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Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.
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Deep dive training on battery management applications: Detailed feature set and hardware configuration descriptions. 1.) Short market introduction on Battery Management Systems (BMS). 2.) Overview of key application requirements (incl. 14V, 48V, HV Daisy Chain, HV CAN, Wireless). 3.) Introduction to NXP BMS New product portfolio key features, value proposition. 4.) Future BMS product outlook.
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The session includes the overview of S32K Automotive MCU product family for general purpose automotive applications, as well as industrial applications which require automotive quality and reliability. It will cover the introduction of S32K solutions – touch sense, motor control, secured car access, CAN-FD communication, etc.
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Hands-on: Quick introduction into non-AUTOSAR software solutions based on NXP S32 SDK. How to create an automotive application featuring secure CAN communication. Integration with S32 Design Studio IDE, tips and tricks.
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NXP is the leader in secure car access chipsets. This session will introduce car access trends and different use cases, products and system solutions for NFC and RF Auto.
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This course will provide an in-depth system analysis of High Voltage (HV) Electric. We review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using system block diagrams and oscilloscope screen shots of NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design considerations, layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring and advanced features achieve system ASIL level D and ISO26262 certification.
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Hands-on: How to build an automotive application using the S32 SDK for Power Architecture drivers and FreeRTOS. Integration with S32 Design Studio IDE, tips and tricks.
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In this session you will learn how to design and what to expect from our free software tools.
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Lecture showing and analyzing SqueezeNet CNN classifier demo on S32V234. See how S32V234 can use CNNs to process and classify images in a power-efficient manner.
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Designing automotive gateway applications using SDK drivers, software stacks and FreeRTOS.
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Introduction to the S12 MagniV based automotive motor control solutions for high power applications.
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The autonomous vehicle of the future will set new requirements on safety, reliability and dependability. In this talk we will review resulting requirements on vehicle architectures of the future and how they will be enabled by Smart Actuators.
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NXP is a recognized automotive market leader in Motion Sensors, Pressure Sensors, and Magneto-Resistive Sensors with an ever growing base of products and solutions. Join this training session to learn about the latest evolutions of the sensor product roadmaps and targeted applications.
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The vehicle becomes the most complex node in the Internet of Things and driver assistance functions will ultimately merge in the autonomous vehicle. On the way more and more consumer components make it into vehicles and the need for unprecedented compute performance is redefining “high-end” in cars. NXP is a leader in Automotive since decades and the leader in highest-end compute Networking solutions. This session will highlight 66 critical differences that may generically exist between automotive and consumer components as identified by a ZVEI industry workgroup (German Association of Electronics Industry) e.g. impacting reliability, quality and lifetime of vehicles. We will demonstrate how NXP’s capabilities across all product segments and performance ranges might address many of your hidden risks providing an excellent starting point towards your autonomous vehicle.
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Introduction to the standard - with emphasis on how to apply it, cross BL.
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Design, Software & Services LAT-DES-T2443 - An Update on i.MX Applications Processors Product Family: i.MX 6UltraLite, i.MX 6ULL, i.MX 6QuadPlus, i.MX 7 and i.MX 8  LAT-DES-T2441 - Demystifying Designs with MPUs: How the Available Documentation and Tools Can Ease the Process of a Complex i.MX Application Processor based Board  LAT-DES-T2445 - PCB Layout Tips and Tricks – A Journey to Robustness  Smart Home & Buildings LAT-HMB-T2459 - Future Electronics: Designing with Security in Mind  LAT-HMB-T2460 - Turing Computer: Hands-On Workshop: Adding Hotspot Features (3G/4G-Wi-Fi Router) to Your Multimedia Product  Insight & Innovation LAT-INS-T2442 - Analog Solutions for Multi-Market - Automotive and Industrial LAT-INS-T2438 - Learn About the Most Comprehensive Solutions based on ARM® Cortex®-M MCUs: Kinetis and LPC  LAT-INS-T2437 - Solutions Around the Core - Designing with NXP’s Interface and Power Solutions
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This session will address the newest technology solutions including: PMIC for i.MX application processors / Layerscape; Functional SBCs for applications up to ASIL D; Li-Ion Battery Cell Controller (14V, 48V and more); Smart high side switches; Valve controller for hydraulics and pneumatics systems.
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With focus on different applications, this session will highlight both the Kinetis and LPC families. We will present the new members of each family and provide you insight of what you could expect from these families going forward.
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Electronic system designers typically have a central processing unit that interfaces with other peripheral devices, other sub-systems or the user. Often, the signals from these interconnects may be incompatible on both ends. Therefore, various semiconductor devices such as analog switches, high speed switches, voltage level translators and GPIO expanders are often used to bridge between the interconnects on the board. In this session, we will present the broad portfolio of NXP’s interface and connectivity solutions that go around the processor. These solutions include signal switches, voltage translation, I2C interface devices, real time clocks, and temperature sensors. We will also present some solutions for managing the power to the system.
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This hands-on session sponsored and specially created by Turing Computer, will go over a step-by-step process of how you can add connectivity to your multimedia application using i.MX 6 and Linux. The laboratory will introduce you to the concepts of how to enable a 3G/4G modem under Linux, adding internet connectivity to your product, and will also guide you on how to enable an Wi-Fi radio. The final step will be to enable the bridge between the 3G/4G and Wi-Fi, creating a Hotspot for internet access. The hardware used during the lab is an i.MX 6 based System on Module (SoM) from Turing Computer and their evaluation kit, which includes a Wi-Fi and a 3G/4G module. Among the various applications that could benefit from such feature are: video streaming, IoT gateway, digital signage, automotive multimedia and many others.
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