Video   NXP’s Touch Sense Interface (TSI) offers a complete solution to help easily integrate this growing ‘touch’ requirement on your next design. NXP’s touch software, offered as a middleware as part of the MCUXpresso SDK, is optimized to work with the Kinetis KE15Z MCU to deliver an easy-to-implement solution. Product features Advanced EMC robustness, pass IEC61000-4-6 standard test Support both of Self-cap sensor and Mutual-cap sensor, up to 36 touch keys Low BOM cost per touch key, no need for external devices Adjustable touch sensing resolution and sensitivity, high performance for waterproof Low power support NXP recommends the following links for additional information Product Link NXP Touch Solution for Kinetis KE15Z MCU Family NXP Touch-Based User Interface Solutions for Kinetis KE15Z MCU Family | NXP  Touch Module for Freedom Board FRDM-TOUCH|Touch Module for Freedom Board | NXP  Freedom Development Platform for Kinetis® KE1xMCUs FRDM-KE15Z Platform|Freedom Development Board | NXP 

This demo shows a demonstration of NXP's wireless charging reference design for a tablet computer.       Features Consumer and Automotive Applications Compliance with wireless power consortium QI standard Transfer efficiency Touch sensing Featured NXP Products WCT1000 Links Link to Wireless Charging Links to document page Block Diagram  

Demo This demo shows how the FlexIO peripheral can be utilized to connect directly to an RGB TFT display to deliver a rich graphical display. The demo uses the versatile Tower ecosystem to connect the TWR-K80F150M MCU board to the display. The demo is well documented by an Application note and associated software     Features Dynamic Graphical LCD (480x272) with 16bt RGB interface Images stored in fast external Serial NOR flash FlexIO utilized to generate 16bit interface to TFT display with minimal CPU intervention   _______________________________________________________________________________________________________   Featured NXP Products: Product Link Kinetis® K80 MCU Tower® System Module TWR-K80F150M|Tower® System Board|Kinetis® MCUs | NXP  Graphical LCD Tower System Module with RGB Interface Graphical LCD Tower Module with RGB Interface | NXP  _______________________________________________________________________________________________________ Links AN5275: Using FlexIOhttp://cache.nxp.com/files/microcontrollers/doc/app_note/AN5275.pdf?fsrch=1&sr=1&pageNum=1 AN5280: Using Kinetis FlexIO to drive a Graphical LCD http://cache.nxp.com/files/archives/doc/app_note/AN5280SW.zip

Demo Owner Clark Jarvis   The following demo will show a comprehensive enablement in software. Next-gen Kinetis K series MCUs, new FRDM-K64F development platform, software development kit* and Kinetis Design Studio IDE*, paired with Processor Expert software, MQX RTOS and PEG graphics studio to provide powerful and rapid prototyping. *In beta release now     Features Comprehensive, all in one development software Featured NXP Products Product Link Freedom Development Platform for Kinetis® K64, K63, and K24 MCUs FRDM-K64F Platform|Freedom Development Board|Kinetis MCUs | NXP  Supporting Hardware Dialog Auto Shield Arduino Display

Overview The NXP ®  S12G automotive HVAC platform reference solution uses the scalable S12G 16-bit MCU family with MC33905, MC33932 and MC33937 analog devices to drive stepper, DC and BLDC motors and provide a feature-rich solution for automotive HVAC applications. Consists of a central control board with (HMI, a motor control board, flap and blower motors Enables basic functions of an auto HVAC using temperature, light, humidity and air quality sensing interfaces with configurable automatic climate control software algorithm to efficiently control vehicle climate Reduces overall design effort, shortens time to market and can be tailored for both 12V and 24V systems Features Three types of motor control sensorless BLDC DC stepper motor Automatic climate control Supports multiple temperature zones Ultra low power mode, can be woken up by HMI or LIN CAN bus CAN and LIN communication interfaces 3x3 matrix keypad and two encoder knob inputs 4x37 segment LCD and adjustable backlighting Sensor interfaces for temperature, light, humidity and air quality available Two logic relay interfaces to compressor defrost module Real-time clock and date display, adjustment for calendar Extensible with touch keyboard or touchscreen board Suitable for both 12 volt and 24 volt HVAC systems Block Diagram Design Resources

