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NXP Designs Knowledge Base

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Demo Owner: Carlos Neri Want to learn how to create USB based speakers? In this video, you'll learn how you can build speakers to play any sound from any USB system using only TOWER K40X256, TWR-Audio and TWR- serial modules. Watch how you can increase and decrease volume as well as change the frequency on the fly without any audio distortion.     Features Entirely built on the K40X256 Tower system Features HID for volume control to the host USB Stack Featured NXP Products TWR-K40X256: Kinetis K40 Tower System Module TWR-SER: Serial (USB, Ethernet, CAN, RS232/485) Tower System Module TWR-SER2: Enhanced Serial (Dual Ethernet, High-Speed USB) Tower System Module TWR-AUDIO-SGTL: SGTL5000 Codec Tower System Audio Module TWR-ELEV: Tower System Elevator Module Links Tower System Modular Development Platform  
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App-based accessory demo for an EKG (Electrocardiogram) using the Tower System with TWR-DOCK module. Combines an EKG probe and a microcontroller to acquire and monitor heart rate data and passes the data to an iOS device where an app displays the data.     NXP Recommend Product Link Tower System Dock Module Tower System Dock Module | NXP  Kinetis K53 Tower System Module TWR-K53N512|Tower System Board|Kinetis MCUs | NXP  Tower System Elevator Module Tower System Elevator Module | NXP  Electrocardiograph Development Kit for Tower System Electrocardiograph Development Kit for Tower System | NXP    Featured NXP Products App-based accessory demo for an EKG (Electrocardiogram) using the Tower System with TWR-DOCK module Combines an EKG probe and a Microcontroller to acquire and monitor heart rate data and passes the data to an iOS device where an app displays the data
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Demo Kinetis KW4x MCU is an ultra low power, highly integrated single-chip device that enables Bluetooth low energy (BLE) connectivity for portable, extremely low-power embedded systems.     Features iBeacon Location-based Messages The KW4x is an ultra low power, highly integrated single-chip device that enables Bluetooth low energy (BLE) or IEEE Std. 802.15.4/ZigBee RF connectivity for portable, extremely low-power embedded systems. Applications include portable health care devices, wearable sports and fitness devices, AV remote controls, computer keyboards and mice, gaming controllers, access control, security systems, smart energy and home area networks.  The KW4x SoC integrates a radio transceiver operating in the 2.36GHz to 2.48GHz range supporting a range of FSK/GFSK and O-QPSK modulations, an ARM Cortex-M0+ CPU, 160KB Flash and 20KB SRAM, BLE Link Layer hardware, 802.15.4 packet processor hardware and peripherals optimized to meet the requirements of the target applications.  The KW4x’s radio frequency transceiver is compliant with Bluetooth version 4.1 for Low Energy (aka Bluetooth Smart), and the IEEE 802.15.4-2011 standard using O-QPSK in the 2.4 GHz ISM band and the IEEE 802.15.4j MBAN frequency range spanning from 2.36 GHz to 2.40 GHz. In addition, the KW4x allows the Bluetooth Low Energy protocol to be used in the MBAN frequency range for proprietary applications. Enabled by Kinetis KW4x MCUs Discover location-based context A Bluetooth® Smart low-power application   Bluetooth Smart and 802.15.4 Dual Mode Communication BLE heart rate sensor on a KW40Z connecting, pairing and exchanging data with an iPod while the 802.15.4 end device (on the same KW40Z chip) associates and exchanges data with a coordinator. The OTA packets are displayed in sniffer applications on a Windows PC.  The KW4x is an ultra low power, highly integrated single-chip device that enables Bluetooth low energy (BLE) or IEEE Std. 802.15.4/ZigBee RF connectivity for portable, extremely low-power embedded systems. Applications include portable health care devices, wearable sports and fitness devices, AV remote controls, computer keyboards and mice, gaming controllers, access control, security systems, smart energy and home area networks.  The KW4x SoC integrates a radio transceiver operating in the 2.36GHz to 2.48GHz range supporting a range of FSK/GFSK and O-QPSK modulations, an ARM Cortex-M0+ CPU, 160KB Flash and 20KB SRAM, BLE Link Layer hardware, 802.15.4 packet processor hardware and peripherals optimized to meet the requirements of the target applications.  The KW4x’s radio frequency transceiver is compliant with Bluetooth version 4.1 for Low Energy (aka Bluetooth Smart), and the IEEE 802.15.4-2011 standard using O-QPSK in the 2.4 GHz ISM band and the IEEE 802.15.4j MBAN frequency range spanning from 2.36 GHz to 2.40 GHz. In addition, the KW4x allows the Bluetooth Low Energy protocol to be used in the MBAN frequency range for proprietary applications. Concurrent communication on BLE and 802.15.4 Suited for configuring 802.15.4 devices from your smart phone Automatic synchronization completely transparent to the application   BLE-enabled Smart Zumo Robot The Smart Zumo Robot is powered by the new Kinetis KW40X MCU and is enabled by Bluetooth Low Energy (BLE) technology. Low-power, Bluetooth Low Energy (BLE) application Running simple control implementation over BLE to interact and control with the robot Highly-integrated radio solution with scalable memory options   Featured NXP Products   Product Link Bluetooth Low Energy/IEEE® 802.15.4 Packet Sniffer USB Dongle for Kinetis® KW40Z/30Z/20Z MCUs Bluetooth Low Energy/IEEE® 802.15.4 Packet Sniffer USB Dongle for Kinetis® KW40Z/30Z/20Z MCUs | NXP      Development Hardware Used   Freedom Development Platform for Kit Bluetooth Low Energy/IEEE® 802.15.4 Pack
