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Connects - Training Material

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Introduced the basic principle of touch sense solution of NXP and demonstrate the reference design based on S32K family.
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How to accelerate radar signal processing on S32R family utilizing SPT and multiple cores.
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This session provides an introduction to the market and technology trends behind Advanced Driver Assistance Systems (ADAS) and Autonomous Driving and introduces some of the solutions that NXP provides to enable the car of tomorrow to sense, think and act.
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Introduce features and advantages of common chassis approach and differences vs current products.
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Evolution of Automotive car architecture with more hybridization require evolution of power management to fit with application and environment changes. During this session you will have an overview of market dynamics.
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The session will introduce an upcoming xEV traction motor power inverter platform system-play solution featuring a new MCU, new IGBT gate driver, and new safe SBC bound together with system enablement software and ASIL-D compliant safety support. A fully functional traction motor reference design being designed by partner Vepco will also be introduced based on a Power IGBT Module from Fuji Electric. The session will describe the platform’s components, software structure, value proposition, enablement support and go-to-market approach to help enhance understanding of the application and NXP solution as well as how to sell the system platform.
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Product training of MC33771x ICs for HV BMS. 1- Short BMS market introduction (incl. key players, requirements, competitors); 2- Introduction to NXP BMS roadmap and key products (BCC14, BCC6 & TPL); 3-Key BMS applications (14V, 48V, HV Daisy Chain, HV CAN, Wireless) including differentiation and value proposition; 4- Market, application, reference design and product outlook; 5- Functional safety aspects - system safety goal and how to implement functional safety.
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This course provides a system analysis of High Voltage Electric Inverter systems. It is a good session for everyone who wants to know more about NXP's electrification solutions. It reviews the architecture and functional safety of electric vehicle powertrain. Focus is on MC33GD3100 overview, key features and design support.
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Overview of S32K, MagniV and other GPIS products.
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Explores the fast-growing Automotive Gateway market, identifying key use cases and requirements, and how gateways will evolve over the next decade.
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Overview of the S32x next-generation safety architecture spanning ASIL B to ASIL D. What’s new and how we better enable the customer with a full set of safety collateral including MCU HW, SW and SBC HW.
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Show the importance of OTA updates and the requirements for a total system solution for FOTA.
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This presentation will explore key Time-Sensitive Networking (TSN) standards and how they relate to Automotive requirements. An overview of the relevant IEEE®  802.1 TSN standards will be given with examples of how these can be applied and used in the automotive environment. By the end of this session, the attendee will understand and be able to select the features they need based on their network use cases.
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China expects each OEM to make and sell 12% of its output as ZEVs by 2020, large cities ban classic ICE-vehicles, car makers announce new EVs with increasing cadence. This session shall give an overview of the main forces influencing the EV market, describe the main architectural approaches and system components as well as what growth potential this has for NXP.
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Future networks will still use CAN to a huge extend - but the variety of trends is also significantly increasing. This session shows key values, technical background and differentiators of the different CAN trends and the NXP implementation.
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This session will give a deep dive of MagniV products and explain how to well position these products in different applications.
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Automotive Acceleration on Automotive Radar Signal Processing  AD/ADAS Overview  Building Your Automotive Network with Time-Sensitive Networking (TSN) and Ethernet  CAN in Future Car Networks—Understanding the Different Trends and Solutions  Electrification—HV EV Power Inverter System and GD3100 Review  Electrification—MC3377x Battery Cell Controllers for High-Voltage Battery Management System  Exploring the Automotive General-Purpose MCU Portfolio  GPIS Touch Sense Solution  MCU: MagniV® Integrated Solution Deep Dive  Next-Generation Functional Safety Architecture  NXP’s xEV Energy Management Solutions  NXP Car Access—Roadmap Towards Smart Access (NFC, BLE, UWB, SE)  OTA Updates—Requirements for a Full System Solution  Power Management Solutions for Automotive_Connects China  S32 Common Chassis Overview  S32 Radar Processor, Product Revolution  The Rise and Evolution of Automotive Gateways  xEV HV Traction Motor Power Inverter Platform  Artificial Intelligence, Enabling Technologies, Security & Solutions A Vision for Machine Learning (ML) and Artificial Intelligence (AI) in Low-Cost Edge-Computing Nodes  Computing at the Edge - When, Why and How_Connects China  Boot in Less Than One Second? Learn How_Connects China  EdgeScale: A Solution for Secure Edge Device and Application Management from the Cloud_Connects China  Learn to Get Up and Running Fast with MCUXpresso Software and Tools  Overview of i.MX/MCU Security Features  Using OpenWRT, Yocto, Ubuntu or Your Own Custom Linux® Distribution? Learn How NXP is Making it Easy to Leverage a Multi-Distribution Approach to Software Development_Connects China  Smart Machinery & Industrial Automation NXP Complete Motor Control Solutions  Open Industrial Linux® (OpenIL)—Secure, Robust, Real-Time for Industrial and Automation Applications_Connects China  Time-Sensitive Networking (TSN) and Precision Time Protocol (PTP): Challenges, Opportunities and Solutions  Multimedia Experience NXP MCU and MPU Based Voice and Audio Solutions for AI-IoT Market  Smart Networks & Computing DAS and Small Cell for the Mobile Broadband  High Power RF Applications for Above 1GHz Cellular Band with GaN Technology  High Power RF Applications for Cellular Band with LDMOS Technology  SD-CPE—A CPE to be Deployed with VM (Docker, etc.) and Managed by Orchestrator  SD-WAN—Concept and Application to Enable Flexible Network Bandwidth Management On-Demand  Smarter World Solutions & Multimode Connectivity Fast Charger/Adapter (TEA1936+ TEA199x+ TEA1903x/05x); LLC Resonant AC/DC Power (TEA19161+ TEA19162+ TEA1995)  i.MX RT Enablements and Reference Solutions  i.MX RT Overview and Security on Memory Expansion Design  Introduction to NXP Wireless Charging Solution and Design  Low-Cost Production Proven Smart eLock Solution MiGLO®_Connects China  NTAG® SmartSensor_Connects China  NXP Connectivity Solutions for Smart Home, Building and Lighting and BLE Low-Power Solutions for Consumer, Medical, Industrial IoT and Automotive Markets  Power Regulation/Market Trend and Overview of NXP AC/DC Power Solutions  Rapid IoT Prototyping Kit_Connects China  Smart Amp Software_Connects China  Type-C End-to-End Solution_Connect China  Using Sensors for Low-Power IoT Applications: Tips and Tricks_Connects China  Emerging Trends & Innovation An Overview of NXP MCU Portfolio Based on Arm® Cortex®-M Cores  Secure Tamper-Resistant Authentication_Connects China 
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This class will introduce/update on Android Things, the new version of Android designed for the IoT market. The when, what and how of Android Things will be explained and how NXP has worked with Google to enable certified boards based on NXP silicon and why IoT product developers should consider using Android Things for their next IoT project. Finally the relationship between Android Things, Google Voice Assistant and Chromecast built in will be explained and what NXP parts are most appropriate for optimal performance.
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This session will cover in detail some of today's most popular IoT sensing applications such as Asset Tracking, Machine Condition Monitoring, Activity Monitoring, Keyfob, Smart Door, Smart Ball, Inhaler, HVAC, etc. This will involve showcasing NXP's demos/reference designs to explain the execution of some key applications. It will also cover low-power techniques on implementing the above applications.
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Overview of the S32x next-generation safety architecture spanning ASIL B to ASIL D. What’s new and how we better enable the customer with a full set of safety collateral including MCU HW, SW and SBC HW.
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