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This course will provide an in-depth system analysis of High Voltage (HV) Electric. We review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using system block diagrams and oscilloscope screen shots of NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design considerations, layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring and advanced features achieve system ASIL level D and ISO26262 certification.

This training session will provide a mid-level technical review of the latest generation of Motion Sensors and Pressure Sensors targeted for Automotive Safety Applications. Details to be covered include: a) Portfolio Overview; b) Product key functions / block diagrams; c) Functional safety considerations; d) application use case considerations and e) Development Tools. The session will conclude with a live demonstration.

The self driving car has a major impact on ECUs power and complexity and the network architecture connecting them together. The sheer fact that the driver is now a mere passenger with potentially limited options of taking back control raises significant functional safety questions that cannot be addressed with conventional approaches. In this presentation, we discuss how autonomous driving is impacting the functional safety requirements for automotive Ethernet switches and PHYs. We will review what functional safety for a component really means, going beyond marketing figures and ticking off feature lists. Finally, we will discuss how NXP is attacking this challenge in our current portfolio with a hint to the products to come.

NXP has prepared a DroneCode.org compatible Vehicle management unit (VMU) running PX4Pro. The NXPhlite VMU is compatible with the full stack from Dronecode, including internal and external comms, planning and groundstation control. This can be used as the basis to coordinate with a higher level companion system running LINUX and ROS, or as a standalone vehicle such as a semi-autonomous Drone, Rover, boat or even a lawnmower. NXPhlite features multiple interfaces and includes 100BaseT1 2-wire Ethernet and dual CAN interfaces.

Every Linux distribution provides features useful in product development - each SoC provides features necessary to a product's success. If you can't take advantage of the distribution of your choice or the SoC of your choice - product development is hampered or stopped altogether. NXP provides technology easing the adoption of SoC specific components into the distribution of your choice. Learn more about this technology, and practical tips and tricks on how to build and use selected components from LSDK at the component isolated level. Topics include building and deploying PPA and boot loaders, building and booting the Linux kernel, and building and deploying select user space components. Emphasis is on native building because it's easier. This will be a two hour session to leave time for Q&A.

Join this session to understand the breakthrough security features integrated in the recently launched LPC5500 MCU Family. Along with Arm® TrustZone technology the LPC5500 SRAM PUF based key management makes security easy to use and easy to deploy. This session will start off by introducing the scope of securing a smart connected device. It will explain the need for addressing device life cycle in a scalable way that is easy to use and easy to deploy. Then it will detail the protected key management achievable when using LPC5500 with MCUXpresso Software & Tools.

What is USB Type-C and USB-Power Delivery? Why consumer electronics and mobile computing products is adopting this new Type-C connector? What are the advantages and disadvantages using this connector? What is the future for USB Type-C and PowerDelivery. In this section, NXP (SIP) will give a high level introduction on this new technology and the ecosystem. This section is market and ecosystem driven discussion, not technically intense discussion.

Starting with the description of the differences between the many BLE standards, this presentation will provide a clear understanding of the NXP BLE roadmap from the MICR team. It will detail the HW and SW solutions that are in production today vs. the ones that are going to hit the market in the coming quarters. The presenter will also deliver the latest information regarding the validation of the KW35/36A program that specifically targets automotive and industrial applications. Indication of the future direction for wireless connectivity will close the presentation, providing a synergistic perspective with the AUTO developments.

V2X technology has the potential to drastically reduce road accidents and improve the traffic flow by fusing in-car sensor data with data obtained from other road users and from the surrounding infrastructure - visibly or unvisbily and far beyond the driver's line of sight. Vehicle to cloud data communication provides a pathway for anonymous data collection and dissemination. When the true potential for V2X is realized and it becomes a true part of the vehicle safety system it is vital that the authenticity and security of data are guaranteed. In addition, the vehicle control units that coordinate active stability systems must be protected against external influences that might subvert the mechanisms design. This presentation will explore the various security countermeasures needed to make V2X a safe and secure technology for the future.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

Ensuring secure deployment of the billions of end nodes is a key enabler for the Internet of Tomorrow. The Kinetis K8x and Kinetis KL8x families are designed to deliver unsurpassed security for multi-application MCUs with hardware features such as Trust, Cryptographic acceleration, and Anti-Tamper to deliver a scalable, secure platform for embedded developers. This hands-on session will cover the needs of secure embedded applications, performing encrypted firmware updates, utilizing hardware cryptographic accelerators and extending trusted execution to external memories using an on-the-fly AES decryption module. Join this session to learn how your customers can get started creating their next secure node design.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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