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verify serial download port through USB2 on i.MX95-A1 EVK with DDR tool in i.MX config-tools Tested on i.MX95-19x19 EVK wit MX95 A1 version, since MX95 A1 has both USB1 and USB2 enabled as SDP. MX95 B0 will only enable one USB port as SDP, and SDP on USB1 and USB2 will be in different part-number. Need to test with config-tools version 25.03, since 25.06 and above only support MX95-B0.   Requirement: 1. USB2.0 cable with type-A male to type-A male. 2. rework on MX95 EVK: Remove R288 on base board, to disable VBUS output on USB2.(MX95 USB2 act as USB device in SDP mode, PC is USB host)     Connect USB cable from PC to MX95-EVk USB2 and power up MX95-EVK. On PC/laptop, in Window Device Manager, should be able to see new HID device popped up. change the configuration of config-tools, by default MX95 USB1 PID is set(0x015D), modify it to the PID of MX95 USB2(0x015C): =================================== Maybe customer could change the files for their USB2 ID 1. C:\\nxp\\i.MX_CFG_25.03\\bin\\python3\\spsdk\\data\\devices\\mimx9596\\database.yaml vid: 0x1FC9 pid: 0x015D 2. C:\\nxp\\i.MX_CFG_25.03\\bin\\python3\\memtool\\common\\sdp_interface.py "MIMX95": (0x1FC9, 0x015D) =================================== without modifying PID, you will see the following error when running DDR Tools: Untitled1.png the test procedure shall also work on MX95-B0 with USB2 as SDP. On MX95, need to modify the configuration of the Config-Tools to run DDR test if the SDP is through USB2. MX95 A1(engineering version, not for production) has both USB1 and USB2 enabled as SDP. MX95 B0 will only enable one USB port as SDP, and SDP on USB1 and USB2 will be in different part-number. i.MX Processors
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例 MPC5748G レジスタ保護 GHS614 <meta http-equiv="Content-Type" content="text/html; charset=utf-8" /> ******************************************************************************** *詳細な説明: *添付文書「MPC5748G.pdfでのレジスター保護の使用方法」をお読みください ※詳しい説明はこちら * この例では、レジスタMC_MEのロックとロック解除の方法を示しています。RUN_MC[3].R. * 1 つのオプションはポインタを介してメモリに直接書き込むこと、2 番目のオプションは * ヘッダー ファイル reg_prot.h のマクロを使用する場合 * ------------------------------------------------------------------------------ ※テストHW:MPC574XG-324DS Rev.A + MPC574XG-MB Rev.C ※MCU:PPC5748GMMN6A 1N81M * Fsys:160 MHz PLL *デバッガ:Lauterbach Trace32 * 対象:internal_FLASH * ******************************************************************************** 全般
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RT685: SDK 25.12 没有 HASHCRYPT 加速功能 你好 我们最近更新到了 SDK 25.12,发现我们的 TLS 解密率降低了一半。 mbedTLS v3.x 不再使用fsl_hashcrypt硬件加速功能。 下面是使用以前的 SDK 25.09 调用mbedtls_ssl_read 的调用堆栈。可以看到,最终使用了HASHCRYPT_AES_EncryptEcb。 hashcrypt_aes_one_block_aligned() at fsl_hashcrypt.c:437 hashcrypt_aes_one_block() at fsl_hashcrypt.c:581 HASHCRYPT_AES_EncryptEcb() at fsl_hashcrypt.c:1,284 mbedtls_internal_aes_encrypt() at aes_alt.c:1,959 mbedtls_aes_crypt_ecb() at aes_alt.c:1,323 aes_crypt_ecb_wrap() at cipher_wrap.c:114 mbedtls_cipher_update() at cipher.c:521 mbedtls_gcm_update() at gcm.c:358 mbedtls_gcm_crypt_and_tag() at gcm.c:456 mbedtls_gcm_auth_decrypt() at gcm.c:491 mbedtls_cipher_aead_decrypt() at cipher.c:1,407 mbedtls_cipher_auth_decrypt_ext() at cipher.c:1,613 mbedtls_ssl_decrypt_buf() at ssl_msg.c:1,242 ssl_prepare_record_content() at ssl_msg.c:3,667 ssl_get_next_record() at ssl_msg.c:4,551 mbedtls_ssl_read_record() at ssl_msg.c:3,817 mbedtls_ssl_read() at ssl_msg.c:5,237 <...more frames...> 下面是定义了MBEDTLS_USE_PSA_CRYPTO的 SDK 25.12 的调用堆栈。在该版本中,mbedtls_internal_aes_encrypt全部是 C 代码,没有硬件加速。 mbedtls_internal_aes_encrypt() at aes.c:894 mbedtls_aes_crypt_ecb() at aes.c:1,062 aes_crypt_ecb_wrap() at cipher_wrap.c:166 mbedtls_cipher_update() at cipher.c:611 gcm_mask() at gcm.c:546 mbedtls_gcm_update() at gcm.c:641 mbedtls_gcm_crypt_and_tag() at gcm.c:726 mbedtls_gcm_auth_decrypt() at gcm.c:753 mbedtls_psa_aead_decrypt() at psa_crypto_aead.c:270 psa_driver_wrapper_aead_decrypt() at psa_crypto_driver_wrappers.h:4,114 psa_aead_decrypt() at psa_crypto.c:5,023 mbedtls_ssl_decrypt_buf() at ssl_msg.c:1,625 ssl_prepare_record_content() at ssl_msg.c:4,093 ssl_get_next_record() at ssl_msg.c:5,068 mbedtls_ssl_read_record() at ssl_msg.c:4,323 mbedtls_ssl_read() at ssl_msg.c:5,983 <...more frames...> 下面是 SDK 25.12 的调用堆栈,其中没有mbedtls_use_psa_crypto定义的调用堆栈。在这个版本中, mbdtls_internal_aes_encrypt全部是 C 代码,没有硬件加速,也不涉及 PSA。 mbedtls_internal_aes_encrypt() at aes.c:899 mbedtls_aes_crypt_ecb() at aes.c:1,062 aes_crypt_ecb_wrap() at cipher_wrap.c:166 mbedtls_cipher_update() at cipher.c:611 gcm_mask() at gcm.c:546 mbedtls_gcm_update() at gcm.c:628 mbedtls_gcm_crypt_and_tag() at gcm.c:726 mbedtls_gcm_auth_decrypt() at gcm.c:753 mbedtls_cipher_aead_decrypt() at cipher.c:1,528 mbedtls_cipher_auth_decrypt_ext() at cipher.c:1,674 mbedtls_ssl_decrypt_buf() at ssl_msg.c:1,639 ssl_prepare_record_content() at ssl_msg.c:4,093 ssl_get_next_record() at ssl_msg.c:5,068 mbedtls_ssl_read_record() at ssl_msg.c:4,323 mbedtls_ssl_read() at ssl_msg.c:5,983 <...more frames...> 是否有计划在 mbedTLS 中恢复 RT685 HASHCRYPT 硬件加速?某些 PSA Crypto 驱动程序似乎未被执行。 谢谢! Re: RT685: SDK 25.12 no HASHCRYPT acceleration 嗨,埃德温、 我在 EVK 上重现了这个问题。我修改了两个样本,在其中添加了一个迭代 200 次的循环 mbedtls_gcm_self_test 并使用 RTC 时钟为整个执行过程计时。 evkmimxrt685_mbedtls_selftest_cm33 执行测试的时间为 1087ms 使用此调用栈: HASHCRYPT_AES_EncryptEcb() at fsl_hashcrypt.c:1,260 mbedtls_internal_aes_encrypt() at aes_alt.c:1,959 mbedtls_aes_crypt_ecb() at aes_alt.c:1,323 aes_crypt_ecb_wrap() at cipher_wrap.c:114 mbedtls_cipher_update() at cipher.c:521 mbedtls_gcm_starts() at gcm.c:294 mbedtls_gcm_crypt_and_tag() at gcm.c:452 mbedtls_gcm_self_test() at gcm.c:826 evkmimxrt685_mbedtls3x_psatest_cm33 执行测试的时间为 8990ms 使用此调用栈: mbedtls_internal_aes_encrypt() at aes.c:896 mbedtls_aes_crypt_ecb() at aes.c:1,062 aes_crypt_ecb_wrap() at cipher_wrap.c:166 mbedtls_cipher_update() at cipher.c:611 mbedtls_gcm_starts() at gcm.c:441 mbedtls_gcm_crypt_and_tag() at gcm.c:718 mbedtls_gcm_self_test() at gcm.c:1,075   evkmimxrt685_mbedtls3x_psatest_cm33 来自 SDK 25.12 的 mbedtls_psa_accel_key_type_aes 定义的测试执行时间为 8744ms 使用此 callstack: HASHCRYPT_AES_EncryptEcb() at fsl_hashcrypt.c:1,255 hashcrypt_cipher_encrypt() at mcux_psa_hashcrypt_common_cipher.c:187 psa_driver_wrapper_cipher_encrypt() at psa_crypto_driver_wrappers.h:2,353 psa_cipher_encrypt() at psa_crypto.c:4,766 mbedtls_block_cipher_encrypt() at block_cipher.c:177 mbedtls_gcm_starts() at gcm.c:439 mbedtls_gcm_crypt_and_tag() at gcm.c:718 mbedtls_gcm_self_test() at gcm.c:1,075 对示例的修改要点如下: BOARD_InitHardware(); test_rtc_init(); psa_crypto_init(); uint64_t ms_start = test_rtc_get_msecs(); for (int i = 0; i < 200; ++i) { PRINTF("test iteration %d\r\n", i+1); mbedtls_gcm_self_test(0); } uint64_t ms_end = test_rtc_get_msecs(); PRINTF("test time = %ums\r\n", (unsigned)(ms_end - ms_start)); ... 其中test_rtc_get_msecs使用亚秒精度返回当前 RTC 时间。 正如您所看到的,使用新的 SDK 加密 GCM/AES 的速度慢了约 8 倍。 如果您需要,我可以附上修改后的示例。 问候, Amilcar Re: RT685: SDK 25.12 no HASHCRYPT acceleration 嗨,埃德温, 我们已经阅读了迁移指南。不过,我们看不出不带 PSA 的 mbedTLS 2.x 或 mbedTLS 3.x 如何在此版本的 SDK 中进行硬件加速。由于 aes_alt.c 已被删除,而 HASHCRYPT 功能仅由 PSA 驱动程序支持。 我们的应用程序在使用 SDK 25.12 时一切正常,我们当然希望在连接时使用 TLS 1.3,但现在的情况会让我们的性能大打折扣。 我们将继续调查此事。我将修改其中一个示例,看看能否重现性能损失。 问候, Amilcar Re: RT685: SDK 25.12 no HASHCRYPT acceleration 你好,@hrc-amilcar、 感谢您耐心解答这个问题。我刚刚收到内部团队的回复,请参见下文。 从调用堆栈中我可以看到,您使用的是传统的 mbedtls_xxx 加密 API。事实上,它并没有加速。MbedTLS3.x推出了新的加密应用程序接口,它就是 PSA。mbedtls/docs/psa-transition.md at v3.6.5 - Mbed-TLS/mbedtls - GitHub而且它还被加速了。 MbedTLS4.x 进一步删除了传统加密 API。 我检查了 RT600 SDK 中的 psa_crypto_examples,通过定义PSA_CRYPTO_DRIVER_HASHCRYPT,HASHCRYPT硬件加速在默认情况下是启用的,这使得加密驱动程序封装器可以将加密计算卸载到硬件上。