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Demo This demo demonstrates the Mobility software (PDCP-GTPU) as VNF in virtualized environment, virtio-PDCP device for PDCP Security offload to H/W accelerator. The guest application is real time implementation of PDCP-GTPU layers of LTE data plane using DPDK library.       Features: Accelerated PDCP-GTPU VNF for Cloud RAN Deployments. DPDK integrated solution for high performance on ARM cores. Accelerated PDCP security processing by offloading to NXP SEC accelerator via virtio-interface (virtio-pdcp) Option to offload Virtio backends to AIOP Cores on NXP LS platforms.   _______________________________________________________________________________________________________   Featured NXP Products: QorIQ Processors Based on ARM Technology|NXP QorIQ LS2085A Communication Processors |NXP _______________________________________________________________________________________________________ Related Link https://community.freescale.com/videos/3994     N11
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Overview Remote virtual smartphones promise the same benefits as remote computer desktops and cloud-based gaming: low-cost client hardware, sandboxed user environments, and persistent user state. The way they work is that the physical smartphone runs only thin-client software and the smartphone application runs remotely on a server. To be economical, this server hosts multiple of these virtual smartphones, taking advantage of hardware virtualization support built into its processor. Slotted into the machine, an add-on GPU provides high-performance graphics. To reduce latency for real-time gameplay, the server is best located near the end-user in the edge of the mobile network. For virtual smartphones to be compatible with physical smartphones, Arm compatibility is required. At the 2020 Consumer Electronics Show, NXP demonstrated the Layerscape LX2160A processor hosting Redfinger’s cloud-based Android emulator and virtual smartphone. NXP’s processor integrates 16 CPU cores, enabling it to host 16 or more virtual smartphones. Games and other software execute with the same look and feel as if they were running locally on a smartphone. Like other Layerscape processors, the LX2160A delivers excellent performance per watt and is designed to work in high-temperature environments, such as being packed densely in a rack in a data center or deployed remotely at an edge-computing site. Although NXP designed it for stringent embedded applications, the LX2160A processor is powerful enough for servers—making it a great solution for Android emulation.     Block Diagram NXP Products Name of Product QorIQ LX2160A Development Board | NXP    Related Documents from Community Name of Document Discover i.MX: Industry-Leading Processor Solution for Media, Smart Home, Smart Industrial, Health/Medical and Broad Embedded Applications    Related Communities Name of Document Layerscape 
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Overview In this demo we show how to load an example of an NFC reader using the combination between the UDOO NEO card and the development kit for the PN7150. PN7150ARD kit is a high performance fully NFC compliant expansion board compatible with Arduino Compatible Interface platforms. It meets compliance with Reader mode, P2P mode and Card emulation mode standards. The board features an integrated high-performance RF antenna to insure high interoperability level with NFC devices. Video Required Items UDOO NEO Compatible MicroSD card of at least 4 or 8 Gb memory size Micro USB cable UDOO Neo demo image file PN7150 NFC Controller Board         Links   Step by Step guide (Inlclude all links): https://www.nxp.com/docs/en/application-note/AN11841.pdf    NXP Product Link Development Kits for PN7150 Plug’n Play NFC Controller NFC Development Kits for Arduino and more | NXP 
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This post entry provides a detailed information about the EMVCo L1 certification process for contactless payment devices. The structure is the following: EMV Introduction Objective When a company is developing a POS device, there are some challenges to consider for a successful deployment in the market: The device needs to have a good performance to provide the client with a good user experience. Moreover, the device should be able to operate seamlessly with other devices and cards in the market in a secure and reliable way.   These key characteristics are tackled by the EMV specifications. Summarizing, EMV is a group of specifications for smart payment cards and terminals that were created by EMVCo to guarantee interoperability and acceptance of secure payment transactions. EMV stands for Europay, Mastercard, and Visa, the three companies that originally created the standard. These specifications are now managed by EMVCo, an organization of six members – including Mastercard, UnionPay, Visa, AmEx, Discover, and JCB.   EMVCo organization We can see in the figure below the structure of the organization. EMVCo is managed by the Board of Managers that consists of two representatives of every member of the organization. On top of the Board of Managers, the Executive Committee provides guidance on the group’s long-term strategy.     From a more technical point-of-view, it is organized in several Working Groups, each of them dedicated to specific topics. EMVCo also has the Associates Program, so key industry stakeholders can provide input and feedback to the Board of Managers, Executive Committee, and Working Groups.   EMV Technologies EMV specifications encompass a wide range of technologies, including: Contact chip technology, where smartcards and readers provide with cryptographical security advantages in comparison with the traditional magnetic stripe. EMV specifications also regulate contactless payment devices based on NFC technology.  Mobile Transactions where the mobile phone would play the role of a contactless device. The QR code technology, where the transaction can be made using a QR reader. Payment tokenization, that enables to perform transactions without compromising sensible card information. And other technologies like Secure Remote Commerce, 2nd Gen or 3-D Secure.   EMV Contactless specifications EMV Contactless specifications is now on version 2.6 but planning to move to version 3.0 by the end of the year.   