Connects - Training Material

Discussions

This session will go into the detail of the software enablement around the BlueBox v2.0, aka “Blue Box Min”. From an engineering perspective, topics will include: The SoCs in the platform and it’s layout; Booting the individual SoCs; Linux options between and inter-communication between them; Discussion of middleware options (including ROS versions, Polysync and others); How ADAS vision perception is accomplished with Neusoft ADAS perception; Combined to achieve level 2/3 ADAS with AutonomouStuff; Extra topics: OpenCV, OpenSSL security between subsystems and more. Please expect a non-marketing lecture explaining the internals of this enablement.

Starting with the description of the differences between the many BLE standards, this presentation will provide a clear understanding of the NXP BLE roadmap from the MICR team. It will detail the HW and SW solutions that are in production today vs. the ones that are going to hit the market in the coming quarters. The presenter will also deliver the latest information regarding the validation of the KW35/36A program that specifically targets automotive and industrial applications. Indication of the future direction for wireless connectivity will close the presentation, providing a synergistic perspective with the AUTO developments.

Electronic system designers typically have a central processing unit that interfaces with other peripheral devices, other sub-systems or the user. Often, the signals from these interconnects may be incompatible on both ends. Therefore, various semiconductor devices such as analog switches, high speed switches, voltage level translators and GPIO expanders are often used to bridge between the interconnects on the board. In this session, we will present the broad portfolio of NXP’s interface and connectivity solutions that go around the processor. These solutions include signal switches, voltage translation, I2C interface devices, real time clocks, and temperature sensors. We will also present some solutions for managing the power to the system.

This is a highly integrated eLock platform for a rocket start in the Chinese (residential) access market. It features NFC, BLE, fingerprint, keypad entries and can be easily configured using WeChat “mini programs” platform for maximum compatibility with existing cell phones. Learn more about the products behind - NFC controller PN7362AU and BLE controller QN9021 – and how this highly integrated eLock solution can dramatically simplify the configuration for end users.

NXP’s latest i.MX 8M processors require the latest memories to keep them running efficiently. As a system designer, your memory choices can impact the performance, size, cost, power reliability and longevity of your end product. We will discuss the latest memories supported on the new i.MX 8M processor family. This includes DDR3, DDR4 and LPDDR4. We will show designers how they can prioritize performance, power or price to develop the most optimum system. We will also provide details on eMMC 5.1 storage products. This includes high performance features including command queueing, and several new Cache operations. We will also highlight a new MCP that includes LPDDR4 and eMMC in a single space saving package. This session will provide designers with the tools necessary to create state-of-the-art i.MX 8M systems.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

Connects - Training Material

Connects - Training Material

Training Sessions Material

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