另一方面,MbedTLS3.x+ 更为复杂,也更符合 PSA API 规范,因此可能会出现某些用例性能较低的情况。对于 TLS,我认为非对称加密技术(CASPER 硬件 IP)会成为性能瓶颈,因为该 IP 只能支持少量加速,而且与 PSA API 不兼容,后者希望硬件 IP 实现整个算法。我们已尽全力至少加速了部分 ECC 操作(签名、验证),但其他操作(如 ECDHE 密钥交换过程中的密钥生成)可能会更糟。 现在,如果您能使用 PSA API 进行性能测量,并确认 PSA_CRYPTO_DRIVER_HASHCRYPT 已定义且调用栈使用了它,那将是一件好事。仅供参考:Hashcrypt本身没有提供AES-GCM加速,因此最好对AES-密码块链接(CBC)或AES-CTR进行基准测试,以查看硬件IP的实际收益。 BR, Edwin. Re: RT685: SDK 25.12 no HASHCRYPT acceleration 你好,@hrc-amilcar、 从mbedTLS 2.x(不含 PSA)迁移到 mbedTLS 3.x(含 PSA)必然会导致性能下降: " PSA 驱动程序接口仅部分实现。因此,编写驱动程序的交付内容以及将驱动程序与 Mbed TLS 集成的方法将根据所加速的操作而有所不同。"(https://mcuxpresso.nxp.com/mcuxsdk/latest/html/middleware/mbedtls3x/docs/psa-driver-example-and-guide.html) 目前,我所能推荐的最好方法是遵循如何正确从 2.x 迁移到 3.x 的指南:从 Mbed TLS 2.x 迁移到 Mbed TLS 3.0 - MCUXpresso SDK 文档 以及正确过渡到 PSA API 的指南:过渡到 PSA API - MCUXpresso SDK 文档 不便之处,敬请原谅。 BR, Edwin. Re: RT685: SDK 25.12 no HASHCRYPT acceleration 我在 mbedTLS 配置文件中定义了 MBEDTLS_PSA_ACCEL_KEY_TYPE_AES,现在它正在调用 ASHCRY PT,但是我们的 mbedtls_ssl_read 读取速度现在更慢了。我想知道是否还有其他缺失的定义,或者PSA层增加了额外的开销。   通过 TLS 插口从 WiFi 下载 4KB 数据包的速率: SDK 25.09:205KB/秒(没有 PSA 和 ksdk 端口文件的 mbedTLS 2.x) SDK 25.12:138KB/秒(不带 MBEDTLS_PSA_ACCEL_KEY_TYPE_AES) SDK 25.12:125KB/秒(使用 MBEDTLS_PSA_ACCEL_KEY_TYPE_AES 时) 下面是使用 MBEDTLS_PSA_ACCEL_KEY_TYPE_AES 的新调用栈: HASHCRYPT_AES_EncryptEcb() at fsl_hashcrypt.c:1,255 hashcrypt_cipher_encrypt() at mcux_psa_hashcrypt_common_cipher.c:203 psa_driver_wrapper_cipher_encrypt() at psa_crypto_driver_wrappers.h:2,353 psa_cipher_encrypt() at psa_crypto.c:4,766 mbedtls_block_cipher_encrypt() at block_cipher.c:177 gcm_mask() at gcm.c:543 mbedtls_gcm_update() at gcm.c:628 mbedtls_gcm_crypt_and_tag() at gcm.c:726 mbedtls_gcm_auth_decrypt() at gcm.c:753 mbedtls_psa_aead_decrypt() at psa_crypto_aead.c:270 psa_driver_wrapper_aead_decrypt() at psa_crypto_driver_wrappers.h:4,114 psa_aead_decrypt() at psa_crypto.c:5,023 mbedtls_ssl_decrypt_buf() at ssl_msg.c:1,625 ssl_prepare_record_content() at ssl_msg.c:4,093 ssl_get_next_record() at ssl_msg.c:5,068 mbedtls_ssl_read_record() at ssl_msg.c:4,323 mbedtls_ssl_read() at ssl_msg.c:5,983 <...more frames...> Re: RT685: SDK 25.12 no HASHCRYPT acceleration 你好,@hrc-amilcar、 更新 SDK 后,您是否做了任何更改?您在使用 SDK 示例代码时也看到了这种行为吗?你使用的是独立组网 \\(SA\\) IDE 还是 VS Code 扩展? BR, Edwin. Re: RT685: SDK 25.12 no HASHCRYPT acceleration 你好,@EdwinHz、 我们使用的是 MCUXpresso 集成开发环境。 更新 SDK 后无额外更改: 当我们更新 SDK 时,我们会重新运行 " SDK 管理 "-> " 刷新 SDK 元器件 " 来获取新的和更新的文件。 然后,我们比较 .cproject配置为已启用类似功能的样本之一(例如evkmimxrt685_wifi_wpa_supplicant_cm33) psa_crypto_driver_casper=1 psa_crypto_driver_hashcrypt=1 config_wpa_supp_crypto_mbedtls_psa=1 等等 我们使用默认的mcux_mbedtls_config.h作为主要的 mbedTLS 配置头文件,并使用与evkmimxrt685_wifi_wpa_supplicant_cm33示例中的wpa_supp_mbedtls_config .h几乎相同的用户配置文件。 我将尝试使用 mbedtls3x_examples,看看它们的表现如何。也许我们漏掉了一些定义。 我在浏览代码时注意到,也许需要定义MBEDTLS_BLOCK_CIPHER_C,以便加速 gcm 操作。 看起来头文件mbedtls3x/include/mbedtls/config_adjust_legacy_crypto.h对此负有责任,但由于某些原因最终没有定义该宏。 Re: RT685: SDK 25.12 no HASHCRYPT acceleration 为了他人的利益... 看来 来自 mbedTLS 3.x 的 mbedtls_xor 一次循环遍历 4 字节的数据,并调用 mbed tls_get_unaligned_uint32 和 mbedtls_put_unalign ed_uint32, 它们都使用 memcp y 来处理单个 uint32。 我认识到 MbedTLS 的作者正试图通过一次计算 异或 4 字节块(使用余数循环)来提高性能,但是对 memcpy 的完整调用实际上使代码变慢。 在对反汇编进行一些调查后,我发现我们的项目在编译时使用了 -fno-builtin,导致编译器无法内联小的 memcpys。 移除该选项后,HASHCRYPT 硬件不用于 AES-GCM 操作所造成的性能损失基本得以恢复。因此,我发布的示例执行时间从 8600 毫秒缩短到 2100 毫秒。还没有达到 mbedTLS 2.x + ksdk alt(1087ms)的水平。但修复后的性能已经足够好了。 -阿米尔卡
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带有 S32K5xx RTD 的时钟 IP 发出的 S32DS 警告 0.8.0 使用 S32K5xx RTD 时 0.8.0编译时,我收到了来自时钟 IP 模块的许多警告。 DirkEtzler_0-1771115696535.png 有办法纠正它们吗? 这些警告是否可以忽略? 有计划把它们修好吗? Re: S32DS Warnings from Clock IP with S32K5xx RTD 0.8.0 你好@DirkEtzler、 谢谢您的提问。如前所述,S32K5 系列目前是 NPI(新产品推出)设备。因此,所有支持请求必须直接通过指定的恩智浦 FAE 处理。 或者,请通过以下网址创建支持票据: https://support.nxp.com/s/?language=en_US 系统会自动将您的请求转给相应的 FAE 团队,以便提供进一步帮助。 感谢您的理解。 顺祝商祺! 帕维尔
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KW45 知识中心 KW45 的三核架构集成了一个 96 MHz CM33 应用核心、专用 CM3 无线模块内核和一个隔离的 EdgeLock 安全区域。基于闪存的无线模块内核具有专用 SRAM,可提供高度可配置和可升级的软件实施无线模块,从而将主内核上的资源释放给客户应用空间。 符合低功耗蓝牙 5.3 标准的无线模块最多可同时支持 24 个安全连接。EdgeLock 安全区域的隔离执行环境提供了一套加密加速器、密钥存储操作和安全生命周期管理,最大限度地减少了主要内核安全责任。 KW45 MCU 还集成了 FlexCAN,有助于无缝集成到汽车的车载或工业 CAN 通信网络中。FlexCAN 模块可以支持 CAN 的灵活数据传输速率 (CAN FD),以实现更高带宽和更低延迟。 neidys_vargas_0-1729795404448.png KW45 方框图 neidys_vargas_0-1730123110234.png KW45 架构框图 文件 参考手册 Datasheet Errata Secure Reference 手册** 认证 SESIP 认证 SESIP ST PSA认证 RED 认证 欧盟符合性声明 (EVK) 欧盟符合性声明(LOC) 日本 MIC KW45-LOC _TELEC-20250221请参见下方附件 蓝牙规范 蓝牙 5.0 功能概述 蓝牙 5.1 功能概述 蓝牙 5.2 功能概述 Bluetooth_5.3_功能概述 Bluetooth_5.4_功能概述 Bluetooth_6_Feature_Overview 评估板 KW45 KW45-EVK KW45-EVK 原理图 KW45-EVK设计文件 KW45-EVK 用户手册 KW45-LOC 用户手册 KW45-EVK快速入门 应用笔记 软件、硬件和外设: AN14122 :如何在 KW45 上使用 RTC本应用笔记介绍了如何在 BLE 演示中配置和使用 RTC 外围设备 AN14141:在 KW45 低功耗蓝牙连接堆栈中启用看门狗定时器模块 。本应用笔记描述了在连接堆栈演示中实现 WDOG 定时器的过程。 AN13855:将 OTAP 客户端服务集成到 KW45/K32W1 蓝牙 LE 外围设备中 本应用笔记提供了将空中编程客户端服务集成到 BLE 外围设备的步骤和过程。 AN13584:Kinetis KW45 和 K32W1 负载拉动报告 本应用笔记描述了负载拉动特性的测量方法及相关结果。 AN13860:使用 OTAP 工具为 KW45/K32W1 创建固件更新镜像 本应用笔记提供了通过 OTAP 工具在 KW45 开发板上创建并升级镜像的步骤。 AN14077:将 KW45 (1MB) 迁移至 KW45 (512kB) 的步骤  本应用笔记描述了从 1MB 闪存迁移至 512kB 闪存所需的初始步骤。 电源管理: AN13230:Kinetis KW45 和 K32W1 蓝牙低功耗 (BLE) 功耗分析  本应用笔记提供了关于 KW45 无线微控制器 (MCU) 的功耗信息,包括硬件设计及优化以实现低功耗运行。 AN13831:KW45/K32W1 电源管理硬件  本应用笔记描述了在 KW45/K32W1 微控制器中用于电源管理的不同模块的使用方法。 射频: AN13687:K32W1 802.15.4 应用连接性测试 本应用笔记介绍了如何使用连接性测试工具来测试 K32W1 802.15.4 的射频性能。 AN13728:KW45 射频系统评估报告(适用于蓝牙低功耗和 IEEE 802.15.4 应用)本应用笔记提供了 KW45 开发板在蓝牙低功耗(2FSK 调制)和 IEEE 802.15.4(OQPSK 调制)应用中的射频评估测试结果。还描述了可以用于执行测试的设置和工具。  AN14098: KW45-LOC 射频测试报告  本应用笔记提供了KW45B41Z定位板的基本射频测试结果。  AN13228:用于 BLE 应用的 KW45-EVK 射频系统评估报告 本应用笔记提供了 KW45B41Z-EVK 在 BLE 应用中使用二进制频移键控调制的射频评估测试结果。 AN13229:KW45-EVK 与射频系统共存的评估报告(适用于 BLE 应用)本应用笔记提供了 KW45B41Z-EVK 在 BLE 应用(2FSK 调制)中的射频评估测试结果 AN13512:Kinetis 无线产品系列 BLE 与 Wi-Fi 共存应用  本应用笔记介绍了 K32W1/4X 低功耗产品系列对 Wi-Fi 信号的抗干扰能力,并提供了改善与 Wi-Fi 共存的方法  安全性: AN13859:KW45/K32W1 系统内编程工具  本应用笔记提供了在 ISP 模式下启动 KW45/K32W1 微控制器并建立各种串行连接以与微控制器通信的步骤。 AN1403:在批量生产中通过串行线调试(SWD)为KW45闪存编程以应用和无线固件 。本应用笔记详细介绍了在批量生产中通过SWD编写、烧录和设置所有必要参数的步骤。  AN13883: 通过 SPSDK 使用 ISP 更新 KW45 无线电固件  本应用笔记提供了在 ISP 模式下启动 KW45/K32W1 MCU 并使用安全二进制文件更新无线电固件的步骤。 AN14109:使用SEC工具实现KW45和K32W148安全启动 本应用笔记提供了使用 SEC GUI 工具,通过签名镜像和安全二进制文件实现 KW45/K32W1 MCU 安全启动的步骤。 AN13838:KW45 和 K32W148 安全启动使用 SPSDK 命令行工具本应用笔记提供了使用 SPSDK 命令行工具,通过签名镜像和安全二进制文件实现 KW45/K32W1 MCU 安全启动的步骤。 AN13931:KW45 和 K32W148 的生命周期管理 本应用笔记提供了使用 SEC GUI 和 SPSDK 命令行工具来转换 KW45/K32W1 MCU 的过渡生命周期的步骤。 AN14174:KW45/K32W148 使用 NPX 进行闪存加密本应用笔记提供了在 KW45/K32W1 微控制器上启用实时加密的步骤。 AN14158:KW45/K32W148 上的调试认证本应用笔记介绍了如何进行调试认证,以便在现场安全地调试应用程序。  AN14544:EdgeLock 2GO 服务适用于 MPU 和 MCU 本应用笔记介绍了 NXP 设备的 EL2GO 服务。该服务允许在不受信任的环境中为设备进行信任配置。 支持 如果您对 KW45 有任何疑问,请在我们的无线 MCU 社区中留下您的问题!此处 有用链接 参考设计 - NXP 社区 [MCUXSDK] 如何使用 GitHub SDK 适用于 KW4x、MCXW7x、MCXW2x - NXP 社区此社区帖子逐步介绍了如何使用 GitHub SDK [MCUXSDK] GitHub SDK - 蓝牙 LE 平台文档 - NXP 社区此社区帖子提供了 BLE 平台的文档。  使用 KW45/KW47/MCXW71/MCXW72 的信号频率分析仪 (SFA) 模块进行时钟测量 - NXP 社区:该社区提供了如何使用信号频率分析仪的步骤 首次正确构建 PCB 的最佳方式是使用 KW45(汽车)或 K32W1/MCXW71(物联网/工业)... 社区:在此社区中,您可以找到使用 KW45 或 K32W148 和 MCXW71 构建 PCB 的重要链接,所有链接均涉及无线电性能、低功耗和无线电认证 (CE/FCC/ICC) 如何在 Kinetis 系列产品上使用 HCI_bb 并进入 DTM 模式:本文分为两部分: 如何将HCI_bb二进制文件烧录到Kinetis产品中。 使用 R&S CMW270 进行射频测量 BLE HCI 应用程序设置发射机/接收机测试命令:本文提供了相关步骤,展示用户如何向设备发送串行命令。 Bluetooth LE HCI 黑盒快速入门指南:本文介绍了一个简单流程,能让用户通过串行命令控制无线电。 Kinetis (K32/38/KW45 & K32W1/MCXW71)功率配置工具: 此页面专门介绍 Kinetis (KW35/KW38/KW45) 和 MCX W7x (MCX W71) 功率配置工具。它将帮助您估算您的应用程序(汽车或物联网)的功耗,并评估您解决方案的电池寿命。 KW45/K32W1 32MHz 和 32kHz 振荡裕度:本文提供了电路中振荡裕度的正确配置。 基于 KW45 的 CS 1 对多演示NXP - 信道探测   培训 BLE Introduction  射频开关比较 吸收型/反射型 ETSI / FCC / ARIB 标准比较与要求 BLE 信道探测  - 概述 BLE 信道探测 - RF 硬件 BLE 信道探测 - ANSYS 建模工具 BLE 信道探测 - 天线原型验证测量 设备 无线设备: 本文提供了有助于项目开发的设备链接  开发工具  SDK 构建器: MCUXpresso SDK 提供开源驱动程序、中间件和参考示例应用程序,以加快软件开发。 SDK GitHub:SDK 开源驱动程序、中间件和参考示例在 GitHub 上。 NXP MCUXpresso: MCUXpresso 集成开发环境 (IDE) 提供了高级编辑、编译和调试功能,并增加了 MCU 专用的调试功能。支持与所有通用 Arm Cortex-M 的连接。  NXP SPSDK:是一个统一、可靠且易于使用的Python SDK库,适用于 NXP MCU 产品组合,为客户快速制作原型到生产部署提供坚实的基础。 NXP SEC工具: MCUXpresso安全配置工具是一款基于 GUI 的应用程序,用于简化在 NCP MCU 设备上生成和配置可启动的可执行文件。 NXP OTAP Tool: 是一款帮助用户对 NXP 开发板执行空中固件更新的应用程序。 配置工具: MCUXpresso 配置工具是一套集成的配置工具套件,这些工具允许开发人员快速构建自定义 SDK,并利用引脚、时钟和外设生成初始化 C 代码或自定义板支持的寄存器值。 无线 MCU 的 SDK 示例: 这些无线示例包含许多常见的蓝牙配置。 **对于安全文件,必须请求额外的访问权限。  动手实践培训 产品:K32W1 协议:802.15.4 协议:BLE -> 连接性 协议:蓝牙 协议:Matter 协议:Thread 协议:Zigbee