The EMV Contactless specifications are structured in three books and the Contactless Interface Specifications that substitutes the Book D from previous versions of the specs. The Book A describes the overall architecture of the system, and the instructions involved in the communication between the entry point and the kernel. The Book B addresses the specifications regarding the Entry Point, which is the piece of sw in charge of the transaction pre-processing, or protocol activation among other tasks. Book C consists of 6 different levels for each of the kernels that are defined in the specifications. The EMV Contactless Interface Specifications describe the minimum set of functionalities that are required for the correct operation between the PICCs and the PCD.   In addition we will mention other relevant documents like: The PCD Test Bench and Test Case Requirements, that describes the test cases that are carried out by the testing laboratory in order to evaluate the devices. Note that there are 2 different documents, one for the Analog L1 tests and another one for the Digital tests. Another document describes the Device Test Environment, which is the software needed to control the device during the testing phase Another document describes the requirements regarding the Contactless symbol that should appear in all EMVCo Contactless POS in the market.   PCD L1 Type Approval The following diagram summarizes the process for the PCD L1 Type Approval:     In the first step the Product Provider shall submit a Request for Registration form to EMVCo. Once EMVCo reviews and accepts the form, the product provider will receive a contract that has to be signed. Upon reception of this contract, EMVCo will assign a product provider registration number. In the second step the Product Provider will choose a Test Laboratory and complete a document called Implementation Conformance Statement in which it provides detailed information about the device and its features. The third step is the Product Validation phase. In this phase the laboratory performs the product testing, where the device goes through a set of tests to evaluate the digital and analog performance. In a final phase and considering the test reports from the Laboratory, the Product Provider might decide to send the product to EMVCo for approval. In that case, EMVCo would analyze the tests reports and grant with a Letter of Approval in case the reports demonstrate sufficient product conformance.   In our case we are going to focus on the Analog L1 PCD tests.    EMV Analog L1 PCD Tests Environment Before going directly to the actual set of tests, it worth it to explain some components about the testing environment to better understand the testing procedure. We have the following elements: Device Test Environment Contactless symbol Positioning conventions EMVCo Reference PICC   Device Test Environment (DTE) The Device Test Environment is a software application that is used to control the device under evaluation during the whole testing process. This application has to be developed by the product provider and shall be implemented in compliance with a set of requirements defined in the specifications. The software is submitted to the test laboratory along with the samples of the device under certification. The DTE shall implement different applications or modes of operation that would be used depending on the testing scenario. These application are:   PCD Controls: It allows the test operator to execute single basic commands from the ISO14443 standard (Carrier ON/OFF, WUPA, WUPB,..) Pre-validation application: This application is used to test the communication of the device with a set of actual EMV compliant cards. Loopback application: It is used to test the device for the majority of the Analog and Digital L1 PCD Tests. In this case the reader is communicating with a Card simulator connected to a reference antenna. Transaction send application:  This application can be used by the laboratory to evaluate the compliancy of the device with the waveform requirements defined for the Analog L1 PCD Tests. The main characteristic of this mode of operation is that the device sends a sequence of commands without waiting the responses from the PICC.   Contactless symbol The contactless symbol is the logo that you can see in the lower image. It helps the user identify the area in the Point Of Sale where he has to tap the card in order to trigger the transaction. This symbol has to be visible in the device surface or screen before and during the transaction. The Contactless symbol is extremely important for the testing procedure as it marks the reference point for all the positions that the device should be tested.   Using this reference point EMVCo defines an operating volume.   Positioning convention All test position are included in this operating volume. Depending on the test case, it will be run in one or more positions. Every position is expressed with a set of 3 coordinates or parameters, representing the height, the radius, and the angle respectively.     In the figure above you can see the operating volume along with the different values that each parameter can have.   EMVCo Reference PICC The EMVCo Reference PICC is the reference antenna used to communicate with the PCD under test. It has 4 ports and 2 jumpers that are used to configure the PICC for different purposes. For example, jumper 8 is used to select between linear and non-linear load depending on the type of tests that are performed. In the same line, the MOD IN port where a Signal Generator will inject a certain modulation to emulate a PICC response. The DC OUT port is used to measure the voltage level in the power tests and the LETI COIL OUT is used to measure the waveform tests among others. In the figure below you can also see the reference point of the antenna where the two white lines crossed:   Power tests The power tests are evaluated in all positions with the purpose of guaranteeing that the device is emitting enough field in all the positions. Depending on the height the limiting values will differ. In the figure below you can see the different planes with the respective limiting values.     