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i.MX Processors Knowledge Base

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All, This document will help you to understand the " YOCTO PROJECT COMMUNITY LAYERS" and the "YOCTO PROJECT FREESCALE OFFICIAL RELEASE" differences and where the layer content is coming from.   Best Regards, Luis
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This is the prototype demo to enable surround view demo on SabreSD.   The attached Files are HW&SW guides and demo video. Updating Notes: Add miniPCIE Surround View_Rev A design file (include schematic and layout) as attachement. Add Gerber file   i.MX6Q Surround view patch https://community.freescale.com/docs/DOC-95143 Original Attachment has been moved to: Gerber-file.zip Original Attachment has been moved to: miniPCIe-Surround-View_Rev-A.zip
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When you do long test (days or weeks) test on i.MX board and your test fails, you often wants to know what has happen with a JTAG probe. The problem is when you have 50 boards running in parallel, you don't have the budget to have 50 JTAG debug probe. If you do a "hot plug" of your JTAG probe, you have roughly one chance out 2 to reset your board... so you'll have to wait another couple of hour to resee the problem. Anyway to have a reliable JTAG plug with no reset, it is really simple... cut the RESET line on your cable! then you'll still be able to "attach" to your i.MX. On the MEK board, with a 10-pin JTAG connector, you have the cut the cable line 10 of the ribbon cable: On the cable, cut the reset line like this: With my Lauterbach JTAG  probe, when I do a "hot plug" I never have a reset of my i.MX. BR Vincent
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It is based on 3.0.35 GA 4.1.0 BSP.   0001-Correct-mipi-camera-virtual-channel-setting-in-ipu_c.patch It is the updated IPU code for MIPI ID and SMFC setting in ipu_capture.c. These setting should not be combined with MIPI virtual channel value, they shoule be fixed with ID 0.   0002-Use-virtual-channel-3-for-ov5640-mipi-camera-on-iMX6.patch The sample code to modify ov5640_mipi camera to use virtual channel 3 on SabreSD board.   The followed command can be used to verify the mipi camera function after booted into Linux: $ gst-launch mfw_v4lsrc capture-mode=1 device=/dev/video1 ! mfw_v4lsink     2014-09-30 update: Added the patch for 3.10.17_GA1.0.0 BSP. "L3.10.17_1.0.0_mipi_camera_virtual_channel_3.zip"  
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MIPI can support video streaming over 1, 2, 3 and 4 lanes. On i.MX6 Sabre boards, the OV5640 camera supports 1 or 2 lanes and the NXP Linux Kernel uses 2 lanes as default. In order to use only one lane, follow the steps below: 1 - Change the board Device Tree on Linux Kernel. On file <linux kernel folder>/arch/arm/boot/dts/imx6qdl-sabresd.dtsi, find the entry "&mipi_csi" and change lanes from 2 to 1. 2 - Configure OV5640 to use only one lane instead of two. On file <linux kernel folder>/drivers/media/platform/mxc/capture/ov5640_mipi.c, change the register 0x300e value from 0x45 to 0x05. This register setup is located at struct ov5640_init_setting_30fps_VGA. 3 - Build the kernel and device tree files. 4 - Test the camera. Unit test can be used to test the video capture: /unit_tests/mxc_v4l2_overlay.out -di /dev/video1 -ow 1024 -oh 768 -m 1 5 - Checking if it's really using one lane. MIPI_CSI_PHY_STATE resgister (address 0x021D_C014) provides the status of all data and clock lanes. During video streaming using 2 lanes, the register value constantly changes its value between 0x0000_0300 and 0x0000_0330. When using only one lane, this register value constantly changes its value between 0x0000_0300 and 0x0000_0310. To read the register value during the stream, run the video test with &: /unit_tests/mxc_v4l2_overlay.out -di /dev/video1 -ow 1024 -oh 768 -m 1 & Now, run the memtool: /unit_tests/memtool -32 0x021dc014 1 i.MX6DL running mxc_v4l2_overlay.out with only one lane:
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Hi All, The i.MX6 Android R13.4-GA.03 patch release is now available on www.freescale.com ·         Files available # Name Description 1 IMX6_R13.4.03_ANDROID_PATCH This patch release is based on the i.MX 6 Android R13.4   release. The purpose of this patch release is correct the PFD workflow in   U-Boot, fix the miscalibration issue for the thermal sensor and corrects   ramp-up time of the internal LDOs
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NOTE: Always de-power the target board and the aggregator when plugging or unplugging smart sensors from the aggregator. NOTE: See this link to instrument a board with a Smart Sensor. Overview The i.MX Power Profiler system consists of one to fourteen "smart" current sensors, an aggregator shield, and a Kinetis FRDM board (the FRDM-KL25 has been used in prototyping but the FRDM-K64F and FRDM-K66F should also be fully compatible). One of the biggest improvements of this system over its preceeding dual-range measurement system is that the microcontroller on each sensor board allows near-simultaneous measurement of all instrumented rails on a board. The dual range profiler has only a single MCU for all sensors, so only one measurement can be made at a time.  It is intended to be used to instrument one to fourteen rails of a target i.MX appliation board. Ideally, the target board will have been designed with a matching/mating power sense footprint for each rail to be measured.  Each smart sensor can sense current in three ranges with three current sense amplifiers. They are "smart" because each sensor board has a Kinetis KL05Z on it to control the switching FETs and to digitize the analog signals (the sense amplifier outputs and the target's power supply rail voltage). A 1% voltage regulator on each smart sensor provides a good voltage reference right next to the KL05Z to ensure better ADC accuracy. Each smart sensor board communicates via I2C. The aggregator shield has three I2C bus extenders (PCA9518) which essentially provide a dedicated I2C bus for each of the connected smart sensors. The FRDM board's I2C is also connected to one of the bus extenders ports. Individual GPIO lines are routed to each smart sensor's connected along with a ganged reset and trigger line for all of the connected smart sensors. A boost regulator generates almost 12V from the FRDM board's 5V supply, which is used for all the switching FETs on the smart sensor boards. The FRDM board's 5V rail is also routed to each smart sensor, which is regulated down to 3.3V locally on each connected smart sensor. Here is a photo of the very first prototypes after moving to 10-pin 0.05" spaced headers and ribbon cables instead of FFC: The smart sensor is intended to mate with through-hole current sense tap points on the target i.MX application board. Three holes spaced at 0.05" each. When not instrumented with sensor, a short needs to be placed across the outer two pins so that the board will function normally. The through hole connections provide physical protection to the target board, keeping traces from getting ripped off. The ground connection in the center provides a reference for meauring the rail voltage on the target board. A partial layout example of the implementation of the current sense footprint is below, where two 0805 shorting resistors in parallel are placed on each side of the holes. The top trace connects to the regulator output and the bottom to the load, usually an i.MX power supply rail. To include the current sense footprint into a board during the design phase, it should be configured as in the following partial schematic:  Every effort should be made to place the feedback on the i.MX side of the sense points so that the regulator compensates for the additional series resistance of the smart sensor, which effectively eliminates the additional series resistance the smart sensor adds. The Feedback should be before the smart sensor if the switching supply won't tolerate the additional series resistance (i.e., output becomes unstable).
