i.MX Processors Knowledge Base

cancel
Showing results for 
Show  only  | Search instead for 
Did you mean: 

i.MX Processors Knowledge Base

Discussions

Sort by:
Important: If you have any questions or would like to report any issues with the DDR tools or supporting documents please create a support ticket in the  i.MX community. Please note that any private messages or direct emails are not monitored and will not receive a response. NOTE: Please note that DDR support for the i.MX 8M Family and has also been added in the Config Tools for i.MX Applications Processors | NXP Semiconductors Please consider using this tool with more enhanced features. i.MX 8M Family DDR Tools Overview The i.MX 8M Family DDR Tool is a Windows-based software to help users to do LPDDR4/DDR4/DDR3L training, stress test and DDR initial code generation for u-boot SPL. This page contains the latest releases for the i.MX 8M Family DDR Tools and cover the following SoCs : i.MX 8M Quad and its derivatives i.MX 8M Quadlite and i.MX 8M Dual i.MX 8M Mini Quad and its derivatives i.MX 8M Mini Quadlite/Dual/DualLite/Solo/SoloLite  i.MX 8M Nano Quad and its derivatives i.MX 8M Nano Quadlite/Dual/DualLite/Solo/SoloLite  i.MX 8M Plus   NOTE: For the i.MX 8/8X Family of DDR tools please refer to the: i.MX 8/8X Family DDR Tools Release   The purpose of the i.MX 8M Family DDR Tools is to enable users to generate and test a custom DRAM initialization based on their device configuration (density, number of chip selects, etc.) and board layout (data bus bit swizzling, etc.).  This process equips the user to then proceed with the bring-up of a boot loader and an OS.  Once the OS is brought up, it is recommended to run an OS-based memory test (like Linux memtester) to further verify and test the DDR memory interface.     The i.MX 8M Family DDR Tools consist of: DDR Register Programming Aid (RPA) MSCALE DDR Tool   For more details regarding these DDR tools and their usage, refer to the i.MX 8M DDR Tools User Guide.   i.MX 8M Family DDR Tool    The i.MX 8M Family DDR stress test tool is a Windows-based software tool that is used as a mechanism to verify that the DDR initialization is operational for use with u-boot and OS bring-up. To install the DDR Stress Test, save and extract the zip file mscale_ddr_tool_vXXX_setup.exe.zip   (where 'xxx' is the current version number) and follow the on-screen installation instructions.   i.MX 8M Family DDR Tool Requirements   The tool requires access to the Windows registry, hence users must run it in administrator mode. When users design new i.MX 8M Family boards, please make sure to follow the rules outlined in the respective Hardware Developers Guide and the MSCALE_DDR_Tool_User_Guide, which can help users bring up DDR devices on their respective i.MX 8M boards.   i.MX 8M Family DDR Tool User Guide   The i.MX 8M DDR tool includes the document: MSCALE_DDR_Tool_User_Guide NOTE: Please read the MSCALE_DDR_Tool_User_Guide inside the package carefully before you use this tool.   i.MX8M DDR Tool Revision History   Rev Major Changes* (Features) Comments 3.31 Integration of the workaround for 8MQ ERR051273   3.30 Fix DBI enabled issue for all i.MX 8M series Automatically identify ROHM and PCA9450 PMICs on i.MX 8M Nano board Fix 4GB/8GB memory tester issues   3.20 Add support to i.MX 8M Plus   3.10 Fixe UART communication issues for some specific characters between the PC software and the target board. Fine-tune DDRPHY registers in generated C code.   3.00 Add support to i.MX8M-nano Add support to different PMIC or PMIC configuration Add support to stress test for all DDR frequency points RPA tools for Nano include support for DDR3L, DDR4, and LPDDR4.   Note that the DDR3L and LPDDR4 RPAs contain the name preliminary only to denote that these RPAs are based on internal NXP validation boards where the DDR4 RPA is based on the released EVK.   2.10 Change DDR4 capacity computing method   2.00 Add support to i.MX8M-mini   * Further details available in the release notes   Sample configuration in the .ds script for i.MX 8M debug UART2: ################step 0: configure debug uart port. Assumes use of UART IO Pads.   ##### ##### If using non-UART pads (i.e. using other pads to mux out the UART signals), ##### ##### then it is up to the user to overwrite the following IO register settings   ##### memory set 0x3033023C 32 0x00000000 #IOMUXC_SW_MUX_UART2_RXD memory set 0x30330240 32 0x00000000 #IOMUXC_SW_MUX_UART2_TXD memory set 0x303304A4 32 0x0000000E #IOMUXC_SW_PAD_UART2_RXD memory set 0x303304A8 32 0x0000000E #IOMUXC_SW_PAD_UART2_TXD memory set 0x303304FC 32 0x00000000 #IOMUXC_SW_MUX_UART2_SEL_RXD sysparam set debug_uart   1 #UART index from 0 ('0' = UART1, '1' = UART2, '2' = UART3, '3' = UART4)   Sample configuration in the front of the .ds script for i.MX 8M debug UART3  ################step 0: configure debug uart port. Assumes use of UART IO Pads.   ##### ##### If using non-UART pads (i.e. using other pads to mux out the UART signals), ##### ##### then it is up to the user to overwrite the following IO register settings   ##### memory set 0x30330244 32 0x00000000 #IOMUXC_SW_MUX_UART3_RXD memory set 0x30330248 32 0x00000000 #IOMUXC_SW_MUX_UART3_TXD memory set 0x303304AC 32 0x0000000E #IOMUXC_SW_PAD_UART3_RXD memory set 0x303304B0 32 0x0000000E #IOMUXC_SW_PAD_UART3_TXD memory set 0x30330504 32 0x00000002 #IOMUXC_SW_MUX_UART3_SEL_RXD sysparam set debug_uart   2 #UART index from 0 ('0' = UART1, '1' = UART2, '2' = UART3, '3' = UART4)   Sample configuration in the front of the .ds script for i.MX 8M Mini PMIC configuration: ##############step 0.5: configure I2C port IO pads according to your PCB design.   ##### ########### You can modify the following instructions to adapt to your board PMIC ####### memory set 0x30330214 32 0x00000010  #IOMUXC_SW_MUX_I2C1_SCL memory set 0x30330218 32 0x00000010  #IOMUXC_SW_MUX_I2C1_SDA memory set 0x3033047C 32 0x000000C6 #IOMUXC_SW_PAD_I2C1_SCL memory set 0x30330480 32 0x000000C6  #IOMUXC_SW_PAD_I2C1_SDA sysparam set pmic_cfg 0x004B #bit[7:0] = PMIC addr,bit[15:8]=I2C Bus. Bus index from 0 ('0' = I2C1, '1' = I2C2, '2' = I2C3, '3' = I2C4) sysparam set pmic_set 0x2F01 #bit[7:0] = Reg val, bit[15:8]=Reg addr. #REG(0x2F) = 0x01 sysparam set pmic_set 0x0C02   #REG(0x0C) = 0x02 sysparam set pmic_set 0x171E   #REG(0x17) = 0x1E sysparam set pmic_set 0x0C00   #REG(0x0C) = 0x00 sysparam set pmic_set 0x2F11    #REG(0x2F)=0x11     i.MX 8M Family DDR Register Programming Aid (RPA) The i.MX 8M DDR RPA (or simply RPA) is an Excel spreadsheet tool used to develop DDR initialization for a user’s specific DDR configuration (DDR device type, density, etc.). The RPA generates the DDR initialization(in a separate Excel worksheet tab):   DDR Stress Test Script: This format is used specifically with the DDR stress test by first copying the contents in this worksheet tab and then pasting it to a text file, naming the document with the “.ds” file extension. The user will select this file when executing the DDR stress test. The How to Use Excel worksheet tab provides instructions on using the RPA   i.MX 8M Family DDR Register Programming Aid (RPA): Current Versions To obtain the latest RPAs, please refer to the following links (note, existing RPAs have been removed from this main page and moved to the SoC specific links below): i.MX 8M Quad : https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8M-m850D-DDR-Register-Programming-Aid-RPA/ta-p/1172441 i.MX 8M Mini : https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8MMini-m845S-DDR-Register-Programming-Aid-RPA/ta-p/1172443 i.MX 8M Nano: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX8MNano-m815S-DDR-Register-Programming-Aid-RPA/ta-p/1172444 i.MX 8M Plus: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8MPlus-m865S-DDR-Register-Programming-Aids-RPA/ta-p/1235352   Processor Mask Revisions Memory Supported Latest RPA Version * i.MX 8M Quad & Derivatives All LPDDR4 Rev 36 i.MX 8M Quad & Derivatives All DDR4 Rev 20 i.MX 8M Quad & Derivatives All DDR3L Rev 12 i.MX 8M Mini & Derivatives A0 LPDDR4 Rev 25 i.MX 8M Mini & Derivatives A0 DDR4 Rev 23 i.MX 8M Mini & Derivatives A0 DDR3L Rev 12 i.MX 8M Nano & Derivatives A0 LPDDR4 Rev 12 i.MX 8M Nano & Derivatives A0 DDR4 Rev 14 i.MX 8M Nano & Derivatives A0 DDR3L Rev 8 i.MX 8M Plus & Derivatives A1 LPDDR4 Rev 11 i.MX 8M Plus & Derivatives A1 DDR4 Rev 11 * For the details about the updates, please refer to the Revision History tab of the respective RPA.    To modify the DRAM Frequency for a custom setting refer to iMX 8M Mini Register Programming Aid DRAM PLL setting    Related Resources Links: Config Tools for i.MX Applications Processors | NXP Semiconductors i.MX 8M Mini Register Programming Aid DRAM PLL setting  i.MX 8/8X Series DDR Tool Release  i.MX 6/7 DDR Stress test GUI Tool i.MX 8M Application Processor Related Resources i.MX8M (m850D) DDR Register Programming Aid (RPA)  i.MX8MMini (m845S) DDR Register Programming Aid (RPA)  i.MX8MNano (m815S) DDR Register Programming Aid (RPA) i.MX 8MPlus (m865S) DDR Register Programming Aids (RPA)   i.MX 8ULP DDR tools: i.MX Software and Development Tools | NXP Semiconductors Scroll down to “Other Resources --> Tools --> DDR Tools”  
View full article
This is a detailed programming aid for the registers associated with i.MX 8MNano (m815S) DDR initialization.  For more details, refer to the main mScale DDR tools page: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Please note that this page is only intended to store the RPA spreadsheets. For questions, please create a new community thread.
View full article
This is a detailed programming aid for the registers associated with i.MX 8MMini (m845S) DDR initialization.  For more details, refer to the main mScale DDR tools page: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Please note that this page is only intended to store the RPA spreadsheets. For questions, please create a new community thread.
View full article
This is a detailed programming aid for the registers associated with i.MX 8M (m850D) DDR initialization.  For more details, refer to the main mScale DDR tools page: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Please note that this page is only intended to store the RPA spreadsheets. For questions, please create a new community thread.
View full article
  This is a detailed programming aid for the registers associated with i.MX 8M Plus DDR initialization. LPDDR4 DDR4  For more details, refer to the main mScale DDR tools page: https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467 Please note that this page is only intended to store the RPA spreadsheets. For questions, please create a new community thread.  
View full article
What actually happens between powering on an i.MX95 system and reaching a Linux login prompt? The answer involves far more than a bootloader and a kernel. This QEMU-based i.MX95 emulation turns that otherwise difficult-to-observe sequence into a reproducible virtual laboratory for students, hobbyists, and engineers who want to study the complete boot chain without relying entirely on physical hardware.