The critical positions for the power tests are usually the outer positions for plane z=4 and z=3 where the voltage measured may not be strong enough to pass the tests. On top of that and depending on the transmission configuration used, it can also happen that the voltage measured at positions (1, 0, 0) and (0, 0, 0) can exceed the maximum level.   Waveform tests The purpose of the waveform tests is to evaluate the wave shape of the modulation used in the commands from the PCD. That way, if the wave shape fits with the requirements an EMVCo compliant PICC would not have any problem understanding the commands sent by the PCD.   The waveform evaluation for Type A modulation include the following test cases: t 1 (TB121) Monotonic Decrease (TB122) Ringing (TB123) t 2 (TB124) t 3 and t 4 (TB125) Monotonic Increase (TB126) Overshoot (TB127)     In the same way, the Type B test cases are the following: Modulation Index (TB121)# Fall time (TB122) Rise time (TB123) Monotonic Increase (TB124) Monotonic Decrease (TB125) Overshoots (TB126) Undershoots (TB127)     Reception tests The objective of the communication or responsiveness tests is to guarantee that the PCD is able to properly finish a transaction when the response of the PICC is in the limits of the specifications in terms of amplitude and polarity.   That way we find 4 different tests: Minimum load modulation, positive polarity (Tx131) Maximum load modulation, positive polarity  (Tx133) Minimum load modulation, negative polarity  (Tx135) Maximum load modulation, negative polarity  (Tx137)   In the two figures below we can easily check the difference in the load modulation level between the oscilloscope capture for the Tx131 and the Tx133.     Other tests Besides the power, waveform and communication tests there are other tests included in the EMVCo Analog L1 Test cases. Here is the list of these other tests:   Carrier frequency (TAB112) Field resetting (TAB113) Power off (TAB114) Polling sequence (TAB115) FDTA PICC (TA139) BitRate (TA141 & TB141) BitCodingPCD (TA142 & TB142) BitCodingPICC (TA143 & TB146) BitBoundaries (TB147) TFSOFF (TB145 & TB148)   EMV Contactless Specs v3.0 The most important change is that the tests will no longer be carried out with one specific EMVCo reference PICC but with three. The first two are Class 1 antennas tuned to 16.1MHz and 13.56MHz, and the third reference PICC is a Class 3 antenna tuned to 13.56MHz.     This is important since the device will need to pass the test for 3 different antennas, making the testing process between 2 and 3 times slower and the tuning of the device more difficult than for the 2.6 version of the specs.   Other changes are a second different load for the linear load tests and the modifications of some waveform tests limits.   NXP Product portfolio for POS The product portfolio that NXP offers for contactless POS device includes three main chips: CLRC663 plus: EMVCo 2.6 ready chip compliant both for analog and digital L1 requirements. The CLRC663 plus is able to work with a transmitter current of 350 mA and a limiting value of 500 mA. This feature allows us to increase the field strength radiated and overcome power issues because of the design of the POS or the antenna.  PN5180: The PN5180 chip is also an EMVCo compliant frontend, that supports highly innovative and unique features like the Dynamic Power Control that optimizes the RF performance even under detuned antenna conditions. Other features are the Adaptative Waveform Control or the Adaptative Receiver Control to automatically adjust the transmitter modulation or the receiver parameters. These and many other features turn the PN5180 into the best NFC frontend in the market. PN7462: It supports contact and contactless interface in the same chip. It is an NFC controller, so includes an MCU with a configurable host interface. For the contactless interface, it implements similar functionalities as the PN5180, like the Dynamic Power Control, the Adaptative Receiver Control, and the Adaptative Waveform Control.   Further Information You can find more information about NFC in: Our NFC everywhere portal: https://www.nxp.com/nfc You can ask your question in our technical community:   https://community.nxp.com/community/identification-security/nfc You can look for design partners:   https://nxp.surl.ms/NFC_AEC And you can check our recorded training:   http://www.nxp.com/support/online-academy/nfc-webinars:NFC-WEBINARS   Video recorded session
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Description A gamepad is a device used to interact with a videogame through a PC or console.  This gamepad in particular, includes an LCD display and touch panel for a better gaming experience. In addition, as the play environment becomes more mobile and a game can easily be connected to any network (at a friend’s house, an Internet café, a community gaming center or even an amusement park) NXP offers secure, connected devices and technologies. Add in our sensing solutions with high-performance sensing capability, processing capacity and customizable software, power management ICs and wireless charging solutions to get a complete system solution.   Features   LCD Display Touch Panel NFC Pair BLE connectivity USB Type C LED driver Smart amplifier for speaker     Block Diagram       Products   Category Name 1: MCU Product URL 1 LPC546XX Microcontroller (MCU) Family | NXP  Product Description 1 Offering the ultimate in flexibility and performance scalability, the LPC546xx MCU family provides up to 220 MHz performance while retaining power-efficiency as low as 100 uA / MHz. Its 21 communication interfaces makes it ideal for the HMI and connectivity needs of next-generation IoT applications.   