Combining NXP's wireless MCU with NFC controller allows to build a BLE-NFC bridge. It allows demonstrating transmission of NFC data over BLE, acting then as a king of Magic NFC remote. This demonstrator is built assembling the OM5578: Development Kits for PN7150 Plug’n Play NFC Controller (OM5578/PN7150ARD version including Arduino compatible connectors). on top of the FRDM-KW41Z: Freedom Development Kit for Kinetis ® KW41Z/31Z/21Z MCUs (minimum version B1 since previous versions have a pin conflict on the Arduino connector) Alternatively the Rigado R41Z Eval Board can be used as replacement to the FRDM-KW41Z To complete the demonstration, an android phone is used as BLE counterpart. It shall run the modified version of Kinetis BLE Toolbox android application including the NFC demo part. This dedicated version of the Kinetis BLE Toolbox android application is available for download from the files attached to this document. Below is a video of the demo. As shown, it demonstrate capabilities to control the NFC discovery remotely (via BLE) from the phone. Then, if tapping a card on the bridge, the related information including the content is conveyed through BLE to the phone and get displayed by the app. Additionally, the app can configure a message to be shared whenever an NFC reader (e.g. NFC phone) tap the bridge. The K41Z firmware of this demo is built based on the wireless UART example from MCUXpresso Software Development Kit (SDK), and updated with the porting of the NXP-NCI MCUXpresso example. The complete MCUXpresso project is given in source code in the attached files. To replicate the demo, just import it in an MCUXpresso workspace by selecting "Existing Projects into Workspace", then browsing to the BLE-NFC_bridge_MCUXpressoProject.zip file. Select the frdmkw41z_BLE-NFC_bridge from the "Project Explorer" view, and click on the blue bug icon to build, flash and debug the program.