Overview Heating, ventilation, and air conditioning (HVAC) systems are based on inputs from a variety of sensors, controlling different types of motors such as stepper motors for flaps and DC/BLDC blower fan motors. NXP broad portfolio of 32-bit, 16-bit S12, and 8-bit S08 families of microcontrollers enables designers to meet the needs of a variety of HVAC applications. System basis chips (SBCs) combine physical network connection with power management. Intelligent eXtreme switches complete the system solution for DC motor blowers. BLDC motor control requires more complex algorithms. NXP’s MagniV products combine MCU with SBC functionality, network connection, and motor control, specific drivers, into a single package, providing a cost-effective small footprint system solution. Interactive Block Diagrams https://www.nxp.com/video/building-automation:BUILDING-AUTOMATION-V02Recommended Products Category Products Features MCU MPC560xB|32-bit MCU|Body-Electronic | NXP  32-bit single-core Power Architecture® MCU. 32-bit Automotive General Purpose MCUs | NXP  Arm Cortex-M0+|Kinetis KEA 32-bit Automotive MCUs | NXP  System Basis Chip (SBC) MC33742 | SBC with Enhanced High-Speed CAN Transceiver | NXP  System basis chip with high-speed CAN Interface. SBC Gen2 with High-speed CAN | NXP  System basis chip with high-speed CAN Interface. MC33905 | SBC Gen2 with High-Speed CAN and LIN | NXP  System basis chip with high-speed CAN Interface. LIN SBC | NXP MC33910  System basis chip with LIN interface (Entry Level). LIN SBC | NXP MC33911 System basis chip with LIN interface (Medium Level). LIN SBC | NXP MC33912 System basis chip with LIN interface (High-end Level). CAN Interface MC33897 | Single-Wire Can Transceiver | NXP  CAN interface with protection features LIN Interface TJA1021 | LIN2.1/SAE J2602 Transceiver | NXP  LIN interface with low emission. MC33662 | LIN 2.1 / SAEJ2602-2, LIN Physical Layer | NXP  LIN 2.1 and SAEJ2602-2 interface. Switch Monitoring MC33972 | MSDI with Suppressed Wakeup | NXP  Multiple switch detection interface with sleep mode. MSDI | NXP  Multiple switch detection interface with sleep mode. Motor Control MagniV® S12ZVM Mixed-Signal MCUs | NXP  Single-chip BLDC motor control solution. MC33937 | Field Effect Transistor | NXP  Three phase field effect transistor (FET) pre-driver. MC33932 | H-Bridge Motor Driver | NXP  Dual 5.0 A throttle control H-bridge. High Side Switches MC33937 | Field Effect Transistor | NXP  Three phase field effect transistor (FET) pre-driver. MC33932 | H-Bridge Motor Driver | NXP  Dual 5.0 A throttle control H-bridge. Tools and Software Link Features Development Kit for sensorless BLDC | NXP  Based on the 32-bit Arm Cortex-M4F S32K144, the MTRDEVKSBNK144 is a development kit engineered for sensorless applications requiring one Brushless Direct Current (BLDC).

这篇文章通过覆盖与GFSK （通用频移键控）通信并行的 低功耗蓝牙 多节点连接，提供了混 合应用程序（ W ireless UART + GFSK Advertising ）的示例。这是 SDK 的另一个示例，其中我 们定义了 混合应用程序，用于与 GFSK 通信并行进行蓝牙 LE 广告和扫描。 Products Product Category NXP Part Number URL MCU KW36/35/34 https://www.nxp.com/products/wireless/bluetooth-low-energy/kw36-35-34-arm-cortex-m0-pluskinetis-kw36-35-34-bluetooth-low-energy-32-bit-mcus-nxp:KW36-35 MCU KW39/38/37 https://www.nxp.com/products/wireless/bluetooth-low-energy/kw39-38-37-32-bit-bluetooth-5-0-long-range-mcus-with-can-fd-and-lin-bus-options-arm-cortex-m0-plus-core:KW39-38-37   Tools NXP Development Board URL FRDM-KW36 Freedom Development Kit https://www.nxp.com/design/development-boards/freedom-development-boards/mcu-boards/frdm-kw36-freedom-development-kit-for-kinetis-kw36-35-34-mcus:FRDM-KW36 FRDM-KW38 Freedom Development Kit https://www.nxp.com/design/designs/freedom-development-kit-for-kw39-38-37-mcus:FRDM-KW38   SDK SDK Version URL MCUXpresso SDK Builder https://mcuxpresso.nxp.com/en/welcome