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imx95 电源模式 我正在开发一款运行 Linux 6.12(基于 Yocto)的自定义 i.MX95 板。我遇到了与 USB3 主机控制器有关的挂起到内存(深度睡眠)故障。当执行 echo mem> /sys/power/state 时,系统会中止 xhci-hcd 的挂起:WARN: xHC CMD_RUN 超时,紧接着 PM: failed to suspend async: error -110.启用 USB 主机模式时,即使没有活动的 USB 流量,问题也会持续出现。我使用的是由 GPIO 控制的固定 5V VBUS 稳压器,USB3 控制器、PHY、时钟和功率域在 DTS(附后)中定义。我的要求是在低电源模式下完全关闭 USB VBUS 的电源,同时允许系统成功进入深度睡眠。我附上了完整的暂停/恢复 dmesg 日志和与 USB 相关的相关 DTS 节点以供参考。我希望得到指导,了解在 i.MX95 上避免 xHCI 挂起超时所需的正确 DTS 和/或驱动程序处理方法。 Re: imx95 low power mode 您能否向我们分享详细步骤,以便我们在 EVK 板上复现它?谢谢 Re: imx95 low power mode 在自定义板中我使用 fusb302 但未作为 usb3.0 启用,我们将其用作 usb2.0。 但在进入深度睡眠时(echo mem> /sys/power/state ),xhci-hcd 驱动程序出现错误。 测试设置: • SoC:i.MX95 • 操作系统:Yocto Linux(内核 6.x、电路板支持包) • USB 模式:主机(xHCI、USB3)• 连接设备:USB 闪存盘(大容量存储) 正常启动板。 将 USB 存储设备连接到 USB3 主机端口。 使用 lsusb 验证枚举并确认设备可访问。 使用以下命令进入电源模式: echo mem > /sys/power/state 在此步骤本身之后它会显示错误。 使用配置的唤醒源(电源按钮/ GPIO)恢复系统。 恢复后,观察到 USB 设备是: 未检测到,或 在 dmesg 中显示 xHCI / DWC3 相关错误,或 需要重新插入 USB 才能重新工作。 ERROR LOGS : echo mem> /sys/power/state [ 117.057281] PM: suspend entry (deep) [ 117.066009] Filesystems sync:0.005 seconds [ 117.071209] Freezing user space processes [ 117.076800] Freezing user space processes completed (elapsed 0.001 seconds) [ 117.083781] OOM killer disabled. [117.087011] 冻结剩余的可冻结任务 [117.132725] 冻结剩余已完成的可冻结任务(已经 0.041 秒) [117.140164] printk:暂停主机(使用 no_console_suspend 调试) [117.156868] sd 0:0:0:0:0:[sda] 同步 SCSI 缓存 [117.267552] xhci52-hcd xhci-hcd.2.auto:警告:xHC CMD_RUN 超时 [117.267611] xhci-hcd xhci-hcd.2.auto:PM:dpm_run_callback ():platform_pm_suspend 返回 -110 [117.267631] xhci-hcd xhci-hcd.2.auto:无法暂停异步:-110 [117.267702] 下午:一些 设备无法挂起,或者检测到提前唤醒事件 [117.268017] hub 1-0:1.0:hub_ext_port_status 失败(错误 = -108) [117.268044] USB usb1-port1:无法禁用(错误 = -108)[117.516365] 下午:恢复设备花了 0.248 秒 [117.570639] OOM 杀手已启用。 [ 117.573777] 重新启动任务......完成。 [ 117.575261] sd 0:0:0:0: [sda] 测试单元就绪失败:Result: hostbyte=0x01 driverbyte=DRIVER_OK [ 117.578423] random: crng reseeded on system resumption [ 117.587117] sda: detected capacity change from 120164352 to 0 [ 117.598136] PM: suspend exit -sh: echo: write error:连接超时 Re: imx95 low power mode 嗨@kannappan、 好了,我们要放元旦假期了。当我回到办公室时我会在我们的板上试一试然后给你回复。 祝您有美好的一天 顺祝商祺! Rita Re: imx95 low power mode 嗨@kannappan、 对不起,这周太忙了,我下周会为您测试并与您分享结果。 祝您有美好的一天 顺祝商祺! Rita Re: imx95 low power mode HI@Rita_Wang, 对于上述问题是否有任何答复。 谨致 Kannappan
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CSEc Error 我在使用S32K144的CSEc,在BOOT_DEFINE时,何时会返回KEY_INVAILD错误呢? 希望得到解答,祝每天开心! Re: CSEc Error 你好@小智 我看不出在调用 BOOT_DEFINE 函数时出现这种错误的原因。即使尚未配置 BOOT_MAC_KEY,也可以调用此函数,因此它不需要密钥。 此致, Lukas
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S32 Design Studio 3.6.5 Release Announcement Product Release Announcement Analog & Automotive Embedded Systems S32 Design Studio 3.6.5 Irina_Costachescu_0-1765531594525.png The Analog & Automotive Embedded Systems (AAES) - Software Development Tools Engineering Team at NXP Semiconductors is pleased to announce the release of the S32 Design Studio 3.6.5 with support for: AMCU AP RAS APN S32K3 Family S32G Family S32R41 Family S32J Family S32K1 Family S32ZE Family S32R45 Family   S32M2 Family S32N Family S32R47 Family       SAF8xxx Family   Major Features for S32 Design Studio 3.6.5 Installer S32 Design Studio 3.6.5 is delivered with all public NPI's in a single 2.63GB installer to improve first time user experience. Additional packages for alpha customers are available based on Flexera entitlement and can be installed on top of S32 Design Studio 3.6.5 using Extension and Updates. Irina_Costachescu_1-1765531866020.png   Installer will require admin rights only when the user chooses to install components which need elevation (Visual Studio Redistributable or debugger drivers). If a user chooses a custom installation only with S32DS IDE and its components (no drivers) the installation will finish without admin rights. Irina_Costachescu_2-1765531914107.png Platform IDE and UI Integrated Cody, the open-source Eclipse plugin from Sourcegraph, into S32 Design Studio. This plugin is installed by default, allowing users with a valid Cody license to log in directly within S32DS and access Generative AI features. Note: Users must agree to the Sourcegraph Terms of Service before using Cody. Irina_Costachescu_2-1765456346536.gif Enabled integration with the NXP Application Code Hub, allowing users to browse available examples and import them directly from the hub page into S32 Design Studio. Note: the application examples will be published soon on the Application Code Hub URL. Irina_Costachescu_3-1765456346537.png Note: This image is taken from internal sources. The illustrated examples are currently under development and will be available soon. Extended the Quick Fix mechanism for the missing NPI and Real Time Drivers packages. Basically, an error message displays in the Problems view whenever the IDE identifies a missing package (build tool, NPI, RTD) associated with the current project. The Quick Fix automatically installs the missing package if it is available in the configured Update Sites. Note: not all scenarios are covered, there may be cases where the tool cannot determine if a package is missing. Irina_Costachescu_4-1765456345392.png A new Recent tab has been added in S32DS Extensions and Updates to display the latest installed packages, providing a clear history of user actions related to package installations. In addition, the default sorting was changed in All tab to bring greater visibility to NXP packages. Irina_Costachescu_5-1765456346540.png Added support for drag-and-drop of S32 Design Studio p2 update sites / installable packages into the S32DS Extensions & Updates window. Users can now simply drag the ZIP file into the window, and the package will be automatically inserted and selected, requiring only a click on Next to complete the installation. Irina_Costachescu_6-1765456348052.gif Significant improvements to Secure Debugging:  Added a dedicated Debug Card view that allows users to generate debug card binaries based on custom input. Implemented Challenge & Response functionality for Linux environment.  Enabled Secure Registry Key view for managing secure registry keys on Linux.  