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  IMX6 S/DL for consumer has both PXP and IPU. Automotive and Industrial versions doesn't have PXP. As IMX6 also has IPU, the Linux framebuffer driver uses IPU and not PXP. Note : “pxp_v4l2_test.out” from unit_tests was made for processors (i.MX6 SL), that have only PXP and its framebuffer driver applies PXP to accelerate image processing. “pxp_v4l2_test.out” should not be used with i.MX6 S/DL. To test PXP device with i.MX6 S/DL users have to try “pxp_test.out”.
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INTRODUCTION REQUIREMENTS CREATE A NEW PROJECT GPU EXAMPLE GSTREAMER EXAMPLE 1. INTRODUCTION:      The below steps show how to create different application examples using Elipse IDE. 2. REQUIREMENTS:      A fully working image and meta-toolchain generated in Yocto . You can follow the  next training: Yocto Training - HOME      Install and configure the Yocto Eclipse Plug-in. For more details about this requirement please refer to Setting up the Eclipse IDE for Yocto Application Development         To demonstrate the steps, L3.14.28  BSP, fsl-image-qt5 image and i.MX6Q SABRE-SDP board were used. 3. CREATE A NEW PROJECT      Follow the section Creating a Hello World Project of this document Setting up the Eclipse IDE for Yocto Application Development 4. GPU EXAMPLE           For this project we use the source code found in the fsl-gpu-sdk that can be downloaded from:      https://www.freescale.com/webapp/Download?colCode=IMX6_GPU_SDK&location=null&Parent_nodeId=1337637154535695831062&Parent…      Follow section 3 and create a new project named gputest.      From the IMX6_GPU_SDK choose one of the examples of GLES2.0 folder. In this case the 01_SimpleTriangle is chosen.      Copy the .c and .h files to the src directory of the gputest project. The Project Explorer window should look like this:              Add the needed files and libraries to compile and link in the Makefile.am file found in the ´src´ folder. The Makefile.am file should have the below content:          bin_PROGRAMS = gputest          gputest_SOURCES = gputest.c fsl_egl.c fslutil.c          AM_CFLAGS = @gputest_CFLAGS@          AM_LDFLAGS = @gputest_LIBS@ -lstdc++ -lm -lGLESv2 -lEGL -lX11 -ldl          CLEANFILES = *~ ​    Add the PATH to CFLAGS where the compiler will look for the headers at Project->Properties->Autotools->configure:           In this project there is no need to add extra PATHs for the headers. Apply the changes by clicking on Reconfigure Project. Build the project To test the file you can send the executable to the board with:           $ scp gputest root@<board_ip>:/home/root      $./gputest      You should get the next output in the display: 5. GSTREAMER EXAMPLE      For this project we use the source code found at Basic tutorial 1: Hello world! - GStreamer SDK documentation - GStreamer SDK documentation    Follow section 3 and create a new project named Gstreamer.    Copy the code of the basic tutorial to your Gstreamer.c file.    Add the needed files and libraries to compile and link in the Makefile.am file found in the ´src´ folder. The Makefile.am file should have the below content:                           bin_PROGRAMS = Gstreamer      Gstreamer_SOURCES = Gstreamer.c      AM_CFLAGS = @Gstreamer_CFLAGS@      AM_LDFLAGS = @Gstreamer_LIBS@ -lstdc++  -lVDK -lm -lGLESv2 -lGAL -lEGL  -ldl -lgstreamer-0.10 -lgobject-2.0 -lgmodule-2.0 -lgthread-2.0 -lrt -lxml2 -lglib-2.0      CLEANFILES = *~         ​    Add the PATH to CFLAGS where the compiler will look for the headers at Project->Properties->Autotools->configure:           For this example the next lines are added             -I${Sysroot}/usr/include/gstreamer-1.0        -I${Sysroot}/usr/include/glib-2.0        -I${Sysroot}/usr/include/libxml2        -I${Sysroot}/usr/lib/glib-2.0/include      Apply the changes by clicking on Reconfigure Project. Build the project To test the file you can send the executable to the board with:           $ scp Gstreamer root@<board_ip>:/home/root To execute the application on the board:      $./Gstreamer The board should have internet access and the application should play the video found at http://docs.gstreamer.com/media/sintel_trailer-480p.webm
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It is based on L3.0.35_GA4.1.0 BSP.   In default Linux BSP, there are 3 kinds of de-interlace mode, motion =0,1,2 mode, motion mode 0 and 1 will use three fields for de-interlace, and motion mode 2 wil use one field for de-interlace, so the whole fps is 30. In this mode, for motion mode 0 and 1, field 1,2,3 was used for first VDI output frame of display; and field 3,4,5 was used for second VDI output frame of display; field 5,6,7 was used for third VDI output frame of display. One field data (such as 2,4,6) was used only once, so there is data lost.   After applied these patches, the VDI de-interlace output will be 60fps: for motion mode 0 and 1, field 0,1,2 was used for first VDI output frame of display; and field 1,2,3 was used for second VDI output frame of display; field 2,3,4 was used for third VDI output frame of display. So all field data will be used twice, there is no video data lost, the VDI quality was improved.   Kernel patches: 0001-Add-MEM-to-VDI-to-MEM-support-for-IPU.patch 0002-Add-IPU-IC-memcpy-support.patch 0003-IPU-VDI-support-switch-odd-and-even-field-in-motion-.patch 0004-IPU-VDI-correct-vdi-top-field-setting.patch   mxc_v4l2_tvin_imx6_vdi_60fps.zip: this is the test application sample code.   Test commands, parameter "-vd" means double fps VDI: ./mxc_v4l2_tvin.out -ol 0 -ot 0 -ow 720 -oh 480 -m 0 -vd  
