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NOTE: Always de-power the target board and the aggregator when plugging or unplugging smart sensors from the aggregator. NOTE: See this link to instrument a board with a Smart Sensor. Overview The i.MX Power Profiler system consists of one to fourteen "smart" current sensors, an aggregator shield, and a Kinetis FRDM board (the FRDM-KL25 has been used in prototyping but the FRDM-K64F and FRDM-K66F should also be fully compatible). One of the biggest improvements of this system over its preceeding dual-range measurement system is that the microcontroller on each sensor board allows near-simultaneous measurement of all instrumented rails on a board. The dual range profiler has only a single MCU for all sensors, so only one measurement can be made at a time.  It is intended to be used to instrument one to fourteen rails of a target i.MX appliation board. Ideally, the target board will have been designed with a matching/mating power sense footprint for each rail to be measured.  Each smart sensor can sense current in three ranges with three current sense amplifiers. They are "smart" because each sensor board has a Kinetis KL05Z on it to control the switching FETs and to digitize the analog signals (the sense amplifier outputs and the target's power supply rail voltage). A 1% voltage regulator on each smart sensor provides a good voltage reference right next to the KL05Z to ensure better ADC accuracy. Each smart sensor board communicates via I2C. The aggregator shield has three I2C bus extenders (PCA9518) which essentially provide a dedicated I2C bus for each of the connected smart sensors. The FRDM board's I2C is also connected to one of the bus extenders ports. Individual GPIO lines are routed to each smart sensor's connected along with a ganged reset and trigger line for all of the connected smart sensors. A boost regulator generates almost 12V from the FRDM board's 5V supply, which is used for all the switching FETs on the smart sensor boards. The FRDM board's 5V rail is also routed to each smart sensor, which is regulated down to 3.3V locally on each connected smart sensor. Here is a photo of the very first prototypes after moving to 10-pin 0.05" spaced headers and ribbon cables instead of FFC: The smart sensor is intended to mate with through-hole current sense tap points on the target i.MX application board. Three holes spaced at 0.05" each. When not instrumented with sensor, a short needs to be placed across the outer two pins so that the board will function normally. The through hole connections provide physical protection to the target board, keeping traces from getting ripped off. The ground connection in the center provides a reference for meauring the rail voltage on the target board. A partial layout example of the implementation of the current sense footprint is below, where two 0805 shorting resistors in parallel are placed on each side of the holes. The top trace connects to the regulator output and the bottom to the load, usually an i.MX power supply rail. To include the current sense footprint into a board during the design phase, it should be configured as in the following partial schematic:  Every effort should be made to place the feedback on the i.MX side of the sense points so that the regulator compensates for the additional series resistance of the smart sensor, which effectively eliminates the additional series resistance the smart sensor adds. The Feedback should be before the smart sensor if the switching supply won't tolerate the additional series resistance (i.e., output becomes unstable).
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Instrumenting A Board To instrument a board, the connection between the power supply and the target device needs to be broken, usually via a series resistor that's placed on the board. Sometimes the inductor needs to be lifted if no series resistor was included on the rail by the board's designer. In the ideal case, through-hole connections were also provided on the board for the connection of these off-board sensors. Here are three close-up photos that show several boards that have been instrumented: In all three cases, the sensors stand in place via the two outer current carrying wires. The middle and right used insulated wires where as the one on the left used bare wires. In all three cases, the sensor's + connection needs to go towards the power supply and the - connection goes to the target device. The outer wires here are 24-26 gauge. (The relatively heavy gauge wire is used to keep the series resistance of inserting a smart sensor to a minimum.) The ground connection is the middle hole of the smart sensor. In the left and middle photos, a 30 gauge wire connects to the middle hole ground connection on the  board. In the right photo, the ground wire was more conveniently added to a big cap just below the bottom of edge of the photo. Here are wider angle view photos of two of the boards above: The sensors on the left are free-standing since the current carrying wires are stiff enough to hold them upright. Care must be taken since too much flexing will cause a wire to break. Too much bending can also cause a short to the board (and that's why insulated wires were used on these boards). The board on the right has the sensors laying parallel to the board. They are not affixed to the board, but a wire is wrapped around the bundle of ribbon cables out of view past the right edge of the photo. For boards without the through hole connections, the smart sensors need to be immobilized to keep from pulling the SMT pads off the board. If there is room on the board or sides of connectors or large components, the sensors may be attached down with foam double-sticky tape (see photo below, sensor affixed on top i.MX7ULP): For boards where there are no convenient unpopulated areas or there are too many sensors, some other means needs to be devised to immoblize the smart sensors. In the left photo below, two inductors per sensor have been flipped and the two sensors inserted to instrument the two rails. The solder pads on the inductors would easily be broken off by any movement of the smart sensors, so a cage with clamps to hold the ribbon cables was 3D printed. On the back side, there is room for the aggregator to be zip tied to the bottom plate, so the instrumented board can be moved as a single unit with minimal flexing of the ribbon cables.
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It is one mandatory patch if you are in the case: The chip you are using is imx6sx TO1.3 and newer, and use the kobs-ng to flash your image to the Nand memory chip. If you are using MFG, you also need rebuild the kobs-ng, and update the binary into your MFG tool.  The patch have been integrated into the default release yocto_4.1.15, but if you are using the older version release before yocto_4.1.15, please make sure you have integrated the modification when you need to use kobs-ng to flash the image to Nand memory chip. commit 5ecf08703da489a3bd317341f630870a3d07dab9 Author: Han Xu <han.xu@nxp.com> Date:   Thu Jan 28 14:40:14 2016 -0600     MMT-105: change the i.mx6sx revision check change the i.mx6sx revision check since v1.3 uses v1.2 boot config as well.     