Connects - Training Material

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i.MX software IP inventory continues to grow. This session will provide an overview of the software available to you that will accelerate time-to-market and reduce project risk, namely: Audio Video Bridging (AVB), Trusted Execution Environment (TEE), Tessellation Run Length Encoding (TRLE), Android Auto / Apple Carplay, Miracast for Linux and HDCP2.x, AUTOSAR Microcontroller Abstraction Layer (MCAL) for i.MX, Fastboot/HAB, 360 SurroundView Monitoring and Rear View Camera (RVC).

i.MX RT product is the most popular crossover MCU products in market this year. Positioning as MCU product, i.MX RT can certainly reuse the traditional Arm MCU ecosystem. Besides, this session will provide an overview introduction of i.MX RT series and their target market applications, then share the existing hardware/software/tools/documentation enablements for overall picture. Finally typical reference solutions on i.MX RT are introduced for better understanding what NXP offers to support customer for quick project development.

V2X technology has the potential to drastically reduce road accidents and improve the traffic flow by fusing in-car sensor data with data obtained from other road users and from the surrounding infrastructure - visibly or unvisbily and far beyond the driver's line of sight. Vehicle to cloud data communication provides a pathway for anonymous data collection and dissemination. When the true potential for V2X is realized and it becomes a true part of the vehicle safety system it is vital that the authenticity and security of data are guaranteed. In addition, the vehicle control units that coordinate active stability systems must be protected against external influences that might subvert the mechanisms design. This presentation will explore the various security countermeasures needed to make V2X a safe and secure technology for the future.

This lecture provides an overview of the software and hardware enablement available to accelerate customer time-to-market and reduce development risks for an In-Vehicle Infotainment (IVI) system. Namely an application processor from i.MX 8 family, Ethernet Switch and PHY, Software Defined Radio and Audio processing, Audio Class-D amplifier, power management, supported by Genivi and AGL compliant BSP and integrated drivers and middleware components for these devices. In a second part, we will present the NXP eCockpit Proof of Concept, which leverages i.MX 8QM HW performances and partitioning capabilities and allows to run two concurrent and independent HLOS and a Safety Critical application (RVC, Display, Audio) on i.MX 8QM.

Ethernet adoption in new OEM platforms is accelerating, as a result of increased media, communication, and ADAS streams between different end points in vehicles. The required Quality of Service and synchronization is typically achieved through the implementation of Audio Video Bridging (AVB) specifications, or derivatives of AVB. NXP has a unique position in the market given our capability to offer a full solution for AVB in the car, from end points (MPUs as well as MCUs), PHYs, switches, plus the needed software stacks. In addition, the software stacks are full featured, including critical but often initially forgotten components such as Media Clock Recovery. Get an introduction to the basis of the AVB technology, and how NXP can help you deploy AVB in your products.

Bluetooth speakers and headsets, printers, cameras, projectors, set-top-boxes, TVs, Wi-Fi routers, fridges and washing machines, they all have one thing in common: Near-field-communication (NFC) which allows new features and easier handling. Just bringing two NFC-enabled devices close together is all it takes to create a connection. Accessories and consumables can be identified and authenticated without any user interaction. And commissioning an IoT node into a wireless network has never been as easy as it is now with NFC.