View full article
Here's the imx-power-estimation SKILL for any AI agents: name: imx-power-estimation description: Estimate the Power Consumption for i.MX95/952/943 SoC. Use this skill when user ask for the i.MX SoC power consumption with their application scenarios. Input: Describe your use case in natural language. e.g: "estimate the power consumption of i.MX95 for Automotive IVI use cases.". You can also specify the temperature/corner/mode, as well as the IP modules usage/bandwidth, like 2xA55 core running 50% loading, DDR bandwidth 30%, 1xETH 500Mbps. Output: Detailed power breakdown by voltage rail with total consumption
View full article
The purpose of this document is to provide extended guidance for selection of compatible LPDDR5 and LPDDR4x memory devices that are supported by the i.MX 95 and i.MX 952/937 processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. Please note that some of the LPDDR4x devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. LPDDR5 - maximum supported densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 95 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses and x8 (byte mode) organization 1, 3, 7 i.MX 952 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses and x8 (byte mode) organization 1, 3, 7, 9 i.MX 937 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses and x8 (byte mode) organization 1, 3, 7, 9   LPDDR5 - list of validated memories Note: The memory vendors often list their devices as LPDDR5x in their high-level product information while in fact, they are in most cases backward compatible with the LPDDR5 mode. This may lead to the false impression that there are not so many LPDDR5 devices on the market. In such cases, it is strongly recommended to check the full datasheet to confirm if the device is in fact LPDDR5/LPDDR5x or LPDDR5x only. The SoC cannot be used with devices that only support the LPDDR5X mode. The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor  Validated Memory Part#  Notes i.MX 95 128Gb/16GB Micron MT62F4G32D8DV-023 FAAT:C - 64Gb/8GB  Samsung K3KL9L90QM-MHCT - 32Gb/4GB  Samsung K3KL8L80QM-MHCT 2 32Gb/4GB  Samsung K3KL8L80EM-MUCV 2        64Gb/8GB  SK HYNIX H58G66DK9VX067N 2 64Gb/8GB Micron MT62F2G32D4DS-023 FAAT:C 2, 6 32Gb/4GB Micron MT62F1G32D2DS-020 WT:D 2 16Gb/2GB Micron MT62F1G16D1DS-023 IT:B 2 64Gb / 8GB Rayson RS2G32LO5D24DB-31BT 2 32Gb/4GB Rayson ATL5X4G32M7E-31IT 2 64Gb / 8GB CXMT CXDB6CCBM-MA-A 2 i.MX 952 128Gb/16GB Micron MT62F4G32D8DV-023 FAAT:C 9 32Gb/4GB Micron MT62F1G32D2DS-020 WT:D 2 i.MX 937 128Gb/16GB Micron MT62F4G32D8DV-023 FAAT:C 9   LPDDR5 - list of incompatible devices The SoC cannot be used with memory devices that only support the LPDDR5x mode. LPDDR4x - maximum supported densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 95 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses 1 i.MX 952 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses 1, 9 i.MX 937 32-bit 128Gb/16GB dual rank, dual channel device with 17-row addresses and x8 (byte mode) organization 1, 3, 7, 9   LPDDR4x - list of validated memories   The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 95 64Gb/8GB Micron   MT53E2G32D4DE-046 AUT:C  5 8Gb/1GB Micron MT53E256M32D1KS-046 IT:L 2 128Gb/16GB Micron MT53E4G32D8GS-046 2 64Gb/8GB SK Hynix H54G66BYYVPX104 2 32Gb/4GB Intelligent Memory IMBG32L4KBB_V10 2 48Gb/6GB Micron MT53E1536M32D4DT-046 WT:A 3, 8 24Gb/3GB Micron MT53E768M32D4DT-053 AIT:E 3, 8 8Gb/1GB Samsung K4U8E3S4ADGHCL  2 32Gb/4GB Intelligent Memory IMBG32LK4BBG-046I 2 32Gb/4GB Alliance Memory AS4C1G32MD4V-046BIN 2 64Gb/8GB Rayson ATL4X8G32M2D-46IT 2 64Gb/8GB Rayson ATL4X8G32M2D-46AIT 2 64Gb/8GB DW DWCTB36HLC0 2 8Gb/1GB Alliance Memory AS4C256M32MD4V-062BAN 2 32Gb/4GB ISSI IS46LQ32K01S2A-046BLA2 2 32Gb/4GB Nanya NT6AT1024T32AV-J1 2 64Gb/8GB Nanya NT6AT2048F32AV-J1 2 64Gb/8GB Rayson RS2G32LR4D4BNR-46BT 2 i.MX 952 64Gb/8GB Micron   MT53E2G32D4DE-046 AUT:C  9 i.MX 937 64Gb/8GB Micron MT53E2G32D4DE-046 AUT:C  9   LPDDR4/4X - list of incompatible devices Note: This SoC supports LPDDR4x memory devices. This SoC is not compatible with memories that only support LPDDR4. Combo Devices that support both LPDDR4x and LPDDR4 are compatible with the SoC. Note 1: The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-5 (LPDDR5) and JESD209-4C/JESD209-4-1 (LPDDR4/4X). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 3: Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. Note 4: All memory parts are available at vendors unless stated otherwise. Checked Q3 2026 Note 5: Memory device supports both LPDDR4x and LPDDR4, however can only be used in LPDDR4x mode Note 6: Not validated by NXP but confirmed working on a non NXP Board Note 7: The maximum density supported may change in the future when DRAM vendors make higher density options available Note 8: This DRAM part number is not recommended for new designs Note 9: This SoC is in Pre-Production
View full article
SPI NAND boot on i.MX8ULP This article is about the SPI NAND boot on the i.MX8ULP, some customers using the i.MX8ULP want to use the SPI NAND on it. We just have verified the NOR NAND on the i.MX8ULP EVK board, for the SPI NAND use customers do not clear and do not know how to realized, here will give details steps and modifications for customers to refer to. 1\The boot mode support on the i.MX8ULP For the i.MX8ULP support many kinds of external memory devices SD, eMMC, SPI NOR and Flash SPI NAND Flash.   Compared to traditional parallel NAND (which requires GPMI/NFC controllers), SPI NAND can be accessed through a serial FlexSPI interface. For the i.MX8ULP for the SPI NAND use need to connect to the FlexSPI2 interface. 2\ Hardware SPI NAND boot configuration On the i.MX8ULP the SPI NAND is mounted on the FlexSPI2 interface, the configuration need to follow the section in the RM.     Boot configuration needs to follow the Table 84. Boot configuration.   In our reference design use the NOR SPI flash, for the SPI NAND connection can refer to it. 3\Software realized for the SPI NAND boot on the i.MX8ULP Make sure the hardware connections are proper. Next step is to boot up. On our 8ULP EVK board I have confirmed that do not have the SPI NAND on it. The default u-boot and the imx-mkimage flash_singleboot_m33_flexspi is for the SPI NOR, not for the SPI NAND, for the SPI NAND is using the different mechanism with SPI NOR, so if customer use ROM code read it fail, in our default released BSP do not include the build images for the 8ULP SPI NAND https://github.com/nxp-imx/imx-mkimage/blob/lf-6.18.20_2.0.0/iMX8ULP/soc.mak. So it need the special build images, and realized by customer themselves. For the i.MX8ULP ROM code already confirm that support the SPI NAND boot, so in customer’s side they need to porting in their side to support it. The SPI NAND boot mechanism for the i.MX8ULP is the same as that of the i.MX91, so we can refer to the i.MX91 design. For support the SPI NAND boot, the actual project needs to supplement U-Boot, imx mkimage, FCDBBT, download, and Linux support for related NAND part numbers. The core of SPI NAND boot is not a single binary image, but a set of data structures for ROM to identify media, bad blocks, and boot image locations. The key structures as FCB, DBBT, and Image Container. 3.1 U-boot modify Add the NAND related information and parameters in the driver: Take the Winbond NAND as an example, https://github.com/nxp-imx/uboot-imx/blob/lf-6.18.20-2.0.0/drivers/mtd/nand/spi/winbond.c   Add customized header support for SPI NAND boot in the cmd_fspinand.c (Added customized FlexSPI NAND header support: allowing different configurations to be generated for different NAND models.) https://github.com/nxp-imx/uboot-imx/blob/lf_v2026.04/arch/arm/mach-imx/cmd_fspinand.c   3.2 Add the SPI NAND support in the imx-mkimage imx-mkimage is a boot image generation tool provided by NXP, used to package multiple boot components such as U-Boot, ATF, OP-TEE, DDR firmware, ELE,SECO firmware into the final boot image (flash.bin). imx-mkimage generates the Container Images that meet Boot ROM requirements. The default code: https://github.com/nxp-imx/imx-mkimage/tree/lf-6.18.20_2.0.0/iMX8ULP Need to add the related information for the SPI NAND support refer to the i.MX91:https://github.com/nxp-imx/imx-mkimage/tree/lf-6.18.20_2.0.0/iMX91 Generate the flash_fw.bin and flash.bin . flash_fw.bin is a temporary boot image used by the UUU tool during SPI NAND programming. flash.bin is the Boot image programmed into the SPI NAND flash. The write the boot images to UUU command is: uuu -b spinand flash_fw.bin flash.bin 3.3 Kernel modify For the kernel need to add the driver and spi-nand node in the board device tree. Add the NAND related information and parameters in the driver like u-boot.   Configure FLEXSPI2 and add the SPI NAND Flash node in the board Device Tree (DTS):   Build the source code, test on the customer’s board. 4\ Trouble shooting a.Need to check the hardware design is proper, check the connection and pins mux. b.Confirm the i.MX8ULP if validation the 4KB SPI NAND Page size. For the page_data_size and page_total_size 2K      config->pageDataSize = 2048;     config->pageTotalSize = 4096; 4K     config->pageDataSize = 4096; config->pageTotalSize = 8192; Confirm if configuration the FCB to 4KB page size or still 2K. At firstly in the 91 RM we can see that there is BOOT_CFG0[7] FlexSPI_NAND_4K_Page_Selection, no describe for the i.MX8ULP. We thought need special configuration for the i.MX8ULP. But for the i.MX8ULP do not use this BOOT_CFG0[7] FlexSPI_NAND_4K_Page_Selection. And in the default ROM Code support 2K and 4K, details can see in the ROM document .       c. The FCB, DBBT, flash.bin, and all contained boot images are 4 KB aligned to match the SPI NAND page size requirement.  Make sure already confirm the FCB configure to 4KB page size. If not 4KB aligned will all met fail boot. d. uboot/arch/arm/mach-imx/cmd_fspinand.c The original code use the fspinand_prep_micron_mem_config() configure NAND's in-die ECC using a semi-hardcoded approach, then write to the SR2 register, this method will cover other key configuration bits in the Winbond W25N04L series SR2. Firstly ask customer to commit out the function of the “fspinand_prep_micron_mem_config()” to see if can pass the fail. (Commenting out the fspinand_prep_micron_mem_config() function in uboot: arch/arm/mach-imx/cmd_fspinand.c will be quick way(not a solution) to verify if this causes the boot failure.) After annotation, the spi nand can start normally, but this is only a verification method and not the final solution. Then customer try to modify the value configuration for the SR2 from 0x10 to 0x19: - config->mem_config.configCmdArgs[1] = 0x10; + config->mem_config.configCmdArgs[1] = 0x19; This works well in customer’s side. But fixed the SR2 value not suit for all customer’s situation using other vendors’ chip. NXP do not use the hard code, because this may affect other NAND customers and instead increase the customized flexspi_nand_config header support. Using the attached U-Boot and mkimage tool patches to generate the required custom header for the target SPI NAND device. Note: Please use our official patches (Already merged in NXP 2026 Q3 release) to address this issue. We have introduced support for customized flexspi_nand_config headers. Please use the attached U-Boot and mkimage tool patches to generate the required custom header for the target SPI NAND device. Please note that the changes in our mkimage patch are based on the SPI NAND implementation for the NXP release of the i.MX91 platform. Please make the corresponding modifications according to the platform you are using. If you are using the Linux 6.18.37_2.1.0 our newest released BSP, we already apply this patch.  Just make porting SPI Nand boot according the i.MX91 section code to finish. If you are using the before released version, the following two patches are needed. 0001-iMX91-soc.mak-add-flash_singleboot_spinand_customhdr.patch.txt 0001-LFU-1037-cmd_fspinand-add-customized-header-support-.patch.txt  