The quadcopter drone is a very popular design for an unmanned aerial vehicle (UAV). It consists of a flight controller and four electronic speed controllers (ESCs), one for each motor. The flight controller is equipped with a radio to receive flight commands provided by the pilot and the inertial measurement unit (IMU). The IMU provides information (such as velocity and orientation) that are necessary for autonomous stabilization of the vehicle, using the internal accelerometer, gyroscope, and sometimes the magnetometer and GPS receiver.   Resources Quadcopter Drone Reference Design   Drone Examples - powered by NXP 3DR Drone Spiri Programmable Flying Robot  DJI Phantom 3 Advanced

Demo Ricardo Anguiano describes a memory game demo built by Mentor Graphics for their Embedded Systems Division's 20th Anniversary. The game uses 36 FRDM-K64F boards with Adafruit 2.8" capacitive touchscreens in a 6 x 6 grid. The FRDM-K64F boards run the Nucleus RTOS from Mentor Graphics. The FRDM-K64F boards are connected over Ethernet to a touchscreen-driven Boundary Devices BD-SL-i.MX6 (formerly the SABRE Lite board) game controller which also runs the Nucleus RTOS. Players start the game by viewing and studying the position of all 36 digital cards, the cards are flipped and the player must touch matching pairs for points before time expires. The memory game generated lots of interest with players coming back multiple times. It was a great way to introduce the ARM TechCon crowd to the Nucleus RTOS, which enjoys wide success in a number of vertical markets and product categories like industrial, medical, IoT, wearables and automotive. The safety-certified version, Nucleus SafetyCert has been verified and documented to meet the certification requirements for device manufacturers developing safety related software for avionics requiring DO-178C Level A, industrial requiring IEC 61508 SIL 3, medical requiring IEC 62304 Class C, and automotive requiring ISO 26262 ASIL B. Features • A fun memory game built on Mentor Graphics' Nucleus RTOS, deployed on over 3 billion devices worldwide. • NXP FRDM-K64F and i.MX6 based hardware NXP products ARM Cortex-M4|Kinetis K64 120 MHz 32-bit MCUs i.MX6Q|i.MX 6Quad Processors|Quad Core Tools FRDM-K64F|Freedom Development Platform|Kinetis MCUs https://boundarydevices.com/product/sabre-lite-imx6-sbc/  Mentor Graphics Links https://www.mentor.com/embedded-software/nucleus/ https://www.mentor.com/embedded-software/nucleus/safety https://blogs.mentor.com/embedded/blog/2016/10/31/testing-your-memory-at-arm-techcon/ 

  Overview The USB Type-C allows multi-function signaling over the same connector. Our active cable application supports the connectivity of data, video, security, and power over a single connector. The active cables system for Type-C supports up to 10 Gbps. The MCU provides fundamental signal processing and management duties. It communicates with both the signal conditioner and USB PD PHY to organize signal traffic and power flow. Interactive Block Diagram Recommended Products Category Products MCU Kinetis® K Series: High-Performance Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core | NXP    LPC800 Series: Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®-M0+ Cores | NXP  Authentication A1006 | Secure Authenticator IC: Embedded Security Platform | NXP  Signal Conditioners SuperSpeed USB 3.0 redriver | NXP    PTN36043A: USB Type-C SuperSpeed active switch | NXP  USB PD PHY PTN5100 | NXP    PTN5100D | NXP    PTN5150 | NXP    Featured Videos Link NXP USB Type C | NXP  USB Type C Shield Board | NXP  NXP® End to End Secure USB Type-C Solution | NXP  Documentation Link Features Paving The Way for USB Type-C Connectors  Delivering data, video, security, and power in one small, easy-to-insert connector, the new USB Type-C connector. PTN5110N PD PHY application programming guide  PTN5110N is a 1-port TCPC (Type-C Port controller) compliant USB Power Delivery (PD) PHY IC   Training Link USB Type-C Overview - Part 1| Introduction to USB Type-C | NXP  Authentication for USB Type-C - Part 1 | Introduction to NXP Identification & Security | NXP  NXP USB Type-C Solution - Part 1| Overview of NXP Secure Interfaces & Power Solutions | NXP    Community Links Link Other NXP Products  Secure Authentication  Introduction to USB Type-C and Type-C Solutions from NXP  USB Type-C Overview  MHW-N1910 Authentication for USB Type-C 