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Instrumenting A Board To instrument a board, the connection between the power supply and the target device needs to be broken, usually via a series resistor that's placed on the board. Sometimes the inductor needs to be lifted if no series resistor was included on the rail by the board's designer. In the ideal case, through-hole connections were also provided on the board for the connection of these off-board sensors. Here are three close-up photos that show several boards that have been instrumented: In all three cases, the sensors stand in place via the two outer current carrying wires. The middle and right used insulated wires where as the one on the left used bare wires. In all three cases, the sensor's + connection needs to go towards the power supply and the - connection goes to the target device. The outer wires here are 24-26 gauge. (The relatively heavy gauge wire is used to keep the series resistance of inserting a smart sensor to a minimum.) The ground connection is the middle hole of the smart sensor. In the left and middle photos, a 30 gauge wire connects to the middle hole ground connection on the  board. In the right photo, the ground wire was more conveniently added to a big cap just below the bottom of edge of the photo. Here are wider angle view photos of two of the boards above: The sensors on the left are free-standing since the current carrying wires are stiff enough to hold them upright. Care must be taken since too much flexing will cause a wire to break. Too much bending can also cause a short to the board (and that's why insulated wires were used on these boards). The board on the right has the sensors laying parallel to the board. They are not affixed to the board, but a wire is wrapped around the bundle of ribbon cables out of view past the right edge of the photo. For boards without the through hole connections, the smart sensors need to be immobilized to keep from pulling the SMT pads off the board. If there is room on the board or sides of connectors or large components, the sensors may be attached down with foam double-sticky tape (see photo below, sensor affixed on top i.MX7ULP): For boards where there are no convenient unpopulated areas or there are too many sensors, some other means needs to be devised to immoblize the smart sensors. In the left photo below, two inductors per sensor have been flipped and the two sensors inserted to instrument the two rails. The solder pads on the inductors would easily be broken off by any movement of the smart sensors, so a cage with clamps to hold the ribbon cables was 3D printed. On the back side, there is room for the aggregator to be zip tied to the bottom plate, so the instrumented board can be moved as a single unit with minimal flexing of the ribbon cables.
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When configuring i.MX6 IPU IDMAC CPMEM parameters or debugging it, it's hard to find the value of a parameter inside the 160 bits word. This web tool separates the 160 bits words into parameters making it easier to check their values. Link: i.MX Tools 
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We use PCIe to connect Intersil TW6865 chip for the surround view solution. This is the connection of PCIe to iMX6Q SabreSD board.   This is the block diagram of the connection: This is the 4 camera surround view:   Code base is L3.0.35_12.10.02 release. You can merge the patch file to the latest Freescale release. Please check the attach file for the patch code.   Note:  It is only a test version. The last code for L3.0.35 BSP: L3.0.35_GA4.1.0 Patches.7z The last code for L3.10.53 BSP: L3.10.53_TW686x_patch.7z Patch for L4.1.15 1.1.0 GA BSP: TW6865 driver for Linux L4.1.15_1.1.0-ga.7z
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Requirements: Host machine with Ubuntu 14.04 UDOO Quad/Dual Board uSD card with at least 8 GB Download documentation and install latest Official Udoobuntu OS (at the moment of writing: UDOObuntu 2.1.2), https://www.udoo.org/downloads/   Overview: This document describes how to install and test Keras (Open source neural network library) and Theano (numerical computation library for python ) for deep learning library usage on i.MX6QD UDOO board.  Installation: $ sudo apt-get update && sudo apt-get upgrade update your date system: e.g. $ sudo date -s “07/08/2017 12:00” First satisfy the run-time and build time dependencies: $ sudo apt-get install python-software-properties software-properties-common make unzip zlib1g-dev git pkg-config autoconf automake libtool curl  python-pip python-numpy libblas-dev liblapack-dev python-dev libatlas-base-dev gfortran libhdf5-serial-dev libhdf5-dev python-setuptools libyaml-dev libpython2.7-dev $ sudo easy_install scipy The last step is installing scipy through pip, and can take several hours. Theano First, we have a few more dependencies to get: $sudo pip install scikit-learn $sudo pip install pillow $sudo pip install h5py With these dependencies met, we can install a stable Theano release from the git source: $ git clone https://github.com/Theano/Theano $ cd Theano Numpy 1.9 cause conflicts with armv7, so we need to change the setup.py configuration: $ sudo nano setup.py Remove line    #       install_requires=['numpy>=1.9.1', 'scipy>=0.14', 'six>=1.9.0'], And add setup_requires=["numpy"], install_requires=["numpy"], Then install it: $ sudo python setup.py install Keras The installation can occur with the command: (this could take a lot of time!!!) $ cd .. $ git clone https://github.com/fchollet/keras.git $ cd keras $ sudo python setup.py install $ LC_ALL=C $sudo pip install --upgrade keras After Keras is installed, you will want to edit the Keras configuration file ~/.keras/keras.json to use Theano instead of the default TensorFlow backend. If it isn't there, you can create it. This requires changing two lines. The first change is: "image_dim_ordering": "tf"  --> "image_dim_ordering": "th" and the second: "backend": "tensorflow" --> "backend": "theano" (The final file should look like