Category Name 2: Drivers Product URL 1 PCA9955BTW | NXP  Product Description 1 The PCA9955B is an I2C-bus controlled 16-channel constant current LED driver optimized for dimming and blinking 57 mA Red/Green/Blue/Amber (RGBA) LEDs in amusement products. Product link 2 9.5 V boosted audio system with adaptive sound maximizer and speaker protection | NXP  Product Description 2 The TFA9890A is a high efficiency class-D audio amplifier with a sophisticated speaker boost and protection algorithm. Product link 3 TEA172x | NXP  Product Description 3 These highly integrated devices enable low no-load power consumption below 10 mW, reduce component count for a cost-effective application design, and provide advanced control modes that deliver exceptional efficiency. Product link 4 Logic controlled high-side power switch | NXP  Product Description 4 The NX5P2190 is an advanced power switch with adjustable current limit. It includes under-voltage and over-voltage lockout, over-current, over-temperature, reverse bias and in-rush current protection circuits.   Category Name 3: USB Product URL 1 USB PD and type C current-limited power switch | NXP  Product Description 1 The NX5P3290 is a precision adjustable current-limited power switch for USB PD application. The device includes under voltage lockout, over-temperature protection, and reverse current protection circuits to automatically isolate the switch terminals when a fault condition occurs. Product link 2 PTN5150 | NXP  Product Description 2 The PTN5150 enables USB Type-C connector to be used in both host and device ends of the Type-C cable. It can support Type-C to USB legacy cables and adapters defined in USB Type-C Spec.   Category Name 4: Wireless Product URL 1 PN7150 | High performance NFC controller for smart devices | NXP  Product Description 1 PN7150 is the the plug andn play NFC solution for easy integration into any OS environment, reducing Bill of Material (BOM) size and cost. Product link 2   NTAG213F, NTAG216F | NFC Forum Type 2 Tag compliant IC with field detection | NXP  Product Description 2 The NTAG213F offers innovative functionalities such as: the configuration of a field detection, the SLEEP mode, the FAST_READ command, and a configurable password protection. These capabilities fit perfectly for applications in electronics that require the following features: connection handover, Bluetooth® simple pairing, Wi-Fi protected set-ups, device authentication or gaming. Product link 3 QN908x: Ultra-Low-Power Bluetooth Low Energy System on Chip (SoC) Solution | NXP  Product Description 3 QN908x is an ultra-low-power, high-performance and highly integrated Bluetooth® Low Energy (BLE) solution for Bluetooth Smart applications such as human interface devices, and app-enabled smart accessories.   Documentation Connecting TFT LCD with LCD controller of LPC MCU:  https://www.nxp.com/docs/en/nxp/application-notes/AN12027.zip    Tools Product Link OM13098: LPCXpresso54628 Development Board OM13098 | LPCXpresso Development Board | LPC Microntrollers (MCUs) | NXP 
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Description   A shared power bank is the sharing economy business model (which has been booming in in recent years). A shared power bank is an publicly accessible charging station, which provides power bank to customers.   A common scenario would be a customer running low on battery on their mobile phone. Using a smartphone app they would locate a nearby charging station, for instance in a cafe. Each station has either six or twelve rechargeable batteries, which can be taken out of the box and connected to an iOS or Android device.   Features   Smartphone app to indicate where a nearby charging station is located Each station has either six or twelve rechargeable batteries   Block Diagram     Products     Category Name 1: MCU Product URL 1 Arm Cortex-M4|Kinetis K22 100 MHz 32-bit USB MCUs | NXP  Product Description 1 The Kinetis® K22 offers analog, communication, timing and control peripherals to meet diverse requirements   Category Name 2: Bluetooth Product URL 1 QN908x: Ultra-Low-Power Bluetooth Low Energy System on Chip (SoC) Solution | NXP  Product Description 1 QN908x integrates a Bluetooth Low-Energy radio, controller, protocol stack and profile software on a single chip, providing a flexible and easy to use Bluetooth Low Energy SoC solution.   Category Name 3: Peripherals Product URL 1 PCA9535A | NXP  Product Description 1 The PCA9535A is a low-voltage 16-bit General Purpose Input/Output (GPIO) expander with interrupt and reset for I²C-bus/SMBus applications.     Tools   Product Link FRDM-K22F: NXP Freedom Development Platform for Kinetis® K22 MCUs FRDM-K22F|NXP Development Platform|Kinetis® MCU | NXP  QN9080DK: A highly extensible platform for application development of QN908x QN9080DK: A highly extensible platform for application development of QN908x | NXP 
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Description   Sigfox is a French company founded in 2009 that builds wireless networks to connect IoT devices. Their original focus was on industrial/professional applications such as water meters. Sigfox has recently been applying their technology to consumer applications such as smart watches and home alarms. The key parameters for the application is the requirement to exchange continuously and securely small amounts of data. A wireless base station is a transceiver that connects other devices to one another and/or to a wider area. In this particular application we are implementing a Sigfox base station.   Features Low power Securely Small amounts of data Securely transmitting small amounts of data   Block Diagram     Products   Category Name 1: MCU Product URL 1 Layerscape LS1012A Communication Processor for the IoT | NXP  Product Description 1 The QorIQ® LS1012A processor, optimized for battery-backed or USB-powered, space-constrained networking and IoT applications.   Category Name 2: Wireless Product URL 1 Low-Power Multi-Channel UHF RF Wireless Platform | NXP  Product Description 1 The OL2385 device is a radio frequency transceiver with an embedded MCU designed for a wide range of industrial and home applications requiring a very high link budget for bi-directional RF communication.   