Signed-off-by: Han Xu <han.xu@nxp.com>     (cherry picked from commit 1dac0c14d1e2016c2fa804f6628543d8d238c680) diff --git a/src/plat_boot_config.c b/src/plat_boot_config.c index 461675a..e1ef6f3 100644 --- a/src/plat_boot_config.c +++ b/src/plat_boot_config.c @@ -1,5 +1,5 @@ /* -* Copyright (C) 2010-2015 Freescale Semiconductor, Inc. All Rights Reserved. +* Copyright (C) 2010-2016 Freescale Semiconductor, Inc. All Rights Reserved. */ /* @@ -256,10 +256,12 @@ int discover_boot_rom_version(void)                                         }                                         fgets(line_buffer, sizeof(line_buffer), revision);                                         if (!strncmp(line_buffer, "1.0", strlen("1.0")) || -                                                       !strncmp(line_buffer, "1.1", strlen("1.1"))) +                                                       !strncmp(line_buffer, "1.1", strlen("1.1"))) {                                                 plat_config_data = &mx6sx_boot_config; -                                       if (!strncmp(line_buffer, "1.2", strlen("1.2"))) +                                       /* all other revisions should use the latest boot config */ +                                       } else {                                                 plat_config_data = &mx6sx_to_1_2_boot_config; +                                       }                                 }                                 if (!strncmp(line_buffer, plat_imx6ul, strlen(plat_imx6ul))) How to apply it to older version quickly:  Apply the patch and rebuild the kobs-ng in yocto_3.14_x environment: bitbake -c compile -v -f imx-kobs cd tmp/work/cortexa9hf-vfp-neon-poky-linux-gnueabi/imx-kobs/5.0-r0/imx-kobs-5.0 git apply yocto_3_14_x.patch bitbake -c compile -v -f imx-kobs you can find the new binary “kobs-ng” under “tmp/work/cortexa9hf-vfp-neon-poky-linux-gnueabi/imx-kobs/5.0-r0/build/src” Apply the patch and rebuild the kobs-ng in yocto_3.10_53 environment: . ./setup-environment build bitbake -c compile -v -f imx-kobs cd tmp/work/cortexa9hf-vfp-neon-poky-linux-gnueabi/imx-kobs/3.10.53-1.1.0-r0/imx-kobs-3.10.53-1.1.0 git apply yocto_3_10_53patch bitbake -c compile -v -f imx-kobs you can find t he new binary “kobs-ng” under tmp/work/cortexa9hf-vfp-neon-poky-linux-gnueabi/imx-kobs/3.10.53-1.1.0-r0/imx-kobs-3.10.53-1.1.0/src As one alternation method, you also can download the whole imx-kobs-5.4 package which yocto_4.1.15 is using to build. wget http://www.freescale.com/lgfiles/NMG/MAD/YOCTO//imx-kobs-5.4.tar.gz
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-343761 
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Important: If you have any questions or would like to report any issues with the DDR tools or supporting documents please create a support ticket in the i.MX community. Please note that any private messages or direct emails are not monitored and will not receive a response. i.MX 6/7 Family DDR Stress Test  The i.MX6/7 DDR Stress Test Tool is a PC-based software to fine-tune DDR parameters and verify the DDR performance on a non-OS, single-task environment(it is a light-weight test tool to test DDR performance). It performs write leveling, DQS gating and read/write delay calibration features. The tool described on this page cover the following i.MX 6/7 series SoCs: i.MX 6DQP (Dual/Quad Plus) i.MX 6DQ (Dual/Quad) i.MX 6DL/S (Dual Lite/Solo) i.MX 6SoloX i.MX 6SL i.MX 6SLL i.MX 6UL i.MX 6ULL/ULZ i.MX 7D/S i.MX 7ULP Note that the DDR Stress test tool supports the all of the above i.MX SoCs, however, some of the supported i.MX SoCs named in the tool support multiple i.MX SoCs as follows: MX6DQ – when selected, this supports both i.MX 6DQ and i.MX 6DQP (Plus) MX6DL – when selected, this supports both i.MX 6DL and i.MX 6S (i.MX 6DLS family) MX6ULL – when selected, this supports both i.MX 6ULL and i.MX6 ULZ MX7D – when selected, this supports both i.MX 7D and i.MX 7S The purpose of the i.MX 6/7 series DDR Tools is to enable users to generate and test a custom DRAM initialization based on their device configuration (density, number of chip selects, etc.) and board layout (data bus bit swizzling, etc.). This process equips the user to then proceed with the bring-up of a boot loader and an OS. Once the OS is brought up, it is recommended to run an OS-based memory test (like Linux memtester) to further verify and test the DDR memory interface. The i.MX 6/7 series DDR Tools consist of: DDR Register Programming Aid (RPA): i.MX 6/7 Series DDR Tool Release DDR Stress test: Described below There are three options to run the DDR Stress test. Each of these options are provided in the attached zip files. The following is a high-level overview of each option along with the naming convention of the associated zip file: Option 1 GUI based: Run the GUI executable and connect your board to the host PC via USB Archive file: ddr_stress_tester_vX.xx.zip The tool will first need to run a DDR initialization script for the specified i.MX SoC (refer to Load Init Script in the GUI tool).  Example initialization scripts based on NXP's development boards can be found in this zip file under the script folder.  Note, these scripts may need to be modified for your custom board and memory.   Option 2 DDR Stress Tester: JTAG Interface A hardware debugger connected to the board via the JTAG interface is used to download an elf file into the i.MX SoC OCRAM (internal RAM) and then begin execution. Results are shown on the UART serial port (115200-8-n-1). Archive file: ddr_stress_tester_jtag_vX.xx.zip As with the GUI tool, the JTAG/debugger option will first need to run a DDR initialization script for the specified i.MX SoC. Refer to the GUI tool description above for the location of the example scripts (which are found in the ddr_stress_tester_vX.xx.zip file). Note that the scripts are available either in the RealView ICE format (.inc file) or the DS-5 DSTERAM format (.ds). For other debuggers, the user will have to modify the script's command syntax for their specific debugger. This is also true if converting from a RealView Ice (.inc) format to a DS-5 DSTREAM (.ds) format and vice versa. The DDR Stress Tester executable (starting with V2.20) has an auto UART detection feature. If a different UART port for the serial console has been chosen than used on the NXP development tool (EVK, SABRE) specific commands can be added to the DDR initialization script that allows you to configure for the specific UART and then load and run the elf executable. Refer to the FAQ section of this community post and the txt file found in the JTAG archive file for instructions.   Option 3 U-Boot: The boot loader u-boot is running and commands in u-boot are used to download the bin file into SoC OCRAM and begin execution. Results are shown on the UART serial port (115200-8-n-1) Archive file: ddr_stress_tester_uboot_vX.xx.zip When downloading the DDR Stress Tool by u-boot, please copy the ddr-test-uboot-jtag-mxxxx.bin to SD card and load it to IRAM using the 'fatload' u-boot command (see notes below when using newer versions of u-boot). For i.MX6, please load the binary to 0x00907000. For i.MX7D, please load the binary to 0x00910000.  It is imperative to first disable the I and D cache in u-boot as shown below as the DDR Stress Test re-configures and re-enables the cache and MMU page table. While this option allows the user to load and run the DDR stress test from u-boot, NXP highly recommends executing the GUI based version for system testing and debugging. The u-boot version is considered a “last resort” for systems in production which may not have USB or JTAG connectivity. The reasons behind this stance are: In the GUI version, the system starts “clean” and uninitialized, whereas u-boot initializes many SoC features outside the knowledge of the DDR stress test and may conflict with the stress test operation When running the u-boot version, the test will overwrite the contents of u-boot residing in DDR, hence the test will overwrite any data in DDR. Once the stress test is loaded and executed, u-boot itself will no longer be accessible. To return to the functionality of u-boot, a system re-boot is required. Newer versions on u-boot do not allow a direct loading of the DDR stress test code from the SD card (boot media) directly to the SoC internal OCRAM (aka IRAM). Hence, the procedure is updated to first load the DDR stress test code into DDR and then copy into OCRAM, as shown in the procedure below: u-boot> dcache off;icache off;fatload mmc 2:1 0x12000000 ddr-test-uboot-jtag-mx6dq.bin;cp.b 0x12000000 0x00907000 0x20000;go 0x00907000 As u-boot initializes many peripherals that may conflict with the operation of the DDR stress test, it is necessary to clock gate these peripherals prior to running the DDR stress test. Hence, it is highly recommended to augment the procedure above as follows: u-boot> dcache off;icache off;fatload mmc 2:1 0x12000000 ddr-test-uboot-jtag-mx6dq.bin;cp.b 0x12000000 0x00907000 0x20000; u-boot> mw 0x020c4068 0x00C0000F; u-boot> mw 0x020c406c 0x00000000; u-boot> mw 0x020c4074 0x3F300000; u-boot> mw 0x020c4078 0x0000F300; u-boot> mw 0x020c407c 0x0F000003; u-boot> mw 0x020c4080 0x000003FC; u-boot> go 0x00907000 Note, in the above procedure, it is recommended to write to each clock gate register in separate commands (refer to commands starting with “mw”). The SoC requires a finite amount of time to gate each clock hence performing this sequence with a new command line write ensures the SoC has time to gate the intended clocks.   