This post entry provides a detailed description of how the Device-to-device communication demo was developed so that you can leverage this knowledge to integrate NFC into your own system. This document has been structured as follows:   Introduction Device-to-device communication demo functionality NFC for communication with a batteryless unit NFC for communication between two devices mounted in close proximity NFC for communication with a rotating part as a cable replacement solution Hardware details Base board based on CLRC663 plus Rotating disk based on NTAG I2C plus Application logic Reader module to rotating disk communication Rotating disk to reader module communication MCU code details NTAG I2C plus pass-through mode data exchange synchronization considerations Reader module MCU code NTAG_Device2DeviceDemo  application workflow Rotating disk MCU code NTAG_I2C _Explorer_01_LEDs_ButtonXample application workflow Video recorded session Available resources Introduction The Device-to-device communication demo shows how NFC can be used as a cable replacement between two units or devices. It is based on the CLRC663 plus NFC Frontend and the NTAG I 2 C plus connected tag solutions. It demonstrates how NFC is used for: Wireless communication with a batteryless unit. Wireless communication between two devices mounted in close vicinity that need to be completely isolated (e.g. dust or water proof). Wireless communication with a rotating part and as a cable replacement solution.   Device-to-device communication demo functionality The purpose of the demo is to illustrate how to enable device-to-device communication via NFC. It consist of: A base board of 14x12 cm, which embeds the CLRC663 plus NFC reader IC for the RF field generation. A sensor embedded on a separate, rotating sensor disk of 8 cm diameter, which embeds the NTAG I 2 C plus connected tag.   The base board and the rotating sensor disk communicate via NFC and optionally, a tablet display can be connected via a Bluetooth Low Energy (BLE) connection (the BLE connection is beyond the scope of this post entry).     NFC for communication with a batteryless unit The first scenario demonstrates the use of NFC for communication with a batteryless unit or sensor. Energy from the RF field generated by an NFC reader can be harvested to power up small devices so that a battery or other power supply no longer needs to be included.   In this demo, only the base board is powered using a 5V supply input (e.g. USB battery bank) while the rotating disk electronics are powered using only the harvested energy from the RF field generated by the base board. To maximize energy transfer and avoid possible interference caused by the electronics, both the rotating disk and base board antennas are placed on the edges. In the following video, you can observe how as soon as the base board is supplied, it starts generating an RF field and automatically. Then,  all the electronics on the rotating disk are powered and its LED turns GREEN.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/f54/f54337d597118_12181097.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb54387b9f NFC for communication between two devices mounted in close proximity The second scenario demonstrates the use of NFC for communication between two devices mounted in close proximity. For instance, any machine or device where sensors are inside or in close vicinity and the sensor needs to be completely sealed (e.g. waterproof, dustproof, etc).   In this demo, the bidirectional communication between the two units is demonstrated using push buttons, which light up LEDs on the opposite unit. For the base board to rotating disk communication direction: While action button 1 is pressed, the LED on the rotating disk turns BLUE. While action button 2 is pressed, the LED on the rotating disk turns RED. While action button 1 and button 2 are pressed, the LED on the rotating disk turns WHITE.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/912/912db3bd13b06_12160248.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb54387c99 With the other way around, for the rotating disk to base board communication direction: While action button 3 is pressed, a pattern on the LED circle will appear.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/d0b/d0b0072da0120_12160391.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb54387e98   NFC for communication with a rotating part as a cable replacement solution The third and last scenario demonstrates the use of NFC to communicate wirelessly with two moving parts where cables may break. For instance, any solution consisting of a main unit and a sensing part recording mechanical-stress readings on moving parts.   In this demo, the accelerometer on the rotating disk continuously sends its coordinates to the base board, which lights up a specific LED according to the calculated angle between the two units. In the following video, you can see that the LED circle "follows" the movement of the rotating disk.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/c0e/c0e3daf347aed_12160349.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb5438709a   Hardware details This section shows the architecture and main components of the base board and rotating disk.  The PCB schematics are attached at the end of this post entry.   Base board based on CLRC663 plus The disk has been dismounted so you can better appreciate the different components of the base board. The base board is driven by an LPC11U68 MCU, which is a low-cost Cortex-M0 USB solution, with 256 kB of flash memory, up to 80 GPIOs and several host interfaces (more details on the LPC11U68 product website).   From the LPC11U68 MCU, some of the GPIOs are used to connect the action buttons and the 12 LEDs of the circle, an SPI port is used to connect the CLRC663 plus NFC Frontend and, a USART port is used for connecting a BLE chip based on NXP's QN9021 chip.     The NFC functionality is provided by our CLRC663 plus reader IC, an NXP high performance multi-protocol reader. It is the evolution of CLRC663, with a larger LPCD detection range, more output power (2x times higher transmitter current), larger temperature operating range and pin-to-pin compatibility with the former version.   Rotating disk based on NTAG I 2 C plus The rotating disk is based on NXP solutions as well. This PCB board is driven by an LPC11U24 MCU, which is a low-cost Cortex M0 32 bit MCU, with 32 kB of flash memory, up to 40 GPIOs and several host interfaces (more details on the LPC11U24 product website).   From the LPC11U24 MCU, some of the GPIOs are used to connect the action button 3 and the RGB LED. In addition, an I 2 C interface port is shared to connect a temperature sensor, the accelerometer and the NTAG I 2 C plus.     The NTAG I 2 C plus is a family of connected NFC tags that combines a memory, a passive NFC interface with a contact I 2 C interface.  Functionally, the NTAG I 2 C plus behaves as a dual port memory. Therefore, the data can pass from an external NFC device to the embedded system. In addition, to this dual interface solution, it has more features: A field detection pin, to send a wake up signal The Energy harvesting, to power external devices The SRAM, a memory without writing cycles limitation The pass-through mode, for fast data exchange between interfaces Several memory access management settings from both NFC and I2C interfaces And an originality signature, to protect against clones.   Application logic This section describes how data is exchanged between the reader module (base board) and the rotating disk using NTAG I 2 C plus as a bridge (pass-through mode) between the two embedded systems.   Reader module to rotating disk communication In this demo, the reader module sends data to the rotating disk when any of its two action buttons are pressed. The NTAG I 2 C plus is configured in pass-through mode and the SRAM memory is used as conduit between the twto units.  The figure below illustrates a simplified representation of NTAG I 2 C plus memory seen from the NFC perspective (organized in pages of 4 bytes each). The red area represents the EEPROM memory while the yellow one represents the SRAM memory location. While the button 1 is pressed: The GPIO 4 of the LPC11U68 is in high level. The CLRC663 plus writes one byte into the SRAM memory (last page, value = 0x01). The LPC11U24 on the rotating disk reads the SRAM. The LPC11U24 changes the GPIO 18 status to high level. The RGB LED turns blue.   The operation that takes place while button 2 is pressed is pretty similar. Basically, it changes: the data written by the CLRC663 plus in the SRAM and the GPIO activated by the LPC11U24 on the rotating disk. More precisely, the steps are: The GPIO 5 of the LPC11U68 is in high level. The CLRC663 plus writes one byte into the SRAM memory (last page, value = 0x02). The LPC11U24 on the rotating disk reads the SRAM. The LPC11U24 changes the GPIO 16 status to high level and sets GPIO 18 to low level. The RGB LED turns red.     In the same way, while the two buttons are pressed at the same time: The LPC11U68 detects that GPIO 4 and 5 are in high level The CLRC663 plus programs a different value on the last SRAM byte (0x03). The LPC11U24 on the rotating disk reads the SRAM. The LPC11U24 sets to high the three GPIOs (16,17,18) controlling the RGB LED. The RGB LED turns white The key message is that: what it is written in the SRAM controls the behavior of the rotating disk LED, demonstrating wireless data exchange between the two embedded systems.   Rotating disk to reader module communication In this demo, the rotating disk keeps sending data to the reader module for as long as it is powered by the RF field. Precisely, it continuously sends the disk position (via the accelerometer axis coordinates) and the measured temperature value. Additionally, an extra byte is sent while the button 3 is pressed. The actual steps are: First, the LPC11U24 MCU triggers a read operation to the temperature sensor and accelerometer. The temperaturre reading occupies 2 bytes while the accelerometer axis coordinates occupy 6 bytes. This data is transfered the LPC11U24 via the I 2 C shared bus. The LPC11U24 writes these 8 bytes into the SRAM in page addresses 0xFD, 0xFE and 0xFF (see the figure below). The CLRC663 plus reads the SRAM when the LPC11U24 has finished writing it. With the read information, the LPC11U68 base board MCU calculates the angle and sets the appropriate GPIO to high level. Since the LED circle contains 12 LEDs, the base board is able to represent position changes of 30 degrees (360º / 12 LEDs).   As mentioned, this data transfer keeps going for as long as the disk is powered. The key concept here is that the LED circle operation is directly controlled by the disk position and the axis coordinates which are exchanged via the NTAG I 2 C plus SRAM at any given moment. To illustrate this, the disk is rotated 90 º clockwise. The steps that take place are: The LPC11U24 MCU triggers the next reading command, the accelerometer axis coordinates have changed to different ones representing the new disk position (in red in the memory map figure below). The LPC11U24 writes into the SRAM again these 8 bytes (now with the updated accelerometer axis coordinates) The CLRC663 plus reads the SRAM when the LPC11U24 has finished writing it. With this new reading, the LPC11U68 MCU recalculates the angle and applies a different GPIO configuration (which leads to a different LED turned on in the circle).     Last, while button 3 is pressed: The LPC11U24 GPIO 12 is set to high value. The LPC11U24 checks GPIO 12 pin status before writing into the SRAM. While it is high level, it adds an additional byte into the SRAM (third byte on page 0xFF- value=0x01). The CLRC663 plus reads the SRAM, getting the latest data from the moving part. With the current firmware, while the third byte on page address 0xFF is set to 0x01, the LPC11U68 performs a LED pattern activating all the GPIOs simultaneously (all the LEDs are ON).     MCU code details This section explains the firmware implementation details for both the base board (CLRC663 plus) and the rotating disk (NTAG I 2 C plus). Before going into the firmware implementation details, a few considerations for data exchange synchronization when using the NTAG I 2 C plus pass-through mode are explained.   NTAG I 2 C plus pass-through mode data exchange synchronization considerations In the demo, the pass-through mode is used to exchange data between the base board and the rotating disk. The pass-through mode provides the SRAM for data communication and the mechanisms for the synchronization of the data transfer. This signalling can be done through the field detection pin or by polling the equivalent registers over the I 2 C interface. For the NFC to I 2 C direction, the synchronization can be done: By checking the SRAM_I2C_READY register to learn if new data has been written by the RF interface. By checking the filed detection pin changing from HIGH to LOW voltage.   For I 2 C interface to NFC direction, the synchronization can be done: By checking the SRAM_RF_READY register to learn if new data has been written by the I 2 C interface. By checking the filed detection pin changing from LOW to HIGH voltage.   The following table includes register bits which can be used for communication synchronization. In addition, there is a dedicated application note providing more details on how NTAG I 2 C plus can be used for bidirectional data communication.   Register bit Use PTHRU_ON_OFF Detects if the pass-through mode is still enabled (gets reset in case of RF or I2C power down). TRANSFER_DIR Defines the data flow direction for the data transfer. I2C_LOCKED Detects if memory access is currently locked to I2C. RF_LOCKED Detects if Memory access is currently locked to RF. SRAM_I2C_READY Detects if there is data available in the SRAM buffer to be fetched by the I²C side. SRAM_RF_READY Detects if there is data available in the SRAM buffer to be fetched by the RF interface. RF_FIELD_PRESENT Shows if a RF field strong enough to read the tag is there.   Reader module MCU code The MCU firmware was developed using our LPCXpresso platform, which provides a complete development environment for LPC MCU and LPC boards. In the source code, there are five project folders: The FreeRTOS project folder, which is an open source real-time operating system (RTOS) for embedded systems supporting many different architectures and compiler toolchains The Lpc_chip_11u6x_lib and nxp_lpcxpresso_11u68b project folders, which belong to the LPCOpen libraries supporting the LPC11U68 MCU and PCB board, the MCU chip integrated in the Explorer board. If you use another MCU, you should replace them by the specific LPCOpen libraries. The NTAG_Device2DeviceDemo  project folder, which implements the logic supporting the device-to-device communication demo for the reader module. The NxpNfcRdLib project folder, which is the NXP's NFC Reader Library software stack supporting the implementation of the demo, the contactless protocols, the LPC MCU host interfaces and the CLRC663 drivers.   The reader module MCU code leverages on the NFC Reader Library. The NFC Reader Library is a software stack for creating and developing contactless applications for NXP's NFC readers. This API facilitates the most common operations required in NFC applications such as: reading or writing data into contactless cards, exchanging data with other NFC-enabled devices and emulating cards.   In order to use the NFC Reader Library, a stack of components has to be built up from the bottom to the top layer. Precisely, the application requirements define which modules need to be enabled and which do not. For the reader module firmware: The FreeRTOS is used. The SPI is used as host interface. A CLRC663 plus reader IC is used. And, communication with NTAG I 2 C plus is needed ( ISO14443 Type A card and NFC Forum Type 2 Tag compliant)   As a result, the software components that need to be enabled within the NFC Reader Library are depicted in the following picture: NTAG_Device2DeviceDemo  application workflow The reader module firmware starts its execution as soon as it is connected to the power bank. The firmware initializes the GPIOs, the UART for the tablet connection and the NFC Reader Library for the contactless operation. After all these initializations, the firmware code generates a new thread in charge of dealing with the disk operation. In this separate thread, the discovery loop for detection of Type A and Type V cards is configured and started. After that, the firmware keeps listening until the NTAG I 2 C plus is detected (i.e. the disk is mounted). On detection, the operation with the rotating disk starts: The reader module waits until the SRAM is available for the RF interface. The SRAM is available for the RF interface while the pass-through mode is enabled (PTHROUGH_ON_OFF register is set) and the RF to I 2 C direction is set (TRANSFER_DIR register bit). The board buttons are checked and the SRAM is written with the corresponding information.   At this point, the program awaits to receive data from the rotating disk. For that, it keeps polling if new data was written in the SRAM by the I 2 C interface (SRAM_RF_READY register bit is set). If new data is available, the SRAM is read and the data is processed: The accelerometer axis coordinates are read, the angle is calculated and the appropriate LED on the circle is activated. While the button 3 is pressed, the MCU triggers the LED pattern on the circle. Optionally, if the tablet connection is established, data is also sent using the BLE channel.   The following figure depicts the reader module application workflow in detail:   Rotating disk MCU code The MCU firmware was also developed using the LPCXpresso platform.  In the source code, there are four project folders: The Lpc_chip_11uxx_lib and nxp_lpcxpresso_11u24h_board_lib project folders belong to the LPCOpen libraries supporting the LPC11U24 MCU and PCB board, the MCU chip integrated in the Explorer board. If you use another MCU, you should replace them by the specific LPCOpen libraries. The NTAG_I 2 C _API project folder is a library providing a set of functions and procedures that allow you to communicate with the NTAG I 2 C from the I 2 C interface. Among others, functions to perform memory operations on EEPROM, SRAM, registers and for enabling the pass through mode The NTAG_I 2 C _Explorer_01_LEDs_ButtonXample project folder implements the logic for the rotating disk of this demo.   NTAG_I 2 C _Explorer_01_LEDs_ButtonXample application workflow The rotating disk firmware starts its execution as soon as it harvests enough energy from the reader's module RF field. The first operation taken is to enable the pass-through mode. Then, the firmware stays on a loop for as long as it is energized.   In this loop, it sets the SRAM into RF to I 2 C direction (TRANSFER_DIR register bit) and waits until the base board has written data. After data has been written from the RF side, it reads the SRAM and checks the last byte: While the last byte value is 0x01, it means the button 1 is pressed and the firmware sets the RGB LED to blue While the last byte value is 0x02, it means the button 2 is pressed and the firmware sets the RGB LED to red While the last byte value is 0x03, it means the button 1 and 2 are pressed and the firmware sets the RGB LED to white.   After receiving data from the base board, it prepares to send data back. For that: it checks the button status, it reads the temperature value and the accelerometer position. Once all the data has been collected: It changes the SRAM to I 2 C to RF direction (TRANSFER_DIR register bit). It writes into the SRAM and waits until the RF has read the data (SRAM_RF_READY register is cleared).   This loop is repeated for as long as the disk is powered. The following figure depicts the rotating disk application workflow in detail:     Video recorded session On 9 March 2017, a live session explaining the device-to-device communication demo was recorded. You can watch the recording here:   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/149/149fee5f5e282_12181079.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb5439ff51 Available resources   Schematics Please see attached in the separate attachment section below. Device-to-device demo source code Please see attached in the separate attachment section below. Quick-start guide for showing the demo Please see attached in the separate attachment section below Android app The android app can be used on a tablet or smart phone connected via BLE to this demo to show additional parameters, and to have a bigger screen for demonstrations. You find it in Google play ("device2devicedemo") and attached below.  