View full article
The purpose of this document is to provide extended guidance for the selection of compatible LPDDR4 memory devices that are supported by the i.MX 91 series of processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity.   LPDDR4 - Maximum Supported Densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 91 (i.MX 91xx) 16-bit 16 Gb / (2 GB) single rank, single channel device with 17-row addresses (R0 - R16) 1, 2, 3   LPDDR4 - List of Validated Memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 91 16 Gb / (2 GB) Micron MT53E1G16D1FW-046 AAT:A MT53E1G16D1ZW-046 AAT:C 5    2 Gb / (256 MB)  Winbond  W66BP6NBHAHJ 4 8 Gb / (1 GB) Nanya NT6AN512M16AV-J1I   4 Gb / (512 MB) Nanya NT6AN256M16AV-J1I 4 8 Gb / (1 GB) ISSI IS43LQ16512B-046BLI 4 12 Gb / (1.5 GB) Micron MT53E768M16D1ZW-046 4 16 Gb / (2 GB) Intelligent Memory IMAG16L4KBBG 4 2 Gb / (256 MB) Nanya NT6AN128M16AV-J1 4 4 Gb / (512 MB) UniIC SCB11N4G160BF-04ZI 4 4 Gb / (512 MB) ISSI IS43LQ16256B-053BLI 4 4 Gb / (512 MB) Winbond W66CP6RBHAHJ 4 4 Gb / (512 MB) Winbond W66CP6RBQAHJ 4     Note: This device supports operation with LPDDR4 memories only. LPDDR4x operation is not supported. Dual‑mode memories that support both LPDDR4 and LPDDR4x are allowed as long as the device can operate in LPDDR4 mode, including using LPDDR4 I/O voltage levels and initialization sequences. NOTE: LPDDR4 devices from certain memory vendors may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low-speed operation is planned in the use case, please consult with the memory vendor about the configuration aspects and possible customization of the memory device so correct functionality is ensured. Note 1: The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-4B (LPDDR4). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The SoC also supports dual rank single channel devices therefore, 16Gb/2GB density can be also achieved by using a dual rank single channel device with 16-row addresses (R0 - R15). Note 4: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 5: The memory part number is not recommended for new designs and superseded by a new part number
View full article
We are pleased to announce that Config Tools for i.MX 26.09 are now available. Downloads & links To download the installer for all platforms, please login to our download site via:  https://www.nxp.com/design/designs/config-tools-for-i-mx-applications-processors:CONFIG-TOOLS-IMX Please refer to  Documentation  for installation and quick start guides. For further information about DDR config and validation, please go to this  blog post. Release Notes Full details on the release (features, known issues...) Version 26.09 Framework Added support for downloading all boards associated with a processor when downloading the processor. DDR tool Added support for i.MX 937 Added DDR3 support for i.MX 8MP FRDM board Added support for i.MX93W FRDM and EVK boards at 3600 MT/s Enabled PMIC PF9453 support for i.MX 91 Minor improvements, enhancements, and bug fixes SerDes tool Added support for i.MX 952 System Manager Multiple validation ID issues are resolved. DDR tool – NXP-validated memory configurations for multiple vendors is available System Manager – extended CLI support for a headless setting      
View full article
Enabling a 2-Channel CAN HAT (MCP2515) on the NXP i.MX93 FRDM Board   This article documents the process of adding hardware support for a 2-Channel CAN HAT from WaveShare using dual Microchip MCP2515 controllers over SPI on the NXP i.MX93 FRDM evaluation board. By default, the board exposes native FlexCAN interfaces, but utilizing a popular Raspberry Pi-compatible CAN HAT requires customizing the Linux device tree and kernel configuration.   Prerequisites   Hardware: NXP i.MX93 FRDM board, 2-Channel CAN HAT. Software: NXP Linux BSP (Tested in 6.18.y). Toolchain: Toolchain obtained from Yocto (Refer to the 4.5.12 How to build U-Boot and Kernel in standalone environment from i.MX Linux User's Guide).   Step 1: Modify the Device Tree   We need to edit the main board device tree file  arch/arm64/boot/dts/freescale/imx93-11x11-frdm.dts  to configure the SPI master, add the dual MCP2515 nodes, assign interrupt pins, and disable conflicting native interfaces. The key changes:   Power Regulators: Ensured the expansion connectors ( VEXP_3V3 and VEXP_5V ) correctly pull up and preserve state using pinctrl-assert-gpios . Fixed Clock: Defined an external 16MHz clock element required by the MCP2515 crystal oscillators. FlexCAN Deactivation: Disabled conflicting native flexcan2 nodes sharing pins. LPSPI3 Configuration: Replaced the default spidev dummy node with two microchip,mcp2515 nodes, adding two distinct Chip Select (CS) pins ( GPIO2_IO08 and GPIO2_IO07 ) and mapping the respective hardware interrupts ( GPIO2_IO23 and GPIO2_IO25 ). Device Tree Git Diff: diff --git a/arch/arm64/boot/dts/freescale/imx93-11x11-frdm.dts b/arch/arm64/boot/dts/freescale/imx93-11x11-frdm.dts index 18afe964e020..7b3af73f144f 100644 --- a/arch/arm64/boot/dts/freescale/imx93-11x11-frdm.dts +++ b/arch/arm64/boot/dts/freescale/imx93-11x11-frdm.dts @@ -134,6 +134,7 @@ reg_vexp_3v3: regulator-vexp-3v3 { compatible = "regulator-fixed"; regulator-name = "VEXP_3V3"; gpio = <&pcal6524 2 GPIO_ACTIVE_HIGH>; + pinctrl-assert-gpios = <&pcal6524 2 GPIO_ACTIVE_HIGH>; regulator-min-microvolt = <3300000>; regulator-max-microvolt = <3300000>; enable-active-high; @@ -144,6 +145,7 @@ reg_vexp_5v: regulator-vexp-5v { compatible = "regulator-fixed"; regulator-name = "VEXP_5V"; gpio = <&pcal6524 8 GPIO_ACTIVE_HIGH>; + pinctrl-assert-gpios = <&pcal6524 8 GPIO_ACTIVE_HIGH>; regulator-min-microvolt = <5000000>; regulator-max-microvolt = <5000000>; enable-active-high; @@ -269,6 +271,15 @@ K3: user_btn2 { interrupts = <6 IRQ_TYPE_EDGE_FALLING>; }; }; + + clocks { + clk16m: clk16m { + compatible = "fixed-clock"; + #clock-cells = <0>; + clock-frequency = <16000000>; + clock-output-names = "clk16m"; + }; + }; }; &adc1 { @@ -292,7 +303,7 @@ &flexcan2 { pinctrl-0 = <&pinctrl_flexcan2>; pinctrl-1 = <&pinctrl_flexcan2_sleep>; xceiver-supply = <&reg_can2_stby>; - status = "okay"; + status = "disabled"; }; &mu1 { @@ -620,15 +631,29 @@ typec1_dr_sw: endpoint { &lpspi3 { pinctrl-names = "default"; pinctrl-0 = <&pinctrl_lpspi3>; - cs-gpios = <&gpio2 8 GPIO_ACTIVE_LOW>; - pinctrl-assert-gpios = <&pcal6408 0 GPIO_ACTIVE_HIGH>; + cs-gpios = <&gpio2 8 GPIO_ACTIVE_LOW>, <&gpio2 7 GPIO_ACTIVE_LOW>; + pinctrl-assert-gpios = <&pcal6408 0 GPIO_ACTIVE_LOW>; status = "okay"; - spidev0: spi@0 { + can0: can@0 { + compatible = "microchip,mcp2515"; reg = <0>; - compatible = "lwn,bk4"; - spi-max-frequency = <1000000>; + clocks = <&clk16m>; + interrupt-parent = <&gpio2>; + interrupts = <23 IRQ_TYPE_LEVEL_LOW>; + spi-max-frequency = <10000000>; }; + + can1: can@1 { + compatible = "microchip,mcp2515"; + reg = <1>; + clocks = <&clk16m>; + interrupt-parent = <&gpio2>; + interrupts = <25 IRQ_TYPE_LEVEL_LOW>; + spi-max-frequency = <10000000>; + }; + + }; &lpuart1 { /* console */ @@ -894,9 +919,12 @@ MX93_PAD_GPIO_IO29__LPI2C3_SCL 0x40000b9e pinctrl_lpspi3: lpspi3grp { fsl,pins = < MX93_PAD_GPIO_IO08__GPIO2_IO08 0x39e + MX93_PAD_GPIO_IO07__GPIO2_IO07 0x39e MX93_PAD_GPIO_IO09__LPSPI3_SIN 0x39e MX93_PAD_GPIO_IO10__LPSPI3_SOUT 0x39e MX93_PAD_GPIO_IO11__LPSPI3_SCK 0x39e + MX93_PAD_GPIO_IO23__GPIO2_IO23 0x39e + MX93_PAD_GPIO_IO25__GPIO2_IO25 0x39e >; };   After modifying the file, compile your device tree blobs (.dtb) and deploy them to your target boot partition. You can refer to the below post to know the process: How to compile Linux Kernel Image and device tree using Yocto SDK.   Step 2: Enable Kernel Driver Support   The MCP251x driver must be enabled within the Linux kernel configuration framework. Run the configuration tool: user@host:~/linux-imx$ make menuconfig   Navigate through the menu to enable the driver either statically ( [*] ) or as a module ( [M] 😞 [*] Networking support <*> CAN bus subsystem support <*> Raw CAN Protocol (raw access with CAN-ID filtering)   <*> Broadcast Manager CAN Protocol (with content filtering) <*> CAN Gateway/Router (with netlink configuration) And: Device Drivers [*] Network device support <*> CAN Device Drivers CAN SPI interfaces <*> Microchip MCP251x and MCP25625 SPI CAN controllers <*> Microchip MCP251xFD SPI CAN controllers   Save your configuration and compile your kernel/modules.   Step 3: Initialize and Test Interfaces   Once the board boots with the new device tree and kernel, you should see two new network interfaces listed under ip link show ( can0 and can1 ).   Now, you can setup the CAN interfaces: $ sudo ip link set can0 up type can bitrate 1000000 $ sudo ip link set can1 up type can bitrate 1000000 $ sudo ifconfig can0 txqueuelen 65536 $ sudo ifconfig can1 txqueuelen 65536   Connect the HAT in loopback:     From Interface can0: candump can0   From interface can1: cansend can1 000#11.22.33.44         Hope this can be helpful.   Best regards, Salas.        