Stress Test Revision Features Comments 3.00 Add i.MX 7ULP support in the GUI version Known issues: USB connection is unstable when under USB HUB or some PC environments 2.92 Minor correction with write leveling calibration code error check to avoid a corner case of flagging an error when none have occurred.    2.91 Resolved issue with write leveling calibration code where a race condition in the code may result in the calibration routine not being able to find any delay values.   Only applies to MX6 series SoCs that support DDR3.  2.90 Reserve write delay line register (MMDC_MPWRDLCTL) configuration as DDR script does when do write calibration. In previous releases, MMDC_MPWRDLCTL would be changed to 0x40404040 by default.      * Further details available in the release notes  _________________________________________________________________________________________________________________________________________    FAQ   Q. I see an error message that states "ERROR: DCD addr is out of valid range.", why is this and how do I resolve?   A. Sometimes, when using the register programming aid, there are registers writes that are not supported in the DCD range.  Try looking for the following items and comment them out from the DDR initialization script: wait = on setmem /16 0x020bc000 = 0x30 // disable watchdog (note the address for this may be different between i.MX6x devices)  Q. How do I select the "DDR Density" pull-down menu and what is the purpose of this?   A. The DDR Density pull-down menu gives the user the option of testing a DDR density smaller than what they actually have on their board.  The advantage of doing this is to speed up test time to allow the user to perform a "quick test" of their system.  IMPORTANT: it is imperative that the user not set this value higher than the supported density on their board, doing so will cause the stress test to fail and/or lock up. The DDR Density has a different meaning depending on the memory type being tested (DDR3 or LPDDR2): For DDR3, this is the density per CHIP SELECT.  So if your board has two chip selects, and each chip select has 512MB, you would simply select 512MB or lower.  The default setting will simply set this to the detected density per chip select. For LPDDR2, this is the density per CHANNEL.  This is only relevant for MX6 devices that support 2 channel LPDDR2 memories (MX6DQ, MX6DL).  For other MX6 devices that support only one LPDDR2 channel, then this is the total density (for the maximum setting) for that channel. Note that for LPDDR2, the number of chip selects (per channel) is irrelevant when selecting the density to test as the stress test combines both chip-selects into one combined density per channel.  For example, lets say you have a 2GB LPDDR2 device, which 2 channels and 2 chip-selects per channel.  That means you have 512MB per chip select, per channel.  Or, it also means you have 1GB per channel when combining both chip selects per channel.  In this case, you would choose (a maximum setting of) 1GB in the DDR Density drop down menu.  However, this is also the same setting as the default setting (which you are welcome to still choose 1GB to convince yourself that 1GB per channel is indeed being tested). Now let's assume you have only one channel (LPDDR2) and one chip select, with a density of 128MB; in this case, the maximum DDR Density you can select is 128MB. Let's assume you have one channel and two chip selects, each chip select is 128MB;  in this case, the maximum DDR Density you can select is 256MB (a combination of both chip selects).   Note, for the MX7D, an actual density needs to be entered. For the MX6x series, simply leaving this field as Default will cause the DDR stress test to ascertain the supported density from the DDR init script. As the MX7D DDR controller is different, this feature is not supported, hence it is required for the user to enter an actual density (for more details regarding MX7D usage of density and number of chip-selects, see the next FAQ on the DDR CS setting).   Q.  What is the purpose of the "DDR CS" pull-down option?   A.  The answer depends on which processor you are testing:   For the i.MX 6x series: This pull down menu gives you the option of testing one chip select (CS0) or ALL (both) chip selects *IF* you have a two-chip select configuration.  If you have a two-chip select configuration, then this allows you to test only one chip select for faster test time; else you can choose to test both chip selects.  Note that if you have a one-chip select configuration and you choose "ALL", the stress test will return an error.   For the iMX 7D: Because the MX7D DDR controller is different, the DDR stress test will need the user to supply the entire supported density found on their board. The chip select field should be left as is (0) as the test will naturally test one chip select to the next. For example, let’s assume you are using two chip selects, with each chip select being 512MB. In this case, you would enter 1GB for the DDR Density field ensuring that both chip selects will be tested. The user is allowed to enter a density less than the density found on their board (for quicker testing), but keeping in mind both chip selects may not be tested in this case.   Q. I run DDR calibration using the DDR Stress Test Tool to obtain the calibration results.  Are these calibration parameters are written to the uboot flash_header.S automatically or manually?   A. The calibration values obtained from the DDR Stress Test Tool will need to be manually updated in the flash_header.S file or any other DDR initialization script.   Q. When running the DDR stress test on MX7D and I try to perform calibration, I get an error stating that calibration is not supported, is this expected?   A. Yes, calibration is not supported or needed when using MX7.  The reason is, MX7 uses a different memory controller than the MX6 series.  The MX6 series memory controller has built-in support for calibration where the MX7 memory controller does not.   Q. When running the GUI version of the DDR stress test, on MX7 and I leave DDR Density as default, I get an error in the tool stating I must supply a density.  Why is this?   A. This is due to the fact that MX7 uses a different memory controller than the MX6 series.  In the MX6 series, it was possible to calculate the memory density from the memory controller register settings.  The MX7 memory controller is different and does not lend itself to easily calculate the supported density based on the register settings.  Instead, the user should verify the density on their board and selected this value in the DDR Density pull-down menu.    Q. I noticed that when I run write-leveling calibration I sometimes see a note that due to the write-leveling calibration value being greater than 1/8 clock cycle that WALAT must be set to 1.  What does this mean?   