Speed development time when designing your portable medical device with NXP's Healthcare Analog Front End (AFE) reference platform which includes a complete hardware platform, schematics and software.  Based on the Kinetis Microcontroller K53 measurement. Demo Owner: dr.josefernandezv Demo Owner: aleguzman Features Speed development time when designing your portable medical device with NXP's Healthcare Analog Front End (AFE) reference platform which includes a complete hardware platform, schematics and software NXP offers a complete development platform based on the Tower System, which eases the development of medical applications with a fully integrated set of solutions that reduces the design effort The Medical suitcase is composed of six different analog front ends, each one focused on a specific medical application. Applications included are, 1-Lead ECG, pulse oximeter, blood pressure monitor, glucometer, spirometer, and ultrasound digital stethoscope Featured NXP Products K50_100: Kinetis K50 Measurement 100 MHz MCUs Healthcare Analog Front End( AFE) Block Diagram

Android Open Accessory support allows external USB hardware (an Android USB accessory) to interact with an Android-powered device in a special accessory mode. When an Android-powered powered device is in accessory mode, the connected accessory acts as the USB host (powers the bus and enumerates devices) and the Android-powered device acts in the USB accessory role. This ADK library is based on NXP Kinetis Microcontroller KL26, It implements some functions to communicate with android phone.  

The purpose of this project is the control of a RGB LED panel using the FlexIO peripheral included in the Kinetis K82 microcontroller. The FlexIO peripheral offers a great advantage, unloading the CPU in the process of refreshing the LED color and brightness information, comparing with other control methods using GPIO bit-banging or PWM + DMA. I will use different method. The panel will use LED stripes with the WS2812B controller. We will also have a simulation platform for developing the applications. Hardware: 30 x16 LED WS2812B Panel Multiplexer board FRDM-K82 Uctronics QVGA display Software: IAR Workbench 7.50.1 SDK 1.3 for the Kinetis K82 FreeRTOS eGUI graphic library You can watch the video with the LED panel working: Video Link : 4707 Part 1: Building the LED Panel Part 2: LED control method using the FlexIO Part 3: Software for LED Panel emulation Part 4: Software for panel control

    Description: Teensy 3.1 and Teensy-LC are a complete USB-based development tools featuring respectively the Kinetis 32-bit Cortex-M4 K20 and Cortex-M0+ KL26 devices running @ 72 and 48 MHz. Teensy 3.1 is equipped with 256KB flash and 64KB RAM. Teensy-LC board is equipped with 62KB flash and 8KB RAM.   Value Propositions * Very small footprint development tools * Very Low Cost dev tool * They are able to implement many different projects * Open source SDKs   Teensy board with very high extended-Arduino compatible performance levels and libraries taking advantage of Kinetis features like low power modes and internal DMA. Libraries for LED (WS2811) and 16bit 44.1kHz audio quality is where Makers go when they need quality, performance and small size. FEATURES Hardware Specifications Specification Teensy LC Teensy 3.0 Teensy 3.1 & 3.2 Units Processor MKL26Z64VFT4 32 bit ARM Cortex-M0+ 48 MHz MK20DX128 32 bit ARM Cortex-M4 48 MHz MK20DX256 32 bit ARM Cortex-M4 72 MHz Flash Memory 62 128 256 kbytes RAM Memory 8 16 64 kbytes EEPROM 1/8 (emu) 2 2 kbytes I/O 46, 5 Volt 34, 3.3 Volt 34, 3.3V, 5V tol Analog In 8 14 21 PWM 9 10 12 UART,I2C,SPI 1,1,1 3,1,1 3,2,1 Price $24.00 $19.00 $19.80 USD   Software Enablement Teensy 3.2 & 3.1: New Features https://www.pjrc.com/store/teensylc.html     RECOMMENDED PRODUCTS Product Description Kinetis K Microcontroller Kinetis L Microcontroller RESOURCES Title Type PJRC (Teensy Official Website) Web Page