UI is aligned to the secure debugging functionality latest changes introduced by HSE2. Irina_Costachescu_0-1765808827917.png Extended the S32 Debugger OS awareness support with FreeRTOS. OS threads are now visible in S32 Design Studio and user will be able to individually debug them. Extended the command line support to display OS threads and objects. Irina_Costachescu_8-1765456347125.png Enable debug in low power mode with S32 Debugger for S32K3xx devices:  The debug session will recover after core exits low power or standby mode, allowing the user to continue application debugging. Debugging from the first instruction after low power exit is now possible by using this configuration command when starting the debug session: monitor template config :ccs:S32K3XX:SoC#0 6 1 Expanded the S32Trace debug-info parser to fully support DWARF-5, adding compatibility with projects using GCC 11.4 and newer. Major Features for NPIs S32N Family S32Flash Programmer improvements for erase and verify write operations on S32N5. S32G2/G3, S32J100, and SAF8xxx Families S32J100 development package is now public and delivered inside S32DS installer. Enabled debugging support for S32G2 devices on VDK R10. S32Flash Programmer enhancements for erase and verify write operations. Various bug fixes and improvements for arm cores and accelerators. Irina_Costachescu_3-1765532135684.png This release is available for download on: S32 Design Studio 3.6.5 can be found on  nxp.com  Flexera catalogue S32 Design Studio for S32 Platform v.3.6 Target Audience: S32 Design Studio 3.6.5 and bundled NPIs releases are targeted for public audience. The Installation Procedure for Packages: Download S32 Design Studio v3.6.5, available on nxp.com and in Flexera catalogue S32 Design Studio for S32 Platform v.3.6. If you have any local admin restrictions(ex. Admin by Request) the installer will request elevation, alternatively you can use “Run as Administrator” to run the installer. Download any additional packages if it’s required. Start S32 Design Studio v3.6.5 and install the desired package. Go to  Help > S32DS Extensions and Updates. For additional packages, in the S32DS Extensions and Updates dialog box, drag the ZIP file into the window, and the package will be automatically inserted and selected, requiring only a click on Next to complete the installation, or click Add Update Sites. Navigate to the directory with the downloaded ZIP file. Choose it and click Open, then click OK. You will get back to S32DS Extensions and Updates and can use this dialog to select desired packages.​​ Technical Support: Please use the public community for general questions: https://community.nxp.com/community/s32/s32ds For internal packages please use INTERNAL S32DS NXP Community space:https://community.nxp.com/groups/internals32ds Irina_Costachescu_10-1765457452129.png
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[不正使用] 記事作成者: @jeremyzhou / ナレッジベース: imxrt@tkb / 報告者: eikewp eikewp は、 @jeremyzhou が投稿した記事 「マイクロコントローラ使用の認識モデル」を 以下の理由で報告しました。 理由:ヌードまたは性行為 詳細: CANゼニカルを注文します 安いゼニカル 土曜日配送 インターネット ジェネリックゼニカル 購入安いゼニカル60mg ロイズ薬局のゼニカル インドにおけるゼニカルの価格 次のゼニカルをどこで注文できるか ゼニカルの割引 ゼニカルを購入したい 一般ゼニカル錠 CANゼニカルを注文します 注文ゼニカル 安いゼニカル錠 ゼニカルはどこで買える? ゼニカルアメックスの迅速な配達 ゼニカルの割引 ゼニカルイギリスでオンライン購入 ゼニカルを購入したい ジェネリックゼニカル ゼニカルを注文する ゼニカルを注文したい ゼニカルイギリスでオンライン購入 できるゼニカルを購入しました ゼニカルを次に注文する場所 ゼニカルの購入方法 ゼニカル肥満 スクリプトなし バジルドン 一般ゼニカル錠 一般ゼニカル薬の割引 ゼニカルヴァイタイジェネリック フィナステリド ゼニカルのオンライン購入情報 ジェネリックゼニカル薬の割引 購入安いゼニカル60mg ゼニカルブランド 安い kchge ジェネリックゼニカル錠 安いゼニカル 英国 オンライン ゼニカルブランド 安い kchge 欲しいゼニカルを注文する ジェネリックゼニカル錠 ゼニカル オンライン購入 5bdvi ロイズ薬局のゼニカル 記事リンク: https://community.nxp.com/t5/i-MX-RT-Crossover-MCUs-Knowledge/Recognition-model-for-microcontroller-use/ta-p/1103364 記事の著者: @jeremyzhou |メールアドレス 報告者: eikewp |メールレポーター 報告された記事には 8 件のコメントがあります。
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CLRC663 (CLEV6630B) スタンバイ電流はデータシートよりはるかに高い こんにちは、 CLEV6630BでCLRC663を使用して、スタンバイ モードで電流を測定しています。 設定: CLEV6630B VDDピンはNordic Power Profiler Kit (PPK) (J303)を介して電源供給されます。 nRF52840とCLEV6630B間のSPI接続(MOSI、MISO、SCK、SSEL) CLRC663とのSPI通信 ジャンパーJ303、J101、J300が切断されています 問題: スタンバイモードでは、VDD で約 60~70 µAを測定しましたが、データシートでは約 4~6 µA と指定されています。 質問: スタンバイ電流が高くなる原因は何でしょうか? SPI、MCU、またはその他の I/O パス(オンボード回路を含む)を介したリークが発生する可能性がありますか? データシートのスタンバイ電流に達するために、リーク電流を最小限に抑えるにはどうすればよいですか? スタンバイ データシートの基準を満たすために、VDD から CLRC663 への電流のみを測定するための推奨方法は何ですか? よろしくお願いします。 Re: CLRC663 (CLEV6630B) Standby Current Much Higher Than Datasheet こんにちは@Lior スタンバイ (アイドル) モードにするコマンドも送信する必要があります。 Re: CLRC663 (CLEV6630B) Standby Current Much Higher Than Datasheet こんにちは、 コマンド レジスタのスタンバイ ビットを上げています。
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S32K3X4EVB-T172 上的 PEmicro 连接助手问题 我无法连接到 S32K3X4EVB-T172,尽管遵循了《快速入门指南》: https://www.nxp.com/document/guide/quick-start-guide-for-s32k3x4evb-board:GS-S32K3X4EVB-Q172 板和 LED: zaighamkhawaja_4-1764249676294.png 尝试调试时,会显示 PEmicro 连接助手。 zaighamkhawaja_0-1764249542881.png 设备驱动程序: zaighamkhawaja_1-1764249590231.png 调试设置: zaighamkhawaja_2-1764249639854.png zaighamkhawaja_3-1764249653892.png 已经尝试过更换数据线、更换电脑、重新安装 S32DS、重新安装驱动程序、尝试 P&E Micro Utilities。 Windows 11,在 S32DS 3.6.4 上试用& 3.6.1 S32K3X4EVB-T172 S32DS-S32PLACE OPENSDA Re: PEmicro Connection Assistant Issue on S32K3X4EVB-T172 这是第一次尝试连接 EVB 吗?之前是否上传过任何项目? 该板是全新的,似乎有一些出厂预装的程序,即按下 SW5 和 SW6 会改变 USER_LED_0 的颜色 从图中可以看到,RESET_K3 和 RST_OSDA 两个 LED 都亮着。给板供电时 RESET_K3 是否一直处于开启状态? 你能测量吗?通常,当RESET LED 亮起时,线路会定期在很短的时间内被拉动,从而保持 MCU 处于RESET状态。 当我按照开机程序连接板时,RESET_K3 和 RST_OSDA 最初处于关闭状态。尝试调试时,RST_OSDA(有时是 RST_K3)LED 灯亮起,同时弹出 PEmicro 连接助手。 此外,如果我按下 SW4 键,然后重新尝试调试,就会出现不同的弹出窗口: zaighamkhawaja_0-1764732467636.png 此外,测量电压源,如果电压源没有提供预期值,则意味着 MCU 可能已损坏。 我已经尝试过两种不同的适配器:12V-4A 和 12V-5A,得到的结果是一样的。适配器电压输出稳定。 -如果你的意思是 S32K3 MCU 已损坏:默认应用程序(LED 颜色变化)仍在板上运行。 -如果你的意思是恩智浦 K26 受损了:我还能使用 " Multilink 固件配置实用程序 " 将固件升级到 usbmlacpembeddedens.1098 如果您有任何可用的外部调试器(PEmicro、JLink、Latuerbach 等),可以尝试使用它们来查看是否可以连接。 下周我将得到一个 JLink 和一个新的 EVB。这次将是 S32K344MINI EVB。 如果还需要什么来确定根本原因,请告诉我。 Zaigham Re: PEmicro Connection Assistant Issue on S32K3X4EVB-T172 嗨,@zaighamkhawaja、 感谢您分享安装细节。看来 S32K3x Dev.软件包和 peMicro 插件已正确安装。这是第一次尝试连接 EVB 吗?之前是否上传过任何项目? 从图中可以看到,RESET_K3 和 RST_OSDA 两个 LED 都亮着。给板供电时 RESET_K3 是否一直处于开启状态?你能测量它吗? 通常,当RESET LED 亮起时,线路会定期在很短的时间内被拉动,从而保持 MCU 处于RESET状态。 此外,测量电压源,如果电压源没有提供预期值,则意味着 MCU 可能已损坏。 如果您有任何可用的外部调试器(PEmicro、JLink、Latuerbach 等),可以尝试使用它们来查看是否可以连接。 致以最诚挚的问候, Julián Re: PEmicro Connection Assistant Issue on S32K3X4EVB-T172 感谢您关注我们的产品并为我们的社区做出贡献。 请让我们先退一步。 请提供您的 "安装详细信息" 的屏幕截图,您可以在 IDE 的 "税务摊销收益" 中找到该屏幕截图。 Re: PEmicro Connection Assistant Issue on S32K3X4EVB-T172 当然,就在这里: zaighamkhawaja_0-1764623301449.png zaighamkhawaja_1-1764623365030.png C/C++ Common GDB Support 11.4.0.202309142347 org.eclipse.cdt.gdb.feature.group Eclipse CDT C/C++ Development Platform 11.4.0.202311271618 org.eclipse.cdt.platform.feature.group Eclipse CDT C/C++ Development Tooling Native Utilities 11.4.0.202311271618 org.eclipse.cdt.native.feature.group Eclipse CDT C/C++ Development Tools 11.4.0.202311271618 org.eclipse.cdt.feature.group Eclipse CDT C/C++ DSF GDB Debugger Integration 11.4.0.202309151124 org.eclipse.cdt.gnu.dsf.feature.group Eclipse CDT C/C++ GCC Cross Compiler Support 11.4.0.202309151124 org.eclipse.cdt.build.crossgcc.feature.group Eclipse CDT C/C++ GDB Hardware Debugging 11.4.0.202309151124 org.eclipse.cdt.debug.gdbjtag.feature.group Eclipse CDT C/C++ GNU Toolchain Build Support 11.4.0.202311121705 org.eclipse.cdt.gnu.build.feature.group Eclipse CDT C/C++ GNU Toolchain Debug Support 11.4.0.202309151124 org.eclipse.cdt.gnu.debug.feature.group Eclipse CDT C/C++ Memory View Enhancements 11.4.0.202309151124 org.eclipse.cdt.debug.ui.memory.feature.group Eclipse CDT C/C++ Remote Launch 11.4.0.202309142347 org.eclipse.cdt.launch.remote.feature.group Eclipse CDT Core Server Feature 1.15.200.v20231110-1900 org.eclipse.equinox.server.core.feature.group Eclipse Equinox Project e(fx)clipse - IDE - Basic 3.9.0.202210170554 org.eclipse.fx.ide.basic.feature.feature.group Eclipse.org ECF Apache Httpclient 5 FileTransfer Provider 1.1.702.v20231114-1017 org.eclipse.ecf.filetransfer.httpclient5.feature.feature.group Eclipse.org - ECF ECF Core Feature 1.6.2.v20231021-2127 org.eclipse.ecf.core.feature.feature.group Eclipse.org - ECF ECF Filetransfer Feature 3.14.1900.v20230715-1945 org.eclipse.ecf.filetransfer.feature.feature.group Eclipse.org - ECF ECF Filetransfer SSL Feature 1.1.402.v20231021-2127 org.eclipse.ecf.filetransfer.ssl.feature.feature.group Eclipse.org - ECF Eclipse Help System 2.3.1600.v20231201-0110 org.eclipse.help.feature.group