KW36-创建保留存储器内容的OTAP镜像 简介 当OTAP客户端（接收软件更新的设备，通常为Bluetooth LEPeripheral）从OTAP服务器（发送软件更新的设备，通常为Bluetooth LE Central）请求软件更新时，用户可能希望保留以前获取的一些数据，例如绑定信息，系统振荡器的调整值或者应用程序的NVM数据。 本文档将介绍在执行OTAP更新时，保留需要的指定数据内容。 本文档适用于熟悉OTAP自定义Bluetooth LE服务的开发人员。相关更多信息，可以阅读以下文章：使用OTAP客户端软件对KW36设备进行重新编程。 OTAP Header和子元素 OTAP协议为软件更新实现了一种数据格式，该格式由Header和指定数量的子元素组成。 OTAP Header描述了关于软件更新的普通信息，其格式定义如下图所示。 有关Header字段的更多信息，请转至SDK中的<SDK_2.2.X_FRDM-KW36_Download_Path> \ docs \ wireless \ Bluetooth中的《 Bluetooth Low Energy Application Developer's Guide》文档的11.4.1 Bluetooth Low Energy OTAP Header一章。   每个子元素都包含用于特定目的的信息。 用户可以为其应用程序实现专有字段（有关子元素字段的更多信息，请转至SDK中的<SDK_2.2.X_FRDM-KW36_Download_Path> \ docs \ wireless \ Bluetooth中的《 Bluetooth Low Energy Application Developer's Guide》文档的11.4.1 Bluetooth Low Energy OTAP Header一章。 OTAP包含以下子元素： 镜像文件子元素 值字段长度 （字节） 描述 升级镜像 n 该子元素包含实际的二进制可执行镜像，该镜像已复制到OTAP客户端设备的闪存中。 该子元素的最大字节长度取决于目标硬件。 扇区位图 32 该子元素包含目标设备闪存的扇区位图，该位图告诉引导加载程序哪些扇区应被覆盖，哪些扇区保持完整。 该字段的格式是首先使用每个字节的最低有效位，且最低有效字节和位代表闪存的最低存储扇区。 镜像文件CRC 2 这是在镜像文件的所有元素（此字段本身除外）上计算的16位CRC。 该元素必须是通过空中发送的镜像文件中的最后一个子元素。 OTAP扇区位图子元素字段 KW36闪存分为： 一个256 KB程序闪存（P-Flash）阵列，每个扇区大小2KB，闪存地址范围为0x0000_0000至0x0003_FFFF。 一个256 KB FlexNVM阵列，每个扇区大小2KB，闪存地址范围为0x1000_0000至0x1003_FFFF，别名存储器的地址范围为0x0004_0000至0x0007_FFFF。   位图子元素的长度为256位，就KW36闪存而言，每个位代表2KB扇区，覆盖从0x0-0x0007_FFFF的地址范围（P-Flash到FlexNVM Alias地址范围），其中1表示该扇区应被擦除，0表示应保留该扇区。 OTAP引导加载程序使用位图字段来获取在使用软件更新对KW36进行编程之前应擦除的地址范围，因此必须在发送软件更新之前对其进行配置，使得包含保留数据的内存地址范围内其内容保持不变，仅擦除将被软件更新覆盖的地址范围的数据。   例如：假设开发人员想要保留0x7D800-0x7FFFF之间的地址范围和0x0-0x1FFF之间的地址范围的数据，并且必须擦除其余数据。 0x7D800-0x7FFFF之间的地址范围对应于高地址5个闪存扇区，0x0-0x1FFF之间的地址范围是低地址4个扇区。   因此，这意味着应将256和252之间的位（256、255、254、253和252）以及4和1之间的位（4、3、2和1）设置为0，则OTAP位图为 ： 0x07FFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFF0 使用NXP测试工具配置OTAP位图以保护指定地址范围的数据 在恩智浦网站上下载并安装用于连接产品的测试工具   在PC上打开NXP Test Tool 12软件。 转到“ OTA更新-> OTAP蓝牙LE”，然后单击“浏览...”按钮加载用于软件更新的映像文件（NXP测试工具仅接受.bin和.srec文件）。 选择“覆盖扇区位图”复选框，配置OTAP位图，并更改默认值为新的位图值。 配置完位图后，选择“保存...”。   然后，弹出一个窗口，用于选择保存.bleota文件的目录。 填写文件名，点击保存。 在Android和iOS上，该文件可以使用IoT Toolbox中的OTAP进行软件升级。 这个新的.bleota文件所包含位图告诉OTAP引导加载程序哪些扇区将被擦除，哪些扇区将被保留。    

