Connects - Training Material

Discussions

As LEDs continue to penetrate exterior automotive lighting applications by replacing traditional lighting solutions, there is an increasing demand for more safe, efficient, flexible and scalable electronics & driver ICs that can enable the full benefits of LEDs in these safety critical applications. This session will provide an overview of the requirements of Advanced Automotive Lighting Systems to provide safety in ADAS systems. Also the impact these system requirements have on the IC specifications, ranging from full system diagnostics, limp home modes, thermal and EMC considerations.

The self driving car has a major impact on ECUs power and complexity and the network architecture connecting them together. The sheer fact that the driver is now a mere passenger with potentially limited options of taking back control raises significant functional safety questions that cannot be addressed with conventional approaches. In this presentation, we discuss how autonomous driving is impacting the functional safety requirements for automotive Ethernet switches and PHYs. We will review what functional safety for a component really means, going beyond marketing figures and ticking off feature lists. Finally, we will discuss how NXP is attacking this challenge in our current portfolio with a hint to the products to come.

The GD3100 is a programmable high-voltage gate driver with advanced functional safety (FuSa), control, and protection features, developed for automotive and eMobility applications. This presentation will give a brief review of HV power devices such as Si IGBTs and WBG MOSFETs. Then the talk will focus on key features of the GD3100 that are important for implementation of high traction inverters, DC/DC converters, or on-board chargers (OBCs) using Si IGBTs or SiC MOSFETs.

In electronic systems, it is typical to have a central processing unit that interfaces with other peripheral devices, other sub-systems or the user. Often, the signals from these interconnects may be incompatible on both ends. Therefore, various semiconductor devices such as analog switches, voltage level translators and GPIO expanders are often used to bridge between the interconnects on the board. In this session, we will explore the application of these interface devices from NXP and discuss their applications in various customer systems.

NXP’s latest i.MX 8M processors require the latest memories to keep them running efficiently. As a system designer, your memory choices can impact the performance, size, cost, power reliability and longevity of your end product. We will discuss the latest memories supported on the new i.MX 8M processor family. This includes DDR3, DDR4 and LPDDR4. We will show designers how they can prioritize performance, power or price to develop the most optimum system. We will also provide details on eMMC 5.1 storage products. This includes high performance features including command queueing, and several new Cache operations. We will also highlight a new MCP that includes LPDDR4 and eMMC in a single space saving package. This session will provide designers with the tools necessary to create state-of-the-art i.MX 8M systems.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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