A. In the MMDC chapter of the reference manual for the specific i.MX 6 device, the need to set WALAT is described in the MDMISC register as follows: "The purpose of WALAT is to add time delay at the end of a burst write operation to ensure that the JEDEC time specification for Write Post Amble Delay (tWPST) is met (DQS strobe is held low at the end of a write burst for > 30% a clock cycle before it is released). If the value of any of the WL_DL_ABS_OFFSETn register fields are greater than ‘1F’, WALAT should be set to ‘1’ (cycle additional delay). WALAT should be further increased for any full-cycle delays added by the WL_CYC_DELn register fields." Therefore, if the write-leveling calibration routine detects any write-leveling delay value greater than 0x1F, it will note to the user that WALAT must be set and the user should update their DDR3 init script to ensure WALAT is set.  Sometimes, a user may find that the write-leveling delay value may fluctuate from one run to the next, which is quite normal.  If it is found that this delay is "borderline" meaning sometimes it is greater than 0x1F and sometimes it might be slightly less, then it is ok to go ahead and set WALAT permanently in your init script as there is no harm in doing so and will ensure you will stay within JEDEC's tWPST.   Q. I sometimes see that after running write-leveling calibration that delay values being reported back are zero'd out (0x00), and then at times I see a non-zero value being reported, why is this? A. It is quite normal to see slight variations in the delay value between write-leveling calibration runs.  The write-leveling calibration routine assumes a majority of users have designed their board such that the DDR3 memories are placed close to the i.MX 6 SoC. There’s a mechanism in NXP’s DDR Stress test write leveling calibration code that checks the returned write leveling value. If the write-leveling calibration routine detects that the returned delay value is greater than ¾ of a clock cycle, it will "zero out" the delay value. It does this because it assumes that such a large delay result is due to the fact that the DQS signal is already delayed relative to the SDCLK, and to align DQS with SDCLK requires the calibration routine to delay DQS even further to align it to the next SDCLK edge, something we ideally would like to avoid.  JEDEC specs that the DQS edge must be within 25% of a SDCLK cycle with respect to the SDCLK edge, so having DQS initially slightly delayed from SDCLK is actually ok, hence why the calibration routine “zero’s” this out when the returned value exceeds ¾ of a clock cycle.  In cases like this, the DQS edge and SDCLK edge are so close together that in some calibration runs, the DQS edge may slightly precede SDCLK (resulting in a very small write-leveling delay value) and other runs, it may be slightly delayed relative to the SDCLK (resulting in a very large write-leveling delay value that will try to align DQS to the next SDCLK edge, hence needs to be zero’d out).   Q. When using the JTAG version of the DDR stress test, how can I select a different UART port for my serial port?   A. Under the folder ddr_stress_tester_jtag_v2.52, there's a text file that describes how to add a different UART port by adding a few additional commands to your DDR init script.  The following is an outline of these commands: 1. Ungate UART module clocks (most NXP scripts ungate all of the peripheral clocks at the beginning of the script, so this part is already done) 2. Configure the IOMUX options for the pins you wish the UART to use (normally an IOMUX option for UART_TX and UART_RX, and a daisy chain option for the UART_RX input) 3. Enable the desired UART module via the register UCR1, bit UART_EN 4. Disable other UART modules (UCR1[UART_EN] = 0).  Normally disabling UART1 should be sufficient, but it doesn't hurt to disable all of the other un-used UART options for the purpose of the stress test.   Here's an example in the .ds file vernacular of a set up as follows: MX6DQ, UART4 on KEY_COL0 and KEY_ROW0 (assume clock is ungated to all peripherals): mem set 0x020E01F8 32 0x00000004   #// config_pad_mode(KEY_COL0, ALT4) mem set 0x020E01FC 32 0x00000004   #// config_pad_mode(KEY_ROW0, ALT4); mem set 0x020E0938 32 0x00000001   #// Pad KEY_ROW0 is involved in Daisy Chain. mem set 0x02020080 32 0x00000000   #//disable UART1 in UART1_UCR1 (Note, you can disable other UART modules as well) mem set 0x021F0080 32 0x00000001   #//enable UART4 in UART4_UCR1   Here's another example in the .inc file vernacular of a set up as follows: MX6SX, UART5 on SD4_DATA4 abd SD4_DATA5 (assume clock is ungated to all peripherals): setmem /32 0x020E0294 = 0x2 //IOMUXC_SW_MUX_CTL_PAD_SD4_DATA5, ALT2; UART5_TX_DATA setmem /32 0x020E0290 = 0x2 //IOMUXC_SW_MUX_CTL_PAD_SD4_DATA4, ALT2; UART5_RX_DATA setmem /32 0x020E0850 = 0x00000000 // IOMUXC_UART5_IPP_UART_RXD_MUX_SELECT_INPUT, daisy chain for UART5_RX input to use SD4_DATA4 setmem /32 0x021F4080 = 0x00000001 // Enable UART_EN in UCR1 of UART5 // Disable UART_EN in UCR1 of UART1, UART2, UART3, and UART4 setmem /32 0x02020080 = 0x00000000 // UART1 setmem /32 0x021F0080 = 0x00000000 // UART2 setmem /32 0x021EC080 = 0x00000000 // UART3 setmem /32 0x021E8080 = 0x00000000 // UART4     Related Resources Links: iMX 8M Mini Register Programming Aid DRAM PLL setting  i.MX 8/8X Series DDR Tool Release  i.MX 8M Family DDR Tool Release 
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The following document contains a list of document, questions and discussions that are relevant in the community based on amount of views. If you are having a problem, doubt or getting started in i.MX processors, you should check the following links to see if your doubt is in there. Yocto Project Freescale Yocto Project main page‌ Yocto Training - HOME‌ i.MX Yocto Project: Frequently Asked Questions‌ Useful bitbake commands‌ Yocto Project Package Management - smart  How to add a new layer and a new recipe in Yocto  Setting up the Eclipse IDE for Yocto Application Development Guide to the .sdcard format  Yocto NFS &amp; TFTP boot  YOCTO project clean  Yocto with a package manager (ex: apt-get)  Yocto Setting the Default Ethernet address and disable DHCP on boot.  i.MX x Building QT for i.MX6  i.MX6/7 DDR Stress Test Tool V3.00  i.MX6DQSDL DDR3 Script Aid  Installing Ubuntu Rootfs on NXP i.MX6 boards  iMX6DQ MAX9286 MIPI CSI2 720P camera surround view solution for Linux BSP i.MX Design&amp;Tool Lists  Simple GPIO Example - quandry  i.MX6 GStreamer-imx Plugins - Tutorial &amp; Example Pipelines  Streaming USB Webcam over Network  Step-by-step: How to setup TI Wilink (WL18xx) with iMX6 Linux 3.10.53  Linux / Kernel Copying Files Between Windows and Linux using PuTTY  Building Linux Kernel  Patch to support uboot logo keep from uboot to kernel for NXP Linux and Android BSP (HDMI, LCD and LVDS)  load kernel from SD card in U-boot  Changing the Kernel configuration for i.MX6 SABRE  Android  The Android Booting process  What is inside the init.rc and what is it used for.  Others How to use qtmultimedia(QML) with Gstreamer 1.0
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From iMX 3.1x kernel, all kernel debug messages will be print to debug serial port after UART driver loaded, so if the kernel hang up before tty console driver ready, there will be no kernel boot up messages.   The attached patch can be used to enable the iMX serial debug console in early time, then kernel will not buffer the debug messages.   Note: the default patch is for UART1 (tty0) as the debug port, if you need use other debug port, please modify the code "early_console_setup()" with correct UART port base address.   L3.10.53-Add-early-console-for-debug-message.patch This patch is based on L3.10.53_GA1.1.0 release, it can support iMX6S/DL/D/Q.   L3.14.52-Add-early-console-for-debug-message.patch This patch is based on L3.14.52_GA1.1.0 release, it can support iMX6S/DL/D/Q, iMX6SL, iMX6SX, iMX6UL and iMX7.  