View full article
The purpose of this document is to provide extended guidance for the selection of compatible LPDDR4/4X memory devices that are supported by the i.MX 93 series of processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs. The i.MX 93 series of processors supports different packages, and each have their own maximum supported LPDDR4/4x data rates. Please refer to the respective datasheets. Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. NOTE: Some of the LPDDR4/4X devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low-speed operation is planned in the use case, please consult with the memory vendor about the configuration aspects and possible customization of the memory device so correct functionality is ensured. LPDDR4/4X - Maximum Supported Densities SoC Max Data bus width Maximum density Assumed memory organization Notes i.MX 93 (i.MX 93xx) 16-bit 16 Gb / (2 GB) single rank, single channel device with 17-row addresses (R0 - R16) 1, 2, 3   LPDDR4/4X - List of Validated Memories The validation process is an ongoing effort - regular updates of the table are expected. SoC Density Memory Vendor Validated Memory Part# Notes i.MX 93 16 Gb/ (2 GB) Micron LPDDR4/4x: MT53E1G16D1FW-046 AAT:A  (Z32N) MT53E1G16D1ZW-046 AAT:C (Z42N) 7   4, 8 8 Gb/ (1 GB) Micron LPDDR4/4x: MT53D512M16D1DS-046 AAT (Z11M) 4, 10 16 Gb/ (2 GB) Micron LPDDR4/4x: MT53E1G32D2FW-046 AUT:B (Z42M) 4, 5, 10 8 Gb/ (1 GB) Nanya LPDDR4: NT6AN512M16AV-J1I LPDDR4x: NT6AP512M16BV-J1I 4, 8 4 Gb/ (512 MB) Nanya LPDDR4x: NT6AP256M16AV  4, 8 16 Gb/ (2 GB) Kingston LPDDR4: D1611PM3BDGUI-U 4, 8 16 Gb/ (2 GB) Kingston LPDDR4: C1612PC2WDGTKR-U  7, 9 4 Gb/ (512 MB) ISSI LPDDR4: IS43LQ16256B-062BLI 4, 8 2 Gb / (256 MB) ISSI LPDDR4: IS43LQ16128A-062BSLI 4, 6, 8   8 Gb/ (1 GB) CXMT LPDDR4/4x: CXDB4CBAM-EA-M 4, 9 16 Gb/ (2 GB) JSC LPDDR4x: JSL4BAG167ZAMF  4, 8 8 Gb/ (1 GB) JSC LPDDR4x: JSL4B8G168ZAMF-05x  4, 8 4 Gb/ (512 MB) JSC LPDDR4x: JSL4A4G168ZAMF-05 4, 8 2 Gb / (256 MB) Winbond  LPDDR4x: W66BQ6NBHAGJ 4, 6, 8 8 Gb / (1 GB) IM (Intelligent Memory) LPDDR4x: IM8G16L4JCB-046I 4, 11 16 Gb / (2 GB) IM (Intelligent Memory) LPDDR4/4x: IMAG16L4KBBG 4, 8 4 Gb / (512 MB) Samsung LPDDR4: K4F4E164HD-THCL 4, 8 8Gb / (1 GB) AM (Alliance Memory) LPDDR4X: AS4C512M16MD4V-053BIN 4, 8 4 Gb / (512 MB) ISSI LPDDR4/4X: IS43LQ16256B-053BLI 4, 8 8 Gb / (1 GB) ISSI LPDDR4/4X: IS46LQ16512B-046BLA2 4, 8 32Gb / (4GB) 16 Gb / (2Gb) usable by i.MX 93 ISSI LPDDR4/4X: IS46LQ32K01B-046BLI 4, 8   Note 1: The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-4B/JESD209-4-1 (LPDDR4/4X). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4/4X devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The SoC also supports dual rank single channel devices therefore, 16Gb/2GB density can be also achieved by using a dual rank single channel device with 16-row addresses (R0 - R15). Note 4: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 5: This is a dual channel x32 device. Since i.MX93 only supports 16-bit LPDDR4/X data bus, it can only interface with one of the channels and therefore, utilize only half of the device's density. As indicated in the table - the device has 32Gb/4GB density however, only 16Gb/2GB can be used. There is no functional problem with using only one channel of a dual channel device as the channels are independent in LPDDR4/4X.  Note 6: This is a new JEDEC 100 ball package, half the size of the standard 200 ball package. This 100 ball package has the same performance and functionality as the 200 ball package, and has the added advantage of being smaller and cheaper than the standard package. Note 7: This device has been EoLed by the manufacturer and has been updated by a new memory part number  Note 8: Part is active. Reviewed Q3 2026 Note 9: Part is obsolete. Note 10: This device will be EoLed in Q2 24 by the manufacturer and will not be updated by a new memory part number Note 11: DQ eye marginalities were identified during TSA analysis. vTSA and stability testing did not identify any issues.
View full article
lspci output on iMX95EVK as PCIe RC Please take a good look at the snippet above. It is taken from the console of iMX95 after executing 'lspci' on a specific PCIe device[iMX8MM as PCIe EP] that gets enumerated as BDF[Bus Device Function] 01:00.0. This blog attempts to debunk the mystery revolving around the "Memory at " info of the lspci output. We will discuss what this address is, why it is used and its relevance in the PCIe world. This blog will focus on the following agendas: - 1. PCIe parent and child relationship in Linux Device Tree 2. What is CPU and PCIe address space and the need for address space translation?  3. Assigning resources to a PCIe device in Linux 4. How is address space translation carried out in Linux PCI Subsystem?   PCIe parent and child relationship in Linux Device Tree In the Linux device tree, PCIe parent and child relationship defines how PCIe Root Complex and Endpoints are positioned in the system. A PCIe parent node in the device tree represents a PCIe controller (Root Complex / Host-Bridge). Taking reference from a PCIe node present in the device tree source of imx95: -   pcie@4c300000 {                         compatible = "fsl,imx95-pcie";                         reg = <0x00 0x4c300000 0x00 0x10000 0x00 0x4c360000 0x00 0x20000 0x00 0x60100000 0x00 0xfe00000>;                         reg-names = "dbi\0atu\0config";                         #address-cells = <0x03>   …  }   pcie@4c300000 represents a Designware PCIe controller Root Complex which is a parent to the devices/bridge that will be connected to it. -- 'compatible' property identifies the specific PCIe controller. Its corresponding driver resides in drivers/pci/controller/dwc/pci-imx6.c -- 'reg' property specifies the memory mapped registers of the PCIe controller. Child nodes under PCIe RC represent devices on the PCIe bus. They can be fixed function devices like Wi-fi, Ethernet, NVMe or they can be PCIe bridges which further can have devices connected to it. Taking reference from 'arch/arm64/boot/dts/freescale/imx95.dtsi'   pcie_4ca00000: pcie@4ca00000 {                         compatible = "pci-host-ecam-generic";                         reg = <0x0 0x4ca00000 0x0 0x100000>;                         /* Must be 3. */              …              …              enetc_port0: ethernet@0,0 {                                 compatible = "fsl,imx95-enetc";                                 reg = <0x000000 0 0 0 0>;                                 clocks = <&scmi_clk IMX95_CLK_ENET>,                                          <&scmi_clk IMX95_CLK_ENETREF>;                                 clock-names = "ipg_clk", "enet_ref_clk";                                 nvmem-cells = <&eth_mac0>;                                 nvmem-cell-names = "mac-address";                                 status = "disabled";                         }; }   ethernet@0,0 is a PCIe device at bus 0, device 0, function 0. It is a child of PCIe RC which is memory mapped at 0x4ca00000   These child devices/bridges can either be dynamically discovered using PCI enumeration or they can be statically described in a device tree as seen in the device-tree snippet above in which "ethernet@0,0" entry statically tells the RC that the ethernet child device is connected to it. These child nodes are nested within a PCI parent node of the device tree as seen in the above example.   What is CPU and PCIe address space and the need for address space translation ? CPU address space is the system's physical memory map as seen by the processor. Example of CPU Physical Address Space viewed by Cortex-A55 on iMX95:-   Start address      End address    Module 0x48000000       0x4812FFFF    GIC Programming registers 0x4AA00000      0x4AAFFFFF    Neutron SRAM 0x4AC10000      0x4AC1FFFF    Camera domain block control 0x4E080000       0x4E08FFFF    DDR Controller This address space is kind of a global system view which is managed by system firmware/OS. These addresses are fixed by hardware-design. On the other hand, PCIe address space is local to PCI bus, managed by PCIe subsystem. The  addresses in this space are dynamically assigned. An example of PCIe address space that could look like the following:- 0x00000000   -    0x0FFFFFFF 0x10000000   -    0x1FFFFFFF 0x20000000   -    0x2FFFFFFF It is evident from the above explanation that CPU and PCIe address space operate in a separate and independent address domains. So the CPU cannot access the space of PCIe device unless a translation mechanism is in place. In one of the upcoming sections we will get to that as well but please spare a few minutes and ponder the question below:- Question : Why do you need separate address spaces for CPU and PCIe? Answer : One of the major reasons is modularity. We have separate spaces so that PCIe devices can be designed independently of the CPU architecture. Same card will work in different system. It will always have the flexibility of CPU remapping the PCIe space as and when needed. Also, different address spaces prevent devices to access arbitrary system memory. Based on the discussion in this section, it is evident that the PCIe address space is inherently different from the CPU address space and truth be told- it has its advantages. Therefore we need an entity to translate to/fro these address spaces. Here comes 'iATU' - Internal Address Translation Unit. On iMX SOCs, these hardware units are responsible for carrying out the address translation. These units are a part of Synopsys DesignWare PCIe Controller, providing programmable address translation windows for inbound and outbound transactions. For the readers who are uninitiated on the inbound and outbound transactions in pcie, please spare some time go through this technical blog - Understanding PCIe Outbound/Inbound windows with a use-case - NXP Community Note: - Address translation simply ensures that the CPU can access a PCIe device's memory and vice-versa.   Up until here, the readers must have got a basic picture of PCIe Address Translation. Before jumping into the nitty-gritty of this translation in the Linux PCI subsystem, let's discuss how the resources are assigned to a PCIe device.   Assigning resources to a PCIe device in Linux PCIe devices do not have a direct CPU instruction interface so they communicate through memory-mapped regions. Devices need memory for DMA operations or for MSI/MSIX interrupts. Different devices have different needs, so resources in PCIe could be MMIO where device registers are mapped or memory regions needed for DMA transfer. In linux, pci_assign_resource function of PCI subsystem is responsible for assigning IO and memory resources to the PCIe devices during system initialisation after PCIe devices are enumerated. It is called for all the devices on a PCI bus and based on the PCI devices' resource requirement, it assigns them. But how does the PCI subsystem in linux figure out what resources does the PCIe devices need ? - Every PCIe device has a configuration space defined by the PCIe specification. This includes   BAR[Base Address Registers] - To indicate what type of resource[IO/Mem] does  the device needs and the size of resource. Capabilities - To broadcast the device capabilities such as MSI Interrupts, ASPM low power states etc. Reading the BARs from the PCIe device will tell us what kind and size of the resources are needed by the device. // To determine the size of resource from the BAR of PCIe device:- Step-1: Write all 1's to the target BAR register. Step-2: Read back the value and clear the lower 4 bits (for a memory BAR) or 2 bits (for an I/O BAR), as these are status bits, not part of the size calculation Step-3 Perform Bitwise NOT on the value and add 1 to it. Step-4: The returned value indicates the size. Taking an example to understand this:- Let's assume that after reading back the value in Step-2 above, the BAR returns 0xFFFFF000. The lower 4 bits are already cleared. Step-3  we perform bitwise NOT on the value -> ~(0xFFFFF000) = 0x00000FFF Adding 1 to it : 0x00000FFF + 1 = 0x00001000 The obtained value 0x1000 = 4096 bytes indicates the size, meaning the BAR requires a 4KB memory region. // To determine the type of resource from the BAR of PCIe device:-   A Base Address Register (BAR) in PCI configuration space: Bit 0 → Resource type: 1 = I/O space 0 = Memory space For memory BARs: 00 = 32-bit 10 = 64-bit Bits 1–2 → Addressing type: Bit 3 → Prefetchable flag   Interpreting the value 0xFFFFF000, we get:-   Bit 0 = 0 → Memory space Bits 1–2 = 00 → 32-bit address Bit 3 = 0 → Prefetchable Upper bits → Base address (after masking)   pci_read_bases [drivers/pci/probe.c] in linux PCI subsystem is responsible to figure out the BAR memory size and type requirement during device enumeration. Needless to say, the above sequence of writing to the Endpoint's BAR and identifying the size and type of resource is executed on the PCIe RC. We have the following setup :- iMX95 <------> iMX8MM [RC]                     [EP] After PCIe RC has the size of the BAR that is required, the pci_assign_resource function allocates a memory range and then sets up translation from this memory range to the PCIe address space. we started this blog with a snippet, that shows the following lspci log:-   Referring to the above, please note that the RC driver has allocated: - 0x910100000 - 0x910110000 as the non-prefetchable memory address range, size=64KB The above memory address range is in the PCIe 1 Outbound space memory mapped on iMX95 SoC: -   The range 0x910100000 - 0x910110000 will be mapped to the PCIe address space of the End-point. This essentially means that if the cpu generates any address in between this range [inclusive of start and end-address], a PCIe TLP will be sent by the PCIe controller on the RC to the End-point on the bus. It could be a read or write to the memory of Endpoint. The address to write/read would be decided based on the address space translation. We shall discuss in-detail how this translation is exercised in the linux kernel in the next section.   