit of Model-Based Design is the ability to cover traceability between design artifacts produced as a part of the design process. A traceability path from requirement management tool to software model, code, and finally tests in the hardware-in-the-loop environment is demonstrated. A typical PMSM Field Oriented Control application will be used to demonstrate all the steps shown above using NXP S32K Motor Kit.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

Power saving is always so important for power supply. So many well-known regulations have played an important role this year to drive this direction, like EUP Lot6, DOE, COC, Energy Star, etc. However, nowadays,since IoT is so popular what is expected for power saving? What will power look like for TV power, PC power, adapter and fast charger? In this class NXP will help audiences to understand NXP’s AC/DC power controller IC portfolio-- from 1W up to 350W.

As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

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