Eclipse.org Eclipse Platform 4.30.0.v20231201-0512 org.eclipse.platform.feature.group Eclipse.org Eclipse RCP 4.30.0.v20231201-0512 org.eclipse.rcp.feature.group Eclipse.org Eclipse XML Editors and Tools 3.31.0.v202308200343 org.eclipse.wst.xml_ui.feature.feature.group Eclipse Web Tools Platform Embedded C/C++ J-Link Debugging 6.4.0.202307251916 org.eclipse.embedcdt.debug.gdbjtag.jlink.feature.group Eclipse Embedded CDT EMF - Eclipse Modeling Framework Core Runtime 2.36.0.v20231002-1156 org.eclipse.emf.ecore.feature.group Eclipse Modeling Project EMF Common 2.30.0.v20230916-0637 org.eclipse.emf.common.feature.group Eclipse Modeling Project EMF Ecore Edit 2.16.0.v20230211-1150 org.eclipse.emf.ecore.edit.feature.group Eclipse Modeling Project Equinox p2, headless functionalities 1.7.0.v20231112-1314 org.eclipse.equinox.p2.core.feature.feature.group Eclipse.org - Equinox Equinox p2, minimal support for RCP applications 1.4.2200.v20231112-1314 org.eclipse.equinox.p2.rcp.feature.feature.group Eclipse.org - Equinox GDB Client for Arm Embedded Processors 15.1 Build 1703 1.0.0.202511261537 com.nxp.s32ds.brc.gdb.tools.feature.feature.group NXP GEF Classic Draw2d 3.18.0.202311222042 org.eclipse.draw2d.feature.group Eclipse GEF GEF Classic GEF (MVC) 3.18.0.202311222042 org.eclipse.gef.feature.group Eclipse GEF GEF Classic Zest 3.18.0.202311222042 org.eclipse.zest.feature.group Eclipse GEF Git integration for Eclipse 6.8.0.202311291450-r org.eclipse.egit.feature.group Eclipse EGit GNU ARM PEMicro Interface Debugging Support 6.0.9.202509241532 com.pemicro.debug.gdbjtag.pne.feature.feature.group P&E Microcomputer Systems Inc. Memory Analyzer 1.15.0.202311170814 org.eclipse.mat.feature.feature.group Eclipse Memory Analyzer Nebula Grid Widget 1.1.0.202303072132 org.eclipse.nebula.widgets.grid.feature.feature.group Eclipse Nebula net.sourceforge.ehep 1.1.0 net.sourceforge.ehep.feature.group Randallco and EHEP Team NXP GCC for Arm Embedded Processors 10.2 Build 1728 1.0.0.202508270740 com.nxp.s32ds.brc.arm.tools.gcc102.feature.feature.group NXP NXP GCC for Arm Embedded Processors 11.4 Build 1763 1.0.0.202508271006 com.nxp.s32ds.brc.arm.tools.gcc114.feature.feature.group NXP PEmicro ARM Device Expansion Plugin 6.0.9.202509241532 com.pemicro.debug.gdbjtag.pne.expansion.feature.feature.group P&E Microcomputer Systems Inc. Remote Services 11.4.0.202309142347 org.eclipse.remote.feature.group Eclipse CDT Remote System Explorer End-User Runtime 4.5.500.202305261020 org.eclipse.rse.feature.group Eclipse TM Project RTD S32K3XX 6.0.0.202506161748 com.nxp.RTD.S32K3XX.feature.feature.group NXP Semiconductors, Inc. RTD S32K3XX 6.0.0.202506161748 com.nxp.RTD.S32K3XX.root.feature.feature.group NXP Semiconductors, Inc. S32 Debugger Core 3.6.5.202511272018 com.nxp.s32ds.brc.debugger.core.feature.feature.group NXP S32 Design Studio CLE S32CT 1.8.9.202511261304 com.nxp.s32ds.cle.uct.feature.feature.group NXP S32 Design Studio for S32 Platform 3.6.5.202511272206 com.nxp.s32ds.platform.ide.feature.feature.group NXP S32 Design Studio for S32 Platform Tools 3.6.5.202511272206 com.nxp.s32ds.platform.ide.tools.feature.feature.group NXP S32DS Product 3.6.4.202509291703 com.nxp.s32ds.platform.ide.product NXP S32G development package 3.6.4.202509291633 com.nxp.s32ds.s32g2.dev.feature.feature.group NXP S32K1xx development package 3.6.5.202511272256 com.nxp.s32ds.s32k1.dev.feature.feature.group NXP S32K3 FreeMASTER Serial Communication Driver 1.4.2.202412201001 com.nxp.s32ds.s32k3.sdk.freemaster.feature.feature.group NXP S32K3xx development package 3.6.4.202509291639 com.nxp.s32ds.s32k3.dev.feature.feature.group NXP S32M2xx development package 3.6.4.202509291626 com.nxp.s32ds.s32m2.dev.feature.feature.group NXP S32N5 development package 3.6.4.202509291626 com.nxp.s32ds.s32n.dev.feature.feature.group NXP S32R41 development package 3.6.4.202509291624 com.nxp.s32ds.s32r41.dev.feature.feature.group NXP S32R45 development package 3.6.4.202509291624 com.nxp.s32ds.s32r45.dev.feature.feature.group NXP S32R47 development package 3.6.4.202509291625 com.nxp.s32ds.s32r47.dev.feature.feature.group NXP S32Z2/E2 development package 3.6.4.202509291631 com.nxp.s32ds.s32esz.dev.feature.feature.group NXP SAF85xx development package 3.6.4.202509291625 com.nxp.s32ds.saf85.dev.feature.feature.group NXP SAF86xx development package 3.6.4.202509291626 com.nxp.s32ds.saf86.dev.feature.feature.group NXP SECRDR S32K1 3.0.0.202508081221 com.nxp.SECRDR.S32K1.feature.feature.group NXP Semiconductors, Inc. Terminal (Console) View 11.4.0.202311142324 org.eclipse.tm.terminal.view.feature.feature.group Eclipse CDT TM Terminal 11.4.0.202309142347 org.eclipse.tm.terminal.feature.feature.group Eclipse CDT TM Terminal Control 11.4.0.202311142253 org.eclipse.tm.terminal.control.feature.feature.group Eclipse CDT TM Terminal Local Connector Extensions 11.4.0.202309142347 org.eclipse.tm.terminal.connector.local.feature.feature.group Eclipse CDT TM Terminal SSH Connector Extensions 11.4.0.202309142347 org.eclipse.tm.terminal.connector.ssh.feature.feature.group Eclipse CDT Xtend Library 2.33.0.v20231121-0955 org.eclipse.xtend.lib.feature.group Eclipse Xtext   Re: PEmicro Connection Assistant Issue on S32K3X4EVB-T172 嗨,@zaighamkhawaja、 感谢您提供的补充信息。 如果您能连接外部调试器,请向我提供最新信息。 空白项目或示例项目会出现这种情况吗?作为最后的机会,您是否尝试过连接 MCU 而不是尝试调试/擦除? Julin_AragnM_0-1764966031025.png 这让我相信,要么安装了 HSE,要么调试端口被锁定,需要通过密码或 "挑战/响应 "来解除安全保护。PEmicro 提供 Python 脚本,用于 在每次会话开始时验证 调试器;但 需要输入密码。 最后一个资源可以是交换 MCU 以确认调试接口是否有故障,或者 MCU 是否处于安全/禁用调试引脚。 致以最诚挚的问候, Julián Re: PEmicro Connection Assistant Issue on S32K3X4EVB-T172 - 外部 JTAG 调试器正常工作。 - 空项目或样本项目也不起作用。 - 附加到运行目标不起作用。 我还购买了另一块板,它可以与板载调试器一起使用,因此与 IDE 或配置设置无关。
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KW45 硬件设计建议 亲爱的恩智浦团队, 我想知道,如果我不将下图中给出的外部迹线从 CDD_CORE / VOUT_CORE 连接到 VDD_CORE,会出现什么问题。 images.jpg 我以为是一样的,所以没有从外部电路连接。会有问题吗? 我遇到了一个奇怪的问题,能告诉我是什么原因吗? 当电压从 3.1V 降到 3V 时,射频下降。 MCU 似乎能正常工作,因为我们实现了 LED 闪烁。 在某些情况下,如低于 2.5V 时,MCU 可以工作,但射频输出是错误的。 在某些情况下,例如电压低于 2.5V 时,MCU 会完全停止发送数据,我们可以看到大约 7/8/9/12mA 的持续功耗。 我无法理解,因为当我们降低电压或低电压时,总是会出现这种情况。 KW45B41Z-EVK KW45 BLE-NFC   如果两个引脚都是内部连接的,会有问题吗? Kinetis K系列MCU Re: KW45 HW Design Recommendation 你好 希望你一切顺利。 您在设计中使用的电源配置是什么?您是如何为 VDD_RF 供电的? 有关最常见的电源配置和注意事项,请参阅 AN13831 KW45/K32W148-电源管理单元硬件第 3 节 " KW45/K32W148 电源配置 "。 请注意,您的应用程序要求的任何电源配置都必须符合每个功率域的直流电压要求,该要求在第 2.2 节 " 电源域速率 " 中规定 内部稳压器输出由 VDD_CORE/VOUT_CORE 提供,稳压器输入由 VDD_CORE 提供。强烈建议在外部连接引脚以及适当的去耦电容,以提供反馈路径并保持电压稳定性。 您可以在这篇文章中找到我们的最低物料清单演示文稿,了解推荐的电容值和其他硬件建议:使用 KW 45(汽车)或 K32W1/MCXW71(物联网/工业)首次版本 PCB 的最佳方式 您还可以根据我们的 KW45-EVK 原理图来 确认您的 原理图 设计。 顺祝商祺! 安娜-索菲亚
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场景工具就在这里!(适用于 Windows 的处理器专家软件)~ <meta http-equiv="Content-Type" content="text/html; charset=utf-8" /> 如果您是CodeWarrior用户但还没有许可证,那么这篇文章对您和您的设计将非常有用! 您可能还在使用Power Architecture技术和QorIQ 处理器。如果我没记错的话,我会向您介绍 QorIQ 处理器的新优化套件。 整个 QorIQ 优化套件利用 QorIQ 处理器的片上硬件来帮助优化您的应用程序,从而提供数百个片上硬件事件的增强可视性,您将在这里找到的第一个包含的工具是场景工具,它包含以下新的有趣的功能: 采用下列工具提取测量信息: 飞思卡尔TAP TCP/IP,如果运行飞思卡尔SDK,且TCF连接器启用。 把数据作为平均值或一组时间序列值 选择数据子集进行绘制或求平均值 保存样本数据,供以后查看 多个窗口,可显示多个测量 采样时基 由主机确定 现在您知道它通过利用“测量场景”提供可见性,您将不再“盲目”设计,并且您将能够立即测试您的创作的潜力。这些测量场景包括CPU场景、内存和流量场景以及DPAA和外设场景。 要求: 主机系统要求 Microsoft® Windows® 7 Microsoft Windows Vista (SP2)(32 位)家庭普通版、家庭高级版、商业版、企业版、旗舰版 Microsoft Windows XP专业版(SP3) 32位和64位 Red Hat企业版Linux 5.4,32位和64位 Ubuntu 8.0.4,32位,9.10,32位和10.04,64位 SuSE 11,32位(采用11.1版进行测试) 目标系统要求 兼容QorIQ器件(见“支持的器件”) 连接方法(您只需其中一种) 运行飞思卡尔的TCF连接器的Linux系统 (含在面向支持器件的飞思卡尔SDK中) 飞思卡尔USB TAP或Gigabit TAP 在 概述 中获取 更多信息 或立即开始并 下载 适用于 Windows 的场景工具 ! 而是Linux 版本? 组件开发环境