How is address space translation carried out in Linux PCI Subsystem?   We start with some important questions: - Where is the range 0x910100000 - 0x910110000 specified ? How does the kernel know that it has to map the PCIe 1 Outbound space and not PCIe2 Outbound space or any other address space for that matter? -- Like all good things in Linux, this also starts with a 'device tree binary'. A dtb is passed by Uboot to the kernel so that it could get the hardware description of our board. Since we are using Torradex 's Verdin iMX95 EVK Board as Root Complex, this is the dtb that we are using - imx95-19x19-verdin-adv7535.dtb I will be attaching a working dtb with this blog so that the readers can use it if needed. This dtb includes - arch/arm64/boot/dts/freescale/imx95.dtsi Let's have a look at a particular pcie node of interest: -   'ranges' property is the answer to the questions that were asked in this section earlier.  - This property defines the address translation rules between the parent's address space and the child PCI address space.   Note:- This blog focuses only on 'ranges' property since it is relevant to our discussion. So the readers are advised to look elsewhere if they want to understand other device-tree properties of the PCIe node.  Let's decode the ranges property : It has the following format:- <PCI address><CPU address> <PCI size>      3 cells               2 cells             2 cells             So one entry will have 7 cells. In our dtsi we have 2 entries. 1st is for IO space translation and the 2nd is for Mem space translation. Referring to the second entry  :-   0x82000000 0x0 0x10000000 0x9 0x10000000 0 0x10000000 |------PCI address---------------| |-CPU address-| |---PCI size---|   The above gives us the following info: - MEM Space prefetchable <   0x82000000 0x00 0x10000000   // PCIe address: 0x10000000   0x09 0x10000000              // CPU/system address: 0x910000000   0x00 0x10000000              // Size: 256MB >;   0x82000000 = 1000 0010 0000 0000 0000 0000 0000 0000   Bits 31–30 (10) → Configuration space type: This indicates memory space. Bit 29 (0) → Non-relocatable Bit 28 (0) → Non-prefetchable  (0 means non-prefetchable) Bits 27–24 (0010) → Address space type = Memory So, 0x82000000 means: PCI memory space Non-prefetchable 32-bit address space   Note:- For those of you wondering why lspci output mentions [size=64K] and dts says 256 MB. This is because 256MB is the maximum address space available for the PCIe devices. It is upto the Endpoint device, how large address space does it require and accordingly it gets allocated.     Similary IO space translation is also created from the 1st entry in 'ranges':- < 0x81000000 0x00 0x00 → PCI I/O address: 0x00000000 0x00 0x6ff00000 → CPU/system address: 0x6ff00000 0x00 0x100000 → Size: 1MB >;   we observe the same in the dmesg output of iMX95 Verdin EVK Linux console:-   So the MEM Space mapping is from CPU Address 0x910000000 - 0x091fffffff translated to PCIe Address 0x10000000 - 0x1fffffff It is only fair that we mention the driver that uses the 'ranges' property. The 'ranges' property get parsed in "pci_parse_request_of_pci_ranges -> devm_of_pci_get_host_bridge_resources" of "drivers/pci/of.c"     devm_of_pci_get_host_bridge_resources, for each range automatically  manages the memory allocated for these resources. It ensures that the resources are freed when the device is detached or the driver is removed. We have got the answer what & why is the cpu and pci address range the way it is. But in the lspci, you see 0x910100000 and not 0x910000000 which is what the intended start range is supposed to be as per the dtb. Why is that ? To answer this - we need to go back to the PCIe device enumeration. During PCIe enumeration, in the linux PCI driver the bar resources were determined like we had discussed earlier and then the PCI core driver may assign addresses keeping alignment requirements in mind that is why EP's BAR0 was assigned a PCI bus address as 0x10100000 with a 1MB[0x100000] offset from 0x10000000. And keeping the device tree pci translation window in mind:- 0x10100000 translates to 0x910100000 This translation doesn't happen on its own. Device tree binary just mentions the translation window specifics such as the CPU address space to translate to and the PCI address space to translate from. The actual translation is done via iATU. This is done in the dw_pcie_iatu_setup function of drivers/pci/controller/dwc/pcie-designware-host.c by creating the outbound window using dw_pcie_prog_outbound_atu function. Translation is configured on the RC successfully but there is still something missing. .. .. Inbound window !! Without an inbound window on the Endpoint i.e iMX8MM, the writes/reads to 0x910100000 would be meaningless. On iMX8MM we are using PCI Endpoint test driver which is quite popular in linux community and I would urge the readers to visit this page if they want more info - 9. PCI Endpoint Framework — The Linux Kernel documentation pci_epc_map_addr function in drivers/pci/endpoint/pci-epc-core.c creates inbound window by mapping PCI address [0x10100000] to physical address in EP's memory. That's how the reads and writes go through. If there's no Inbound window configured, something like this unfolds in case of read:-   So now everything is set up. Translation windows are configured in the PCI drivers and you are at linux console. The following sequence unfolds when the CPU issues a memory read:-   In case of memory writes:- The following happens on the Endpoint: - The beauty is that this entire translation happens transparently in hardware - your driver just reads/writes to the CPU address, and the PCI host controller handles all the translation automatically! -- How do we test the Address Translation ?   To test reads and writes, either we can make some changes in the driver itself or use devmem5 user-space binary. We are going to make minor driver side changes on iMX8MM and use devmem5 on the RC. iMX8MM is the PCIe Endpoint and we are using end-point test driver to configure it as such. If  you want to do the same, please follow this blog - Enabling PCIe End-point framework on iMX95 torradex board and iMX8MM EVK - NXP Community On the contrary if you want to make iMX95 as RC and iMX8MM Endpoint, feel free to follow this blog - How to configure iMX95EVK as PCIe Endpoint and test it using PCIe Endpoint Test Framework - NXP Community Two things we are going to do next: - 1. On iMX8MM EP, we are going to write some random values  in the drivers/pci/endpoint/pci-epf-core.c, make the following changes in pci_epf_alloc_space function: -     'space' is the virtual address and 'phys_addr' is the physical address that is contiguous. Please note that it is a crude way to test this translation. There are better ways to do it. Build the kernel after the changes and boot the board with it. Make iMX8MM an Endpoint using PCI Endpoint Test Framework. 2. On iMX95 Verdin EVK [PCIe RC], we are going to read the address 0x910100000 using devmem5 to verify that we can observe the same data on the RC.   That's it for today. This was a long blog and if you feel overwhelmed by the details, please feel free to drop in the DMs or comments so that I can try to make it easier. Until next time! Gaurav Sharma  
View full article
This article describes a Full-Bridge PCIe reference design that connects an NXP i.MX95 SoC (acting as PCIe Root Complex) to a Lattice CertusPro-NX / Certus-NX FPGA endpoint, together with a Linux kernel driver. Updating the FPGA bitstream over PCIe is demonstrated as the reference use case, built on top of a general-purpose PCIe data-transfer, register-access and MSI-completion interface. Hardware Host / Root Complex: NXP i.MX95 SoC running Linux (DesignWare PCIe controller) FPGA target / endpoint: Lattice CertusPro-NX PCIe Bridge board (Device ID  0x9C25 ) or Certus-NX (Device ID  0x9C1D ) — Lattice Vendor ID  0x1204 PCIe link: 1-lane (x1), single BAR (BAR1) design Interrupt: 1 MSI vector, EP→Host completion signalling   Board Connection Architecture The host application talks to the FPGA through the  kernel driver. The driver exposes BAR1 as a character device and manages two host-side DMA-coherent buffers. Because the design is a full bridge, both sides can initiate PCIe transactions: the host issues MWr/MRd to BAR1, and the FPGA (as bus master) issues its own MWr/MRd back into host memory. Driver Architecture Block Role Application (userspace) Issues IOCTLs; supplies payload and DMA target addresses Driver  lattice_nxp_pcie_ep.c BAR1 MMIO window, SRC/DST DMA buffers, MSI completion, char device  /dev/lattice_nxp_pcie_bar1 FPGA (CertusPro-NX / Certus-NX) PCIe endpoint; executes command, performs MRd/MWr, raises MSI on completion Host memory DMA-coherent SRC and DST buffers   What the driver covers The kernel module is a general-purpose PCIe endpoint transport, not a bitstream-specific driver. It contains no bitstream or image parsing — bitstream update is simply the reference application layered on top of these primitives. It provides three planes: FPGA→Host DMA path (EP-initiated bulk transfer): two host DMA-coherent buffers (SRC/DST, default 4 KB, tunable up to 1 MB). The host fills SRC, programs the FPGA SRC/DST mailbox registers and rings a doorbell; the FPGA (bus master) then moves data via its own MRd/MWr and writes results into the host DST buffer. Usable for any payload. Host↔FPGA BAR1 MMIO window: the char-device  read() / write()  path exposes the whole BAR1 aperture as an 8-byte-granular, byte-addressable window ( readq / writeq , or paired  readl / writel  on 32-bit) for register/RAM access and MWr+MRd readback tests. Control + completion plane: arbitrary 32-bit BAR1 register read/write by offset (the "command" and "doorbell" registers are conventions the application chooses), plus MSI-based completion notification (atomic counter + wait/poll IOCTLs). In short, it is a generic data-transfer + register-access + interrupt-notification interface. Bitstream loading is one application built on it; any host↔FPGA bulk transfer or register-control workflow uses the same primitives.   Driver overview —  Probe & init: enable the PCIe device and set bus master → configure the DMA mask (32-bit default, 64-bit fallback) → map BAR1 MMIO → allocate SRC + DST coherent DMA buffers → allocate 1 MSI vector → register  /dev/lattice_nxp_pcie_bar1 . IOCTL interface (9 commands): Command Di r  Description IOCTL_GET_INFO R Return BAR1 size, SRC/DST DMA handles, MSI IRQ number IOCTL_FILL_SRC W Copy userspace buffer into the SRC DMA buffer IOCTL_CLEAR_DMA – Zero the DST DMA buffer before a transfer IOCTL_READ_DMA R Read back bytes from the DST DMA buffer after the FPGA copy IOCTL_WAIT_MSI W Block until the next MSI fires (with  timeout_ms ) IOCTL_WAIT_MSI_SINCE W Block until  msi_count  exceeds a given baseline (race-free) IOCTL_GET_MSI_COUNT R Read the current MSI interrupt counter (atomic u64) IOCTL_WRITE_REG W Write one 32-bit MMIO register in BAR1 by offset IOCTL_READ_REG R Read one 32-bit MMIO register from BAR1 by offset   Driver internals BAR1 read/write paths:  pcie_read()  /  pcie_write()  expose BAR1 as a char device. Accesses must be 8-byte aligned; 64-bit uses  readq / writeq , 32-bit uses paired  readl / writel . MSI ISR:  pcie_isr()  atomically increments  msi_count  and wakes the wait-queue, unblocking  WAIT_MSI  /  WAIT_MSI_SINCE  callers. Verbosity level 2 logs each interrupt with its running count. iATU resync workaround ( FORCE_SYNC_IATU  on probe, the driver clears and then restores the root-port Memory Base/Limit registers to force the DesignWare PCIe block to rebuild its inbound iATU translation table. This is required after an FPGA reconfiguration + PCIe remove + rescan cycle. The macro can be commented out if the workaround is not needed. Note that this alters the upstream port and can affect other PCIe devices on the same bus. Vendor ID:  0x1204   |  Device IDs:  0x9C25  (CertusPro-NX),  0x9C1D  (Certus-NX). Module parameters Parameter Type / default / perm Description verbose int / 1 / 0644 0 = minimal (critical errors only); 1 = info (probe steps, DMA sizes, MSI events); 2 = chatty (all IOCTL calls, read/write rejections, MSI interrupts) dma_bits int / 32 / 0644 DMA address width for coherent-buffer allocation. 32 = default (most platforms); 64 = use if probe fails with  -ENOMEM  (-12) on a 32-bit mask dma_buf_bytes uint / 4096 / 0644 Size (bytes) of each DMA coherent buffer (SRC and DST). Min 256, default 4096 All three parameters are adjustable at load time;  verbose  and  dma_bits  can also be changed at runtime via sysfs.   Known limitations — unsupported PCIe transaction types Configuration Read (CfgRd0 / CfgRd1) — PCIe TLP Type 0/1 config reads are not supported Configuration Write (CfgWr0 / CfgWr1) — PCIe TLP Type 0/1 config writes are not supported Legacy I/O Read (IORd) — x86-style I/O reads are not supported; no I/O BARs are mapped Legacy I/O Write (IOWr) — x86-style I/O writes are not supported; all access goes through BAR1 MMIO Supported: Memory Read (MRd), Memory Write (MWr), and MSI interrupt signalling via the BAR1 mailbox. Reference lattice_nxp_pcie_ep.c  — Linux kernel PCIe EP driver
View full article
This document analyzes IMX95 supported TSN protocols such as 802.1Qav, 802.1Qbv, 802.1Qbu and 802.1Qci, and introduces use cases design to implement these protocols on I.MX95 platform.