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-342833 
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-343273 
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-344336 
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NOTE: Always de-power the target board and the aggregator when plugging or unplugging smart sensors from the aggregator. NOTE: See this link to instrument a board with a Smart Sensor. This page documents the triple-range "smart" current sensor that's part of a larger system for profiling power on application boards. The smart sensor features a Kinetis KL05Z with three current sense amplifiers. It allows measurement currents in three ranges. Four assembly options allow measurement of rail voltages 0-3.3V (two overall current ranges), 0-6.6V, and 12V. It connects to an aggregator, which powers, controls and aggregates data from a number of smart sensor boards. One of the biggest improvements over the older dual-range measurement system is that the on-sensor microcontroller allows near-simultaneous measurement of all instrumented rails on a board. The dual range profiler can only make one measurement at a time.  These are intended to be used with a microncontroller board to act as a trigger and data aggregator. This aggregator could also be used to reprogram the sensors.  The series resistance added by the smart sensor when in run mode (highest current range) is under 11 milliOhms as measured with 4-point probes and a Keysight B2902B SMU.  A "power oscilloscope" can be made by triggering measurements at regular intervals and presenting the results graphically.... Schematic: Board Layout, Top: Board Layout, Bottom: Here's a photo of two with a nickel is included to show scale. The board measures about 0.5 by 1.3 inches. Connections: The smart sensor header connections are: 5V: powers the 3.3V regulator, which in turn powers everything else on the sensor board 12V: all the gates of all the switching FETs are pulled pulled up to 12V GND: ground connection SCL/TX: I2C clock line  SDA/RX: I2C data line  SWD_CLK:  line for triggering smart sensors to make measurements RESET_B:  line for resetting the smart sensor board SWD_IO: select line for the smart sensor Theory of operation: Three shunts and current sense amplifiers are used to measure current in three ranges. One shunt/sense amp pair has a 0.002Ω shunt integrated into the IC package (U1, INA250). The other two sense amps (U2 and U3, INA212) require an external shunt.  FETs Q1, Q2,  and Q3 are used to switch the two lower range shunt/sense amp pairs in and out of circuit. In normal run operation (highest current range), Q1 (FDMC012N03, with Rds(on) under 1.5mΩ) is turned on, which shorts leaves only U1 in circuit. FETs Q4, Q5 and Q6 translate the voltages to 3.3V so that GPIO on U4 (MCU KL05Z) can control them.  Rail voltage measurement is facilitated via resistors R3, R4, and R12 and Q7. Not all of these are populated in every assembly option. For measuring rail voltages 0-3.3V, R12 is populated. To measure 0-6.6V, R3, R4,and Q7 are populated. When turned on Q7 enables the voltage divider. All of the assembly option population info can be found in the schematic (attached). Regulator U5 (AP2210N) provides the 3.3V supply for all of the components on the board. This 1% tolerance regulator is used to provide a good reference for the ADC in U4.  Microcontroller U4 detects the assembly population option of the board via resistors R9, R10, and R11 so that the same application code can be used across all variations of the sensor boards. GPIO control the FETs and four ADC channels are used to measure the sense amplifier outputs and the rail voltage. Having a microcontroller on the sensor board allows the user to do extra credit things like count coulombs as well as allowing all similarly instrumented rails to measure at the same time via trigger line SWD_CLK. Data communication can be via I2C or UART, since these two pins can do both.  But if multiple sensor boards are to be used with an aggregator, communication needs to be over I2C. Application Code: The latest application code for the KL05Z on the smart sensor resides here: https://os.mbed.com/users/r14793/code/30847-SMRTSNSR-KL05Z/. The latest binary is attached below. In order to re-flash a smart sensor, the modification detailed in the aggregator page needs to be made. Once the modification is completed, leave the aggregator unpowered while pluging the SWD debugger into J5 and the smart sensor to be programmed into JP15. Very old UART-based application code for the KL05Z, built in the on-line MBED compiler (note that it requires the modified mbed library for internal oscillator). This code was used while testing the first smart sensor prototypes. It has since been abandoned. It's published here in the event that a user wants to use a single sensor plugged into JP15 with UART breakout connector J6. /****************************************************************************** * * MIT License (https://spdx.org/licenses/MIT.html) * Copyright 2017-2018 NXP * * MBED code for KL05Z-based "smart" current sensor board, basic testing * of functions via UART (connected via FRDM board and OpenSDA USB virtual * COM port). * * Eventual goal is to have each smart sensor communicate over I2C to an * aggregator board (FRDM board with a custom shield), allowing 1-10 power * supply rails to be instrumented. Extra credit effort is to support * sensors and aggregator with sigrok... * * Because there is no crystal on the board, need to edit source mbed-dev library * to use internal oscillator with pound-define: * change to "#define CLOCK_SETUP 0" in file: * mbed-dev/targets/TARGET_Freescale/TARGET_KLXX/TARGET_KL05Z/device/system_MKL05Z4.c * ******************************************************************************/ #include "mbed.h" // These will be GPIO for programming I2C address... // not yet implemented, using as test pins... DigitalOut addr0(PTA3); DigitalOut addr1(PTA4); DigitalOut addr2(PTA5); DigitalOut addr3(PTA6); // configure pins for measurements... // analog inputs from sense amps and rail voltage divider... AnalogIn HIGH_ADC(PTB10); AnalogIn VRAIL_ADC(PTB11); AnalogIn LOW1_ADC(PTA9); AnalogIn LOW2_ADC(PTA8); // outputs which control switching FETs... DigitalOut VRAIL_MEAS(PTA7); // turns on Q7, connecting voltage divider DigitalOut LOW_ENABLE(PTB0); // turns on Q4, turning off Q1, enabling low measurement DigitalOut LOW1(PTB2); // turns on Q5, turning off Q2, disconnecting shunt R1 DigitalOut LOW2(PTB1); // turns on Q6, turning off Q3, disconnecting shunt R2 // input used for triggering measurement... // will eventually need to be set up as an interrupt so it minimizes delay before measurement InterruptIn trigger(PTA0); // use as a trigger to make measurement... // PTB3/4 can be used as UART or I2C... // For easier development with one smart sensor, we are using UART here... Serial uart(PTB3, PTB4); // tx, rx