Description Earlier this year NXP organized a promotional opportunity for amateur radio enthusiasts to use their creativity and build their own power amplifier designs. NXP received numerous creative submissions in this competitive Homebrew RF Design Challenge. We appreciate the dedication and enthusiasm from the community that made this contest a success. First place winner An MRF101AN broadband amplifier design with 1 W Input, 100 W Output 1.8-54 MHZ Amplifier deck. (For more information visit:NXP MRF-101 - RFPowerTools )  It is an amplifier with a bandwidth of 1.8MHz to 54MHz. Maximum output power of 100W up to 30MHz and 70W up to 50MHz. Maximum power supply 50V to 4A, with a Voltage Standing Wave Ratio of 1.5:1 maximum. The design dimensions of the PCB is 5x5 cm (2x2 in). and 310g weight including fan and heat sink. Second place winner A 600W broadband HF amplifier using affordable LDMOS devices (For more information visit: https://qrpblog.com/2019/10/a-600w-broadband-hf-amplifier-using-affordable-ldmos-devices/  ) This project is meant to demonstrate the capabilities of the MRF300 transistors as linear broadband devices in the 2-50MHz range and to be used by radio amateurs as a starting point for a medium-high power amplifier. This is also my entry to the NXP Homebrew RF Design Challenge 2019. To achieve the target of 600W output while also minimizing the level of even-number harmonics, a “push-pull” configuration of two transistors is used. Luckily, the manufacturer made it easy to design the PCB layout for such a thing by offering two versions (the MRF300AN & MRF300BN) that have mirrored pinout. The common TO-247 package is used, with the source connected to the tab. Each individual MRF300 LDMOS transistor is specified at 330W output over a 1.8-250MHz working frequency range, a maximum 28dB of gain and over 70% efficiency. The recommended supply range is 30-50Vdc. By studying the specifications, it looks like with correct broadband matching and some operational safety margin we can get close to 600W output at a voltage of around 45V across a resonably large bandwidth; the aim is to cover 1.8 to 54MHz. Main challenges when designing this amplifier are related to achieving good input and output matching over the entire frequency range as well as maintaining high and flat gain. Good linearity and a low level of harmonic products are mandatory. As the TO-247 is not a package specifically designed for high-power RF, there are some challenges with thermal design and PCB layout as well. Information taken from the essay by the winner. Third place winner A High Efficiency Switchmode RF Amplifier using a MRF101AN LDMOS Device for a CubeSat Plasma Thruster (For more information visit: Research - SuperLab@Stanford ) The Class E amplifier utilizes the active device as a switch, operating in only cutoff (off) and saturated (on) conditions. This minimizes the overlap of voltage and current, reducing losses in the active device. To further reduce loss the Class E amplifier utilizes an inductively tuned resonant network to achieve zero voltage switching, bringing the voltage across the switch to zero before turn on, eliminating energy stored in the output capacitance of the active device that would otherwise be dissipated. This is achieved with an inductively tuned series resonant output filter.  In the Class E amplifier losses are almost entirely determined by the current conducted by the active device so a high drain impedance is desired to maximize efficiency. The drain impedance is ultimately limited by the voltage rating of the switch. For our desired output power of 40W and the maximum voltage rating of 133V for the MRF101AN this impedance is still less than 50 ohms, so a L match circuit is used to match the drain impedance to 50 ohms. The load network in our design provides a drain impedance of 15.4+12.8j. As the MRF101AN will operate in saturation a high drive level is desired. To eliminate the need for a preamplifier and allow for digital control, we use a high speed gate drive chip typically used in switch-mode power supplies, LMG1020, to drive the MRF101AN instead of a RF preamplifier. A resonant network is used to provide voltage gain at the fundamental and third harmonic, providing a quasi-square wave on the gate which helps insure the device remains in saturation. Conclusion It was a close call and highly competitive! Each participant had their own creative, unique and impressive way of displaying the capabilities of these new parts. NXP is always up for new design challenges. Ready for the next challenge?

NXP Content: PN7462, NTAG I²C plus NXP Recommends: PN7462, NTAG I²C plus The NFC Cube is a universal demo with which all 3 basic NFC operation modes can be shown: Interaction between a device and a card or tag Interaction between 2 electronic devices (NFC as cable replacement) Interaction between a device and an NFC phone Value Propositions The NFC Cube is a universal NFC demo Support Under https://nxp.box.com/NFCcube you find more information and a video showing the NFC Cube in action.

这篇文章通过覆盖与GFSK （通用频移键控）通信并行的 低功耗蓝牙 多节点连接，提供了混 合应用程序（ W ireless UART + GFSK Advertising ）的示例。这是 SDK 的另一个示例，其中我 们定义了 混合应用程序，用于与 GFSK 通信并行进行蓝牙 LE 广告和扫描。 Products Product Category NXP Part Number URL MCU KW36/35/34 https://www.nxp.com/products/wireless/bluetooth-low-energy/kw36-35-34-arm-cortex-m0-pluskinetis-kw36-35-34-bluetooth-low-energy-32-bit-mcus-nxp:KW36-35 MCU KW39/38/37 https://www.nxp.com/products/wireless/bluetooth-low-energy/kw39-38-37-32-bit-bluetooth-5-0-long-range-mcus-with-can-fd-and-lin-bus-options-arm-cortex-m0-plus-core:KW39-38-37   Tools NXP Development Board URL FRDM-KW36 Freedom Development Kit https://www.nxp.com/design/development-boards/freedom-development-boards/mcu-boards/frdm-kw36-freedom-development-kit-for-kinetis-kw36-35-34-mcus:FRDM-KW36 FRDM-KW38 Freedom Development Kit https://www.nxp.com/design/designs/freedom-development-kit-for-kw39-38-37-mcus:FRDM-KW38   SDK SDK Version URL MCUXpresso SDK Builder https://mcuxpresso.nxp.com/en/welcome

Overview   NXP smart amplifier is a high efficiency boosted Class-D audio amplifier with a sophisticated SpeakerBoost acoustic enhancement and Protection algorithm in on-Chip DSP with temperature and excursion protection. The internal adaptive DC-to-DC converter raises the power supply voltage, providing ample headroom for major improvements in sound quality. NXP portfolio counts with multicore solutions for multimedia and display applications with high-performance and low-power capabilities that are scalable, safe, and secure. This solution is based on an i.MX 8M Family MCU. This application processor provides industry-leading audio, voice and video processing. Block Diagram Products Category MPU Product URL i.MX 8M Family - Arm® Cortex®-A53, Cortex-M4, Audio, Voice, Video  Product Description The i.MX 8M family of applications processors based on Arm® Cortex®-A53 and Cortex-M4 cores provide industry-leading audio, voice and video processing for applications.   Category Wireless Product URL 1 QN9090/30(T): Bluetooth Low Energy MCU with Arm®Cortex®-M4 CPU, Energy efficiency, analog and digital peripherals and NFC Tag option  Product Description 1 The QN9090 and QN9030 are the latest microcontrollers in the QN series of Bluetooth low energy devices that achieve ultra-low-power consumption and integrate an Arm®Cortex®-M4 CPU with a comprehensive mix of analog and digital peripherals. Product URL 2 88W8987: 2.4/5 GHz Dual-Band 1x1 Wi-Fi® 5 (802.11ac) + Bluetooth® 5 Solution  Product Description 2 The 88W8987 is a highly integrated Wi-Fi (2.4/5 GHz) and Bluetooth single-chip solution specifically designed to support the speed, reliability and quality requirements of Very High Throughput (VHT) products. Product URL 3 NTAG I2C plus: NFC Forum Type 2 Tag with I2C interface  Product Description 3 The NTAG I2C plus combines a passive NFC interface with a contact I2C interface.   Category Power Management Product URL 1 TEA1833LTS: GreenChip SMPS Control IC  Product Description 1 The TEA1833LTS is a low-cost Switched Mode Power Supply (SMPS) controller IC intended for flyback topologies. Product URL 2 PCA9450: Power Manage IC (PMIC) for i.MX 8M Mini/Nano/Plus  Product Description 2 The PCA9450 is a single chip Power Management IC (PMIC) specifically designed to support i.MX 8M family processor in both 1 cell Li-Ion and Li-polymer battery portable application and 5 V adapter nonportable applications.   Category RF Amplifier Product URL BGS8324: WLAN LNA + switch  Product Description The BGS8324 is, also known as the WLAN3001H, a fully integrated Low-Noise Amplifier (LNA) and SP3T switch for Bluetooth path and transmit path.   Category Peripherals Product URL 1 PCT2075: I2C-Bus Fm+, 1 Degree C Accuracy, Digital Temperature Sensor And Thermal Watchdog  Product Description 1 The PCT2075 is a temperature-to-digital converter featuring ±1 °C accuracy over ‑25 °C to +100 °C range. Product URL 2 PCA9955BTW: 16-channel Fm+ I²C-bus 57 mA/20 V constant current LED driver  Product Description 2 The PCA9955B is an I2C-bus controlled 16-channel constant current LED driver optimized for dimming and blinking 57 mA Red/Green/Blue/Amber (RGBA) LEDs in amusement products.