the example below) sudo nano ~/.keras/keras.json {     "image_dim_ordering": "th",     "epsilon": 1e-07,     "floatx": "float32",     "image_data_format": "channels_last",     "backend": "theano" } You can also define the environment variable KERAS_BACKEND and this will override what is defined in your config file : $ KERAS_BACKEND=theano python -c "from keras import backend" Testing Quick test: udooer@udoo:~$ python Python 2.7.6 (default, Oct 26 2016, 20:46:32) [GCC 4.8.4] on linux2 Type "help", "copyright", "credits" or "license" for more information. >>> import keras Using Theano backend. >>>  Test 2: Be aware this test take some time (~1hr on udoo dual): $ curl -sSL -k https://github.com/fchollet/keras/raw/master/examples/mnist_mlp.py | python Output: For demonstration, deep-learning-models repository provided by pyimagesearch and from fchollet git, and also have three Keras models (VGG16, VGG19, and ResNet50) online — these networks are pre-trained on the ImageNet dataset, meaning that they can recognize 1,000 common object classes out-of-the-box. $ cd keras $ git clone https://github.com/fchollet/deep-learning-models $ Cd deep-learning-models $ ls -l Notice how we have four Python files. The resnet50.py , vgg16.py , and vgg19.py  files correspond to their respective network architecture definitions. The imagenet_utils  file, as the name suggests, contains a couple helper functions that allow us to prepare images for classification as well as obtain the final class label predictions from the network Classify ImageNet classes with ResNet50 ResNet50 model, with weights pre-trained on ImageNet. This model is available for both the Theano and TensorFlow backend, and can be built both with "channels_first" data format (channels, height, width) or "channels_last" data format (height, width, channels). The default input size for this model is 224x224. We are now ready to write some Python code to classify image contents utilizing  convolutional Neural Networks (CNNs) pre-trained on the ImageNet dataset. For udoo Quad/Dual use ResNet50 due to avoid space conflict. Also we are going to use ImageNet (http://image-net.org/) that is an image database organized according to the WordNet hierarchy, in which each node of the hierarchy is depicted by hundreds and thousands of images. from keras.applications.resnet50 import ResNet50 from keras.preprocessing import image from keras.applications.resnet50 import preprocess_input, decode_predictions import numpy as np   model = ResNet50(weights='imagenet')   #for this sample I download the image from: http://i.imgur.com/wpxMwsR.jpg  img_path = 'elephant.jpg' img = image.load_img(img_path, target_size=(224, 224)) x = image.img_to_array(img) x = np.expand_dims(x, axis=0) x = preprocess_input(x)   preds = model.predict(x) # decode the results into a list of tuples (class, description, probability) # (one such list for each sample in the batch) print('Predicted:', decode_predictions(preds, top=3)[0]) Save the file an run it. Results for elephant image: Top prediction was 0.8890 for African Elephant Testing with this image: http://i.imgur.com/4FIOwAN.jpg Results: Top prediction was: 0.7799 for golden_retriever. Now your Udoo is ready to use Keras and Theano as Deep Learning libraries, next time we are going to show some usage example for image classification models with OpenCV. References: GitHub - fchollet/keras: Deep Learning library for Python. Runs on TensorFlow, Theano, or CNTK.  GitHub - Theano/Theano: Theano is a Python library that allows you to define, optimize, and evaluate mathematical expres…  GitHub - fchollet/deep-learning-models: Keras code and weights files for popular deep learning models.  Installing Keras for deep learning - PyImageSearch 
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These questions and answers are about interrupt generation at a dedicated (configurable) video output port. The i.MX6D manual (Rev. 0) Image Processing Unit (IPU) chapter mentions: Every DI has 10 timing generator counters. The IPU Interrupt Generator has 10 DI0 counters (1...10) and just 2 DI1 counters (3 & 😎 as interrupt sources. The Interrupt Control Register lists 11 DI0 counters (0...10) Q1. Are the DI timing-generator counters linked to the counters in the interrupt controller, or are they different counters? A1. Yes, the DI timing generator counters are linked to the counters in the interrupt controller. Q2. Why are there 11 counters listed in the interrupt controller, but just 10 counters in the timing generator? A2. There is disp_clk_en_pre in the interrupt controller. Thus the 11 counters: 10 timing generator counters and 1 disp clock generator counter. Q3. Is configurable timing feasible for DI0 by using the timing generator counters? A3. Yes, using the 10 internal timing counters you can generate various timing relationships. In addition, you can detect any of the interrupt counters. For example, if you use counter 8, then you can detect the interrupt associated with counter 8. Q4. Explain the impact of the DI1 counter access of only channels 3 and 8. A4. DI1 also has 10 timing generator counters and 1 disp clock generator counter, which you can use to generate desired waveforms. This is similar to DI0. The difference is only 2 of the 10 counters (plus another disp_clk) are connected to the interrupt controller for DI1. Therefore, there is a restriction for detection. If you use counter 7, read out the counter 7 interrupt of DI1 is not possible. However, 2 channels should be sufficient. These interrupts are usually used to indicate a frame start or a frame end. We usually use counter 3 to represent Vsync. So normally we only use counter 3 interrupt. DI1 has only 3 accesses because this covers the anticipated use case and the desire was to restrict register size. The extra counters facilitate flexible DI1 timing generation.