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Design your NFC Antenna with NXP’s OM29263ADK development kit This post entry provides a detailed description of the OM29263ADK kit, a new antenna tuning development kit specially designed to facilitate the NFC antenna prototyping process. This document has been structured as follows: OM29263ADK kit contents Using OM29263ADK kit with CLEV6630A or CLEV6630B Using OM29263ADK kit with PNEV5180B or PNEV7462C Using OM29263ADK kit to connect your own antenna coil Define target impedance and Q-factor Measure antenna coil Design EMC filter Calculate matching circuit components Assemble and measure Adjust receiver circuit Using OM29263ADK kit to evaluate the performance of different antenna shapes Background information Coupling coefficient Mutual inductance Antenna tuning components used for the large antenna Antenna tuning components used for the small antenna OM29263ADK large antenna vs small antenna ISO/IEC14443 vs ISO/IEC15693 reader - Quality factor Further information Video recorded session OM29263ADK kit contents This kit consists of a single PCB board that includes:  A pre-matched antenna of 2 turns and a size of 77 by 113 mm.  A second pre-matched antenna of 4 turns and a smaller size of 20 by 20 mm.  And, 8 extra boards to prepare the matching for custom antennas. As a result, this kit is a perfect resource for different purposes such as evaluating the RF performance of different antenna sizes and, for prototyping your custom antenna quickly. In addition, this NFC antenna development kit is compatible with our existing product support package. You can directly connect it to CLRC663 demoboards, as well as to PN5180 and PN7462 demoboards after a minor tuning. Using OM29263ADK kit with CLEV6630A or CLEV6630B The process is really straightforward… First, take one CLRC663 demoboard and separate the main PCB from the antenna & matching circuit. The board includes cut lines, so you can divide both sections easily by only using your hands. Second, break the kit OM29263ADK PCB so that you separate the pre-matched antenna from the other PCB parts. Then, it is just a matter of connecting the two parts together. The kit antenna includes pin male connectors while the CLRC663 board includes the corresponding female connectors. Therefore, hook up the antenna with the main board, solder the connectors and that’s all. We can observe that when we connect the kit large antenna to the reader PCB, the  impedance measured with our network analyzer shows that the tuning is adjusted to approximately, 19 Ohms. This is the result obtained without any hardware modification The same process applies for the smaller antenna: Similarly, we can observe that when we connect the kit small antenna to the reader PCB, the  impedance measured with our network analyzer shows that the tuning is adjusted to approximately, 36 Ohms. This is the result obtained without any hardware modification: Using OM29263ADK kit with PNEV5180B or PNEV7462C In case you are interested to connect the OM29263ADK kit antennas to the PNEV5180B or PNEV7462C boards, the preparation process is the following: First, separate the antenna and the matching section from the PN5180 or PN7462 demoboards, as before, using the cut lines. Then, take one kit sample, and separate the pre-matched antennas for the other PCB parts. And finally, adjust the EMC filter. The EMC filter adaptation is required because the kit antenna is prepared for asymmetric tuning while the PN5180 and PN7462 original antenna use a symmetrical tuning. The main difference between both types of tuning is the cut off frequency. The symmetric tuning uses a cutoff frequency around 15MHz, while the asymmetric can go up to 22 MHz. In practice, for this adaptation, we only need to change the value of the capacitor C0 in the main board. For instance, the existing 220 pF capacitor can be replaced for another one of 68 pF. Using OM29263ADK kit to connect your own antenna coil This section describes how to use the kit PCB boards for our custom antenna tuning. For this task, the list of material that we need is: A reader PCB board, in the example, we picked CLRC663 One of the PCBs for antenna matching included in the kit And, the any antenna to be matched  In our case, we have selected one sample antenna available in our lab. The following explanation will be guided using this antenna as a reference, but any antenna can be tune using the same process. The usual list of steps to tune a custom antenna are: First, we need to define target impedance and Q factor, as design parameters for our reader Then, we will characterize the antenna coil and find its parameters After that, we will design the EMC filter With this, we will calculate the matching components using an Excel sheet Afterwards, we will assemble the calculated components and measure the first results. We will take field measurements, which probably will show that it is not perfect, so we may need to adapt the matching values With these fine-tuned vales, we will re-assemble again And finally, we will design the receiver circuit. Define target impedance and Q-factor First, we start defining the target impedance and Q-factor. The target impedance is a design parameter, which needs to be chosen according to our needs whether we want to go for maximum field strength or minimum battery consumption or a trade-off in between. Typically, reasonable values are between 20 Ohms and 80. Another important design parameter is the Q factor. The Q factor is a dimensionless parameter indicating the performance of a resonant circuit. The higher the Q factor, the higher the read range. On the other hand, increasing the Q factor also reduces the bandwidth of the circuit. As a result, in practical implementation, Q-factor values below 30 are demonstrated to fit well for the ISO14443 wave form timing requirements and corresponding spectrum.  For our tuning exercise, the design parameters chosen are an impedance of 20 ohms and a Q factor of 25 Measure antenna coil Next step is to characterize the antenna coil. Any antenna coil has an input impedance. This input impedance is complex and consists of an inductance, capacitance as well as some losses represented by a resistance (R). The actual values depend, among others, on antenna material, thickness of conductor, distance between the windings, number of turns, etc.  The coil characterization needs to be done with a network analyzer. It could be a high end, such as Agilent or Rohde & Schwarz, which is powerful, accurate, easy to use, but expensive. Or we can also go for low end solutions, such as the miniVNA PRO, which is cheap compared with the previous ones, and accurate enough for our needs. In our case, the characterization of our lab antenna shows:  An inductance around 1.3 uH And a resistance of 2.5 Ohms Design EMC filter The next step is to design the EMC filter. As we are using CLRC663, we will go for an asymmetric antenna tuning. Good inductor values are between 330nH and 560nH. and 21MHz cutoff frequency is ideal for asymmetric tuning. Fixing this two parameters, we can easily calculate the required capacitor component for our EMC filter with the formula below. In our example, we need to use a capacitor of C= 122 pF. With this, we just pick up the closer commercial value from our components box Calculate matching circuit components We have characterized the antenna coil and completed the EMC filter. Now, we can calculate the matching network components. The matching components need to be calculated so that the maximum power from the reader is transmitted to the antenna. This happens when the equivalent impedance seen from the reader IC only has the real part, without the complex part. There are some complex