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Connects - Training Material

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Introduction and review of the latest family of Functional Safety System Basis Chips with integrated CAN FD PHY. Power Management and flexible safety features will be discussed as well as the operation and interconnection with MCUs. Also in this presentation, you’ll identify how the robustness of our design are verified in a real application environment to achieve a common goal of an excellent system reliability performance. From the ADAS to the drive train market that requires reliability, power scalability and safety, learn how our system Basis Chip solution can enable and simplify your design.
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This session will present the advantages of H-bridge based window lifters against relay based ones, new functionalities that can be implemented and how NXP MagniV S12ZVMB64 microcontroller provides a well-integrated solution for a window lifter end node. With integrated functionalities like: internal regulator, GDU, PMF, ADC, current sensing, input capture and LIN physical layer.
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Complexity is increasing abruptly in the IVI market, while TTM has decreased from 5 to 2-3 years over a few product generations. The entire ecosystem is moving from a close to an open system model, and from proprietary/close source to standard interfaces/open source components. NXP is committed to support you in this new reality, as well as providing help in leveraging the extensive BOM NXP typically has in IVI solutions. Through the IVI Platform, NXP offers a solid and complete base for fast product development, integrating productized and optimized BSP and middleware components, with out of the box security. Find out more during a one hour presentation, covering platform features, delivery mechanisms, roadmap and availability.
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Automotive An NXP DroneCode Platform for Developing Low-Cost Small Autonomous Vehicles and Leveraging High-Reliability Automotive Components  Body & Comfort: Exploring the Automotive General-Purpose MCU Portfolio  Component Selection—The Make-or-Break Milestone Towards Autonomous Vehicles 2018  Connectivity: Building Your Automotive Network with Time-Sensitive Networking (TSN) and Ethernet  Connectivity: CAN in Future Car Networks—Understanding the Different Trends and Solutions  Connectivity: NXP Car Access—Roadmap Towards Smart Access (NFC, BLE, UWB, SE)  Driver Replacement: AD/ADAS Overview  Driver Experience: i.MX 8/8X Multimedia—Graphics, Display Controller, Vision, Machine Learning  Driver Replacement: Introduction to NXP Automated Drive Kit  Driver Experience: IVI/eCockpit Platform on i.MX 8  Functional Safety & Security: Functional Safety Introduction  Functional Safety & Security: Next-Generation Functional Safety Architecture  Functional Safety & Security: NXP® Automotive Cybersecurity Program  i.MX 8/8X Overview  Micron® Technology: Micron’s Memory Solutions for the New i.MX 8 Microprocessor Family  Power Management Solutions for Automotive  Powertrain & Vehicle Dynamics: Electrification—HV EV Power Inverter System and GD3100 Review  Powertrain & Vehicle Dynamics: Electrification—MC3377x Battery Cell Controllers for High-Voltage Battery Management System  Powertrain & Vehicle Dynamics: NXP’s xEV Energy Management Solutions  Secure Networks & Gateways: OTA Updates—Requirements for a Full System Solution  Secure Networks & Gateways: The Rise and Evolution of Automotive Gateways  Secure Networks & Gateways: Vehicle Network Processing with the MPC5748G MCU + LS1043A Processor  Tools & Enablement: The Software Enablement of BlueBox v2.0: ADAS Enablement  Artificial Intelligence, Enabling Technologies, Security & Solutions A Vision for Machine Learning (ML) and Artificial Intelligence (AI) in Low-cost Edge-computing Nodes  Boot in Less Than One Second? Learn How  Computing at the Edge - When, Why and How  EdgeScale: A Solution for Secure Edge Device and Application Management from the Cloud  Hands-On Workshop: Achieving End-to-End Security Starting with Secure Boot  i.MX RT Secure Boot Lab Guide.pdf Hands-On Workshop: Advanced Debugging with MCUXpresso IDE  Hands-On Workshop: Crossover MCU Memory Expansion Advantage: Designing with Execute in Place Serial Flash   i.MX RT Execute in Place Serial Flash Lab Guide.pdf  Hands-On Workshop: Learn to Get Up and Running Fast with MCUXpresso Software and Tools  AMF-ENT-T3024 - Lab 2 - Getting