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[中文翻译版] 见附件   原文链接: https://community.nxp.com/docs/DOC-343761 
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Important: If you have any questions or would like to report any issues with the DDR tools or supporting documents please create a support ticket in the i.MX community. Please note that any private messages or direct emails are not monitored and will not receive a response. i.MX 6/7 Family DDR Stress Test  The i.MX6/7 DDR Stress Test Tool is a PC-based software to fine-tune DDR parameters and verify the DDR performance on a non-OS, single-task environment(it is a light-weight test tool to test DDR performance). It performs write leveling, DQS gating and read/write delay calibration features. The tool described on this page cover the following i.MX 6/7 series SoCs: i.MX 6DQP (Dual/Quad Plus) i.MX 6DQ (Dual/Quad) i.MX 6DL/S (Dual Lite/Solo) i.MX 6SoloX i.MX 6SL i.MX 6SLL i.MX 6UL i.MX 6ULL/ULZ i.MX 7D/S i.MX 7ULP Note that the DDR Stress test tool supports the all of the above i.MX SoCs, however, some of the supported i.MX SoCs named in the tool support multiple i.MX SoCs as follows: MX6DQ – when selected, this supports both i.MX 6DQ and i.MX 6DQP (Plus) MX6DL – when selected, this supports both i.MX 6DL and i.MX 6S (i.MX 6DLS family) MX6ULL – when selected, this supports both i.MX 6ULL and i.MX6 ULZ MX7D – when selected, this supports both i.MX 7D and i.MX 7S The purpose of the i.MX 6/7 series DDR Tools is to enable users to generate and test a custom DRAM initialization based on their device configuration (density, number of chip selects, etc.) and board layout (data bus bit swizzling, etc.). This process equips the user to then proceed with the bring-up of a boot loader and an OS. Once the OS is brought up, it is recommended to run an OS-based memory test (like Linux memtester) to further verify and test the DDR memory interface. The i.MX 6/7 series DDR Tools consist of: DDR Register Programming Aid (RPA): i.MX 6/7 Series DDR Tool Release DDR Stress test: Described below There are three options to run the DDR Stress test. Each of these options are provided in the attached zip files. The following is a high-level overview of each option along with the naming convention of the associated zip file: Option 1 GUI based: Run the GUI executable and connect your board to the host PC via USB Archive file: ddr_stress_tester_vX.xx.zip The tool will first need to run a DDR initialization script for the specified i.MX SoC (refer to Load Init Script in the GUI tool).  Example initialization scripts based on NXP's development boards can be found in this zip file under the script folder.  Note, these scripts may need to be modified for your custom board and memory.   Option 2 DDR Stress Tester: JTAG Interface A hardware debugger connected to the board via the JTAG interface is used to download an elf file into the i.MX SoC OCRAM (internal RAM) and then begin execution. Results are shown on the UART serial port (115200-8-n-1). Archive file: ddr_stress_tester_jtag_vX.xx.zip As with the GUI tool, the JTAG/debugger option will first need to run a DDR initialization script for the specified i.MX SoC. Refer to the GUI tool description above for the location of the example scripts (which are found in the ddr_stress_tester_vX.xx.zip file). Note that the scripts are available either in the RealView ICE format (.inc file) or the DS-5 DSTERAM format (.ds). For other debuggers, the user will have to modify the script's command syntax for their specific debugger. This is also true if converting from a RealView Ice (.inc) format to a DS-5 DSTREAM (.ds) format and vice versa. The DDR Stress Tester executable (starting with V2.20) has an auto UART detection feature. If a different UART port for the serial console has been chosen than used on the NXP development tool (EVK, SABRE) specific commands can be added to the DDR initialization script that allows you to configure for the specific UART and then load and run the elf executable. Refer to the FAQ section of this community post and the txt file found in the JTAG archive file for instructions.   Option 3 U-Boot: The boot loader u-boot is running and commands in u-boot are used to download the bin file into SoC OCRAM and begin execution. Results are shown on the UART serial port (115200-8-n-1) Archive file: ddr_stress_tester_uboot_vX.xx.zip When downloading the DDR Stress Tool by u-boot, please copy the ddr-test-uboot-jtag-mxxxx.bin to SD card and load it to IRAM using the 'fatload' u-boot command (see notes below when using newer versions of u-boot). For i.MX6, please load the binary to 0x00907000. For i.MX7D, please load the binary to 0x00910000.  It is imperative to first disable the I and D cache in u-boot as shown below as the DDR Stress Test re-configures and re-enables the cache and MMU page table. While this option allows the user to load and run the DDR stress test from u-boot, NXP highly recommends executing the GUI based version for system testing and debugging. The u-boot version is considered a “last resort” for systems in production which may not have USB or JTAG connectivity. The reasons behind this stance are: In the GUI version, the system starts “clean” and uninitialized, whereas u-boot initializes many SoC features outside the knowledge of the DDR stress test and may conflict with the stress test operation When running the u-boot version, the test will overwrite the contents of u-boot residing in DDR, hence the test will overwrite any data in DDR. Once the stress test is loaded and executed, u-boot itself will no longer be accessible. To return to the functionality of u-boot, a system re-boot is required. Newer versions on u-boot do not allow a direct loading of the DDR stress test code from the SD card (boot media) directly to the SoC