Category Name 3: Power Management Product URL 1 VR5100 Multi-output DC-DC for COMM Processor | NXP  Product Description 1 The VR5100 is a high-performance, multi-output DC-DC regulator designed to power single or dual core LS1 processors like LS1012A and LS1024A.   Category Name 4: Peripherals Product URL 1 Logic controlled high-side power switch | NXP  Product Description 1 The NX5P2190 is an advanced power switch with adjustable current limit. It includes under-voltage and over-voltage lockout, over-current, over-temperature, reverse bias and in-rush current protection circuits. Product URL 2   TJA1101 | 2nd generation PHY Transceiver | NXP  Product Description 2 TJA1101  offers 100Mbit/s transmit and receive capability per port over up to at least 15m of unshielded twisted pair (UTP) cable.   Tools   Product Link OM2385/SF001 - OL2385 Wireless sub-GHz Transceiver SIGFOX Development Kit with KL43Z OM2385/SF001 - SIGFOX Development Kit | NXP  Layerscape FRWY-LS1012A board FRWY-LS1012A Development Platform | NXP  KITVR5100FRDMEVM: Evaluation Kit for VR5100 Power Management Integrated Circuit Evaluation Kit for VR5100 Power Management Integrated Circuit | NXP 
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  Overview China stopped providing analog walkie talkie licenses which consequently has created a high demand for more digital walkie talkie applications. The digital walkie talkies transmits speech in the form of digital encoding. DMR (time division),is more widely used and has a communication speed of 9.6kbps so efficient compression algorithms are necessary. Digital walkie-talkie advantages: Less bandwidth than analog walkie talkie Can use encryption algorithm for higher security Easy networking High quality speech The Airfast® RF power portfolio brings extreme ruggedness and high gain to mobile radio applications. The high gain of our devices helps eliminate amplification stages and reduce system cost. Plus, the high efficiency of the portfolio allows customers to use smaller heatsinks and housing while improving reliability. The broadband capability of the mobile radio devices enables full performance across each band. Block Diagram Products Category MCU Product URL K24_120: Kinetis® K24-120 MHz, Full-Speed USB, 256KB SRAM Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core  Product Description The Kinetis® K24 120 MHz MCU family targets low-power, cost-sensitive applications requiring high-performance processing efficiency and large memory densities.   Category Accelerometer Product URL MMA8653FC: ±2g/±4g/±8g, Low g, 10-Bit Digital Accelerometer  Product Description The NXP® MMA8653FC 10-bit accelerometer has industry leading performance in a small DFN package.   Category Secure Element Product URL A1006: Secure Authenticator IC - Embedded Security Platform  Product Description The Secure Authenticator IC is manufactured in a high-density submicron technology.   Category Audio Amplifier Product URL TDF8530TH: I2C-Bus Controlled Quad Channel 45 W / 2 Ω Class-D Power Amplifier with Full Diagnostics  Product Description The TDF8530 is a quad Bridge-Tied Load (BTL) car audio amplifier comprising an NDMOST-NDMOST output stage based on SOI BCDMOS technology.
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  Overview Hearables or smart headphones are highly integrated, truly wireless earbuds designed to improve audio experiences across a range of consumer and healthcare applications. Small form factors, ultra-light weight and wireless operation increase user comfort. The continued challenge for hearables is how to combine audio quality, user experience and better battery life in a tiny package while offering a multitude of possibilities, all of which demands digital signal processing. To simplify customer engineering efforts on prototype TWS earbud, NXP built an Application Development Kit. Customer just need plug and play to test the functionality and performance of earbud. The ADK demonstrated a stable audio streaming link from Bluetooth mobile phone to both ear. It can be used as a fundamental platform for customer to develop hearables. Features Fitness tracking (pedometer, heart rate, etc.) Local playback (mp3, wav…) Voice UI (command trigger, ON/OFF) Voice enhancement (argument hearing, be forming) Universal translator Block Diagram Products Category MCU Product URL LPC541XX: Low-Power Microcontrollers (MCUs) Based on Arm® Cortex®-M4 Cores With Optional Cortex®-M0+ Co-processor  Product Description The LPC541xx MCU family of single-core and dual-core MCUs are our next-generation of power efficient MCUs.   Category NFMI Radio Product URL NXH2266: NFMI radio for wireless audio and data streaming  Product Description The NXP® NXH2266 is a fully integrated single-chip solution that enables wireless audio streaming and data communication using Near Field Magnetic Induction (NFMI), a mature technology that has a proven track record in the hearing industry.   Category Audio Codec Product URL SGTL5000: Ultra-Low-Power Audio Codec  Product Description The SGTL5000 is a low-power stereo codec designed to provide a comprehensive audio solution for portable products that require line-in, mic-in, line-out, headphone-out and digital I/O.   Category NFC Product URL NTAG I2C plus: NFC Forum Type 2 Tag with I2C interface  Product Description The NTAG I2C plus combines a passive NFC interface with a contact I2C interface.   Category Accelerometer Product URL MMA8652FC: ±2g/±4g/±8g, Low g, 12-Bit Digital Accelerometer  Product Description The NXP® MMA8652FC 12-bit accelerometer has industry-leading performance in a small package.   Category Power Management Product URL MC34673: 1.2 A Single-Cell Li-Ion/Li-Polymer Battery Charger  Product Description The MC34673 is a cost-effective fully-integrated battery charger for Li-Ion or Li-Polymer batteries.   Category Voltage Level Translator Product URL GTL2005PW: Quad GTL/GTL+ to LVTTL/TTL bidirectional non-latched translator  Product Description The GTL2005 is a quad translating transceiver designed for 3.3 V system interface with a GTL/GTL+ bus.