Description   An ultrasonic-based measurement or a camera implementation are a key part of applications dealing with non-contact object distance measurement and object detection, like an automotive parking distance sensor, blind spot detection and object detection. For an ultrasonic implementation, the S12ZVC integrates a 16-bit MCU, automotive voltage regulator, CAN physical layer, and high-speed timers with input capture and output compare, making it a single chip solution for low-end parking aid systems. For a camera implementation, the i.MX 8 applications processor along with the S32V234 vision processor offers the power required for image processing and intercommunication between multiple cameras and modules.   Features   Automotive voltage regulator CAN physical layer High speed timers with input capture and output compare Ultrasonic technology or cameras for the detection and avoidance of close objects   Block Diagram       Products   Category Name 1: MCU Product URL 1 S12ZVC Mixed-Signal MCUs|MagniV | NXP  Product Description 1 The S12ZVC platform, part of the S12 MagniV® mixed-signal MCU family, offers a low-cost, highly integrated solution that enables the design of smallest possible automotive CAN-termination nodes, while the family concept gives you scalability for platform design. Product URL 2 i.MX 8 Family Applications Processor | Arm Cortex-A53/A72/M4 | NXP  Product Description 2 Fast multi-OS platform deployment via advanced full-chip hardware virtualization and domain protection. Incorporate vision and speech recognition interactivity via a powerful vision pipeline and audio processing subsystem. Product URL 3 S32V234 Vision Processor | NXP  Product Description 3 The S32V234 MPU offers an Image Signal Processor (ISP), powerful 3D Graphic Processor Unit (GPU), dual APEX-2 vision accelerators, automotive-grade reliability, functional safety, and security capabilities for supporting computation intensive ADAS, NCAP front camera, object detection and recognition, surround view, and automotive image processing.   Category Name 2: Ethernet Product URL 1 SJA 110EL | Five ports AVB Automotive Ethernet Switch | NXP  Product Description 1 The SJA1105EL Ethernet switch offers a flexible solution for implementing modular and cost-optimized ECUs capable of supporting any in-vehicle connectivity requirement. Product URL 2 TJA1101 | 2nd generation PHY Transceiver | NXP  Product Description 2 TJA1101 is a high-performance single port, IEEE 100BASE-T1 compliant Ethernet PHY Transceiver. Product URL 3 TJA1102/TJA1102S | Automotive Ethernet Transceivers | NXP  Product Description TJA1102 (TJA1102S) is a highly integrated dual (respectively single) port, IEEE 100BASE-T1 compliant Ethernet PHY Transceiver.   Category Name 3: Power Management Product URL 1 PMIC for high-performance applications | NXP  Product Description 1 The PF8100/PF8200 PMIC family is designed for high-performance processing applications such as infotainment, telematics, clusters, vehicle networking, ADAS, vision and sensor fusion.   Category Name 4: CAN Product URL 1 TJA1057 | High speed CAN transceiver | NXP  Product Description 1 The TJA1057 is part of the Mantis family of high-speed CAN transceivers. It provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.   Documentation S32R Radar Signal Compression: https://www.nxp.com/docs/en/application-note/AN5375.pdf    Tools Product Link DEVKIT-S12ZVC: Development Board for 9S12ZVCA192 MCU Evaluation DEVKIT-S12ZVC development platform for S12ZVC | NXP  MCIMX8QM-CPU: i.MX 8QuadMax Multisensory Enablement Kit (MEK) i.MX 8QuadMax/QuadPlus Multisensory Enablement Kit | NXP  S32V234EVB: S32V Vision and Sensor Fusion Evaluation System S32V Vision and Sensor Fusion Evaluation System | NXP  OM14500-TJA1102: Evaluation Board, TJA1102HN 100BASE-T1 Automotive Ethernet PHY TJA1102/S Evaluation Board | NXP  SJA1105Q-EVB: Ethernet Switch & PHY Evaluation Board. SJA1105Q-EVB | Ethernet Switch and PHY Evaluation Board | NXP 