Overview   As gaming application needs real time, quick and fast reaction, user would like to have low latency solution for gaming application. Existing BT solution has higher latency. Also power consumption is critical in the design with limited battery capacity. NXP’s gaming headset solution combined with low latency and lower power consumption than competitors. We provide two platforms. One use KL27 MCU and the other one use LPC5528 MCU as processor. The key different feature between these two MCU platform is the audio resolution support. KL27 platform supports 48K sampling rate and LPC5528 platform supports USB audio up to 96K sampling rate. We design USB dongle and headset side solution, either module or Arduino interface H/W design. Also PMIC is important in the headset side. NXP can provide MCU, BLE and PMIC for this application. Block Diagram Products Category MCU Product URL 1 KL2x: Kinetis® KL2x-72/96 MHz, USB Ultra-Low-Power Microcontrollers (MCUs) based on Arm® Cortex®-M0+ Core  Product Description 1 The Kinetis® KL2x is an ultra-low-power MCU family that adds a full-speed USB 2.0 On-the-Go (OTG) controller or a full-speed crystal-less USB 2.0 device controller in addition to the Kinetis KL1x series. Product URL 2 LPC552x/S2x: Mainstream Arm® Cortex®-M33-based Microcontroller Family  Product Description 2 The LPC552x/S2x MCU family further expands the world’s first general purpose Cortex-M33-based MCU series   Category Power Management Product URL PCA9420: PMIC for Low Power Applications  Product Description The PCA9420 is a highly integrated Power Management IC (PMIC), targeted to provide power management solution for low-power microcontroller applications or other similar applications powered by Li-ion battery.   Category Wireless Product URL NXH3670: Ultra-low Power, Low Latency Audio for Wireless Gaming Headphone  Product Description The NxH3670 constitutes a highly integrated, single-chip ultra-low-power 2.4 GHz wireless transceiver with embedded MCU (Integrated Arm® Cortex®-M0 processor), targeted at wireless audio streaming for gaming headphones, delivering low latency audio and ultra-low power consumption.

  Overview Hearables or smart headphones are highly integrated, truly wireless earbuds designed to improve audio experiences across a range of consumer and healthcare applications. Small form factors, ultra-light weight and wireless operation increase user comfort. The continued challenge for hearables is how to combine audio quality, user experience and better battery life in a tiny package while offering a multitude of possibilities, all of which demands digital signal processing. To simplify customer engineering efforts on prototype TWS earbud, NXP built an Application Development Kit. Customer just need plug and play to test the functionality and performance of earbud. The ADK demonstrated a stable audio streaming link from Bluetooth mobile phone to both ear. It can be used as a fundamental platform for customer to develop hearables. Features Fitness tracking (pedometer, heart rate, etc.) Local playback (mp3, wav…) Voice UI (command trigger, ON/OFF) Voice enhancement (argument hearing, be forming) Universal translator Block Diagram Products Category MCU Product URL LPC541XX: Low-Power Microcontrollers (MCUs) Based on Arm® Cortex®-M4 Cores With Optional Cortex®-M0+ Co-processor  Product Description The LPC541xx MCU family of single-core and dual-core MCUs are our next-generation of power efficient MCUs.   Category NFMI Radio Product URL NXH2266: NFMI radio for wireless audio and data streaming  Product Description The NXP® NXH2266 is a fully integrated single-chip solution that enables wireless audio streaming and data communication using Near Field Magnetic Induction (NFMI), a mature technology that has a proven track record in the hearing industry.   Category Audio Codec Product URL SGTL5000: Ultra-Low-Power Audio Codec  Product Description The SGTL5000 is a low-power stereo codec designed to provide a comprehensive audio solution for portable products that require line-in, mic-in, line-out, headphone-out and digital I/O.   Category NFC Product URL NTAG I2C plus: NFC Forum Type 2 Tag with I2C interface  Product Description The NTAG I2C plus combines a passive NFC interface with a contact I2C interface.   Category Accelerometer Product URL MMA8652FC: ±2g/±4g/±8g, Low g, 12-Bit Digital Accelerometer  Product Description The NXP® MMA8652FC 12-bit accelerometer has industry-leading performance in a small package.   Category Power Management Product URL MC34673: 1.2 A Single-Cell Li-Ion/Li-Polymer Battery Charger  Product Description The MC34673 is a cost-effective fully-integrated battery charger for Li-Ion or Li-Polymer batteries.   Category Voltage Level Translator Product URL GTL2005PW: Quad GTL/GTL+ to LVTTL/TTL bidirectional non-latched translator  Product Description The GTL2005 is a quad translating transceiver designed for 3.3 V system interface with a GTL/GTL+ bus.

  Overview China stopped providing analog walkie talkie licenses which consequently has created a high demand for more digital walkie talkie applications. The digital walkie talkies transmits speech in the form of digital encoding. DMR (time division),is more widely used and has a communication speed of 9.6kbps so efficient compression algorithms are necessary. Digital walkie-talkie advantages: Less bandwidth than analog walkie talkie Can use encryption algorithm for higher security Easy networking High quality speech The Airfast® RF power portfolio brings extreme ruggedness and high gain to mobile radio applications. The high gain of our devices helps eliminate amplification stages and reduce system cost. Plus, the high efficiency of the portfolio allows customers to use smaller heatsinks and housing while improving reliability. The broadband capability of the mobile radio devices enables full performance across each band. Block Diagram Products Category MCU Product URL K24_120: Kinetis® K24-120 MHz, Full-Speed USB, 256KB SRAM Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core  Product Description The Kinetis® K24 120 MHz MCU family targets low-power, cost-sensitive applications requiring high-performance processing efficiency and large memory densities.   Category Accelerometer Product URL MMA8653FC: ±2g/±4g/±8g, Low g, 10-Bit Digital Accelerometer  Product Description The NXP® MMA8653FC 10-bit accelerometer has industry leading performance in a small DFN package.   Category Secure Element Product URL A1006: Secure Authenticator IC - Embedded Security Platform  Product Description The Secure Authenticator IC is manufactured in a high-density submicron technology.   Category Audio Amplifier Product URL TDF8530TH: I2C-Bus Controlled Quad Channel 45 W / 2 Ω Class-D Power Amplifier with Full Diagnostics  Product Description The TDF8530 is a quad Bridge-Tied Load (BTL) car audio amplifier comprising an NDMOST-NDMOST output stage based on SOI BCDMOS technology.