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NFC Tandem offers best of both worlds: An NFC reader and a passive connected tag sharing one antenna. A user can interact with the device when it is powered off (through the NTAG I²C plus); when the device is powered, it can interact with cards, P2P devices or other connected tags.                                                             NFC Tandem Uses Cases and Applications: One-touch pairing WiFi with phone, or card Bluetooth with phone, headset, speaker IoT network node commissioning User identification with badge or phone Authentication and configuration of consumable and accessory Zero-power parametrization Zero-power firmware update Zero-power diagnosis and maintenance NFC Tandem Demo: NFC Tandem concept is demonstrated using NFC Tandem reference board: The demo can run on either: UDOO Neo Download UDOO Neo demo image or Raspberry Pi Download Raspberry Pi demo image Video of the demo: <script src="https://players.brightcove.net/6153537070001/default_default/index.min.js"></script>(view in My Videos) NFC Tandem References: PN7150 High performance NFC controller, supporting all NFC Forum modes, with integrated firmware and NCI interface NTAG I²C plus NFC Forum Type 2 Tag with I²C interface NFC Tandem Documents: User Manual and reference schematics are attached to this document
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Description This is a very simple dodge the objects game. You are going to control a spaceship nave with the pushbuttons, one is use for up and the other to down, using the GPIO capabilities of the MCU. The on-board capacitive touch pad acts as start button and the game will prints in a terminal application as Tera term or also you can use an SSD1306 OLED display via SPI, the next picture show a block diagram of the project. Video Requirements LPC845 Breakout Board MCUXpresso IDE SDK_2.6.0_LPC845BREAKOUT LPC845_Spaceship.zip Micro USB cable Terminal Emulator (Tera Term, Putty) OLED Display from Adafruit (optional) Block Diagram NXP Product Link LPC84X LPC84x 30MHz|Arm® Cortex®-M0+|32-bit Microcontrollers (MCUs) | NXP  LPC845-BRK LPC845 Breakout Board for LPC84x family MCUs | NXP 
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Description    NXP’s Personal Network Attached Storage (NAS) solution enables portable personal storage to be shared through an internal protocol (IP) or Wireless network allowing users to share photos, data, stream music or videos, backup and recovery of data over the local area network in a completely secure environment. In addition, the solution can support gateway features such as packet forwarding, cloud connectivity via Ethernet, Wi-Fi or LTE. This NAS solution offers significant advantages to consumer and SMB environments, including: Hardware-accelerated Raid for data parity and recovery, a reduced bill of materials (BOM) and ease-of-use associated with an IP network that most business and consumers already find familiar. Based on the QorIQ Layerscape LS1012A processor and the Network Attached Storage Application Solution Kit (ASK), the personal/consumer NAS solution offered by NXP allows developers to easily build storage applications leveraging the highly-optimized and feature rich ASK software stack along with the small form factor, low-power consumption and packet processing capabilities enabled by LS1012A processor. NXP provides an integrated platform solution (SW and HW) helping the customer to reduce his time to market, increase security and increase performance by leveraging the packet accelerators within the QorIQ® Layerscape LS1012A processor while delivering high NAS performance and IP forwarding applications with reduced load on the Arm® core. In addition, NXP LS1012ARDB supports a full set of popular interfaces such as SATA, USB 3.0, PCIe and 2.5/1Gigabit Ethernet for LAN and WAN, allowing customers and operators to securely connect storage devices with the cloud. Features Integrated Platform Solution Commercial Market Proven Software Solution Hardware Offloading Popular Connectivity Flexible and Optimized Software Architecture Use Cases Personal Storage Consumer Network Attached Storage (NAS) Consumer Direct Attached Storage (DAS) Battery Powered Portable NAS Wireless Personal Storage Media Gateway Chip on Drive Wi-Fi SSD and Small/Portable Drive Ethernet Drives Block Diagram Products Category Name MPU Product URL Layerscape LS1012A Communication Processor for the IoT | NXP  Product Description The QorIQ® LS1012A processor, optimized for battery-backed or USB-powered, space-constrained networking and IoT applications Category Name DC Regulator Product URL MC34VR500 | Multi-Output DC/DC Regulator | NXP  Product Description The NXP® MC34VR500 power management solution for network processor systems is a high-efficiency, quad buck regulator with up to 4.5 A output and five user-programmable LDOs. Tools Product URL QorIQ® LS1012A Development Board QorIQ® LS1012A Development Board | NXP  Layerscape FRWY-LS1012A board FRWY-LS1012A Development Platform | NXP 
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Description Earlier this year NXP organized a promotional opportunity for amateur radio enthusiasts to use their creativity and build their own power amplifier designs. NXP received numerous creative submissions in this competitive Homebrew RF Design Challenge. We appreciate the dedication and enthusiasm from the community that made this contest a success. First place winner An MRF101AN broadband amplifier design with 1 W Input, 100 W Output 1.8-54 MHZ Amplifier deck. (For more information visit:NXP MRF-101 - RFPowerTools )  It is an amplifier with a bandwidth of 1.8MHz to 54MHz. Maximum output power of 100W up to 30MHz and 70W up to 50MHz. Maximum power supply 50V to 4A, with a Voltage Standing Wave Ratio of 1.5:1 maximum. The design dimensions of the PCB is 5x5 cm (2x2 in).  