calculation involved in the process. In order to avoid these cumbersome formulas, NXP provides a useful Antenna Tuning excel sheet that calculate the appropriate components for you. Below, you can see a screenshot of the Excel sheet in the slide. This sheet calculates C1 and C2 matching values according to the inputs expected from the user. These are The measured antenna coil parameters The EMC filter parameters. The target impedance and Q-factor of our design With these values, The Excel sheet calculates and outputs the value of the matching components: C0, C1, C2 and Rs. In our exercise, the output values calculated for the matching network by the Excel sheet are C1 around 43 pF and C2 around 144 pF Assemble and measure Typically, the calculated values do not match with commercial components. The easiest way is to add components in parallel to get as close as possible to the calculated values. If we take a closer look to the kit antenna matching PCB board, the pad location is the following: We have two slots for C0 – so we can have two capacitors in parallel to achieve a better accuracy on the capacitance value we need to achieve We also have two slots for C1, for the same purpose We have two more slots for C2 soldering We also have two slots for the dampening resistor, in case we need to reduce the Q-factor of our antenna. And finally, one slot for the receiver resistor circuit. After the first component assembly, it is worth performing a field measurement to find out how accurate our matching is in reality. Typically, the measured impedance is different than the impedance calculated in the simulation. Therefore, the calculated matching components were not 100% accurate. But we knew that in advance. We were aware that we were just getting a rough approximation to the antenna parameters. As a result, a good matching is achieved after a number of iterations according to the field measurements that we obtain. As a general rule,  C1 changes the magnitude of the matching impedance and C2 changes its imaginary part. In our exercise, after soldering the first components, the equivalent impedance is around 19 Ohms but it also has a significant imaginary part. As a result, it can be fine-tuned towards better performance. We modified C1 and C2 a couple of times until we found out the final values that work better. obtaining a impedance with only real part at 22 Ohms (C1= 36pF and C2=154 pF). Adjust receiver circuit The last step of tuning our antenna is to design the receiver circuit. The Rx circuit that consists of a voltage divider and a coupling capacitor connected from the output of the EMC filter to the RX pins of the NFC reader. The objective is to set the voltage level at the reception pins to achieve the compromise between a good sensitivity. For CLRC663 plus, the serial resistor is in the range of 7 and 15 kΩ. You can start with a 11 KOhm value, then, the resistor can be adjusted depending on the voltage measured in the Rx pins. If the voltage at Rx pin is higher than 1.7 V, it is recommended to increase the resistor value and if the voltage at Rx pin is below than 1.2 V, it is recommended to decrease the resistor value. Using OM29263ADK kit to evaluate the performance of different antenna shapes The section covers how you can use the antennas included in the kit for performance comparison. Please note that this lab exercise is shown only for illustrative purposes on how the kit can be used to evaluate the performance of different antenna shapes. As an example, we defined a sample scenario where we want to characterize how the field strength decreases with distance when using antennas of different size. For that, we used the following setup: A class 1 ISO14443 Reference PICC A scope A CLRC663 board connected to the small antenna A CLRC663 board connected to the large antenna A ruler to measure the distance The measurements were taken in this way: We tuned the large and small antennas to 20 Ohms We connected the board to the laptop, and we executed the NFC Cockpit tool to control the RF field. We measured with the scope the voltage level obtained by the ISO14443 Class 1 Reference PICC while we increased the distance. Background information Before actually showing you the results, it is worth it to review a couple of antenna design principles to properly understand the results. Coupling coefficient Before actually showing you the results, it is worth it to review a couple of antenna design principles to properly understand the results. The coupling coefficient is a parameter that indicates how much of the magnetic field generated by the reader is picked up by the card. The coupling coefficient takes a value between 0 and 1 If the coupling equals 1, it means we have a perfect coupling, all magnetic field lines are picked by the card If the coupling equals 0, it means we have no coupling at all, no magnetic field lines are picked by the card The key message is that the coupling coefficient is just a geometric quantity. It depends on: The reader and card antenna dimensions (both antenna radius) Their relative position (whether in parallel or perpendicular, they will pick a different amount of magnetic field lines) The distance between them And the magnetic properties of the medium Mutual inductance Very related to the coupling coefficient, we have the mutual inductance. The mutual inductance allows us to determine the voltage induced in the card antenna, that depends on: Coupling coefficient  Better coupling, higher the voltage Driver current  The higher the current we drive in the reader antenna, the stronger the magnetic field Antenna inductance Precisely, in this setup, we are going to measure the voltage perceived by the reference PICC when using two different antennas. Antenna tuning components used for the large antenna First, we prepared a tuning of 20 Ohms in the large antenna. This task was done using the process described above. As an example, we selected a low Q-factor of 10, which helped us to accommodate high bit rates for ISO14443. In the figure below, you can see the components we assembled to tune the large antenna near to 20 Ohms. Antenna tuning components used for the small antenna Second, we prepared a tuning of 20 Ohms in the small antenna so that the results are comparable. The same Q-factor and EMC filter values were used, but obviously, as the antenna size is different, we used different C1, C2 and Rs values to achieve the same equivalent impedance OM29263ADK large antenna vs small antenna The following graph shows the results we obtained: The blue line, represents the DC output voltage obtained from the Class 1 Reference PICC as we increase the distance from the reader using the large antenna… The green line, represents the DC output voltage obtained from the Class 1 Reference PICC but using the reader with the small antenna connected. As a result, what we see is that at close distance, both antennas are able to deliver the same field strength. However, as distance increases, the RF field of the small antenna starts to attenuate quickly from 2 cm distance of the reader while the RF field of the large antenna is more or less stable until 5 cm, after that, it starts to attenuate quickly as well. Potentially, what we can conclude is that for this setup, we might be able to get more reading distance with the large antenna. ISO/IEC14443 vs ISO/IEC15693 reader - Quality factor We need to bear in mind that our antenna is not only for energy transfer, but also it should match with the waveform requirements. Therefore, from the practical point of view, the Q factor of the system is limited by the bandwidth as