internal OCRAM (aka IRAM). Hence, the procedure is updated to first load the DDR stress test code into DDR and then copy into OCRAM, as shown in the procedure below: u-boot> dcache off;icache off;fatload mmc 2:1 0x12000000 ddr-test-uboot-jtag-mx6dq.bin;cp.b 0x12000000 0x00907000 0x20000;go 0x00907000 As u-boot initializes many peripherals that may conflict with the operation of the DDR stress test, it is necessary to clock gate these peripherals prior to running the DDR stress test. Hence, it is highly recommended to augment the procedure above as follows: u-boot> dcache off;icache off;fatload mmc 2:1 0x12000000 ddr-test-uboot-jtag-mx6dq.bin;cp.b 0x12000000 0x00907000 0x20000; u-boot> mw 0x020c4068 0x00C0000F; u-boot> mw 0x020c406c 0x00000000; u-boot> mw 0x020c4074 0x3F300000; u-boot> mw 0x020c4078 0x0000F300; u-boot> mw 0x020c407c 0x0F000003; u-boot> mw 0x020c4080 0x000003FC; u-boot> go 0x00907000 Note, in the above procedure, it is recommended to write to each clock gate register in separate commands (refer to commands starting with “mw”). The SoC requires a finite amount of time to gate each clock hence performing this sequence with a new command line write ensures the SoC has time to gate the intended clocks.   Stress Test Revision Features Comments 3.00 Add i.MX 7ULP support in the GUI version Known issues: USB connection is unstable when under USB HUB or some PC environments 2.92 Minor correction with write leveling calibration code error check to avoid a corner case of flagging an error when none have occurred.    2.91 Resolved issue with write leveling calibration code where a race condition in the code may result in the calibration routine not being able to find any delay values.   Only applies to MX6 series SoCs that support DDR3.  2.90 Reserve write delay line register (MMDC_MPWRDLCTL) configuration as DDR script does when do write calibration. In previous releases, MMDC_MPWRDLCTL would be changed to 0x40404040 by default.      * Further details available in the release notes  _________________________________________________________________________________________________________________________________________    FAQ   Q. I see an error message that states "ERROR: DCD addr is out of valid range.", why is this and how do I resolve?   A. Sometimes, when using the register programming aid, there are registers writes that are not supported in the DCD range.  Try looking for the following items and comment them out from the DDR initialization script: wait = on setmem /16 0x020bc000 = 0x30 // disable watchdog (note the address for this may be different between i.MX6x devices)  Q. How do I select the "DDR Density" pull-down menu and what is the purpose of this?   A. The DDR Density pull-down menu gives the user the option of testing a DDR density smaller than what they actually have on their board.  The advantage of doing this is to speed up test time to allow the user to perform a "quick test" of their system.  IMPORTANT: it is imperative that the user not set this value higher than the supported density on their board, doing so will cause the stress test to fail and/or lock up. The DDR Density has a different meaning depending on the memory type being tested (DDR3 or LPDDR2): For DDR3, this is the density per CHIP SELECT.  So if your board has two chip selects, and each chip select has 512MB, you would simply select 512MB or lower.  The default setting will simply set this to the detected density per chip select. For LPDDR2, this is the density per CHANNEL.  This is only relevant for MX6 devices that support 2 channel LPDDR2 memories (MX6DQ, MX6DL).  For other MX6 devices that support only one LPDDR2 channel, then this is the total density (for the maximum setting) for that channel. Note that for LPDDR2, the number of chip selects (per channel) is irrelevant when selecting the density to test as the stress test combines both chip-selects into one combined density per channel.  For example, lets say you have a 2GB LPDDR2 device, which 2 channels and 2 chip-selects per channel.  That means you have 512MB per chip select, per channel.  Or, it also means you have 1GB per channel when combining both chip selects per channel.  In this case, you would choose (a maximum setting of) 1GB in the DDR Density drop down menu.  However, this is also the same setting as the default setting (which you are welcome to still choose 1GB to convince yourself that 1GB per channel is indeed being tested). Now let's assume you have only one channel (LPDDR2) and one chip select, with a density of 128MB; in this case, the maximum DDR Density you can select is 128MB. Let's assume you have one channel and two chip selects, each chip select is 128MB;  in this case, the maximum DDR Density you can select is 256MB (a combination of both chip selects).   Note, for the MX7D, an actual density needs to be entered. For the MX6x series, simply leaving this field as Default will cause the DDR stress test to ascertain the supported density from the DDR init script. As the MX7D DDR controller is different, this feature is not supported, hence it is required for the user to enter an actual density (for more details regarding MX7D usage of density and number of chip-selects, see the next FAQ on the DDR CS setting).   Q.  What is the purpose of the "DDR CS" pull-down option?   A.  The answer depends on which processor you are testing:   For the i.MX 6x series: This pull down menu gives you the option of testing one chip select (CS0) or ALL (both) chip selects *IF* you have a two-chip select configuration.  If you have a two-chip select configuration, then this allows you to test only one chip select for faster test time; else you can choose to test both chip selects.  Note that if you have a one-chip select configuration and you choose "ALL", the stress test will return an error.   