NXP Thread Commissioning Demo with Arrayent’s Cloud Control Thread devices can be monitored and controlled from anywhere in the world using Arrayent Connect Cloud Devices are easily commissioned onto a Thread network using NXP Thread App & QR code Devices are secure using Arrayent Unique ID (whitelisting) and AES-128 bit encryption. This Demo Is Probably of Interest If You: Want to monitor and control Thread devices that sit behind a consumer grade firewall from anywhere in the world. Want to commission Thread devices in a easy way. Differentiation This Demo Highlights Control and monitor Thread devices that sit behind a consumer grade firewall from anywhere in the world. Commission Thread devices using QR code Description The Thread network is managed by a LS1021A  IT Gateway with FRDM-KW24 Thread Border border reference design. The board supports Thread, Wi-Fi, BlueTooth and NFC too. NXP’s Thread commissioning android App discovers the Thread border router. NXP powered Thread “device” is a card with a NXP Kinetis® KW2xD 802.15.4 Wireless chip with an ARM Cortex M4 MCU board running the Thread protocol and the lightweight Arrayent Connect Agent. The Thread device boards are commissioned (or “paired”) on to the Thread network by using the NXP Thread commissioning Android App takes the device’s unique ID from the  QR code on the  device and pushes Thread network credentials into the device. This is shown again with a second card. Arrayent’s Connect Agent has been pre-loaded into the device boards.  And once the board is connected to the Thread network, the device board starts communicates directly to the Arrayent Cloud. Essentially key attributes on the board are presented up to the Arrayent Connect Cloud web services APIs. The final step is to use the Arrayent devkit app to monitor and control the device board from anywhere in the world.  In this case the we can demonstrate three monitor/control use cases: 1.     Turn on and off the device LED from the mobile app. 2.     Press a button three times to update the Apps button press counter (in this case three times.) 3.     Push the board temperature to the mobile app. What this Demo is All About Video Link : 5310 Find more information Press release: Read on The Business Journals Blog posts to read: NXP and Arrayent Collaborate to Connect Thread Devices at Embedded World, Nuremberg, Germany Thread-Enabled Smart Home Powered by Arrayent Demo Diagram IoT Physical Components Gateways SOC: NXP i.MX6 Applications Processor, NXP Kinetis®KW24D SoC Software: Embedded Linux, NXP Thread Stack for border router End User Products: LS1021A IT Gateway with FRDM-KW24 Thread Border border reference design Edge Devices SOC: NXP Kinetis®KW24D (802.15.4 Wireless chip with an ARM Cortex M4 MCU) Boards/Modules: NXP FRDM-KW24D  Development Board Software: Arrayent Connect Agent ported to the KW2xD, NXP Thread Stack for router end devices Wireless Connectivity SOC: NXP Kinetis®KW24D (802.15.4 Wireless chip with an ARM Cortex M4 MCU) Sensors SOC: KW24D On-chip Temperature, MMA8451Q 3-axis accelerometer Cloud Infrastructure/Services Software/Services: Arrayent Connect Cloud Smart Devices/Apps Software: Arrayent Android DevKit sample app and SDK Software: NXP Android Thread provisioning app IoT System Capabilities Device Management Each device is flashed at time of manufacturing a unique Arrayent Device ID and AES key.  The device ID is bound to a specific customer account at time of device commissioning. Cloud/App Communications/Interworking Arrayent devkit app talks to the Arrayent Connect Cloud’s device services interface through the Arrayent Connect Agent embedded software to connect to the device boards. The App is used to monitor and control the device board from anywhere in the world.  In this case the we can demonstrate three monitor/control use cases: Turn on and off the device LED from the mobile app. Press a button three times to update the Apps button press counter (in this case three times.) Push the board temperature to the mobile app. Security Arrayent uses device ID Whitelisting, that is Arrayent issued device ID is flashed into endpoint MCU memory at time of manufacturing.  The per device unique ID is reserved in the cloud. Arrayent ACA embedded agent and ACC cloud services support AES-128 bit end-to-end encryption with dynamic temporal key refresh. Analytics/Data The Arrayent Connect Cloud support IoT Product Type Product/Component Vendor Research or Procure This Product/Component End User Hardware USB Wireless Keyboard and Touchpad Commercial Logitech Wireless Touch Keyboard K400 with Built-in Multi-Touch Touchpad, Black End User Hardware Dell 22" HDMI Monitor Commercial Dell 22" Monitor End User Smart Device Motorola XT1032 Moto G Android Smart Phone Commercial Motorola Android Smart Phone End User Edge Device Xfinity XR2 Remote Control Unit Commercial Comcast Remote Control End User Edge Device Philips HUE Bulb ZigBee Lightlink (HA 1.2) Commercial Hue, Professional Wireless LED Lighting | Philips Lighting End User Edge Device CentraLite 3-Series Appliance Module (4257050-RZHAC) (Zigbee HA 1.2) Commercial SmartPlug End User Edge Device Axis 0301004 M1011-W camera (WiFi g) Commercial AXIS M1011-W Network Camera, a small wireless IP camera | Axis Communications End User Edge Device Maxxima Style Night Light w/ sensor Commercial Night Light End User Edge Device TP-LINK TL-MR3020 3G/4G Wireless N 150 Portable Router Commercial WiFi Router

Demo FlexIO Demos below: Title Link Luminaire: A tale of woe https://www.hackster.io/0xtj/luminaire-a-tale-of-woe-263189 FlexIO Based Multi-Copter Rotor Control https://www.hackster.io/agent-titanium-c6063b/flexio-based-multi-copter-rotor-control-57d124 Automated water level https://www.hackster.io/andre-pereira-da-silva/automated-water-level-2fb900 IOT" Hydrometer E-mailer" https://www.hackster.io/benf2/iot-hydrometer-e-mailer-7a7ca5 FlexIO 3D Printer https://www.hackster.io/BigLazyPlayer/flexio-3d-printer-7e9d57 IoT with Kinetis FlexIO https://www.hackster.io/bltrobotics/iot-with-kinetis-flexio-0d4c3e Air Quality Control https://www.hackster.io/claude4/air-quality-control-2e7d65 Wireless Digital scale https://www.hackster.io/dhq/wireless-digital-scale-238e83 FRDMK82F Servo and Brushless Motor Control https://www.hackster.io/ElvisWolcott/frdmk82f-servo-and-brushless-motor-control-6461fb FRDM-K82F Camera Based Parking Assistant https://www.hackster.io/inakizi/frdm-k82f-camera-based-parking-assistant-9dfa6f KD2 Droid https://www.hackster.io/jreese/kd2-droid-7fbed1 NXP Kinetics Smart Web Multimedia IoT - Flexduino Platform https://www.hackster.io/mhanuel/nxp-kinetics-smart-web-multimedia-iot-flexduino-platform-1a76f7 Ultimate Hardware Expansion Board https://www.hackster.io/myriaddev/ultimate-hardware-expansion-board-494906 MIDI-USB Theremin https://www.hackster.io/razulued/midi-usb-theremin-65b521 Marveloucycle  https://www.hackster.io/skywalker-efe247/marveloucycle-4aafdb Port MySensors Library https://www.hackster.io/storycrafter/port-mysensors-library-1df3b6 Face match doorbell https://www.hackster.io/user015606/face-match-doorbell-db49bc Twitter Bot https://www.hackster.io/user1713477/twitter-bot-0687fe Agricultural flow estimator https://www.hackster.io/uLipe/agricultural-flow-estimator-1ad21d Directional Motion-Detecting USB Web Cam Using a FRDM-K82F https://www.hackster.io/stephanick/directional-motion-detecting-usb-web-cam-using-a-frdm-k82f-f81b81 How to build an Air Mouse with NXP K82F https://www.hackster.io/asadzia/how-to-build-an-air-mouse-with-nxp-k82f-56fb60 Intelligent Elbow Motion-Assistance Actuator https://www.hackster.io/hal-flynn-f79994/intelligent-elbow-motion-assistance-actuator-6a6c73 Water quality flow control https://www.hackster.io/mikey0000/water-quality-flow-control-030b2e Flex-WS2812B https://www.hackster.io/momososo/flex-ws2812b-a6beaf Freedom K82F Sport Kit Companion https://www.hackster.io/nghiajenius_iot/freedom-k82f-sport-kit-companion-319878 Freedom Maraca https://www.hackster.io/wesee/freedom-maraca-6f7bfc Twinkle Twinkle Little Star Musical Cup https://www.hackster.io/wesee/twinkle-twinkle-little-star-musical-cup-45a584 Smart DICE: The Physical + Digital RNG https://www.hackster.io/whatnick/smart-dice-the-physical-digital-rng-18ee03 Navisys https://www.hackster.io/YasithLokuge/navisys-03aa5f Flash! https://www.hackster.io/acylbotr/flash-6c1959 Freedom Flight Controller for Autonomus Drones https://www.hackster.io/bluetiger9/freedom-flight-controller-for-autonomus-drones-9efba4 Camera modules for Self-Driving Car. https://www.hackster.io/gawad/camera-modules-for-self-driving-car-fb37fb The Freedom Infinity Mirror https://www.hackster.io/MarcelK/the-freedom-infinity-mirror-9a2c13 Kinetis FlexIO Ultrasonic Radar https://www.hackster.io/mirkix/kinetis-flexio-ultrasonic-radar-573b40 Self-powered weather station https://www.hackster.io/user52242/self-powered-weather-station-b4252d Android Guided Vehicle https://www.hackster.io/11bharath11/android-guided-vehicle-6892d3 PHYSICALLY REGULATED OPERATING SUITE LIMB https://www.hackster.io/20321/physically-regulated-operating-suite-limb-89a61e Energy Efficient Cooler for home https://www.hackster.io/20986/energy-efficient-cooler-for-home-de0dc5 FRDM K82F-Play X-0 Game https://www.hackster.io/akashchandran30/frdm-k82f-play-x-0-game-0ebccb Working With FRDM-K82F https://www.hackster.io/akashchandran30/working-with-frdm-k82f-9459cd The Portable All Season Clothes Dryer https://www.hackster.io/alz190/the-portable-all-season-clothes-dryer-76626a NXP Scarab Robot https://www.hackster.io/asokfair/nxp-scarab-robot-eb6c6d Tip Tap Game https://www.hackster.io/bharathegr/tip-tap-game-e700e1 Read accelerometer x and y axis readings from the FRDM K82F https://www.hackster.io/gauravmishra/read-accelerometer-x-and-y-axis-readings-from-the-frdm-k82f-b47cc6 VIRTUAL SPEECH FOR VOCALLY CHALLENGED https://www.hackster.io/JagadeeshKumar/virtual-speech-for-vocally-challenged-5233cb Alexa Intelligent Personal Assistant / Home Automation Usi https://www.hackster.io/lalitnandandiwakar/alexa-intelligent-personal-assistant-home-automation-usi-862ea8 Musical Alarm Clock https://www.hackster.io/LiLShReDdeR/musical-alarm-clock-83edfc Eternal Pose to Antarctica: South Pointing Smart LED Compass https://www.hackster.io/PSoC_Rocks/eternal-pose-to-antarctica-south-pointing-smart-led-compass-5fb86f Gesture Drive: Accelerate with Freedom  https://www.hackster.io/PSoC_Rocks/gesture-drive-accelerate-with-freedom-e9dde1 Setting Up GPIO, PWM, I2C for K82 Freedom Board in KDS https://www.hackster.io/PSoC_Rocks/setting-up-gpio-pwm-i2c-for-k82-freedom-board-in-kds-e5b73d Accident Alert system https://www.hackster.io/ROBINTHOMAS/accident-alert-system-e97f34 NeerAssure: Water Usage Statistics https://www.hackster.io/Shachindra/neerassure-water-usage-statistics-03268b Getting Started with FRDM-K82F https://www.hackster.io/sowmith/getting-started-with-frdm-k82f-05b3ed FlexIO Car https://www.hackster.io/SURESH_V_S/flexio-car-13a692 FlexIO Based Smart Helmet https://www.hackster.io/taifur/flexio-based-smart-helmet-82efe9 SMART BAND https://www.hackster.io/user355388807/smart-band-6d3d31 Theft Alarm K82F TSI_LAUNCHPAD https://www.hackster.io/Vignesh_Jaishankar/theft-alarm-k82f-tsi-launchpad-2ff06c FlexIO security keypad https://www.hackster.io/nxp/flexio-security-keypad-15d9fd NXP Recommends http://www.nxp.com/products/microcontrollers-and-processors/arm-processors/kinetis-cortex-m-mcus/k-series/k8x-scalable-secure-mcus:K8X-SCALABLE-SECURE-MCU?cof=0&am=0 AN5275: Using FlexIO for parallel Camera Interfacehttp://cache.nxp.com/files/microcontrollers/doc/app_note/AN5275.pdf?fsrch=1&sr=1&pageNum=1 AN5280: Using Kinetis FlexIO to drive a Graphical LCD Training