long int count=0; int n=25; // global number of averages for each measurement int i, temp; bool repeat=true; // flag indicating whether measurements should repeat or not const float vref = 3.3; // set vref for use in calculations... float delay=0.25; // default delay between measurement bool gui = false; // flag for controlling human vs machine readable output bool statistics = false;// flag for outputting min and max along with average (GUI mode only) void enableHighRange(){ LOW_ENABLE = 0; // short both low current shunts, close Q1 wait_us(5); // delay for FET to settle... (make before break) LOW1 = 0; LOW2 = 0; // connect both shunts to make lower series resistance VRAIL_MEAS = 0; // disconnect rail voltage divider wait_us(250); // wait for B2902A settling... } void enableLow1Range(){ LOW1 = 0; LOW2 = 1; // disconnect LOW2 shunt so LOW1 can measure wait_us(5); // delay for FET to settle... (make before break) LOW_ENABLE = 1; // unshort low current shunts, open Q1 VRAIL_MEAS = 0; // disconnect rail voltage divider wait_us(250); // wait for B2902A settling... } void enableLow2Range(){ LOW1 = 1; LOW2 = 0; // disconnect LOW1 shunt so LOW2 can measure wait_us(5); // delay for FET to settle... (make before break) LOW_ENABLE = 1; // unshort low current shunts, open Q1 VRAIL_MEAS = 0; // disconnect rail voltage divider wait_us(500); // wait for B2902A settling... } void enableRailV(){ VRAIL_MEAS = 1; // turn on Q7, to enable R3-R4 voltage divider wait_us(125); // wait for divider to settle... // Compensation cap can be used to make // voltage at ADC a "square wave" but it is // rail voltage and FET dependent. Cap will // need tuning if this wait time is to be // removed/reduced. // // So, as it turns out, this settling time and // compensation capacitance are voltage dependent // because of the depletion region changes in the // FET. Reminiscent of grad school and DLTS. // Gotta love device physics... } void disableRailV(){ VRAIL_MEAS = 0; // turn off Q7, disabling R3-R4 voltage divider } // this function measures current, autoranging as necessary // to get the best measurement... void measureAuto(){ Timer t; float itemp; float tempI=0; float imin = 1.0; // used to keep track of the minimum... float imax = 0; // used to keep track of the maximum... t.start(); // use timer to see how long things take... enableHighRange(); // this should already be the case, but do it anyway... for (i = 0; i < n; i++){ itemp = HIGH_ADC; // read HIGH range sense amp output if (statistics && itemp>imax) imax = itemp; // update max if necessary if (statistics && itemp<imin) imin = itemp; // update min if necessary tempI += itemp; // add current sample to running sum } tempI = tempI/n *vref/0.8; // compute average we just took... if (gui) uart.printf("=> %5.3f ", tempI); if (statistics && gui) uart.printf("[%5.3f/%5.3f] ", imin*vref/0.8, imax*vref/0.8); // if current is below this threshold, use LOW1 to measure... if (tempI < 0.060) { if (!gui) uart.printf("... too Low: %f A, switching to low1 ==>\r\n", tempI); tempI=0; enableLow1Range(); // change FETs to enable LOW1 measurement... imin = 1.0; imax = 0; for (i = 0; i < n; i++){ itemp = LOW1_ADC; // read LOW1 sense amp output if (statistics && itemp>imax) imax = itemp; // update max if necessary if (statistics && itemp<imin) imin = itemp; // update min if necessary tempI += itemp; // add current sample to running sum } tempI = tempI/n *vref/0.05/1000; // compute average we just took... if (gui) uart.printf("%6.4f ", tempI); if (statistics && gui) uart.printf("[%6.4f/%6.4f] ", imin*vref/0.05/1000, imax*vref/0.05/1000); // if current is below this threshold, use LOW2 to measure... if (tempI < 0.0009){ if (!gui) uart.printf("... too Low: %f A, switching to low2 ==>\r\n", tempI); tempI=0; enableLow2Range(); // change FETs to enable LOW1 measurement... imin = 1.0; imax = 0; for (i = 0; i < n; i++){ itemp = LOW2_ADC; // read LOW2 sense amp output if (statistics && itemp>imax) imax = itemp; // update max if necessary if (statistics && itemp<imin) imin = itemp; // update min if necessary tempI += itemp; // add current sample to running sum } tempI = tempI/n *vref/2/1000; // compute average we just took... if (gui) uart.printf("%8.6f ", tempI); if (statistics && gui) uart.printf("[%8.6f/%8.6f] ", imin*vref/2/1000, imax*vref/2/1000); } } t.stop(); // stop the timer to see how long it took do do this... enableHighRange(); if (!gui) uart.printf("\r\nCurrent = %f A Current Measure Time = %f sec\r\n", tempI, t.read()); } // the autoranging should really be done with functions that return values, as should the // functions below... This would make for shorter and more elegant code, but the author // is a bit of a pasta programmer... void measureHigh(){ float highI=0; enableHighRange(); for (i = 0; i < n; i++){ highI += HIGH_ADC; } highI = highI/n; uart.printf("HIghI = %f A\r\n", vref*highI/0.8); } void measureLow1(){ float low1I=0; enableLow1Range(); for (i = 0; i < n; i++){ low1I += LOW1_ADC; } enableHighRange(); low1I = low1I/n; uart.printf("low1I = %f A\r\n", vref*low1I/0.05/1000); } void measureLow2(){ float low2I=0; enableLow2Range(); for (i = 0; i < n; i++){ low2I += LOW2_ADC; } enableHighRange(); low2I = low2I/n; uart.printf("low2I = %f A\r\n", vref*low2I/2/1000); } // measure the rail voltage, default being with // a divide by 2 resistor divider // It has to be switched out when not in use or it will // add to the measured current, at least in the low ranges... void measureRailV(){ float railv=0; float mult = vref*2; // since divide by 2, we can measure up to 6.6V... float vmin = 5; float vmax = 0; float vtemp; enableRailV(); // switch FETs so divider is connected... for (i = 0; i < n; i++){ vtemp = VRAIL_ADC; // read voltage at divider output... if (statistics && vtemp>vmax) vmax = vtemp; // update max if necessary if (statistics && vtemp<vmin) vmin = vtemp; // update min if necessary railv += vtemp; // add current sample to running sum } disableRailV(); // now disconnect the voltage divider railv = railv/n; // compute average (note this is in normalized ADC [0..1]) // Convert to voltage by multiplying by "mult" if (!gui) uart.printf("RailV = %5.3f V ", mult*railv); if (gui) uart.printf("%5.3f ", mult*railv); if (statistics && gui) uart.printf("[%5.3f/%5.3f] ", mult*vmin, mult*vmax); uart.printf("\r\n"); } // not sure how useful this function is... void measureAll(){ measureHigh(); measureLow1(); measureLow2(); measureRailV(); } // test function to see if trigger pin is being hit... // intended for use later to do timed triggering of measurements... void triggerIn(){ uart.printf("You're triggering me! \r\n"); measureAll(); } // main... int main() { // set up basic conditions... Timer m; uart.baud(115200); enableHighRange(); // default state - only HIGH sense amp in circuit, no divider // signal that we're alive... uart.printf("Hello World!