Connects - Training Material

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Systems are complex, and increasing complexity does not translate to product differentiation. Extracting the maximum networking performance, battery life or graphics capability requires knowledge of the underlying silicon and software. Developer resources are tight, and shifting the focus to product development above platform development maximizes return on investment. Freescale has deep enablement technology, comprehensive support and a vibrant ecosystem available to assist getting your product to market quickly. For automotive, consumer, industrial and networking applications, learn how NXP extends the broad technology and support available today with custom access to experts. A brief overview of the products and services available across NXP will be augmented with case studies and expert Q&A.

Security is becoming a quintessential topic for any OEM, and possibly for the entire industry, as evolutions of Autonomous drive capabilities are inexorably tied to the ability to secure the car. A number of components in the security architecture of nodes in any vehicle are very close to the SoC, exploiting hardware capabilities to achieve intended functionality. Answering customer needs, NXP is providing a Trusted Execution Environment (TEE) stack, which provides a significant number of security features required by the Automotive needs. Get an introduction to the basis of NXP’s TEE stack, capabilities, and how does this integrates in the typical secure node architecture.

This presentation provides an overview of the new toolchain to support the S32 platform of MCUs and application processors, this includes an IDE with new project generation, extensive collateral for ease of use and getting started as well as the next-generation Debugger tools, a new Flash tool specifically design for the S32 platform, the S32 configuration tool plus numerous software products integarted into the toolchain for ease of customer use.

As LEDs continue to penetrate exterior automotive lighting applications by replacing traditional lighting solutions, there is an increasing demand for more safe, efficient, flexible and scalable electronics & driver ICs that can enable the full benefits of LEDs in these safety critical applications. This session will provide an overview of the requirements of Advanced Automotive Lighting Systems to provide safety in ADAS systems. Also the impact these system requirements have on the IC specifications, ranging from full system diagnostics, limp home modes, thermal and EMC considerations.

The automotive market is moving towards electrification and autonomous driving. This trend needs ADAS electronic systems capable of making decisions. To manage the risk of operations, the development of these systems follows the highest ISO26262 Automotive Safety Integrity Level (ASIL D). All safety electronic systems require a safety microcontroller and a reliable, safe source of power management connected to the car battery: this is the System Basis Chip (SBC). Safety microcontrollers and safety system basis chips are the backbone of embedded system architectures. In this presentation, you’ll review the latest functional safety innovations at the power management level (SBC), from the development phase to system design, underscoring the link to reliability and how to enable hardware that is safety ready. A short introduction to the fault tolerant system will be also presented.

As geometries continue to shrink and switching speeds increase, designing electromagnetic systems and printed circuit boards to meet the required signal integrity and EMC specifications has become even more challenging. A new design methodology is required, specifically, the utilization of an electromagnetic physics-based design methodology to control the field energy in your design. This session will review basic EM theory and introduce some new guidelines for designing compliant printed circuited boards.

Emerging Connected and Automated Vehicles (CAVs) require far more compute horsepower, more memory bandwidth, and more high speed IO connectivity than the vehicles in show rooms today. NXP’s highest performance multicore Arm product family (Layerscape) was developed for networking and industrial infrastructure, however their integration and performance per watt has made them attractive in a variety of ‘transportation’ applications, including planes, trains, and now, automobiles. This session will provide an overview of the product family, and its transportation centric use cases.

This course will provide an in-depth system analysis of High Voltage (HV) Electric We review how the MCU, GDIC and IGBTs function individually and as a system. We will discuss EV and HEV power systems and components for achieving a highly efficient and safe HV motor drive. Using system block diagrams and oscilloscope screen shots of NXP’s new HV IGBT GDIC, the GD3100, and Fuji GEN 7 IGBT modules as we will consider how to achieve smaller, more efficient and lower cost HV inverter designs. We will review SPI interface programmability that enables any IGBT to be tuned for maximum efficiency, thermal design considerations, layout considerations, power budget assessment, power up sequencing, managing short circuit faults, temperature monitoring and advanced features achieve system ASIL level D and ISO26262 certification.

Connects - Training Material

Connects - Training Material

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