Demo Industry 4.0 connectivity or Industrial IoT  combines the existing high Level network based on Ethernet type Protocols and the access  to a single sensor data.  IO Link protocol helps in that convergence by providing an easy migration of current of non-connected sensors to networked one. The demonstration show a typical Industrial Network using ModBus and IO Link sensors Features Modbus TCP Slave based on LS1021A Open source stack & Support for Industrial Strength Security Master IOLink Modem  node based on Kinetis KL17 + transceiver Device Node IOlink based on Kinetis KE02 + transceiver NXP Recommends Product Link QorIQ® Layerscape 1021A Dual-Core Communications Processor with LCD Controller https://www.nxp.com/products/processors-and-microcontrollers/arm-processors/layerscape-communication-process/qoriq-layerscape-1021a-dual-core-communications-processor-with-lcd-controller:LS1021A?&lang_cd=en Freedom® Development Platform for Kinetis® KL17 and KL27 MCUs FRDM-KL27Z|Freedom Development Platform|Kinetis® MCU | NXP  Freedom Development Platform for Kinetis KE02 MCUs https://www.nxp.com/design/development-boards/freedom-development-boards/mcu-boards/freedom-development-platform-for-kinetis-ke02-mcus:FRDM-KE02Z40M?&lang_cd=en QorIQ® LS1021A Tower® System Module QorIQ® LS1021A Tower® System Module | NXP 

Demo Low-cost evaluation board running a PMSM motor Products Links S32K144 Evaluation Board https://www.nxp.com/design/development-boards/automotive-development-platforms/s32k-mcu-platforms/s32k144-evaluation-board:S32K144EVB?&fsrch=1&sr=1&pageNum=1 Low-Cost Motor Control Solution for DEVKIT Platform https://www.nxp.com/design/development-boards/automotive-development-platforms/hardware-tools-accessories/low-cost-motor-control-solution-for-devkit-platform:DEVKIT-MOTORGD?&fsrch=1&sr=1&pageNum=1 FreeMASTER Run-Time Debugging Tool FreeMASTER Run-Time Debugging Tool | NXP  Model-Based Design Toolbox https://www.nxp.com/design/automotive-software-and-tools/model-based-design-toolbox:MC_TOOLBOX?&&&code=MC_TOOLBOX&nodeId=0152109D3F12B8F6F8 Model-Based Design Toolbox for S32K14x Automotive MCU rev2.0  Model-Based Design Toolbox For Panther (MPC574xP) Family of Processors 2.0  Learning Model-Based Design Toolbox Motor Control Example Motor Control Class: Motor Control System Motor Control Class with Model-Based Design

Demo This demo showcases NXP’s MCUs, A70CM and NTAG I2C products, combined in an IoT development platform for industrial and home automation applications. Complementary Zentri software enables Wi-Fi connectivity, cloud-based device management and data analysis Features: The LPC43S67-A70CM Cloud Connectivity Kit, coupled with software from Zentri: Helps designers of embedded IoT products quickly build cloud-connected products without the need for deep expertise in security, Wi-Fi stacks, device commissioning, and cloud service APIs. Provides a complete hardware and software platform for evaluating and prototyping cloud-connected applications with IEEE 802.11b/g/n wireless connectivity based on the LPC43S6x microcontroller family and A70CM secure element. NTAG capability enables easy, secure commissioning and diagnosis by field personnel. _______________________________________________________________________________________________________ Featured NXP Products: LPC43S67-A70CM Cloud Connectivity Kit NT3H1101/NT3H1201 LPCXpresso IDE _______________________________________________________________________________________________________ Links Zentri – Securely Connect Your Products

