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As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

i.MX RT product is the most popular crossover MCU products in market this year. Positioning as MCU product, i.MX RT can certainly reuse the traditional Arm MCU ecosystem. Besides, this session will provide an overview introduction of i.MX RT series and their target market applications, then share the existing hardware/software/tools/documentation enablements for overall picture. Finally typical reference solutions on i.MX RT are introduced for better understanding what NXP offers to support customer for quick project development.

A key challenge to the deployment of Edge compute IoT is management and security of 1000s to millions of Edge compute nodes. EdgeScale simplifies this by providing a cloud-based management framework leveraging the hardware security features of Layerscape processors. Learn how you can use EdgeScale to manage a heterogenious set of Edge compute nodes, and use it with your choice of Edge compute framework - AWS Greengrass, Azure IoT Edge and others.

Complexity is increasing abruptly in the IVI market, while TTM has decreased from 5 to 2-3 years over a few product generations. The entire ecosystem is moving from a close to an open system model, and from proprietary/close source to standard interfaces/open source components. NXP is committed to support you in this new reality, as well as providing help in leveraging the extensive BOM NXP typically has in IVI solutions. Through the IVI Platform, NXP offers a solid and complete base for fast product development, integrating productized and optimized BSP and middleware components, with out of the box security. Find out more during a one hour presentation, covering platform features, delivery mechanisms, roadmap and availability.

i.MX RT has a flexible external SPI Flash interface, which supports all existing SPI protocols. However, Serial Flash products may vary in READ performance due to the number of I/O, command protocols and the maximum frequency. Serial Flash Read performance has a direct impact on the system bootup time as well as code execution efficiency. In an advanced system design where system code is shadowed from Flash to DRAM, the initial boot time depends on the data transfer time from Flash to DRAM. In a cost-efficient system design, DRAM is reduced or eliminated since the processor will be able to fetch execution instructions directly from the Flash to the internal cache. During code fetching, a fixed length of data (typically 32- or 64-Byte) is read out from the flash. Shortening the overall 32-Byte or 64-Byte Read time will greatly reduce processor’s wait cycle, leading to improvement on XiP efficiency.

As LEDs continue to penetrate exterior automotive lighting applications by replacing traditional lighting solutions, there is an increasing demand for more safe, efficient, flexible and scalable electronics & driver ICs that can enable the full benefits of LEDs in these safety critical applications. This session will provide an overview of the requirements of Advanced Automotive Lighting Systems to provide safety in ADAS systems. Also the impact these system requirements have on the IC specifications, ranging from full system diagnostics, limp home modes, thermal and EMC considerations.

ARM® mbed™ OS is an open source embedded operating system designed specifically for simplifying the development of scalable Internet of Things (IoT) devices. It includes all of the features you need to develop a connected-product based on ARM Cortex®-M microcontrollers such as Kinetis and LPC MCUs. In this hands on workshop you will get familiar with the features of mbed OS and learn how to develop and debug mbed OS applications with a traditional IDE.

As connected edge devices gain momentum with consumers, the security approaches and assumptions of the past will fail and create new threats and vulnerabilities to consumer safety and privacy. Additionally, the cost for security in mobile phones, tablets, and PCs will present a challenge for applications such as occupant sensors and heart rate monitoring patches. Lastly, the teams of security experts in connected industries do not yet exist at suppliers who are connecting products to the network. Join this session to learn how industries are providing cost effective, highly secure, certified hardware that can hasten the learning cycle for emerging edge node applications, bring solutions for security, drive down costs, and limit the supplier specific required expertise.

Connects - Training Material

Connects - Training Material

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