Automotive Acceleration on Automotive Radar Signal Processing AD/ADAS Overview Building Your Automotive Network with Time-Sensitive Networking (TSN) and Ethernet CAN in Future Car Networks—Understanding the Different Trends and Solutions Electrification—HV EV Power Inverter System and GD3100 Review Electrification—MC3377x Battery Cell Controllers for High-Voltage Battery Management System Exploring the Automotive General-Purpose MCU Portfolio GPIS Touch Sense Solution MCU: MagniV® Integrated Solution Deep Dive Next-Generation Functional Safety Architecture NXP’s xEV Energy Management Solutions NXP Car Access—Roadmap Towards Smart Access (NFC, BLE, UWB, SE) OTA Updates—Requirements for a Full System Solution Power Management Solutions for Automotive_Connects China S32 Common Chassis Overview S32 Radar Processor, Product Revolution The Rise and Evolution of Automotive Gateways xEV HV Traction Motor Power Inverter Platform Artificial Intelligence, Enabling Technologies, Security & Solutions A Vision for Machine Learning (ML) and Artificial Intelligence (AI) in Low-Cost Edge-Computing Nodes Computing at the Edge - When, Why and How_Connects China Boot in Less Than One Second? Learn How_Connects China EdgeScale: A Solution for Secure Edge Device and Application Management from the Cloud_Connects China Learn to Get Up and Running Fast with MCUXpresso Software and Tools Overview of i.MX/MCU Security Features Using OpenWRT, Yocto, Ubuntu or Your Own Custom Linux® Distribution? Learn How NXP is Making it Easy to Leverage a Multi-Distribution Approach to Software Development_Connects China Smart Machinery & Industrial Automation NXP Complete Motor Control Solutions Open Industrial Linux® (OpenIL)—Secure, Robust, Real-Time for Industrial and Automation Applications_Connects China Time-Sensitive Networking (TSN) and Precision Time Protocol (PTP): Challenges, Opportunities and Solutions Multimedia Experience NXP MCU and MPU Based Voice and Audio Solutions for AI-IoT Market Smart Networks & Computing DAS and Small Cell for the Mobile Broadband High Power RF Applications for Above 1GHz Cellular Band with GaN Technology High Power RF Applications for Cellular Band with LDMOS Technology SD-CPE—A CPE to be Deployed with VM (Docker, etc.) and Managed by Orchestrator SD-WAN—Concept and Application to Enable Flexible Network Bandwidth Management On-Demand Smarter World Solutions & Multimode Connectivity Fast Charger/Adapter (TEA1936+ TEA199x+ TEA1903x/05x); LLC Resonant AC/DC Power (TEA19161+ TEA19162+ TEA1995) i.MX RT Enablements and Reference Solutions i.MX RT Overview and Security on Memory Expansion Design Introduction to NXP Wireless Charging Solution and Design Low-Cost Production Proven Smart eLock Solution MiGLO®_Connects China NTAG® SmartSensor_Connects China NXP Connectivity Solutions for Smart Home, Building and Lighting and BLE Low-Power Solutions for Consumer, Medical, Industrial IoT and Automotive Markets Power Regulation/Market Trend and Overview of NXP AC/DC Power Solutions Rapid IoT Prototyping Kit_Connects China Smart Amp Software_Connects China Type-C End-to-End Solution_Connect China Using Sensors for Low-Power IoT Applications: Tips and Tricks_Connects China Emerging Trends & Innovation An Overview of NXP MCU Portfolio Based on Arm® Cortex®-M Cores Secure Tamper-Resistant Authentication_Connects China

Design, Software & Services Hands-On Workshop: Design with Embedded Solutions for the Always-On Market Using the New LPC54114 Power-Efficient MCU DES-N2084 & DES-N1956 Hands-On Workshop: FreeRTOS Solutions for Kinetis MCUs DES-N1960 Hands-On Workshop Kinetis Enablement Hands-On Workshop: Securing the IoT One Edge Node at a Time with Kinetis DES-N1931 i.MX 6QuadPlus and i.MX 6DualPlus Applications Processors-Performance-Tier Multicores for Visually Stunning Graphics-Centric Applications DES-N1940 i.MX 8 Graphics Architecture Kinetis® MCU Security Technology Linear Technology: Proven & Scalable Power Solutions for the Latest QorIQ Series Processors Logic Devices: Case Studies of Practical Examples of Power, Space and Cost Savings with NXP Innovative Logic Solutions Micron Technology: Memory Choices for NXP Microprocessors Security 101: Introduction to Security Acceleration in QorIQ® Processors TQ-Systems: How to Speed Up and Optimize Your Design with Modular Approach USB Type-C Overview Smart Home & Buildings Bluetooth® Smart Mesh: Simple and Easy-to-Use Low-Power Wireless Networking Protocol Hands-On Workshop: Advanced Thread® Stack Class on Routing, Border Router, Security, Low Power and Commissioning Hands-On Workshop: Use NFC Pairing to Connect Multiple Bluetooth® and Wi-Fi® Devices with a Simple Tap How to Choose the Right NFC Solution for Your Use Case Insight & Innovation LPC Microcontrollers Portfolio, Enablement Overview and Roadmap INS-N1819 Sensor Deep-Dive Demos and Data Collection Techniques Secure Mobile, Healthcare & Wearables MHW-N1990 Enabling Ultimate Miniaturization and Customization with the Latest Single Chip System Module Technology MHW-N2009 Hands-On Workshop Develop your IoT and Wearable Applications Instantly with Hexiwear.pdf MHW-N1917 Wireless Charging Lets You Cut that Cord! Smart Machinery & Industrial Automation SMI-N1948 Hands-On Workshop - Kinetis Motor Suite.pdf Smart Networks NET-N1865 Introduction to QorIQ LS1012A - the Worlds Smallest and Lowest Power 64-bit Processor.pdf

Connects - Training Material

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