Demo NXP has a full range of high power LDMOS ICs for powering outdoor small cell base stations. Our small cell portfolio delivers industry leading performance with powerful, efficient and diverse range of outdoor small cells targeting rapidly growing frequencies and regions in the world. This demo features new devices that cover all cellular bands from 700 to 3800 MHz     Outdoor Small Cells for Cellular Infrastructure - YouTube        Demo / product features A2I08H040N 9 W IC Final Small Cell Solution Frequency 728-960 MHz Gain 30.7 dB Efficiency 46% TO-270WB-15 plastic package   A2I20H060N 5 W IC Final Small Cell Solution Frequency 1800–2200 MHz Doherty performance at 8 dB OBO 1805-1880 MHz Gain 28.5 dB Efficiency 44% Peak 48.5 dBm TO-270WB-15 plastic package   A2I25H060N 5 W IC Final Small Cell Solution Frequency 2300–2690 MHz Doherty performance at 8 dB OBO 2496-2690 MHz Gain 27.5 dB Efficiency 41% Peak 48.2 dBm TO-270WB-17 plastic package   A2I35H060N 5 W IC Final Small Cell Solution Frequency 3400–3800 MHz Doherty performance at 8 dB OBO 3400-3600 MHz Gain 24 dB Efficiency 33% Peak 48 dBm TO-270WB-17 plastic package   A2I25D025N 5 W IC Final Small Cell Solution Frequency 2100–2900 MHz Doherty performance at 8 dB OBO 2400-2600 MHz Gain 29.1 dB Efficiency 40% Peak 45.8 dBm TO-270WB-15 plastic package   A2I25D012N 2.2 W IC Final Small Cell Solution Frequency 2100-2900 MHz Gain 27.7 dB Efficiency 40% TO-270WB-15 plastic package   A2I20D040N 5 W IC Final Small Cell Solution Frequency 1400–2300 MHz Doherty performance at 8 dB OBO 1850-1950 MHz Gain 29.7 dB Efficiency 46% Peak 47.6 dBm TO-270WB-17 plastic package   A2I20D020N 2.5 W Final Small Cell Solution Frequency 1400-2300 MHz Gain 29.7 dB Efficiency 43% TO270WB-17 plastic package   NXP Recommends A2I08H040N A2I20H060N A2I25H060N A2I35H060N A2I25D025N A2I25D012N A2I20D040N A2I20D020N   Fast Track 5G with NXP   Fast-Track 5G with NXP - YouTube 