and  310g weight including fan and heat sink. Second place winner A 600W broadband HF amplifier using affordable LDMOS devices (For more information visit: https://qrpblog.com/2019/10/a-600w-broadband-hf-amplifier-using-affordable-ldmos-devices/  ) This project is meant to demonstrate the capabilities of the MRF300 transistors as linear broadband devices in the 2-50MHz range and to be used by radio amateurs as a starting point for a medium-high power amplifier. This is also my entry to the NXP Homebrew RF Design Challenge 2019. To achieve the target of 600W output while also minimizing the level of even-number harmonics, a “push-pull” configuration of two transistors is used. Luckily, the manufacturer made it easy to design the PCB layout for such a thing by offering two versions (the MRF300AN & MRF300BN) that have mirrored pinout. The common TO-247 package is used, with the source connected to the tab. Each individual MRF300 LDMOS transistor is specified at 330W output over a 1.8-250MHz working frequency range, a maximum 28dB of gain and over 70% efficiency. The recommended supply range is 30-50Vdc. By studying the specifications, it looks like with correct broadband matching and some operational safety margin we can get close to 600W output at a voltage of around 45V across a resonably large bandwidth; the aim is to cover 1.8 to 54MHz. Main challenges when designing this amplifier are related to achieving good input and output matching over the entire frequency range as well as maintaining high and flat gain. Good linearity and a low level of harmonic products are mandatory. As the TO-247 is not a package specifically designed for high-power RF, there are some challenges with thermal design and PCB layout as well. Information taken from the essay by the winner. Third place winner A High Efficiency Switchmode RF Amplifier using a MRF101AN LDMOS Device for a CubeSat Plasma Thruster (For more information visit: Research - SuperLab@Stanford ) The Class E amplifier utilizes the active device as a switch, operating in only cutoff (off) and saturated (on) conditions. This minimizes the overlap of voltage and current, reducing losses in the active device. To further reduce loss the Class E amplifier utilizes an inductively tuned resonant network to achieve zero voltage switching, bringing the voltage across the switch to zero before turn on, eliminating energy stored in the output capacitance of the active device that would otherwise be dissipated. This is achieved with an inductively tuned series resonant output filter.  In the Class E amplifier losses are almost entirely determined by the current conducted by the active device so a high drain impedance is desired to maximize efficiency. The drain impedance is ultimately limited by the voltage rating of the switch. For our desired output power of 40W and the maximum voltage rating of 133V for the MRF101AN this impedance is still less than 50 ohms, so a L match circuit is used to match the drain impedance to 50 ohms. The load network in our design provides a drain impedance of 15.4+12.8j. As the MRF101AN will operate in saturation a high drive level is desired. To eliminate the need for a preamplifier and allow for digital control, we use a high speed gate drive chip typically used in switch-mode power supplies, LMG1020, to drive the MRF101AN instead of a RF preamplifier. A resonant network is used to provide voltage gain at the fundamental and third harmonic, providing a quasi-square wave on the gate which helps insure the device remains in saturation. Conclusion It was a close call and highly competitive! Each participant had their own creative, unique and impressive way of displaying the capabilities of these new parts. NXP is always up for new design challenges. Ready for the next challenge?
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Description Near Field Communication (NFC) is used for real-time precision marketing based on time, local inventory and the individual when embedded in product displays or the products themselves. NFC is also becoming the preferred method for payment either in smartphones or smart payment cards. NXP secure MCUs and MPUs paired with our contact and contactless readers provide customers with state-of-the-art, comprehensive, pre-certified PCI and EMVCo payment acceptance capabilities that will ease the development process and speed time to market for payment solutions. SmartPOS will be the most important POS in the future. Customers can download authorized third-party software and connect to an acquiring system via cellular communication. It has both the security of traditional POS and the convenience of mPOS. Features Contact card interface (TDA8035) and contactless card interface (CLRC663) Supports the whole system to pass EMV Level 1/2 certification Magnetic Strip Card Reader (MSR) supports 1/2/3 tracker, which could be implemented by ADC module Tamper detection with more active pin pairs Integrated encryption module/accelerator High speed SPI interface to extend memory space Secure boot Code protection USB/UART/SPI communication ports, etc. Block Diagram Products Category Name 1 MCU and MPU Product URL 1 Arm Cortex-M4|Kinetis K21 120 MHz 32-bit USB MCUs | NXP  Product Description 1 The Kinetis K21 MCU features a hardware encryption coprocessor for secure data transfer and storage. Faster than software implementations and with minimal CPU loading. Supports a wide variety of algorithms - DES, 3DES, AES, MD5, SHA-1, SHA-256 Product URL 2 i.MX RT1170 Crossover MCU Family - First Ghz MCU with Arm® Cortex®-M7 and Cortex-M4 Cores | NXP  Product Description 2 i.MX RT1170 includes NXP’s EdgeLock™ 4A security subsystem, including secure boot and crypto engines Category Name 2 Card Reader Product URL 1 High integrated and low power smart card interface | NXP  Product Description 1 The TDA8035 is the cost efficient successor of the established integrated contact smart card reader IC TDA8024. It offers a high level of security for the card by performing current limitation, short-circuit detection, ESD protection as well as supply supervision. Product URL 2 CLRC663 plus | High-performance multi-protocol NFC frontend | NXP  Product Description 2 The CLRC663 plus is a high-performance NFC Frontend with low-power consumption. Is the perfect choice for NFC applications with high-performance requirements like access control, payment, gaming. Category Name 3 RTC Product URL 1 PCF2129 | NXP  Product Description 1 The PCF2129 is a CMOS Real Time Clock (RTC) and calendar with an integrated Temperature Compensated Crystal (Xtal) Oscillator (TCXO) and a 32.768 kHz quartz crystal optimized for very high accuracy and very low power consumption. Designs Products Links Linux Point of Sale (POS) Reader https://www.nxp.com/design/designs/linux-point-of-sale-pos-reader:SLN-POS-LRDR 
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