Overview This reference design describes the design of a 3-phase BLDC (Brushless DC) motor drive, which supports the NXP® 56F801X Digital Signal Controllers (DSCs). The speed-closed loop and torque control BLDC drive using a Hall sensor is implemented The system is targeted for applications in both industrial and appliance fields (e.g. washing machines, compressors, air conditioning units, pumps or simple industrial drives required high reliability and efficiency) Features Voltage control of BLDC motor using Hall sensor Targeted for 56F801X Digital Signal Controllers Running on 3-phase Motor Board Control technique incorporates: Voltage BLDC motor control with speed-closed loop Current feedback loop Manual interface DCBus undervoltage fault protection Block Diagram Board Design Resources

Demo In this demo, we are showing an 802.11AD 60GHz Wireless Demo with 3Gbps throughput using two LS1046ARDB (ARM Cortex A72 Quad Core) gateways and an LS1012ARDB gateway. These gateways simulate communication between stations. Products Product Link QorIQ® Layerscape 1012A Low Power Communication Processor Layerscape LS1012A Communication Processor for the IoT | NXP  QorIQ® LS1012A Development Board https://www.nxp.com/design/qoriq-developer-resources/qoriq-ls1012a-development-board:LS1012A-RDB?&fsrch=1&sr=2&pageNum=1 QorIQ® Layerscape 1046A and 1026A Multicore Communications Processors QorIQ® Layerscape 1046A | NXP  QorIQ® LS1046A Development Board QorIQ® LS1046A Development Board | NXP  Training New Kid on the Block - 60 GHz Wi-Fi 

Demo Owner: Rick Dumont This demonstration shows 2 examples of AC/DC solutions for efficient fast battery charging. Firstly a slim 25W USB PD + QC adapter built with NXP latest chipset solution. The adapter will demonstrate a fully USB PD (Power Delivery) and QC (Quick Charge) compliant solution charging a true PD device (Apple macbook air / Google Pixel notebook or Google SP) or a QC smartphone (e.g. Samsung S6 edge). Secondly a compact 33W Direct Charging adapter built with NXP latest chipset solution. The adapter will demonstrate a fully compliant direct charging solution charging a true HiSilicon FSP device, supporting the FSP charging protocol like a Huawei smartphone Furthermore will be demonstrated the system configuration and debug features of the secondary controller by using NXP Graphical User Interface (GUI) and control board. Features: Best-in-Class overall efficiency – meets all DOE & EU-CoC regulations Smallest form factor / highest power density due to high efficiency High integration level & very low BOM cost - minimum number of external components Very flexible system due to on-chip DSP and memory – Fully meets USB-PD, QC, FSP/SCP protocols Main functionality (V & I & protections) configurable by programmability of key system parameters All protections integrated in hardware – OVP, OCP, OPP, OTP, various short circuit conditions Low cost and suitable packages for both reflow and wave soldering Optional tamper resistant authentication chip allowing own eco-system specific accessories _________________________________________________________________________________________________________________________________________ Featured NXP Products: 25W USB PD & QC reference application, including a:      - TEA1936 primary controller (DCM/QR)      - TEA1993 synchronous rectification controller      - TEA1905 secondary USB PD and QC controller 33W Direct Charge reference application, including a:      - TEA1936 primary controller (DCM/QR)      - TEA1998 synchronous rectification controller      - TEA1901 secondary Direct Charge controller NXP GUI w/ control board _________________________________________________________________________________________________________________________________________ C08

See the capabilities of our latest dual core, ARM-based instrument cluster solution, showing a high-end cluster with premium quality graphics on a WVGA TFT display.     Features Dual core, ARM-based instrument cluster solution, showing a high-end cluster with premium quality graphics on a WVGA TFT display. 32 bit MCU controlling Instrument clusters with GPU, 2D graphics processing unit (with raster and vector operations) Links MAC57D5xx: Automotive DIS MCUs for Instrument Clusters Block Diagram  

Overview The Occupancy Sensor Node reference design is a compact form factor, open source design. It enables low power nodes based on IEEE 802.15.4 protocols such as Thread and ZigBee to communicate data to a wireless sensor network. NXP supplements the Kinetis KW2xD with tools and software that include hardware evaluation and development boards, software development IDE and demo applications and drivers. Features MKW24D512 802.15.4 Kinetis MCU Full IEEE 802.15.4 compliant wireless node for Thread network Integrated PCB meander horizontal antenna 2 Interrupt push button switches (LLWU) 1 FXOS87000CQ Combo sensor 1 Coin cell battery holder 1 EEPROM 1 Battery charger Block Diagram Board Design Resources