For the iMX 7D: Because the MX7D DDR controller is different, the DDR stress test will need the user to supply the entire supported density found on their board. The chip select field should be left as is (0) as the test will naturally test one chip select to the next. For example, let’s assume you are using two chip selects, with each chip select being 512MB. In this case, you would enter 1GB for the DDR Density field ensuring that both chip selects will be tested. The user is allowed to enter a density less than the density found on their board (for quicker testing), but keeping in mind both chip selects may not be tested in this case.   Q. I run DDR calibration using the DDR Stress Test Tool to obtain the calibration results.  Are these calibration parameters are written to the uboot flash_header.S automatically or manually?   A. The calibration values obtained from the DDR Stress Test Tool will need to be manually updated in the flash_header.S file or any other DDR initialization script.   Q. When running the DDR stress test on MX7D and I try to perform calibration, I get an error stating that calibration is not supported, is this expected?   A. Yes, calibration is not supported or needed when using MX7.  The reason is, MX7 uses a different memory controller than the MX6 series.  The MX6 series memory controller has built-in support for calibration where the MX7 memory controller does not.   Q. When running the GUI version of the DDR stress test, on MX7 and I leave DDR Density as default, I get an error in the tool stating I must supply a density.  Why is this?   A. This is due to the fact that MX7 uses a different memory controller than the MX6 series.  In the MX6 series, it was possible to calculate the memory density from the memory controller register settings.  The MX7 memory controller is different and does not lend itself to easily calculate the supported density based on the register settings.  Instead, the user should verify the density on their board and selected this value in the DDR Density pull-down menu.    Q. I noticed that when I run write-leveling calibration I sometimes see a note that due to the write-leveling calibration value being greater than 1/8 clock cycle that WALAT must be set to 1.  What does this mean?   A. In the MMDC chapter of the reference manual for the specific i.MX 6 device, the need to set WALAT is described in the MDMISC register as follows: "The purpose of WALAT is to add time delay at the end of a burst write operation to ensure that the JEDEC time specification for Write Post Amble Delay (tWPST) is met (DQS strobe is held low at the end of a write burst for > 30% a clock cycle before it is released). If the value of any of the WL_DL_ABS_OFFSETn register fields are greater than ‘1F’, WALAT should be set to ‘1’ (cycle additional delay). WALAT should be further increased for any full-cycle delays added by the WL_CYC_DELn register fields." Therefore, if the write-leveling calibration routine detects any write-leveling delay value greater than 0x1F, it will note to the user that WALAT must be set and the user should update their DDR3 init script to ensure WALAT is set.  Sometimes, a user may find that the write-leveling delay value may fluctuate from one run to the next, which is quite normal.  If it is found that this delay is "borderline" meaning sometimes it is greater than 0x1F and sometimes it might be slightly less, then it is ok to go ahead and set WALAT permanently in your init script as there is no harm in doing so and will ensure you will stay within JEDEC's tWPST.   Q. I sometimes see that after running write-leveling calibration that delay values being reported back are zero'd out (0x00), and then at times I see a non-zero value being reported, why is this? A. It is quite normal to see slight variations in the delay value between write-leveling calibration runs.  The write-leveling calibration routine assumes a majority of users have designed their board such that the DDR3 memories are placed close to the i.MX 6 SoC. There’s a mechanism in NXP’s DDR Stress test write leveling calibration code that checks the returned write leveling value. If the write-leveling calibration routine detects that the returned delay value is greater than ¾ of a clock cycle, it will "zero out" the delay value. It does this because it assumes that such a large delay result is due to the fact that the DQS signal is already delayed relative to the SDCLK, and to align DQS with SDCLK requires the calibration routine to delay DQS even further to align it to the next SDCLK edge, something we ideally would like to avoid.  JEDEC specs that the DQS edge must be within 25% of a SDCLK cycle with respect to the SDCLK edge, so having DQS initially slightly delayed from SDCLK is actually ok, hence why the calibration routine “zero’s” this out when the returned value exceeds ¾ of a clock cycle.  In cases like this, the DQS edge and SDCLK edge are so close together that in some calibration runs, the DQS edge may slightly precede SDCLK (resulting in a very small write-leveling delay value) and other runs, it may be slightly delayed relative to the SDCLK (resulting in a very large write-leveling delay value that will try to align DQS to the next SDCLK edge, hence needs to be zero’d out).   Q. When using the JTAG version of the DDR stress test, how can I select a different UART port for my serial port?   A. Under the folder ddr_stress_tester_jtag_v2.52, there's a text file that describes how to add a different UART port by adding a few additional commands to your DDR init script.  The following is an outline of these commands: 1. Ungate UART module clocks (most NXP scripts ungate all of the peripheral clocks at the beginning of the script, so this part is already done) 2. Configure the IOMUX options for the pins you wish the UART to use (normally an IOMUX option for UART_TX and UART_RX, and a daisy chain option for the UART_RX input) 3. Enable the desired UART module via the register UCR1, bit UART_EN 4. Disable other UART modules (UCR1[UART_EN] = 0).  