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Connects - Training Material

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This session will cover NXP's complete sensor portfolio for both Automotive and IoT markets. This session will also provide an overview of the various target applications for sensors in both automotive and IoT domains.  Applications ranging from Airbags, Tire Pressure Monitors to low power activity monitoring and asset tracking will be covered in the session.
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The raison d'etre of edge computing is processing IoT sensor data, and machine learning techniques are increasingly being used for this analysis. Although general-purpose CPU cores can handle ML, specialized accelerators deliver 10x the performance in the same power envelope. Learn how Layerscape compute and acceleration is addressing the needs today - and see what the future holds.
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This session will introduce NXP differentiated GaN technology for cellular band high power applications, including full cellular portfolio RF Power products.
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S32K11x, S32K14x product and solution, migration to future S32K products.
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As connected edge devices gain momentum with consumers, the security approaches and assumptions of the past will fail and create new threats and vulnerabilities to consumer safety and privacy. Additionally, the cost for security in mobile phones, tablets, and PCs will present a challenge for applications such as occupant sensors and heart rate monitoring patches. Lastly, the teams of security experts in connected industries do not yet exist at suppliers who are connecting products to the network. Join this session to learn how industries are providing cost effective, highly secure, certified hardware that can hasten the learning cycle for emerging edge node applications, bring solutions for security, drive down costs, and limit the supplier specific required expertise.
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As we race through the age of ubiquitous connectivity with insatiable demand for data, the need for high-speed connectivity solutions is more evident than ever. 60 GHz or 802.11ad Wi-Fi is the new kid taking over the block - be it in homes or in offices, high density indoor or outdoor spaces, fronthaul or backhaul applications, it's everywhere! What's more is that this space is being primarily influenced by a lot of new tier 2 players who have innovative approaches to make the best use of this multi-gigabit rate spectrum. Come join NXP to learn how our SoCs are integral to furthering this ecosystem.
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This session will provide an insight into all the sensor hardware and software tools, enabling customers to reduce their time to market. Find out about all the latest sensor tools and reference designs for IoT (Industrial/Medical) applications.
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This course provides a system analysis of High Voltage Electric Inverter systems. It is a good session for everyone who wants to know more about NXP's electrification solutions. It reviews the architecture and functional safety of electric vehicle powertrain. Focus is on MC33GD3100 overview, key features and design support.
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Near Field Magnetic Induction (NFMI) technology, demonstrating a family of ultra-low-power, single-chip solutions enabling wireless audio streaming that are highest quality ear-to-ear communications for hearables and data communication.
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The automotive industry is rapidly evolving and the car is being transformed from a simple mode of transport to a personalized mobile information hub. All these new electronic functions bring great benefits to the driver, increasing comfort, convenience, safety and efficiency. But these features come with new risks, too. Modern vehicles feature wireless interfaces connect the in-vehicle systems of these ‘Connected Cars’ to external networks, which form entry points for hackers. This session will describe a proposal for a layered automotive security architecture providing a defense-in-depth approach to securing a vehicle including secure external interfaces, secure domain isolation, secure internal communication and secure software execution. In addition, the session will describe how all these security layers can be supported through the full vehicle life cycle of design, build, use and scrap.
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Covers the driving of the Buck / Boost LED drivers and Matrix IC using config registers and external components for optimized BOM and performance.
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I2C master and slave devices are used in many system for various reasons. NXP offers the widest portfolio of I2C devices. This class will introduce the I2C-Bus interface, address some common pitfalls when designing with I2C-Bus, and present solutions to these challenges.
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This session will introduce the NXP mature and widely accepted solutions of RF products serve the DAS and small cell applications from 0.5W, 10W to 20W and 40W.
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This session will focus on the memory choices for several of the more popular i.MX 6 and i.MX 7 series as well as NXP’s newest and most powerful microprocessor, the i.MX 8 series. Most processors can support different types of volatile (DRAM) and non-volatile (Flash) memories. For example, the i.MX 7 can support low power DRAM (LPDDR), LPDDR2 and LPDDR3 as well as the standard DDR3 memory. For flash memories, the i.MX 7 supports parallel NOR, serial NOR or NAND Flash. Each of these memory choices has technical advantages and disadvantages as well as the overall market acceptance and expected longevity. The session will also discuss two new high performance memory technologies that the i.MX 8 plans to support, LPDDR4 and XTRMFlash. This session will allow you, the designer to make an informed decision when it comes to selecting memory for your design.
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Introduction on RCI (Remote Control Interface) for our RF products (Lizard, MantraCS, MantraF). System integration and development made easy using the RCI firmware together with the Configuration Development Kit (CDK).
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Wi-Fi 6 is the latest standard in WLAN technology also known as 802.11ax. This enables almost four times faster speed over the previous technology 802.11ac. NXP has been developing front end IC to support this upcoming technology and have won the reference design with a leading SoC vendor. In this course, participants will learn the key features of Wi-Fi 6 and how NXP FEIC will solve those challenges to deliver a cutting edge solution.
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The Pins Tool makes configuring, muxing and routing of pins very easy and fast. It provides real-time feedback of conflicts and provides an intuitive graphical interface with several views. The tool generates device tree and sources files which can be directly integrated into C/C++ applications. This training will provide explanation and demonstration of getting started on a new project with i.MX applications processors.
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You innovate to make the vehicle autonomous & the most complex node in the Internet of Things. Increasingly functionality from consumer components is needed in your solutions. NXP, the leader in Automotive and high-end compute in Networking, highlights 66 critical differences that may generically exist between automotive and consumer components. Identified by a ZVEI industry workgroup (German Association of Electronics Industry) they impact reliability, quality and lifetime of vehicles. Examples demonstrate how NXP’s capabilities across all product segments and performance ranges reduce your hidden risks providing an excellent starting point towards your autonomous vehicle.
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Every Linux distribution provides features useful in product development - each SoC provides features necessary to a product's success. If you can't take advantage of the distribution of your choice or the SoC of your choice - product development is hampered or stopped altogether. NXP provides technology easing the adoption of SoC specific components into the distribution of your choice. Learn more about this technology, and practical tips and tricks on how to build and use selected components from LSDK at the component isolated level. Topics include building and deploying PPA and boot loaders, building and booting the Linux kernel, and building and deploying select user space components. Emphasis is on native building because it's easier. This will be a two hour session to leave time for Q&A.
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