View full article
Market Demand: Due to the inclusion of the Linux Kernel, Android Framework, Vehicle HAL, CarService, and numerous IVI applications, the traditional cold start time of the Android Automotive system is typically long, making it difficult to meet the user experience requirements of "power on and ready to use" in automobiles. Proposed Solution: The Hibernate (Suspend-to-Disk) solution significantly shortens startup time by saving a snapshot of the system's runtime and restoring it to its running state upon the next power-on, while preserving the state of applications such as navigation,music, and Bluetooth. Hardware and software platforms for implementing Hibernate : HW: i.MX95 B0 19*19 EVK SW: Android auto imx-automotive-15.0.0_2.1.0 Lunch device : lunch evk_95_car2-nxp_stable-userdebug  
View full article
The purpose of this document is to provide supportive information for selection of suitable LPDDR4, DDR4 and DDR3L devices that are supported by i.MX 8M family of processors to aid project feasibility assessment capabilities of customers that are evaluating the SoCs for usage in their products.  It is strongly recommended to consult with NXP and the memory vendor the final choice of the memory part number to ensure that the device meets all the compatibility, availability, longevity and pricing requirements. Please note that some of the LPDDR4 devices may not support operation at low speeds and in addition, DQ ODT may not be active, which can impact signal integrity at these speeds. If low speed operation is planned in the use case, please consult with the memory vendor the configuration aspects and possible customization of the memory device so correct functionality is ensured. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the NXP Hardware Developer's Guides for the specific SoCs available on NXP.com Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity. For any questions related to specific DRAM part numbers please contact the respective DRAM vendor. For any questions regarding the i.MX SoC please contact your support representative or enter a support ticket.  LPDDR4 - maximum supported densities Please note that the SoCs only support memory devices that support either the LPDDR4 mode or support both LPDDR4 and LPDDR4X modes. Memory devices that support only the LPDDR4X mode are not supported. SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad 32-bit 32Gb/4GB dual rank, dual-channel  device with 16-row addresses (R0-R15) 1, 2, 4 i.MX 8M Mini  32-bit 64Gb/8GB dual rank, dual-channel  device with 17-row addresses (R0-R16) 1, 2 i.MX 8M Nano  16-bit 32Gb/4GB dual rank, single-channel  device with 17-row addresses (R0-R16) 1, 2, 3, 12 i.MX 8M Plus  32-bit 64Gb/8GB dual rank, dual-channel  device with 17-row addresses (R0-R16)  1, 2   LPDDR4 - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required. SoC Density Memory Vendor Validated Memory Part#  Notes i.MX 8M Quad  24Gb/3GB    Micron MT53B768M32D4NQ-062 WT:B  15 32Gb/4GB Micron MT53D1024M32D4DT-046 AAT:D  14 4Gb/512MB ISSI IS43LQ16256B-062BLI  5, 14 8Gb/1GB ISSI IS43LQ32256B-062BLI  5, 14 i.MX 8M Mini 16Gb/2GB Micron MT53D512M32D2DS-053 WT:D  15 16Gb/2GB    ESMT M56Z16G32512A-SMBIG 5, 14 32Gb/4GB Micron MT53E1G32D2FW-046 WT:A  5, 14 64Gb/8GB Micron MT53E2G32D4DT-046 AIT:A  5, 14 64Gb/8GB Micron MT53E2G32D4DE-046 AUT:C 5, 14 32Gb/4GB Intelligent Memory IMBG32L4KBB 5,14 32Gb/4GB Kingston B3221PM3BDGUI -U 5 16Gb/2GB Kingston D1621PM4CDGVIW-U related PNs also covered by the test: D1621PM4CDGUI-U D1621PM4CDGUIW-U D1621PM4CDGVI-U 5 i.MX 8M Nano  16Gb / 2GB  Kingston C1612PC2WDGTKR-U  15 16Gb / 2GB  Kingston  D1611PM3BDGUI-U 5,14 32Gb / 4GB Micron MT53E2G32D4DT-046 AIT:A  5, 13, 15 16Gb / 2GB Intelligent Memory  IMAG16L4KBB 5,14 4Gb / 512MB Nanya NT6AN256M16AV-J2 5,14 4Gb / 512MB  Winbond W66CP6RBQAHJ 5,14 8Gb / 1GB ISSI IS43LQ16512A-053BLI 5,14 8Gb / 1GB  Micron MT53D512M32D2DS-053 WT:D 13, 15   i.MX 8M Plus       48Gb/6GB  Micron MT53E1536M32D4DT-046 WT:A  15 64Gb/8GB  Micron MT53E2G32D4DE-046 AUT:C  5, 14 32Gb/4GB Samsung K4FBE3D4HB-KHCL  5, 14 32Gb/4GB Kingston B3221PM3BDGVIW-U 5, 14 64Gb/8GB Kingston Q6422PM3BDGVK-U  5, 14 8Gb/1GB Winbond W66DP2RQQAHJ  5, 14 32Gb/4GB ISSI IS46LQ32K01S2A-046BLA2 5, 14 16Gb/2GB ISSI IS46LQ32512A-046BLA3 5 32Gb/4GB ISSI IS43LQ32K01S2A-046BLI 5, 14 32Gb/4GB IM IMBG32LK4BBG-046I 5, 14 32Gb/4GB Nanya NT6AN1024F32AV-J2 5, 14 32Gb/4GB Nanya NT6AT1024T32AV-J1 5   LPDDR4 - list of incompatible devices Given the limitations mentioned in this document, the following memory devices were identified as incompatible with the particular SoCs as detailed in the following table:   Memory Vendor Memory Part# Density Incompatible SoCs Incompatibility reason Samsung K4FHE3S4HA-KU(H/F)CL 24Gb/3Gb i.MX 8M Quad  The memory device requires 17th row address bit to function. Samsung K4UHE3S4AA-KU(H/F)CL K4UJE3D4AA-KU(H/F)CL 24Gb/3Gb 48Gb/6GB i.MX 8M Quad i.MX 8M Mini i.MX 8M Nano i.MX 8M Plus The memory device only supports the LPDDR4X mode. Samsung K4FCE3Q4HB-KU(H/F)CL K4UCE3Q4AB-KU(H/F)CL 64Gb/8GB i.MX 8M Quad i.MX 8M Mini i.MX 8M Nano i.MX 8M Plus A byte mode memory device. The memory device only supports the LPDDR4X mode.    DDR4 - maximum supported densities SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad  32-bit 32Gb/4GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 6 i.MX 8M Mini  32-bit 64Gb/8GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 7 i.MX 8M Nano  16-bit 64Gb/8GB x8, 16Gb device with 2 bank group addresses, 17-row addresses and 10 column addresses 1, 8 i.MX 8M Plus  32-bit 64Gb/8GB x16, 16Gb device with 1 bank group address, 17-row addresses and 10 column addresses 1, 7   DDR4 - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required.   SoC Density Memory Vendor Validated Memory Part#  Notes i.MX 8M Quad 32Gb/4GB Micron 4x MT40A512M16JY-083EAAT  15 i.MX 8M Mini  16Gb/2GB Micron 2x MT40A512M16LY-075:E  15 i.MX 8M Nano 16Gb/2GB Micron 1x MT40A1G16RC-062E:B  15 8Gb/1GB Rayson 1x RS512M16Z2DD-62DT 14 8Gb/1GB UniIC SCB12Q8G160BF-06SI 14 i.MX 8M Plus 64Gb/8GB Micron 4x MT40A1G16RC-062E:B  15 16Gb/2GB Nanya NT5AD512M16C4-JRI  14   DDR3L - maximum supported densities SoC Max data bus width Maximum density Assumed memory organization Notes i.MX 8M Quad  32-bit 32Gb/4GB x16, 8Gb device with 16-row addresses and 10 column addresses 1, 9 i.MX 8M Mini  32-bit 64Gb/8GB x8, 8Gb device with 16-row addresses and 11 column addresses 1, 10 i.MX 8M Nano  16-bit 32Gb/4GB x8, 8Gb device with 16-row addresses and 11 column addresses 1, 11 i.MX 8M Plus  i.MX 8M Plus does not support DDR3L   DDR3L - list of validated memories Please note that the validation process is an ongoing effort - regular updates of the table are expected. Please contact NXP if a specific vendor or configuration is required. SoC Density Vendor Validated Memory Part#  Notes i.MX 8M Quad  16Gb/2GB Micron 4x MT41K256M16TW-107 AAT  14 i.MX 8M Mini  16Gb/2GB Micron 4x MT41K256M16TW-107 AAT  14              i.MX 8M Nano 8Gb/1GB Micron MT41K512M16VRN-107  15   Note 1: The numbers are based purely on the IP vendor documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, and on the JEDEC standards JESD209-4/JESD209-4A (LPDDR4), JESD279-4/JESD279-4A (DDR4), and JESD79-3E/JESD79-3F/JESD79-3-1A (DDR3/DDR3L). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk. Note 2: Byte-mode LPDDR4 devices (x16 channel internally split between two dies, x8 each) of any density are not supported therefore, the numbers are applicable only to devices with x16 internal organization (referred to as "standard" in the JEDEC specification). Note 3: The memory vendors often do not offer so many variants of single-channel memory devices. As an alternative, a dual-channel device with only one channel connected may be used. For example: A dual-rank, single-channel device with 16-row address bits has a density of 16Gb. If such a device is not available at the chosen supplier, a dual-rank, dual-channel device with 16-row address bits can be used instead. This device has a density of 32 Gb however since only one channel can be connected to the SoC, only half of the density is available (16 Gb). Usage of more than one discrete memory chips to overcome market constraints is not supported since only point-to-point connections are assumed for LPDDR4. Note 4: Devices with 17-row addresses (R0-R16) are not supported by the DDR Controller Note 5: The memory part number did not undergo full JEDEC verification however, it passed all functional testing items. Note 6: The density can be achieved by connecting 2 single-rank discrete devices with one 16Gb die each. Since the SoC supports x8 devices and also has connectivity for a second rank, usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 32Gb/4GB of address space dedicated for the DDR. Two x16 16Gb devices giving 32Gb/4GB in total is, therefore, the optimal choice that balances the maximum density aspects, the signal integrity aspects (only two discrete devices used), and bandwidth aspects (full data bus width used). Note 7: The density can be achieved by connecting 4 single rank discrete devices with one 16Gb die each, 2 devices connected to each chip select. Since the SoC supports x8 devices, the usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 64Gb/8GB of address space dedicated for the DDR. Four x16 16Gb devices giving 64Gb/8GB in total is the optimal choice that balances the maximum density aspects, the signal integrity aspects (only four discrete devices used), and the bandwidth aspects (full data bus width used). Note 8: The density can be achieved by connecting 4 single rank discrete devices with one 16Gb die each, 2 devices connected to each chip select.  Note 9: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select, or by connecting 2 dual rank discrete devices with two 8Gb dies each. Since the SoC supports x8 devices, the usage of more discrete devices is possible. However, this advantage cannot be used to get higher density since this SoC has only 32Gb/4GB of address space dedicated for the DDR. Four x16 8Gb devices giving 32Gb/4GB in total is, therefore, the optimal choice that balances the maximum density aspects, the signal integrity aspects (four discrete devices used), and bandwidth aspects (full data bus width used). Note 10: The density can be achieved by connecting 8 single rank discrete devices with one 8Gb die each, 4 devices connected to each chip select or by connecting 4 dual rank discrete devices with two 8Gb dies each. Note that the first option significantly exceeds the number of devices used on the validation board (4 discrete devices) therefore, it is not guaranteed that the i.MX would be able to drive the signals with margin to the required voltage levels due to increased loading on the traces. A significant effort would be required in terms of PCB layout and signal integrity analysis. Practically, it is not recommended to use more than 4 discrete DDR3L devices. This corresponds to the maximum density of 32Gb/4GB in the case of the single rank devices containing one 8Gb die or 64Gb/8GB in case of the dual-rank devices, each containing two 8Gb dies. Note 11: The density can be achieved by connecting 4 single rank discrete devices with one 8Gb die each, 2 devices connected to each chip select or by connecting 2 dual rank discrete devices with two 8Gb dies each. Note 12: For single-channel (x16) memory devices, the current maximum available density in the market is 16Gb/2GB (Q1 2022). Note 13: Only one channel of the device (and hence, half of its density) was utilized due to the reduced data bus width (x16) of the SoC. Note 14: Part is active. Reviewed Jan 2026 Note 15: Part will either EoL or is not recommended for new designs by the respective vendor.   Additional Links https://community.nxp.com/t5/iMX-and-Vybrid-Support/i-MX-8-8X-8XL-maximum-supported-LPDDR4-and-DDR3L-densities/ta-p/1152715           
View full article
Background: The i.MX95 introduces a system manager firmware, which is responsible for power, clock, resource isolation, security management, and system-level control between kernels, essentially acting as the "backend manager" for the entire SoC. Switching between different driver modes is necessary to change the VDD_SOC voltage of the i.MX 95. But, Unlike the i.MX 93, the i.MX 95 does not support DVFS and the i.MX 95 has only one fixed DDR frequency point., it is not possible to switch between OD, ND, and LD modes under userspace. This article will explain how to switch from OD to ND mode.   1. Test environment HW: i.MX95 EVK board SW: imx-oei, imx-sm 2. Voltage and frequency of i.MX 95 series processors in different modes The voltage VDD_SOC varies in different modes. Maximum frequency of i.MX 95 series processor modules in different modes. 3. Code change(Switching to ND mode as an example) 3.1. imx-sm https://github.com/nxp-imx/imx-sm/blob/master/boards/mcimx95evk/sm/brd_sm.c#L107 index 077fa06..023a580 100755 --- a/boards/mcimx95evk/sm/brd_sm.c +++ b/boards/mcimx95evk/sm/brd_sm.c @@ -104,7 +104,7 @@      BRD_SM_REC_VLD_MASK)  /* Performance parameters */ -#define BOARD_PERF_LEVEL  DEV_SM_PERF_LVL_ODV  /* Target perf level */ +#define BOARD_PERF_LEVEL  DEV_SM_PERF_LVL_NOM  /* Target perf level */  #if BOARD_VOLT_SOC >= ES_ODV_UV_VDD_SOC  #define BOARD_BOOT_LEVEL  DEV_SM_PERF_LVL_ODV  /* Boot perf overdrive */  #elif BOARD_VOLT_SOC >= ES_NOM_UV_VDD_SOC diff --git a/configs/mx95evk.cfg b/configs/mx95evk.cfg index 8ac5392..5f19d42 100755 --- a/configs/mx95evk.cfg +++ b/configs/mx95evk.cfg @@ -459,7 +459,7 @@ PD_A55C2            stop=5  PD_A55C3            stop=4  PD_A55C4            stop=3  PD_A55C5            stop=2 -PERF_A55            start=3|3 +PERF_A55            start=3|2  CPU_A55C0           start=4  CPU_A55P            stop=1 @@ -473,7 +473,7 @@ PD_A55C2            msel=1, stop=5  PD_A55C3            msel=1, stop=4  PD_A55C4            msel=1, stop=3  PD_A55C5            msel=1, stop=2 -PERF_A55            msel=1, start=3|3 +PERF_A55            msel=1, start=3|2  CPU_A55C0           msel=1, start=4  CPU_A55P            msel=1, stop=1 @@ -487,7 +487,7 @@ PD_A55C2            msel=2, stop=5  PD_A55C3            msel=2, stop=4  PD_A55C4            msel=2, stop=3  PD_A55C5            msel=2, stop=2 -PERF_A55            msel=2, start=3|3 +PERF_A55            msel=2, start=3|2  CPU_A55C0           msel=2, start=4  CPU_A55P            msel=2, stop=1 diff --git a/configs/mx95evk/config_lmm.h b/configs/mx95evk/config_lmm.h index 3e3f508..999a4a1 100755 --- a/configs/mx95evk/config_lmm.h +++ b/configs/mx95evk/config_lmm.h @@ -152,11 +152,11 @@      {.lmId = 2U, .mSel = 1U, .ss = LMM_SS_PD, .rsrc=DEV_SM_PD_A55P}, \      {.lmId = 2U, .mSel = 2U, .ss = LMM_SS_PD, .rsrc=DEV_SM_PD_A55P}, \      {.lmId = 2U, .mSel = 0U, .ss = LMM_SS_PERF, .rsrc=DEV_SM_PERF_A55, \ -     .numArg = 1, .arg[0] = 3U, }, \ +     .numArg = 1, .arg[0] = 2U, }, \      {.lmId = 2U, .mSel = 1U, .ss = LMM_SS_PERF, .rsrc=DEV_SM_PERF_A55, \ -     .numArg = 1, .arg[0] = 3U, }, \ +     .numArg = 1, .arg[0] = 2U, }, \      {.lmId = 2U, .mSel = 2U, .ss = LMM_SS_PERF, .rsrc=DEV_SM_PERF_A55, \ -     .numArg = 1, .arg[0] = 3U, }, \ +     .numArg = 1, .arg[0] = 2U, }, \      {.lmId = 2U, .mSel = 0U, .ss = LMM_SS_CPU, .rsrc=DEV_SM_CPU_A55C0}, \      {.lmId = 2U, .mSel = 1U, .ss = LMM_SS_CPU, .rsrc=DEV_SM_CPU_A55C0}, \      {.lmId = 2U, .mSel = 2U, .ss = LMM_SS_CPU, .rsrc=DEV_SM_CPU_A55C0}, 3.2. imx-oei Add the timing.c file for different DRAM frequencies under different modes to the following file, and then recompile imx-oei: https://github.com/nxp-imx/imx-oei/tree/master/boards/mx952lp5-19/ddr 4. Boot log: The boot log shows that the CPU frequency had dropped to 1404MHz at this point. Note: Ensure that you are using the DRAM timing.c file corresponding to the specified mode and that the compilation is error-free. To guarantee a complete error-free compilation, it is recommended to create a new timing.c file in the directory corresponding to imx-oei, complete the configuration in the Makefile, and then compile. Do not completely overwrite the contents of the current timing.c file. For instructions on how to use Config Tool and how to update the timing.c file, please refer to the Config Tool User Guide.  