Normally disabling UART1 should be sufficient, but it doesn't hurt to disable all of the other un-used UART options for the purpose of the stress test.   Here's an example in the .ds file vernacular of a set up as follows: MX6DQ, UART4 on KEY_COL0 and KEY_ROW0 (assume clock is ungated to all peripherals): mem set 0x020E01F8 32 0x00000004   #// config_pad_mode(KEY_COL0, ALT4) mem set 0x020E01FC 32 0x00000004   #// config_pad_mode(KEY_ROW0, ALT4); mem set 0x020E0938 32 0x00000001   #// Pad KEY_ROW0 is involved in Daisy Chain. mem set 0x02020080 32 0x00000000   #//disable UART1 in UART1_UCR1 (Note, you can disable other UART modules as well) mem set 0x021F0080 32 0x00000001   #//enable UART4 in UART4_UCR1   Here's another example in the .inc file vernacular of a set up as follows: MX6SX, UART5 on SD4_DATA4 abd SD4_DATA5 (assume clock is ungated to all peripherals): setmem /32 0x020E0294 = 0x2 //IOMUXC_SW_MUX_CTL_PAD_SD4_DATA5, ALT2; UART5_TX_DATA setmem /32 0x020E0290 = 0x2 //IOMUXC_SW_MUX_CTL_PAD_SD4_DATA4, ALT2; UART5_RX_DATA setmem /32 0x020E0850 = 0x00000000 // IOMUXC_UART5_IPP_UART_RXD_MUX_SELECT_INPUT, daisy chain for UART5_RX input to use SD4_DATA4 setmem /32 0x021F4080 = 0x00000001 // Enable UART_EN in UCR1 of UART5 // Disable UART_EN in UCR1 of UART1, UART2, UART3, and UART4 setmem /32 0x02020080 = 0x00000000 // UART1 setmem /32 0x021F0080 = 0x00000000 // UART2 setmem /32 0x021EC080 = 0x00000000 // UART3 setmem /32 0x021E8080 = 0x00000000 // UART4     Related Resources Links: iMX 8M Mini Register Programming Aid DRAM PLL setting  i.MX 8/8X Series DDR Tool Release  i.MX 8M Family DDR Tool Release 
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1.  Software change for Certification Test Compared to standard Linux/Android release, you may need to do below software changes to implement the certification tests, it is applicable from imx_3.10.31_1.1.0 Linux BSP GA release, for the release before that, user may need to apply the related patches before doing below things, and some examples may be different for former releases, the user needs to change accordingly. See the detailed information in this document “How to do USB Compliance Test for 3.10.y kernel”. And there is also a link describes the patch for USB Certification Test: Patch to make i.MX6DQ USB to support test modes for certification test 2. I.MX6 series USB Certification Guide http://cache.freescale.com/files/microcontrollers/doc/user_guide/IMXUSBCGUG.pdf Include the descriptions of all the Certification Test requirements, equipment, procedures for I.MX6 series. For example, Host/Device High Speed Eye Diagram Test(眼图测试).   3. Description of USBCertification related Registers AN4589 Configuring USB on i.MX 6 Series Processors http://cache.freescale.com/files/32bit/doc/app_note/AN4589.pdf   4. I.MX6Q/I.MX6DL/I.MX6SL/ I.MX6SX Certification Reports, see attachments   5. Checklist and TPL, see attachments. Original Attachment has been moved to: I.MX6SX-Checklist-and-TPL.zip
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The following document contains a list of document, questions and discussions that are relevant in the community based on amount of views. If you are having a problem, doubt or getting started in i.MX processors, you should check the following links to see if your doubt is in there. Yocto Project Freescale Yocto Project main page‌ Yocto Training - HOME‌ i.MX Yocto Project: Frequently Asked Questions‌ Useful bitbake commands‌ Yocto Project Package Management - smart  How to add a new layer and a new recipe in Yocto  Setting up the Eclipse IDE for Yocto Application Development Guide to the .sdcard format  Yocto NFS &amp; TFTP boot  YOCTO project clean  Yocto with a package manager (ex: apt-get)  Yocto Setting the Default Ethernet address and disable DHCP on boot.  i.MX x Building QT for i.MX6  i.MX6/7 DDR Stress Test Tool V3.00  i.MX6DQSDL DDR3 Script Aid  Installing Ubuntu Rootfs on NXP i.MX6 boards  iMX6DQ MAX9286 MIPI CSI2 720P camera surround view solution for Linux BSP i.MX Design&amp;Tool Lists  Simple GPIO Example - quandry  i.MX6 GStreamer-imx Plugins - Tutorial &amp; Example Pipelines  Streaming USB Webcam over Network  Step-by-step: How to setup TI Wilink (WL18xx) with iMX6 Linux 3.10.53  Linux / Kernel Copying Files Between Windows and Linux using PuTTY  Building Linux Kernel  Patch to support uboot logo keep from uboot to kernel for NXP Linux and Android BSP (HDMI, LCD and LVDS)  load kernel from SD card in U-boot  Changing the Kernel configuration for i.MX6 SABRE  Android  The Android Booting process  What is inside the init.rc and what is it used for.  Others How to use qtmultimedia(QML) with Gstreamer 1.0
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From iMX 3.1x kernel, all kernel debug messages will be print to debug serial port after UART driver loaded, so if the kernel hang up before tty console driver ready, there will be no kernel boot up messages.   The attached patch can be used to enable the iMX serial debug console in early time, then kernel will not buffer the debug messages.   Note: the default patch is for UART1 (tty0) as the debug port, if you need use other debug port, please modify the code "early_console_setup()" with correct UART port base address.   L3.10.53-Add-early-console-for-debug-message.patch This patch is based on L3.10.53_GA1.1.0 release, it can support iMX6S/DL/D/Q.   L3.14.52-Add-early-console-for-debug-message.patch This patch is based on L3.14.52_GA1.1.0 release, it can support iMX6S/DL/D/Q, iMX6SL, iMX6SX, iMX6UL and iMX7.  
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