Connects - Training Material

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Security is critical to the growing market for IoT-enabled devices: There were already more than 5 billion connected devices in the world last year, and use is expected to grow to 12 billion by 2020. To support this rapid expansion, prominent internet players, including Alibaba, AWS, Google, IBM and Microsoft are establishing their own cloud services and industrial suppliers are moving quickly to broaden their private cloud offerings. At NXP, we believe strong security doesn't have to be hard to work with. Our "Plug & Trust" approach simplifies the implementation of strong security mechanisms in today's IoT devices. NXP's latest A71CH provides just this level of Plug & Trust IoT Security and delivers proven, chip-to-cloud security right out of the box, enabling every customer to secure IoT devices and safely connect to IoT clouds and services without writing security codes or exposing keys.

As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

Secure designs begin with a security model consisting of policies, an understanding of the threat landscape and the methods used to enforce physical and logical security. This session introduces the basic concepts of security, the security threats faced by users, the security features of i.MX/MCU products, and how to use the security features to achieve secure boot, code protection, data protection, secure communication and so on.

i.MX RT product is the most popular crossover MCU products in market this year. Positioning as MCU product, i.MX RT can certainly reuse the traditional Arm MCU ecosystem. Besides, this session will provide an overview introduction of i.MX RT series and their target market applications, then share the existing hardware/software/tools/documentation enablements for overall picture. Finally typical reference solutions on i.MX RT are introduced for better understanding what NXP offers to support customer for quick project development.

Complexity is increasing abruptly in the IVI market, while TTM has decreased from 5 to 2-3 years over a few product generations. The entire ecosystem is moving from a close to an open system model, and from proprietary/close source to standard interfaces/open source components. NXP is committed to support you in this new reality, as well as providing help in leveraging the extensive BOM NXP typically has in IVI solutions. Through the IVI Platform, NXP offers a solid and complete base for fast product development, integrating productized and optimized BSP and middleware components, with out of the box security. Find out more during a one hour presentation, covering platform features, delivery mechanisms, roadmap and availability.

The NFC market is exploding - ABI Research forecasts more than 2 billion NFC-enabled devices to shipped yearly by 2019. While the first product generations focused on standards and reading distance, the newest products also allow for fast design-in and certification thanks to features such as Dynamic Power Control, microcontroller integration or energy harvesting. Today we see three full NFC product categories to adress the growing number of use cases: (1) Connected NFC tag solutions with field-detection function and an NFC Forum-compliant RF or an I²C interface, (2) standalone NFC frontend solutions for the most flexible way to add NFC to a system and (3) NFC controller solutions to enable higher integration by combining an NFC frontend with an advanced 32-bit microcontroller, available with integrated firmware.

i.MX RT has a flexible external SPI Flash interface, which supports all existing SPI protocols. However, Serial Flash products may vary in READ performance due to the number of I/O, command protocols and the maximum frequency. Serial Flash Read performance has a direct impact on the system bootup time as well as code execution efficiency. In an advanced system design where system code is shadowed from Flash to DRAM, the initial boot time depends on the data transfer time from Flash to DRAM. In a cost-efficient system design, DRAM is reduced or eliminated since the processor will be able to fetch execution instructions directly from the Flash to the internal cache. During code fetching, a fixed length of data (typically 32- or 64-Byte) is read out from the flash. Shortening the overall 32-Byte or 64-Byte Read time will greatly reduce processor’s wait cycle, leading to improvement on XiP efficiency.

As LEDs continue to penetrate exterior automotive lighting applications by replacing traditional lighting solutions, there is an increasing demand for more safe, efficient, flexible and scalable electronics & driver ICs that can enable the full benefits of LEDs in these safety critical applications. This session will provide an overview of the requirements of Advanced Automotive Lighting Systems to provide safety in ADAS systems. Also the impact these system requirements have on the IC specifications, ranging from full system diagnostics, limp home modes, thermal and EMC considerations.

This course will provide an in-depth system analysis of High Voltage (HV) Electric We review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using system block diagrams and oscilloscope screen shots of NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design considerations, layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring and advanced features achieve system ASIL level D and ISO26262 certification.

ARM® mbed™ OS is an open source embedded operating system designed specifically for simplifying the development of scalable Internet of Things (IoT) devices. It includes all of the features you need to develop a connected-product based on ARM Cortex®-M microcontrollers such as Kinetis and LPC MCUs. In this hands on workshop you will get familiar with the features of mbed OS and learn how to develop and debug mbed OS applications with a traditional IDE.

In designing cooking appliances, there is ample consideration given to power required from a home's wired electrical system as well as the performance needed to maintain safety and operating temperatures. NXP's solid state RF cooking team has developed a portable food heating appliance using solid state RF energy which is capable of operating on battery power. This session will cover the key challenges and approaches to delivering energy to heat food in a portable, on-the-go appliance.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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