Connects - Training Material

Discussions

Secure designs begin with a security model consisting of policies, an understanding of the threat landscape and the methods used to enforce physical and logical security. This session introduces the basic concepts of security, the security threats faced by users, the security features of i.MX/MCU products, and how to use the security features to achieve secure boot, code protection, data protection, secure communication and so on.

Fixed Wireless Access (FWA) emerged as an attractive option for high-speed broadband connectivity in urban/suburban areas as a solution to the ‘last mile problem’. 60 GHz wireless mesh systems are generating commercial interest due to the attractive cost and deployment logistics of unlicensed, high-bandwidth spectrum relative to optical fiber networks. NXP’s Layerscape products are designed into FWA systems conceived to exploit the many opportunities of wireless mesh networks. Learn how NXP's 64-bit Arm® platforms drive the next generation of FWA success.

This session will first provide an overview of the products, software and enablement that NXP's wireless connectivity MCU portfolio includes to address the IoT market. Then, it will provide a deeper dive and demo on the Thread™ networking technology and how to develop an application using NXP's Thread Stack and ZigBee® Dotdot application layer. This session will also introduce the NXP BLE product family including the latest QN9080/83 ultra low-power BLE WMCU and KW35/36 automotive and industrial BLE WMCU, detailing targeted use cases, the device features, highlighting BLE and stacks as well as supporting enablement.

When choosing the NFC device for a new design, the system architect must consider many parameters. To avoid unpleasant surprises during software implementation phase, software has to be taken into account as well from the beginning. Different NFC IC categories (NFC Frontends, NFC Controller, Connected Tag) have different strengths, depending on the software environment. The way how highly integrated operating systems like Linux are structured brings both new challenges and advantages. This session examines the considerations necessary when designing in NFC in different operating systems or "bare metal" systems. It also discusses the advantages and disadvantages of the different device categories in dependence of the designated environment.

NXP offers a wide range of powerful microprocessors for the automotive and industrial markets. The memory selection of these systems can impact the performance, size, cost, power, reliability and longevity of your design. During this session we will discuss the new memories supported on the latest i.MX 8 Quad Max processor which is focused on automotive and industrial markets. For DRAM, this will include LPDDR4. For non-volatile memory, this will include Micron’s recently announced XccelaTM Octal SPI-NOR Flash and our newer e.MMC devices. These devices provide higher performance and are offered with automotive temperature and quality ratings. This session will provide designers with the information necessary to develop i.MX 8 systems for state-of-the-art automotive solutions.

The NFC market is exploding - ABI Research forecasts more than 2 billion NFC-enabled devices to shipped yearly by 2019. While the first product generations focused on standards and reading distance, the newest products also allow for fast design-in and certification thanks to features such as Dynamic Power Control, microcontroller integration or energy harvesting. Today we see three full NFC product categories to adress the growing number of use cases: (1) Connected NFC tag solutions with field-detection function and an NFC Forum-compliant RF or an I²C interface, (2) standalone NFC frontend solutions for the most flexible way to add NFC to a system and (3) NFC controller solutions to enable higher integration by combining an NFC frontend with an advanced 32-bit microcontroller, available with integrated firmware.

This class will introduce/update on Android Things, the new version of Android designed for the IoT market. The when, what and how of Android Things will be explained and how NXP has worked with Google to enable certified boards based on NXP silicon and why IoT product developers should consider using Android Things for their next IoT project. Finally the relationship between Android Things, Google Voice Assistant and Chromecast built in will be explained and what NXP parts are most appropriate for optimal performance.

With the very public hacks of some major vehicle brands in 2015, there is a renewed focus on vehicle security. There is a large range of vehicle electrical architectures, with significant regional variations, but there is an acceleration towards a domain orientated secure network. This presentation will look at the growing importance of the central gateway in a world of increased connectivity and security. As Ethernet becomes more prevalent, the topic of IP routing & firewall will be introduced and its role in adding another security layer. Finally, the role of the central gateway in enabling OTA software updated beyond the telematics unit, to the entire network will be presented.

In designing cooking appliances, there is ample consideration given to power required from a home's wired electrical system as well as the performance needed to maintain safety and operating temperatures. NXP's solid state RF cooking team has developed a portable food heating appliance using solid state RF energy which is capable of operating on battery power. This session will cover the key challenges and approaches to delivering energy to heat food in a portable, on-the-go appliance.

This course will provide an in-depth system analysis of High Voltage (HV) Electric We review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using system block diagrams and oscilloscope screen shots of NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design considerations, layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring and advanced features achieve system ASIL level D and ISO26262 certification.

Wireless (802.11) deployments are slated to overtake Ethernet switching revenue by the later part of the decade. Along with that volume, the new 802.11ax standard will deliver a 300% increase in useable performance along with higher density access for schools, airports, stadiums etc. Another driver is the demand for high bandwidth wireless within the home. Come learn about NXP's new Layerscape LA1575 and other innovative, integrated, programmable solutions available to address these increasing demands for wireless performance.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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