Connects - Training Material

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Today’s designers are facing ever more challenges to protect their intellectual property and products from counterfeits or unauthorized access. To help understanding the secured solutions offered by NXP, Future’s system design center have designed a Secure Access Demo board to showcase the capabilities of the LPC43S57 a microcontroller with integrated security and the A700X tamper resistant and secure MCU solution. This class will be an overview of the architecture of a secured system and introduction to the secured elements from NXP.

Design, Software & Services DES-N1954 Hands-On Workshop ARM mbed OS the Open Source IoT Operating System DES-N2084 & DES-N1956 Hands-On Workshop: FreeRTOS Solutions for Kinetis MCUs DES-N1973 Hands-On Workshop Master Development on the LPCXpresso Toolchain with Our LPCOpen Development Kit Hands-On Workshop: Securing the IoT One Edge Node at a Time with Kinetis VIDEO PRESENTATION: FTF-DES-N1931 - i.MX 6QuadPlus and i.MX 6DualPlus Applications Processors-Performance-Tier Multicores for Visually Stunning Graphics-Centric Applications DES-N1936 i.MX 6UltraLite DDR Tools Overview and Hardware Design Considerations DES-N1940 i.MX 8 Graphics Architecture DES-N1957 Kinetis Enablement Industry's Most Comprehensive Software Tool Portfolio DES-N1967 Leveraging NXP LPC Microcontrollers to Maximize Energy Efficiency in Always-On Applications AMF-DES-T2001 - Power Distribution Made Easy DES-N1939 Teaching Things to See: Introduction to i.MX 8 Vision Architecture Insight & Innovation INS-N1981 Wireless MCU Overview Secure Connected & Automated Vehicles AUT-N1775 - Enabling Hybrid CAN Networks CAN FD Shield AUT-N1793 Hands-On Workshop S32 Design Studio and SDK AUT-N1797 MagniV Integrated Solutions for Motor Control VIDEO PRESENTATION: FTF-AUT-N1794 - S32K Scalable Next-Generation MCU Family with Advanced Features Secure Mobile, Healthcare & Wearables MHW-N1921 Digital High Efficiency AC/DC Resonant Supplies MHW-N1990 Enabling Ultimate Miniaturization and Customization with the Latest Single Chip System Module Technology MHW-N1988 Hands-on Workshop- Designing with NXP Bluetooth Smart Solution for Wearables and IoT Applications FTF-MHW-N1987 NXP Wearables & Fitness Platform and Solutions Roadmap Smart Networks NET-N1865 Introduction to QorIQ LS1012A - the Worlds Smallest and Lowest Power 64-bit Processor NET-N1868 Market Drivers and Time Sensitive Networks https://community.nxp.com/docs/DOC-331664 NET-N1863 What's Next for QorIQ - Portfolio and Roadmap

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

At Cog Systems, our sole objective is to both build and enable the world’s most secure connected devices. We provide the right foundations for you to build products that provide inherent security, performance, enable reuse, and flexibility needed to support next gen apps while also reducing build cost. We'll look at our system’s toolkit known as D4 Secure SDK. D4 provides key capabilities such as a type-1 hypervisor, various OS, RTOS support, secure boot frameworks, virtual drivers, and packages components such as VPN and secure storage so that you can quickly enhance or build new secure connected device products. Apply this toolkit to an NXP i.MX 6 applications processor based platform for constructing an auto domain/gateway controller and an infotainment system that combines multiple OS and real-time elements with a strong security posture.

The continued growth of processing capabilities and new features introduced with the ARM®v8 based System-on-Chip has made virtualization a realistic option for embedded system developers. With virtualization, system architects can design solutions that reduce the size, weight, power, and cost of legacy systems by consolidating disparate software functions onto a single chip, even if those different software functions require different operating systems or otherwise incompatible software stacks. Virtualization allows architects to partition and isolate software components with different safety, security, or licensing requirements. The virtual machine manager, or hypervisor, is the key piece of software technology enabling virtualization. Open source hypervisor, Xen, supports the ARMv8 processor family.

Signal integrity, EMI, RFI...They are all the result of how well you manage the Electromagnetic fields in your designs. EM fields live in spaces, not conductors. The material presented focuses on the basic physics of electromagnetic energy, presented in an entertaining and easy-to-understand format with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help them to design PCBs that will be more robust and have better EMC performance. This is not rocket science, but an easy-to-understand application of PCB geometry.

As IC geometries continue to shrink and switching speeds increase, designing electromagnetic systems and printed circuit boards to meet the required signal integrity and EMC specifications has become even more challenging. A new design methodology is required. Specifically, the utilization of an electromagnetic physics-based design methodology to control the field energy in your design will be discussed. This training module will walk through the development process and provide you with guidelines for building successful, cost effective printed circuit boards.

Deep dive into the vision processing architecture of the i.MX 8 family. Learn how to access the advanced processing features, the vision SDK, and the vision-based applications enabled by the i.MX 8 processor. This class provides an introduction to understanding the unique way in which machine vision is handled by i.MX 8. It forms a basic introduction class that is a precursor to the more advanced "Call Your Shot!" pool table demo class.

In the past, auto HMI developers approached the instrument cluster, infotainment system and any other auxiliary driver displays as separate projects, each with their own unique challenges and requirements. With eCockpit HMI developers are tasked with approaching the cluster, IVI system, HUD, rear-seat entertainment and other screens in the vehicle as a single system of displays that have been fragmented within the vehicle and even run on a singular MPU. Examine the requirements for these new integrated cockpit systems. Discuss how design teams can deliver consistent language, look and feel across multiple displays with separate and varied purposes. Talk about the concerns related to safety and certification for system as it applies to a variety of auto standards and reveal how teams can successfully design these systems for a single processor family and reuse across low- high-end auto models.

This course will provide an in-depth system analysis of high voltage (HV) electric vehicle (EV) and hybrid electric vehicle (HEV) power conversion. We will review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient, and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design and layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring, and advanced features provides monitoring and reporting of key safety functions to achieve system ASIL level D and ISO26262 certification.

As a major supplier to the world automotive market, NXP Standard Products continues to innovate new semiconductor packaging options for the unique needs of this market. This seminar will cover the latest in packaging technology including: Clip bonded LFPAK (focusing on LFPAK33, LFPAK88, flatpower diodes and BJT LFPAK56); SWF Side Wettable Flanks (focusing on logic DQFN and discrete devices); A comparison of leaded vs leadless MiniLogic packaging.

Connects - Training Material

Connects - Training Material

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