View full article
In this post, we will review the YOLO model export process for three popular NXP families: i.MX8MP, i.MX93, and i.MX95. These processors are increasingly used in edge AI applications such as smart vision, industrial automation, robotics, and intelligent HMI systems. Although they all support machine learning deployment, the export path, supported runtimes, and hardware acceleration options may differ depending on the device. The purpose of this guide is to provide a clearer starting point for developers who want to take a trained YOLO model and prepare it for execution on these i.MX platforms. Whether your workflow targets CPU, NPU. YOLO Model Export Workflow for i.MX Processors 1) Install Ultralytics Install or upgrade the Ultralytics package from PyPI: pip install -U ultralytics   2) Export the YOLO Model (TFLite INT8) Export your trained YOLO model to TensorFlow Lite (TFLite) format with INT8 quantization: yolo export model=<your_model>.pt format=saved_model quantize=8 Example: yolo export model=yolov8n.pt format=saved_model quantize=8   Notes: The model must be exported in TFLite format and fully INT8 quantized. After the export process, a directory named "<your_model>_saved_model" Inside this directory, you should use the following file as the input for the converter called "<your_model>_full_integer_quant.tflite"  This is the fully quantized INT8 model required for NPU deployment. Using any other file from the export directory may result in compatibility issues or prevent proper NPU acceleration. After obtaining the *_full_integer_quant.tflite file, you can proceed with the needed conversion workflow to generate the final model optimized for execution on the NPU. For additional valid export options, please refer to the official Ultralytics documentation: https://docs.ultralytics.com/modes/export/ At this stage: The model can run on CPU for: i.MX8MP i.MX93 i.MX95 On i.MX8MP, this TFLite model can also be deployed to the NPU using the appropriate delegate. 3) i.MX93  Compile for Ethos-U NPU (Vela) For i.MX93, an additional compilation step is required to use the Ethos-U NPU. Run the Vela compiler to convert the TFLite model into an optimized format: vela <model>.tflite --output-dir <output_folder> Notes: This step generates a model optimized for the Ethos-U NPU. The resulting output files are required for deployment using the NPU delegate on the i.MX93 platform. Please ensure that the model complies with the Ethos-U operator constraints, as only supported operations can be accelerated by the NPU. This command can be executed directly on the i.MX93 target, or alternatively by using the eIQ Toolkit (please refer to the eIQ Converter documentation for more details). 4)  i.MX95 Convert Model Using Neutron SDK For i.MX95, the model must be converted using the Neutron Converter, depending on the BSP version installed on your board. .\neutron-converter.exe ` --input "<model>.tflite" ` --target imx95 ` --output "<model_neutron>.tflite" ` --optimization-level OOpt Notes: The Neutron toolchain prepares the model for i.MX95 NPU acceleration. Supported formats and flags may vary depending on the Neutron SDK version. Always verify compatibility with your BSP release. You can check the compatibility details of the Neutron SDK in the "docs" folder of your downloaded Neutron SDK package.   5) Benchmark the Model After exporting and converting the model, you can validate performance using benchmarking tools. Typical options include: TFLite benchmark tool (CPU / delegate): benchmark_model --graph=<model>.tflite --num_threads=X 6) Results iMX8MP CPU root@imx8mpevk:~# /usr/bin/tensorflow-lite-2.19.0/examples/benchmark_model --graph=yolov8n_full_integer_quant.tflite --mum_threads=4 INFO: STARTING! WARN: Unconsumed cmdline flags: --mum_threads=4 INFO: Log parameter values verbosely: [0] INFO: Graph: [yolov8n_full_integer_quant.tflite] INFO: Signature to run: [] INFO: Loaded model yolov8n_full_integer_quant.tflite INFO: Created TensorFlow Lite XNNPACK delegate for CPU. INFO: The input model file size (MB): 3.42652 INFO: Initialized session in 86.368ms. INFO: Running benchmark for at least 1 iterations and at least 0.5 seconds but terminate if exceeding 150 seconds. INFO: count=1 curr=1029584 p5=1029584 median=1029584 p95=1029584 INFO: Running benchmark for at least 50 iterations and at least 1 seconds but terminate if exceeding 150 seconds. INFO: count=50 first=986237 curr=985536 min=983921 max=993982 avg=985863 std=1497 p5=984152 median=985947 p95=986715 INFO: Inference timings in us: Init: 86368, First inference: 1029584, Warmup (avg): 1.02958e+06, Inference (avg): 985863 INFO: Note: as the benchmark tool itself affects memory footprint, the following is only APPROXIMATE to the actual memory footprint of the model at runtime. Take the information at your discretion. INFO: Memory footprint delta from the start of the tool (MB): init=11.207 overall=40.918 root@imx8mpevk:~#   NPU root@imx8mpevk:~# /usr/bin/tensorflow-lite-2.19.0/examples/benchmark_model --graph=yolov8n_full_integer_quant.tflite --num_threads=4 --external_delegate_path=/usr/lib/libvx_delegate.so INFO: STARTING! INFO: Log parameter values verbosely: [0] INFO: Num threads: [4] INFO: Graph: [yolov8n_full_integer_quant.tflite] INFO: Signature to run: [] INFO: #threads used for CPU inference: [4] INFO: #threads used for CPU inference: [4] INFO: External delegate path: [/usr/lib/libvx_delegate.so] INFO: Loaded model yolov8n_full_integer_quant.tflite INFO: Vx delegate: allowed_cache_mode set to 0. INFO: Vx delegate: device num set to 0. INFO: Vx delegate: allowed_builtin_code set to 0. INFO: Vx delegate: error_during_init set to 0. INFO: Vx delegate: error_during_prepare set to 0. INFO: Vx delegate: error_during_invoke set to 0. INFO: EXTERNAL delegate created. INFO: Explicitly applied EXTERNAL delegate, and the model graph will be completely executed by the delegate. INFO: The input model file size (MB): 3.42652 INFO: Initialized session in 39.515ms. INFO: Running benchmark for at least 1 iterations and at least 0.5 seconds but terminate if exceeding 150 seconds. INFO: count=1 curr=16831746 p5=16831746 median=16831746 p95=16831746 INFO: Running benchmark for at least 50 iterations and at least 1 seconds but terminate if exceeding 150 seconds. INFO: count=50 first=67167 curr=67190 min=67048 max=67366 avg=67187 std=64 p5=67094 median=67184 p95=67295 INFO: Inference timings in us: Init: 39515, First inference: 16831746, Warmup (avg): 1.68317e+07, Inference (avg): 67187 INFO: Note: as the benchmark tool itself affects memory footprint, the following is only APPROXIMATE to the actual memory footprint of the model at runtime. Take the information at your discretion. INFO: Memory footprint delta from the start of the tool (MB): init=9.47266 overall=224.398 root@imx8mpevk:~# iMX93 CPU root@imx93evk:~# /usr/bin/tensorflow-lite-2.19.0/examples/benchmark_model --graph=yolov8n_full_integer_quant.tflite --num_threads=2 INFO: STARTING! INFO: Log parameter values verbosely: [0] INFO: Num threads: [2] INFO: Graph: [yolov8n_full_integer_quant.tflite] INFO: Signature to run: [] INFO: #threads used for CPU inference: [2] INFO: #threads used for CPU inference: [2] INFO: Loaded model yolov8n_full_integer_quant.tflite INFO: Created TensorFlow Lite XNNPACK delegate for CPU. INFO: The input model file size (MB): 3.42652 INFO: Initialized session in 57.963ms. INFO: Running benchmark for at least 1 iterations and at least 0.5 seconds but terminate if exceeding 150 seconds. INFO: count=3 first=247896 curr=198973 min=198973 max=247896 avg=215381 std=22991 p5=198973 median=199275 p95=247896 INFO: Running benchmark for at least 50 iterations and at least 1 seconds but terminate if exceeding 150 seconds. INFO: count=50 first=199533 curr=198880 min=197719 max=205262 avg=199032 std=1005 p5=198344 median=198886 p95=199961 INFO: Inference timings in us: Init: 57963, First inference: 247896, Warmup (avg): 215381, Inference (avg): 199032 INFO: Note: as the benchmark tool itself affects memory footprint, the following is only APPROXIMATE to the actual memory footprint of the model at runtime. Take the information at your discretion. INFO: Memory footprint delta from the start of the tool (MB): init=11.2539 overall=40.9961 root@imx93evk:~#   NPU root@imx93evk:~# /usr/bin/tensorflow-lite-2.19.0/examples/benchmark_model --graph=yolov8n_full_integer_quant_vela.tflite --num_threads=2 --external_delegate_path=/usr/lib/libethosu_delegate.so INFO: STARTING! INFO: Log parameter values verbosely: [0] INFO: Num threads: [2] INFO: Graph: [yolov8n_full_integer_quant_vela.tflite] INFO: Signature to run: [] INFO: #threads used for CPU inference: [2] INFO: #threads used for CPU inference: [2] INFO: External delegate path: [/usr/lib/libethosu_delegate.so] INFO: Loaded model yolov8n_full_integer_quant_vela.tflite INFO: Ethosu delegate: device_name set to /dev/ethosu0. INFO: Ethosu delegate: cache_file_path set to . INFO: Ethosu delegate: timeout set to 60000000000. INFO: Ethosu delegate: enable_cycle_counter set to 0. INFO: Ethosu delegate: enable_profiling set to 0. INFO: Ethosu delegate: profiling_buffer_size set to 2048. INFO: Ethosu delegate: pmu_event0 set to 0. INFO: Ethosu delegate: pmu_event1 set to 0. INFO: Ethosu delegate: pmu_event2 set to 0. INFO: Ethosu delegate: pmu_event3 set to 0. INFO: EXTERNAL delegate created. INFO: EthosuDelegate: 8 nodes delegated out of 15 nodes with 8 partitions. INFO: Explicitly applied EXTERNAL delegate, and the model graph will be partially executed by the delegate w/ 8 delegate kernels. INFO: Created TensorFlow Lite XNNPACK delegate for CPU. INFO: The input model file size (MB): 2.9511 INFO: Initialized session in 638.148ms. INFO: Running benchmark for at least 1 iterations and at least 0.5 seconds but terminate if exceeding 150 seconds. INFO: count=7 first=87215 curr=81264 min=81079 max=87215 avg=82056.4 std=2107 p5=81079 median=81187 p95=87215 INFO: Running benchmark for at least 50 iterations and at least 1 seconds but terminate if exceeding 150 seconds. INFO: count=50 first=81497 curr=81232 min=80887 max=81783 avg=81153.1 std=178 p5=80921 median=81148 p95=81497 INFO: Inference timings in us: Init: 638148, First inference: 87215, Warmup (avg): 82056.4, Inference (avg): 81153.1 INFO: Note: as the benchmark tool itself affects memory footprint, the following is only APPROXIMATE to the actual memory footprint of the model at runtime. Take the information at your discretion. INFO: Memory footprint delta from the start of the tool (MB): init=7.36328 overall=8.73828 root@imx93evk:~# iMX95 CPU root@imx95evk:~# /usr/bin/tensorflow-lite-2.19.0/examples/benchmark_model --graph=yolov8n_full_integer_quant.tflite --num_threads=6 INFO: STARTING! INFO: Log parameter values verbosely: [0] INFO: Num threads: [6] INFO: Graph: [yolov8n_full_integer_quant.tflite] INFO: Signature to run: [] INFO: #threads used for CPU inference: [6] INFO: #threads used for CPU inference: [6] INFO: Loaded model yolov8n_full_integer_quant.tflite INFO: Created TensorFlow Lite XNNPACK delegate for CPU. INFO: The input model file size (MB): 3.42652 INFO: Initialized session in 35.268ms. INFO: Running benchmark for at least 1 iterations and at least 0.5 seconds but terminate if exceeding 150 seconds. INFO: count=7 first=115073 curr=74468 min=74170 max=115073 avg=80310.4 std=14192 p5=74170 median=74581 p95=115073 INFO: Running benchmark for at least 50 iterations and at least 1 seconds but terminate if exceeding 150 seconds. INFO: count=50 first=74143 curr=74135 min=73657 max=76392 avg=74346.9 std=447 p5=73829 median=74307 p95=75020 INFO: Inference timings in us: Init: 35268, First inference: 115073, Warmup (avg): 80310.4, Inference (avg): 74346.9 INFO: Note: as the benchmark tool itself affects memory footprint, the following is only APPROXIMATE to the actual memory footprint of the model at runtime. Take the information at your discretion. INFO: Memory footprint delta from the start of the tool (MB): init=11.5195 overall=40.8867 root@imx95evk:~# NPU: root@imx95evk:~# /usr/bin/tensorflow-lite-2.19.0/examples/benchmark_model --graph=yolov8n_full_integer_quant_neutron.tflite --num_threads=6 --external_delegate_path=/usr/lib/libneutron_delegate.so INFO: STARTING! INFO: Log parameter values verbosely: [0] INFO: Num threads: [6] INFO: Graph: [yolov8n_full_integer_quant_neutron.tflite] INFO: Signature to run: [] INFO: #threads used for CPU inference: [6] INFO: #threads used for CPU inference: [6] INFO: External delegate path: [/usr/lib/libneutron_delegate.so] INFO: Loaded model yolov8n_full_integer_quant_neutron.tflite INFO: EXTERNAL delegate created. INFO: NeutronDelegate delegate: 1 nodes delegated out of 33 nodes with 1 partitions. INFO: Neutron delegate version: v1.0.0-7399a58e, zerocp enabled. INFO: Explicitly applied EXTERNAL delegate, and the model graph will be partially executed by the delegate w/ 1 delegate kernels. INFO: Created TensorFlow Lite XNNPACK delegate for CPU. INFO: The input model file size (MB): 3.20989 INFO: Initialized session in 12.756ms. INFO: Running benchmark for at least 1 iterations and at least 0.5 seconds but terminate if exceeding 150 seconds. INFO: count=17 first=31509 curr=27588 min=27555 max=31509 avg=29101.2 std=1166 p5=27555 median=29071 p95=31509 INFO: Running benchmark for at least 50 iterations and at least 1 seconds but terminate if exceeding 150 seconds. INFO: count=50 first=28068 curr=29081 min=26573 max=31340 avg=29104.1 std=1204 p5=27306 median=29141 p95=31171 INFO: Inference timings in us: Init: 12756, First inference: 31509, Warmup (avg): 29101.2, Inference (avg): 29104.1 INFO: Note: as the benchmark tool itself affects memory footprint, the following is only APPROXIMATE to the actual memory footprint of the model at runtime. Take the information at your discretion. INFO: Memory footprint delta from the start of the tool (MB): init=6.98438 overall=12.2344 root@imx95evk:~ Disclaimer: Ultralytics YOLO models have not been officially validated/supported by NXP. Therefore, compatibility with i.MX processors and their corresponding NPUs cannot be guaranteed. Some models or configurations may not work as expected depending on operator support and hardware limitations.
View full article