\r\n"); // configure the trigger interrupt... trigger.rise(&triggerIn); while (true) { count++; wait(delay); if (repeat){ // if repeat flag is set, keep making measurements... m.reset(); // reset and start timer... m.start(); measureAuto(); // measuring current using auto-ranging... measureRailV(); // measure rail voltage... m.stop(); // stop the timer. if (!gui) uart.printf(" Total Measure Time = %f sec", m.read()); if (!gui) uart.printf("\r\n\r\n"); } // see if there are any characters in the receive buffer... // this is how we change things on the fly... // Commands (single keystroke... it's easier) // t = one shot automeasure // v = measure volt // h = one shot high measure // k = one shot LOW1 measure // l = one shot LOW2 measure (letter l) // r = toggle repeat // R = turn off repeat // + = faster repeat rate // - = slower repeat rate // = = set repeat rate to 0.25 sec // g = use human readable text output // G = use compressed text format for GUI // s = turn statistics output off // S = turn statistics output on (only in GUI mode) // n = decrease number of averages for each measurement // N = increase number of averages for each measurement // // these were for testing FET switching... // 1 = LOW_ENABLE = 0 (the number 1) // 2 = LOW1 = 0 // 3 = LOW2 = 0 // 4 = VRAIL_MEAS = 0 // ! = LOW_ENABLE = 1 // @ = LOW1 = 1 // # = LOW2 = 1 // $ = VRAIL_MEAS = 1 if (uart.readable()){ temp = uart.getc(); if (temp==(int) 't') { if (!gui) uart.printf("Keyboard trigger: "); measureAuto(); measureRailV(); //measureAll(); } if (temp==(int) 'v') { uart.printf("Keyboard trigger: "); measureRailV(); } if (temp==(int) 'h') { uart.printf("Keyboard trigger: "); measureHigh(); } if (temp==(int) 'k') { uart.printf("Keyboard trigger: "); measureLow1(); } if (temp==(int) 'l') { uart.printf("Keyboard trigger: "); measureLow2(); } if (temp==(int) '1') { LOW_ENABLE = 0; uart.printf("Keyboard trigger: LowEnable = %d\r\n", 0); } if (temp==(int) '2') { LOW1 = 0; uart.printf("Keyboard trigger: LOW1 = %d\r\n", 0); } if (temp==(int) '3') { LOW2 = 0; uart.printf("Keyboard trigger: LOW2 = %d\r\n", 0); } if (temp==(int) '4') { VRAIL_MEAS = 0; uart.printf("Keyboard trigger: VRAILMEAS = %d\r\n", 0); } if (temp==(int) '!') { LOW_ENABLE = 1; uart.printf("Keyboard trigger: LowEnable = %d\r\n", 1); } if (temp==(int) '@') { LOW1 = 1; uart.printf("Keyboard trigger: LOW1 = %d\r\n", 1); } if (temp==(int) '#') { LOW2 = 1; uart.printf("Keyboard trigger: LOW2 = %d\r\n", 1); } if (temp==(int) '$') { VRAIL_MEAS = 1; uart.printf("Keyboard trigger: VRAILMEAS = %d\r\n", 1); } if (temp==(int) 'r') { repeat = !repeat; uart.printf("Keyboard trigger: repeat toggle: %s \r\n", repeat ? "true" : "false"); } if (temp==(int) 'R') repeat = false; if (temp==(int) '+') { delay -= 0.05; if (delay<0.05) delay = 0.05; } if (temp==(int) '-') { delay += 0.05; if (delay>1) delay = 1; } if (temp==(int) '=') delay = 0.25; if (temp==(int) 'g') gui = false; if (temp==(int) 'G') gui = true; if (temp==(int) 's') statistics = false; if (temp==(int) 'S') statistics = true; if (temp==(int) 'n') { n -= 25; if (n<25) n = 25; } if (temp==(int) 'N') { n += 25; if (n>1000) n = 1000; } if (temp==(int) 'N' || temp==(int) 'n') uart.printf("/r/n/r/n Averages = %d \r\n\r\b", n); } } 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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-343518 
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-343079 
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[中文翻译版] 见附件   原文链接: Guide to flash an eMMC from SD Card on i.MX6Q SABRE-SD 
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L5.4.3_1.0.0 release is now available on IMX_SW landing page: BSP Updates and Releases -> Linux ->Linux L5.4.3_1.0.0. Documentation -> Linux -> Linux 5.4.3_1.0.0 Documentation Files available: # Name Description 1 imx-yocto-LF_L5.4.3_1.0.0.zip i.MX L5.4.3_1.0.0 for Linux BSP Documentation. Includes Release Notes, User Guide. 2 LF_v5.4.y-1.0.0_images_MX6QPDLSOLOX.zip i.MX 6QuadPlus, i.MX 6Quad, i.MX 6DualLite, i.MX 6Solox Linux Binary Demo Files 3 LF_v5.4.y-1.0.0_images_MX6SLLEVK.zip i.MX 6SLL EVK Linux Binary Demo Files 4 LF_v5.4.y-1.0.0_images_MX6UL7D.zip i.MX 6UltraLite EVK, 7Dual SABRESD, 6ULL EVK Linux Binary Demo Files 5 LF_v5.4.y-1.0.0_images_MX7ULPEVK.zip i.MX 7ULP EVK Linux Binary Demo Files  6 LF_v5.4.y-1.0.0_images_MX8MMEVK.zip i.MX 8M Mini EVK Linux Binary Demo Files  7 LF_v5.4.y-1.0.0_images_MX8MNEVK.zip i.MX 8M Nano EVK Linux Binary Demo Files  8 LF_v5.4.y-1.0.0_images_MX8MQEVK.zip i.MX 8M Quad EVK Linux Binary Demo files 9 LF_v5.4.y-1.0.0_images_MX8QMMEK.zip i.MX 8QMax MEK Linux Binary Demo files 10 LF_v5.4.y-1.0.0_images_MX8QXPMEK.zip i.MX 8QXPlus MEK Linux Binary Demo files 11 imx-scfw-porting-kit-1.2.10.1.tar.gz System Controller Firmware (SCFW) porting kit v1.2.10.1 for L5.4.3_1.0.0   Target board: MX 8 Series MX 8QuadXPlus MEK Board MX 8QuadMax MEK Board MX 8M Quad EVK Board MX 8M Mini EVK Board MX 8M Nano EVK Board MX 7 Series MX 7Dual SABRE-SD Board MX 7ULP EVK Board MX 6 Series MX 6QuadPlus SABRE-SD and SABRE-AI Boards MX 6Quad SABRE-SD and SABRE-AI Boards MX 6DualLite SDP SABRE-SD and SABRE-AI Boards MX 6SoloX SABRE-SD MX 6UltraLite EVK Board MX 6ULL EVK Board MX 6ULZ EVK Board MX 6SLL EVK Board   What’s New/Features: Please consult the Release Notes.   Known Issues: For known issues and more details please consult the Release Notes.   More information on changes of Yocto, see: README: https://source.codeaurora.org/external/imx/imx-manifest/tree/README?h=imx-linux-zeus ChangeLog: https://source.codeaurora.org/external/imx/imx-manifest/tree/ChangeLog?h=imx-linux-zeus      
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-343116 
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The Linux L4.9.11_1.0.0 RFP(GA) for i.MX6 release files are now available on www.nxp.com    Files available: # Name Description 1 L4.9.11_1.0.0-ga_images_MX6QPDLSOLOX.tar.gz i.MX 6QuadPlus, i.MX 6Quad, i.MX 6DualPlus, i.MX 6Dual, i.MX 6DualLite, i.MX 6Solo, i.MX 6Solox Linux Binary Demo Files 2 L4.9.11_1.0.0-ga_images_MX6SLEVK.tar.gz i.MX 6Sololite EVK Linux Binary Demo Files 3 L4.9.11_1.0.0-ga_images_MX6UL7D.tar.gz i.MX 6UltraLite EVK, 7Dual SABRESD, 6ULL EVK Linux Binary Demo Files 4 L4.9.11_1.0.0-ga_images_MX6SLLEVK.tar.gz i.MX 6SLL EVK Linux Binary Demo Files 5 L4.9.11_1.0.0-ga_images_MX7ULPEVK.tar.gz i.MX 7ULP EVK Linux Binary Demo Files  6 L4.9.11_1.0.0-ga_mfg-tools.tar.gz i.MX Manufacturing Toolkit for Linux L4.9.11_1.0.0 BSP 7 L4.9.11_1.0.0-ga_gpu-tools.tar.gz L4.9.11_1.0.0 i.MX VivanteVTK file 8 bcmdhd-1.141.100.6.tar.gz The Broadcom firmware package for i.MX Linux L4.9.11_1.0.0 BSP. 9 imx-aacpcodec-4.2.1.tar.gz Linux AAC Plus Codec for L4.9.11_1.0.0 10 fsl-yocto-L4.9.11_1.0.0.tar.gz L4.9.11_1.0.0 for Linux BSP Documentation. Includes Release Notes, User Guide.   Target boards: i.MX 6QuadPlus SABRE-SD Board and Platform i.MX 6QuadPlus SABRE-AI Board i.MX 6Quad SABRE-SD Board and Platform i.MX 6DualLite SABRE-SD Board i.MX 6Quad SABRE-AI Board i.MX 6DualLite SABRE-AI Board i.MX 6SoloLite EVK Board i.MX 6SoloX SABRE-SD Board i.MX 6SoloX SABRE-AI Board i.MX 7Dual SABRE-SD Board i.MX 6UltraLite EVK Board i.MX 6ULL EVK Board i.MX 6SLL EVK Board i.MX 7ULP EVK Board (Beta Quality)   What’s New/Features: Please consult the Release Notes.   Known issues For known issues and more details please consult the Release Notes.   More information on changes, see: README: https://source.codeaurora.org/external/imx/fsl-arm-yocto-bsp/tree/README?h=imx-morty ChangeLog: https://source.codeaurora.org/external/imx/fsl-arm-yocto-bsp/tree/ChangeLog?h=imx-morty