Started with MCUXpresso.pdf NFC Integration in Real-time and Non-Real-time Operating Systems–How to Choose the Right NFC Product  Sensor Toolbox: Complete Ecosystem for Product Development with Sensors  Toradex®: Asymmetric Heterogeneous Architecture for Real-Time and Low-Power Performance  Using OpenWRT, Yocto, Ubuntu or Your Own Custom Linux® Distribution? Learn How NXP is Making it Easy to Leverage a Multi-Distribution Approach to Software Development  Zephyr™ OS Overview  Smart Machinery & Industrial Automation A71CH Plug and Trust Solution for IoT Security  NFC in Industrial and Healthcare - More Use Cases Than You Imagine  Open Industrial Linux® (OpenIL)—Secure, Robust, Real-Time for Industrial and Automation Applications  Time Sensitive Networking (TSN) and Precision Time Protocol (PTP): Challenges, Opportunities and Solutions  Smart Networks & Computing Last Mile Connectivity Using 5G Fixed Wireless—Learn About the Market and Solutions  Understanding the Alphabet Soup of Networking Virtualization from DPDK to SD-WAN to VIRTIO  Smarter World Solutions & Multimode Connectivity Amazon Alexa Voice Service based on i.MX Applications Processors   Hands-On Workshop: Get Started with LPC54018 Based IoT Module to Develop a Cloud-Connected End Node  AMF-SMC-T3148 - AWS Shadow - Labs 1-2  Hands-On Workshop: i.MX 8M Experience—Next Generation of Applications Processors for High Performance, Smart Design and Advanced Multimedia  Hands-On Workshop: i.MX RT Overview and Training  How to Use Android® Things to Build Successful IoT Devices  Identification and Authentication of Consumables and Accessories  i.MX 8M - Next-Generation of Applications Processors for High Performance, Smart Design and Advanced Multimedia  Introduction of NXP Wireless Charging  MiGLO®  NFC in Consumer Electronics and Home Appliances - 2018  NTAG® SmartSensor  NXP BLE Low-Power Solutions for Consumer, Medical, Industrial IoT and Automotive Markets  NXP Connectivity Solutions for Smart Home, Building and Lighting  NXP Wireless Charging Solution Design—Deep Dive  Rapid IoT Prototyping Kit Smart Amp Software  Type-C End-to-End Solution  Using Sensors for Low-Power IoT Applications: Tips and Tricks  Emerging Trends & Innovation NXP MCU Portfolio Based on Arm® Cortex®-M Cores  Secure Tamper-Resistant Authentication 
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Secure designs begin with a security model consisting of policies, an understanding of the threat landscape and the methods used to enforce physical and logical security. To protect firmware execution given today’s threat landscape, there must be a policy to only allow execution of authenticated firmware. The methods used to enforce this policy rely on MCU security technology to create a protected boot flow. The boot firmware can contain public key cryptography to authenticate application code. In addition to these components integrated in the end device, there are tools and steps that must be taken in the manufacturing environment. Join this session to explore the design and implementation of a secure boot by making use of the Arm® mbed TLS open source software and protect against firmware attacks. This class will use the recently launched K32W (K3S) for the hands-on portion.  
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In this session you will learn how to design and what to expect from our free software tools.
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This session introduces the MCUXpresso suite of tools (IDE, SDK, Config Tools) and shows users how to rapidly start development with thousands of Kinetis and LPC MCUs. Using either Kinetis, LPC or i.MX RT development hardware, attendees will watch how to build a custom SDK, configure pins and clocks settings, generate a project, import and debug an application, as well as the advanced debugging capabilities of the MCUXpresso IDE, including trace, profiling, coverage, watch points and more.
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In this class, participants will learn how to leverage model-based design technology (MATLAB/Simulink) to quickly develop motor control algorithms for BLDC, ACIM, and PMSM motors using NXP S32K MCUs on the S32K144 automotive reference platform. Learn the basics of the motor control toolbox to generate C-code from simulation models. The toolbox will be utilized demonstrating peripheral driver blocks, optimized automotive math/motor control blocks, software and processor in the loop techniques for algorithm verification, as well as other utilities for MCU profiling and algorithm development.