This post entry provides a detailed information about the EMVCo L1 certification process for contactless payment devices. The structure is the following: EMV Introduction Objective When a company is developing a POS device, there are some challenges to consider for a successful deployment in the market: The device needs to have a good performance to provide the client with a good user experience. Moreover, the device should be able to operate seamlessly with other devices and cards in the market in a secure and reliable way.   These key characteristics are tackled by the EMV specifications. Summarizing, EMV is a group of specifications for smart payment cards and terminals that were created by EMVCo to guarantee interoperability and acceptance of secure payment transactions. EMV stands for Europay, Mastercard, and Visa, the three companies that originally created the standard. These specifications are now managed by EMVCo, an organization of six members – including Mastercard, UnionPay, Visa, AmEx, Discover, and JCB.   EMVCo organization We can see in the figure below the structure of the organization. EMVCo is managed by the Board of Managers that consists of two representatives of every member of the organization. On top of the Board of Managers, the Executive Committee provides guidance on the group’s long-term strategy.     From a more technical point-of-view, it is organized in several Working Groups, each of them dedicated to specific topics. EMVCo also has the Associates Program, so key industry stakeholders can provide input and feedback to the Board of Managers, Executive Committee, and Working Groups.   EMV Technologies EMV specifications encompass a wide range of technologies, including: Contact chip technology, where smartcards and readers provide with cryptographical security advantages in comparison with the traditional magnetic stripe. EMV specifications also regulate contactless payment devices based on NFC technology.  Mobile Transactions where the mobile phone would play the role of a contactless device. The QR code technology, where the transaction can be made using a QR reader. Payment tokenization, that enables to perform transactions without compromising sensible card information. And other technologies like Secure Remote Commerce, 2nd Gen or 3-D Secure.   EMV Contactless specifications EMV Contactless specifications is now on version 2.6 but planning to move to version 3.0 by the end of the year.   The EMV Contactless specifications are structured in three books and the Contactless Interface Specifications that substitutes the Book D from previous versions of the specs. The Book A describes the overall architecture of the system, and the instructions involved in the communication between the entry point and the kernel. The Book B addresses the specifications regarding the Entry Point, which is the piece of sw in charge of the transaction pre-processing, or protocol activation among other tasks. Book C consists of 6 different levels for each of the kernels that are defined in the specifications. The EMV Contactless Interface Specifications describe the minimum set of functionalities that are required for the correct operation between the PICCs and the PCD.   In addition we will mention other relevant documents like: The PCD Test Bench and Test Case Requirements, that describes the test cases that are carried out by the testing laboratory in order to evaluate the devices. Note that there are 2 different documents, one for the Analog L1 tests and another one for the Digital tests. Another document describes the Device Test Environment, which is the software needed to control the device during the testing phase Another document describes the requirements regarding the Contactless symbol that should appear in all EMVCo Contactless POS in the market.   PCD L1 Type Approval The following diagram summarizes the process for the PCD L1 Type Approval:     In the first step the Product Provider shall submit a Request for Registration form to EMVCo. Once EMVCo reviews and accepts the form, the product provider will receive a contract that has to be signed. Upon reception of this contract, EMVCo will assign a product provider registration number. In the second step the Product Provider will choose a Test Laboratory and complete a document called Implementation Conformance Statement in which it provides detailed information about the device and its features. The third step is the Product Validation phase. In this phase the laboratory performs the product testing, where the device goes through a set of tests to evaluate the digital and analog performance. In a final phase and considering the test reports from the Laboratory, the Product Provider might decide to send the product to EMVCo for approval. In that case, EMVCo would analyze the tests reports and grant with a Letter of Approval in case the reports demonstrate sufficient product conformance.   In our case we are going to focus on the Analog L1 PCD tests.    EMV Analog L1 PCD Tests Environment Before going directly to the actual set of tests, it worth it to explain some components about the testing environment to better understand the testing procedure. We have the following elements: Device Test Environment Contactless symbol Positioning conventions EMVCo Reference PICC   Device Test Environment (DTE) The Device Test Environment is a software application that is used to control the device under evaluation during the whole testing process. This application has to be developed by the product provider and shall be implemented in compliance with a set of requirements defined in the specifications. The software is submitted to the test laboratory along with the samples of the device under certification. The DTE shall implement different applications or modes of operation that would be used depending on the testing scenario. These application are:   PCD Controls: It allows the test operator to execute single basic commands from the ISO14443 standard (Carrier ON/OFF, WUPA, WUPB,..) Pre-validation application: This application is used to test the communication of the device with a set of actual EMV compliant cards. Loopback application: It is used to test the device for the majority of the Analog and Digital L1 PCD Tests. In this case the reader is communicating with a Card simulator connected to a reference antenna. Transaction send application: This application can be used by the laboratory to evaluate the compliancy of the device with the waveform requirements defined for the Analog L1 PCD Tests. The main characteristic of this mode of operation is that the device sends a sequence of commands without waiting the responses from the PICC.   Contactless symbol The contactless symbol is the logo that you can see in the lower image. It helps the user identify the area in the Point Of Sale where he has to tap the card in order to trigger the transaction. This symbol has to be visible in the device surface or screen before and during the transaction. The Contactless symbol is extremely important for the testing procedure as it marks the reference point for all the positions that the device should be tested.   Using this reference point EMVCo defines an operating volume.   Positioning convention All test position are included in this operating volume. Depending on the test case, it will be run in one or more positions. Every position is expressed with a set of 3 coordinates or parameters, representing the height, the radius, and the angle respectively.     In the figure above you can see the operating volume along with the different values that each parameter can have.   EMVCo Reference PICC The EMVCo Reference PICC is the reference antenna used to communicate with the PCD under test. It has 4 ports and 2 jumpers that are used to configure the PICC for different purposes. For example, jumper 8 is used to select between linear and non-linear load depending on the type of tests that are performed. In the same line, the MOD IN port where a Signal Generator will inject a certain modulation to emulate a PICC response. The DC OUT port is used to measure the voltage level in the power tests and the LETI COIL OUT is used to measure the waveform tests among others. In the figure below you can also see the reference point of the antenna where the two white lines crossed:   Power tests The power tests are evaluated in all positions with the purpose of guaranteeing that the device is emitting enough field in all the positions. Depending on the height the limiting values will differ. In the figure below you can see the different planes with the respective limiting values.     The critical positions for the power tests are usually the outer positions for plane z=4 and z=3 where the voltage measured may not be strong enough to pass the tests. On top of that and depending on the transmission configuration used, it can also happen that the voltage measured at positions (1, 0, 0) and (0, 0, 0) can exceed the maximum level.   Waveform tests The purpose of the waveform tests is to evaluate the wave shape of the modulation used in the commands from the PCD. That way, if the wave shape fits with the requirements an EMVCo compliant PICC would not have any problem understanding the commands sent by the PCD.   The waveform evaluation for Type A modulation include the following test cases: t1 (TB121) Monotonic Decrease (TB122) Ringing (TB123) t2 (TB124) t3 and t4 (TB125) Monotonic Increase (TB126) Overshoot (TB127)     In the same way, the Type B test cases are the following: Modulation Index (TB121)# Fall time (TB122) Rise time (TB123) Monotonic Increase (TB124) Monotonic Decrease (TB125) Overshoots (TB126) Undershoots (TB127)     Reception tests The objective of the communication or responsiveness tests is to guarantee that the PCD is able to properly finish a transaction when the response of the PICC is in the limits of the specifications in terms of amplitude and polarity.   That way we find 4 different tests: Minimum load modulation, positive polarity (Tx131) Maximum load modulation, positive polarity (Tx133) Minimum load modulation, negative polarity (Tx135) Maximum load modulation, negative polarity (Tx137)   In the two figures below we can easily check the difference in the load modulation level between the oscilloscope capture for the Tx131 and the Tx133.     Other tests Besides the power, waveform and communication tests there are other tests included in the EMVCo Analog L1 Test cases. Here is the list of these other tests:   Carrier frequency (TAB112) Field resetting (TAB113) Power off (TAB114) Polling sequence (TAB115) FDTA PICC (TA139) BitRate (TA141 & TB141) BitCodingPCD (TA142 & TB142) BitCodingPICC (TA143 & TB146) BitBoundaries (TB147) TFSOFF (TB145 & TB148)   EMV Contactless Specs v3.0 The most important change is that the tests will no longer be carried out with one specific EMVCo reference PICC but with three. The first two are Class 1 antennas tuned to 16.1MHz and 13.56MHz, and the third reference PICC is a Class 3 antenna tuned to 13.56MHz.     This is important since the device will need to pass the test for 3 different antennas, making the testing process between 2 and 3 times slower and the tuning of the device more difficult than for the 2.6 version of the specs.   Other changes are a second different load for the linear load tests and the modifications of some waveform tests limits.   NXP Product portfolio for POS The product portfolio that NXP offers for contactless POS device includes three main chips: CLRC663 plus: EMVCo 2.6 ready chip compliant both for analog and digital L1 requirements. The CLRC663 plus is able to work with a transmitter current of 350 mA and a limiting value of 500 mA. This feature allows us to increase the field strength radiated and overcome power issues because of the design of the POS or the antenna.  PN5180: The PN5180 chip is also an EMVCo compliant frontend, that supports highly innovative and unique features like the Dynamic Power Control that optimizes the RF performance even under detuned antenna conditions. Other features are the Adaptative Waveform Control or the Adaptative Receiver Control to automatically adjust the transmitter modulation or the receiver parameters. These and many other features turn the PN5180 into the best NFC frontend in the market. PN7462: It supports contact and contactless interface in the same chip. It is an NFC controller, so includes an MCU with a configurable host interface. For the contactless interface, it implements similar functionalities as the PN5180, like the Dynamic Power Control, the Adaptative Receiver Control, and the Adaptative Waveform Control.   Further Information You can find more information about NFC in: Our NFC everywhere portal: https://www.nxp.com/nfc You can ask your question in our technical community: https://community.nxp.com/community/identification-security/nfc You can look for design partners: https://nxp.surl.ms/NFC_AEC And you can check our recorded training: http://www.nxp.com/support/online-academy/nfc-webinars:NFC-WEBINARS   Video recorded session