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NOTE: Always de-power the target board and the aggregator when plugging or unplugging smart sensors from the aggregator. The aggregator portion of the i.MX Power Profiling System sits between the "smart" current sensor boards and the host computer. It provides power and signal connections to each connected sensor board. The communication is done over I2C, where three I2C bus extenders (PCA9518) effectively provide a dedicated bus to each I2C device, to better allow for cabling.  More information will follow... A photo, layout images and schematic attached below.   MBED source for the FRDM-KL25Z is available here: 30848-KL25Z-AGGREGATOR    Smart Sensor Connections At each smart sensor header JP0-JP13, these are the connections provided: 5V: powers the 3.3V regulator on each sensor board 12V: all the gates of all the switching FETs are pulled pulled up to 12V GND: ground connection SCL/TX0: I2C clock line  SDA/RX0: I2C data line  SWD_CLK:  global line for triggering smart sensors to make measurements RESET_B:  global line for resetting all smart sensor boards SWD_IO_n: individual select line for each smart sensor I2C Bus Connection Three I2C bus extenders (PCA9518) provide buffered connections between the FRDM board and all the connected smart sensors. The bus extenders were added to allow for longer cables between the aggregator and the smart sensor boards. Each bus extender has five ports and along with connections that allow extending the bus to more bus extenders. Gate Supply The aggregator contains a boost regulator that boost the 5V input from the FRDM board to 12V. The boosted voltage is fed to each of the smart sensor headers. It's used by the smart sensor board to pull up the gates of the switching FETs above any of the rails under test by at least 4.5V in order to benefit from a lower Rds(on). Caution must be exercised with some older FRDM boards since the 5V from the USB connection passes through diodes with a maximum current of 200mA.  The boost regulator and the load presented by the smart sensor boards may exceed the diode's limit and damage it. (Yes, it's happened... two older FRDM-KL25Z boards were used during development. One of them failed with the diode shorted (~0.05 Ohms), so everything kept working. The other failed with a  short of ~45 Ohms, so it kind of worked but not really...) Application Code for Aggregator  To date, application code has only been developed for the FRDM-KL25Z board. The latest application code resides at: https://os.mbed.com/users/r14793/code/30848-KL25Z-AGGREGATOR/, with the latest binary attached below. SWD Programming of Smart Sensors  Connectors J5 and JP15 are provided as an adapter for programming the smart sensor boards via SWD. JP15 provides power to the smart sensor board, since they have no direct 3.3V input for the KL05Z. An SWD programmer (or suitably modified FRDM-KL05Z board) connects to J5. Both connections use 10-pin 0.05"-spaced ribbon cables. Additionally, when a smart sensor is connected to JP15, J6 provides access to the UART pins of the smart sensor (the I2C pins on the smart sensor also mux out the UART of the KL05Z). No hardware changes are necessary at all; changing the code running on the smart sensor is all that's required. In fact, during the initial prototyping of the smart sensors, the serial UART connection was used instead of I2C. Modify Aggregator To Use SWD Dongle To Program Smart Sensor:  Add a wire as shown on the bottom side of the aggregator board as shown below. This ties 3.3V on the aggregator to the debug header, enabling the voltage level translators on the dongle to communicate with the KL05Z on the smart sensor board.  
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The Linux L4.14.98_1.0.0_GA; and SDK2.5 for 8QM/8QXP Post GA, SDK2.5.1 for 7ULP GA3 release are now available. Linux on IMX_SW web page, Overview -> BSP Updates and Releases -> Linux L4.14.98_2.0.0 SDK on https://mcuxpresso.nxp.com Files available: Linux:  # Name Description 1 imx-yocto-L4.14.98_2.0.0_ga.zip L4.14.98_2.0.0 for Linux BSP Documentation. Includes Release Notes, User Guide. 2 L4.14.98_2.0.0_ga_images_MX6QPDLSOLOX.zip i.MX 6QuadPlus, i.MX 6Quad, i.MX 6DualPlus, i.MX 6Dual, i.MX 6DualLite, i.MX 6Solo, i.MX 6Solox Linux Binary Demo Files 3 L4.14.98_2.0.0_ga_images_MX6SLLEVK.zip i.MX 6SLL EVK Linux Binary Demo Files 4 L4.14.98_2.0.0_ga_images_MX6UL7D.zip i.MX 6UltraLite EVK, 7Dual SABRESD, 6ULL EVK Linux Binary Demo Files 5 L4.14.98_2.0.0_ga_images_MX7DSABRESD.zip i.MX 7Dual SABRESD Linux Binary Demo Files  6 L4.14.98_2.0.0_ga_images_MX7ULPEVK.zip i.MX 7ULP EVK Linux Binary Demo Files  7 L4.14.98_2.0.0_ga_images_MX8MMEVK.zip i.MX 8MMini EVK Linux Binary Demo Files  8 L4.14.98_2.0.0_ga_images_MX8MQEVK.zip i.MX 8MQuad EVK Linux Binary Demo files 9 L4.14.98_2.0.0_ga_images_MX8QMMEK.zip i.MX 8QMax MEK Linux Binary Demo files 10 L4.14.98_2.0.0_ga_images_MX8QXPMEK.zip i.MX 8QXPlus MEK Linux Binary Demo files 11 imx-scfw-porting-kit-1.2.tar.gz System Controller Firmware (SCFW) porting kit of L4.14.98_2.0.0 12 imx-aacpcodec-4.4.5.tar.gz Linux AAC Plus Codec v4.4.5 13 VivanteVTK-v6.2.4.p4.1.7.8.tgz Vivante Tool Kit v6.2.4.p4.1.7.8   SDK: On https://mcuxpresso.nxp.com/, click the Select Development Board, EVK-MCIMX7ULP//MEK-MIMX8QM/MEK-MIMX-8QX to customize the SDK based on your configuration then download the SDK package.  Target board: MX 8 Series MX 8QuadXPlus MEK Board MX 8QuadMax MEK Board MX 8M Quad EVK Board MX 8M Mini EVK Board MX 7 Series MX 7Dual SABRE-SD Board MX 7ULP EVK Board MX 6 Series MX 6QuadPlus SABRE-SD and SABRE-AI Boards MX 6Quad SABRE-SD and SABRE-AI Boards MX 6DualLite SDP SABRE-SD and SABRE-AI Boards MX 6SoloX SABRE-SD and SABRE-AI Boards MX 6UltraLite EVK Board MX 6ULL EVK Board MX 6ULZ EVK Board MX 6SLL EVK Board What’s New/Features: Please consult the Release Notes.   Known issues For known issues and more details please consult the Release Notes.   More information on changes of Yocto, see: README: https://source.codeaurora.org/external/imx/imx-manifest/tree/README?h=imx-linux-sumo ChangeLog: https://source.codeaurora.org/external/imx/imx-manifest/tree/ChangeLog?h=imx-linux-sumo#
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-342877 
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