if we increase the Q, we increase the field strength but we decrease the bandwidth. Our reader can be optimized whether we are designing a reader for ISO14443 or ISO15693 as the signals modulation and timing requirements of the rise and fall times for both RF protocols are different. Actually, in practice, ISO15693 allows us a higher Q factor because there is a lower bandwidth requirement as the waveform timings are more relaxed and, the power transfer requirement is lower than ISO14443. For such optimization, you can refer again to NXP antenna tuning excel sheet. If you recall, one of the input fields of the excel sheet is the Q-factor. Therefore, you can introduce here a value below 30 for ISO14443 readers or below 100 for ISO15693 readers. The excel will output reasonable matching values for the first components adjustment. After that, you can do a fine tuning according to the process I explained before. Further information You can find more information about NFC in: Our NFC everywhere portal: https://www.nxp.com/nfc You can ask your question in our technical community: https://community.nxp.com/community/identification-security/nfc You can look for design partners: https://nxp.surl.ms/NFC_AEC And you can check our recorded training: http://www.nxp.com/support/online-academy/nfc-webinars:NFC-WEBINARS Video recorded session On 21 June 2018, a live session explaining this topic. You can watch the recording here: Mobile
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更新固件并擦除并重新编程 FRDM-KV31F <meta http-equiv="Content-Type" content="text/html; charset=utf-8" /> 我已经包含了批量擦除 MCU 闪存和重新编程另一个二进制文件所需的文件。 该过程显示在“ FRDM-KW31_FAT_added_2019 ”文件夹中 总结一下你... 1)使用引导加载程序模式更新调试器(按下重置并插入 USB 电缆)拖放 .sdaMSD 引导加载程序上的文件。 2)拔下并重新插入USB。通过将二进制文件拖放到虚拟大容量存储设备 FRDM-KV31 上来对 flashloader_loader_mkv31f512.bin 进行编程,当您将 USB 电缆从 FRDM-KV31 插入 PC 时,该设备就会出现。 3)打开 CMD 提示符窗口并导航到文件解压缩到的文件夹。 4)使用设备管理器确定COM端口 5)从 CMD 提示符运行批处理文件 Erase_KMS_program_bubble.bat COMX <meta http-equiv="Content-Type" content="text/html; charset=utf-8" /> 我已经包含了批量擦除 MCU 闪存和重新编程另一个二进制文件所需的文件。 该过程显示在“ FRDM-KW31_FAT_added_2019 ”文件夹中 总结一下你... 1)使用引导加载程序模式更新调试器(按下重置并插入 USB 电缆)拖放 .sdaMSD 引导加载程序上的文件。 2)拔下并重新插入USB。通过将二进制文件拖放到虚拟大容量存储设备 FRDM-KV31 上来对 flashloader_loader_mkv31f512.bin 进行编程,当您将 USB 电缆从 FRDM-KV31 插入 PC 时,该设备就会出现。 3)打开 CMD 提示符窗口并导航到文件解压缩到的文件夹。 4)使用设备管理器确定COM端口 5)从 CMD 提示符运行批处理文件 Erase_KMS_program_bubble.bat COMX
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wxWidgetsベースの分散情報および制御システム <meta http-equiv="Content-Type" content="text/html; charset=utf-8" /> そこで開発されたのは、i.MX53+Linuxを使用したコントローラーです。 分散情報・制御システムを構築するためのソリューションを開発しました。 Prototmpyは1年以上運用されています。 例: - 制御電磁攪拌(ミキサー) http://ontecom.com/en/catalog/ems /ルサール、クラスノヤルスク。 - ポンプ場の管理と管理。 - 気候制御システムの監視と制御。 スマートホームシステムやIoTを作ることができます。PLC(Power Line Communication)Qualcomm/Atherosの経験があります。 余暇には、PLC(電力線通信)制御/監視コンポーネントのスマートホーム用の予算ソリューションを開発しています。 標準IEC 61131-3に基づいて開発されたソフトウェア-分散情報管理システム。 解決策はクロスプラットフォームです。単一のシステムには、異なるアーキテクチャとさまざまなオペレーティングシステムのコンピューターが含まれる場合があります。 このような信号は、ARM/Linuxの同期コントローラ、およびx86サーバ(Win、Linux、VMSなど)です。 wxWidgets を使用します。 このテーマに関する記事は、ロシア語です。
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BD-SL-i.MX6 运行 Qt 5.4(Qt 公司出品) <meta http-equiv="Content-Type" content="text/html; charset=utf-8" /> BD-SL-i.MX6 以前称为 SABRE Lite 板,是一种低成本的 i.MX6 开发平台。该主板的最佳特性之一是其提供的强大软件支持。这篇文章介绍了 QT 公司的 Qt5.4。下面的视频展示了Qt 公司的企业设备创建产品,这是一个针对 Qt 优化的预构建软件堆栈,可让您立即开始在真实设备上进行嵌入式 Linux 和 Android 开发的原型设计。该演示运行 Qt5.4,并且该图像可用于 BD-SL-i.MX6 以及我们的 Nitrogen 系列产品。以下是一段简短的视频,展示了部分功能: 上面的视频展示了为嵌入式 Linux 创建的图像,更具体地说,是使用Yocto 项目和飞思卡尔社区 BSP 的工具构建的。因此,您的产品可以利用这些项目提供的软件包,并且您可以使用 Yocto 构建系统来集成您的组件并定制您的构建。 有关更多详细信息,请访问http://qt.io或http://boundarydevices.com/qt-for-device-creation/ 概述
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关于Keil 无法正确下载程序问题的总结   当我们在使用Keil 时,经常会遇到无法下载程序的问题,以下对两种常见的情况进行总结:    1. 在我们需要将某工程代码移植到同系列其他型号器件上使用时,如果只是更改了器件型号,这时可能会导致无法正确下载。需要注意的是不仅要在Device中更换型号,还需要在Flash Download栏中选择正确的flash loader 并且设置正确的RAM起始地址。   举个例子:假设我们需要将FRDM_KL26的Sample code中的hello_world工程移植到256K flash的KL26上使用。打开FRDM_KL26的Sample code中hello_world工程,我们可以看到Device中器件为MKL26Z128xxx4,        在Target中可以看到Flash和RAM的起始地址和大小信息。          如果使用Jlink调试接口,选择J-LINK/J-TRACE Cortex  ,之后选择Setting,可以看到flash loader的相关信息。         将此工程移植到到256K flash的器件上,我们需要做的事情是:      在device中进行修改,选择MKL26Z256xxx4               在Target中可以看到这时flash和RAM的起始地址和大小信息已经自动做了更改。不需要再手动修改了。         但是在Flash Download中的设置还是之前的设置,并没有改变。           所以这时是无法正确下载程序的,需要我们手动去修改这里的两处配置。     一是 RAM for Algorithm中的Start应该设置为0x1FFFE000(从Target栏中可以获取该值),Size不用更改。      二是Program Algorithm 删除掉128k的flash loader ,添加256K的flash loader。       2.第二种可能遇到的情况是:本来可以正常下载的程序当复制到另外一台电脑时就无法正常下载了。遇到这种现象时,需要检查一下Flash Download中的相关配置是否正确,很可能会遇到 Program Algorithm中flashloder为空的情况,发生这种情况的原因可能是两个电脑的Keil版本不同,所以flash loader所在路径就会不同,这样flash loader就会变成空白,这时需要自己手动添加一下即可。
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[不正行為] 投稿者: @RishavKaaraTech / 掲示板: TapLinx-SDK / 報告者: wtgrre wtgrre は、 @RishavKaaraTech が投稿した 「RFIDDiscover ツールを入手したが、その使い方はわからない」という 投稿を以下の理由で報告しました。 理由:裸体または性行為 詳細: 購入ロゲイン・ハミルトン canロゲインを注文します 5mgのコスト ロゲイン60ml ロゲインタブレット配信 ロゲインを次に買う場所 ロゲイン100mg オンライン薬局 ロゲイン最も安い井戸を購入する 母乳育児 ロゲインを購入する ロゲインを購入したい ロゲイン処方薬に関する情報 ロゲインの購入方法 ロゲインの注文方法 購入ロゲイン医薬品の迅速配送 購入ロゲイン ノバスコシア acロゲインの費用 最も安いロゲイン PayPal アメリカン・エキスプレス ロゲインを購入したい 検索ロゲイン処方箋不要 カーマーゼンシャー ロゲインの購入方法 インフラ株価 ロゲイン2 どこで次のロゲインを購入する 薬局ロゲインロイズクーポン2 薬局ロゲインロイズクーポン2 購入ロゲイン医薬品の迅速配送 ロゲイン120 価格 5 最安値のロゲイン、送料無料 購入ロゲイン ノバスコシア コストロゲイン30mg ジェネリックミノキシジル ロゲイン グリーンスボロ ロゲインを次に購入する場所 ロゲインオンライン薬局(処方箋不要) ロゲインタブレット端末の配送 薬局ロゲイン ロイズ クーポン 2 次へロゲインの当日配送 安いロゲイン オンライン ロゲイン錠剤の配送 ロゲインを購入したい ac cost rogaine コストロゲイン30mg otcミノキシジル ロゲイン ソリハルでの費用 投稿リンク: https://community.nxp.com/t5/TapLinx-SDK-TagWriter-and/RFIDDiscover-tool-acquired-but-how-to-use-it/mp/2164324#M205 投稿者: @RishavKaaraTech |作成者に電子メールを送信する 報告者: wtgrre |メールによる報告 報告された投稿には3件の返信があります。
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how to change mode to 8g on MMA8451Q? Hello, i´m using accelerometer MMA8451Q on LFSTBEB3110 sensor kit. after testing i want to change the mode to 4g oder better 8g but i don´t know how. i read that i have to use code warrior and change something in the registers but i have neither the knowledge nor the devices for connecting and programming the kit. so my question is, do some options exist like switch a jumper or change settings in the toolbox? thank you for helping stefan Re: how to change mode to 8g on MMA8451Q? hey Jose, thank you for your help. so I will test the other evaluation kit you recommend. ciao Re: how to change mode to 8g on MMA8451Q? Hi Stefan, Unfortunately no, the designers of the SW GUI for this kit didn’t added the function to change g range or the registers values, and it is not possible to do this change via Hardware, so, the only way to change it from 2g to 4g or 8g would be programming the board externally via Code Warrior. If you do not have access to Code Warrior, and you need to check the full functionality of the Accelerometer MMA845x Family, then I would recommend you to get the LFSTBEB845X Evaluation kit compatible with Sensor Toolbox GUI: https://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=LFSTBEB845X In the following User Guide, you can find all the windows and features available for this kit: http://cache.freescale.com/files/sensors/doc/user_guide/MMA845xQSTUG.pdf Regards, Jose Re: how to change mode to 8g on MMA8451Q? Hello, Thank you for your post, however please consider moving it to the right community place (e.g. Sensors) to get it visible for active members. For details please see general advice Where to post a Discussion? Thank you for using Freescale Community.
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