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Explain 3-phase motor control fundamentals with an overview of NXP’s hardware and software enablement solutions for motor control applications.
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With the trend of frequent and remote software updates on the vehicle, the need of managing this properly at the microcontroller is critical. This session will present the challenges on reprogramming edge node microcontrollers inside the vehicle and show how our S32K144 microcontroller properly addresses it safe and efficiently.  
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Bluetooth speakers and headsets, printers, cameras, projectors, set-top-boxes, TVs, Wi-Fi routers and a variety of home appliances like fridges, washing machines, air purifiers, coffee machines, blenders all have one thing in common: Near Field Communication (NFC) allows new features and easier handling. Just bringing two NFC-enabled devices close together is all it takes to create a connection. Accessories and consumables can be authenticated and configured without any user interaction, and without power supply. And commissioning an IOT node into a wireless network has never been as easy as it is now with NFC. We will share the latest status of NFC support in iOS and present the brand new NFC Tandem module.
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The NFC market is exploding - ABI Research forecasts more than 2 billion NFC-enabled devices to shipped yearly by 2019. While the first product generations focused on standards and reading distance, the newest products also allow for fast design-in and certification thanks to features such as Dynamic Power Control, microcontroller integration or energy harvesting. Today we see three full NFC product categories to adress the growing number of use cases: (1) Connected NFC tag solutions with field-detection function and an NFC Forum-compliant RF or an I²C interface, (2) standalone NFC frontend solutions for the most flexible way to add NFC to a system and (3) NFC controller solutions to enable higher integration by combining an NFC frontend with an advanced 32-bit microcontroller, available with integrated firmware.
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Course will provide an overview of the “Classical Machine Learning Toolbox” developed by the IoT Solutions team, along with an example integration with Microsoft Azure ML.
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Automotive Ethernet PHYs enable future driving scenarios by providing the necessary physical throughput power. While software brings added value for security, diagnosis, energy efficiency and safety. As the functional requirements for automotive PHY drivers differ from general purpose applications, additional functionality is needed to closely monitor and diagnose the device and to create advanced use cases like Layer-1 wake-up and sleep. In this session, these specific requirements for automotive Ethernet PHY SW are discussed. Existing PHY SW frameworks such as Linux or AUTOSAR are introduced and compared. Finally, the session will touch upon typical application scenarios which require interaction with PHY SW. This includes use cases like gPTP time synchronization and 802.1X Port-based Network Access Control (PNAC).
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This session will examine the semiconductor devices that are needed for creating a cost-competitive, modern, fast-chirp, automotive radar sensor. Each essential IC building block will be reviewed for features and function with key attributes/specifications identified. The typical interconnections between ICs will be examined and explained. Radar operating theory will be briefly reviewed to highlight how each hardware block supports the radar sensor operation.
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This course will provide an in-depth system analysis of high voltage (HV) electric vehicle (EV) and hybrid electric vehicle (HEV) power conversion. We will review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient, and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design and layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring, and advanced features provides monitoring and reporting of key safety functions to achieve system ASIL level D and ISO26262 certification.
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What is new, value proposition against competition, current and future plans for collateral, tools & reference designs; SPIDrive Hbridge, Q100 eSwitch.
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When choosing the NFC device for a new design, the system architect must consider many parameters. To avoid unpleasant surprises during software implementation phase, software has to be taken into account as well from the beginning. Different NFC IC categories (NFC Frontends, NFC Controller, Connected Tag) have different strengths, depending on the software environment. The way how highly integrated operating systems like Linux are structured brings both new challenges and advantages. This session examines the considerations necessary when designing in NFC in different operating systems or "bare metal" systems. It also discusses the advantages and disadvantages of the different device categories in dependence of the designated environment.
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This session is for those of you who have never programmed in the Qt Framework. It will guide you through the basics – from setting up the environment to developing two basic applications, a calculator and a thermometer display. You will also have the opportunity to interact with these demos.
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To use the processor in an integrated design is one way. To use an embedded module is another way and will speed up the design, reduce the design risk and lower the design cost. What limitations and restrictions are there, if any, if you use an embedded module? A market overview and guideline to select your embedded module.
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