An ultrasonic-based measurement or a camera implementation are a key part of applications dealing with non-contact object distance measurement and object detection, like an automotive parking distance sensor, blind spot detection and object detection.
For an ultrasonic implementation, the S12ZVC integrates a 16-bit MCU, automotive voltage regulator, CAN physical layer, and high-speed timers with input capture and output compare, making it a single chip solution for low-end parking aid systems.
For a camera implementation, the i.MX 8 applications processor along with the S32V234 vision processor offers the power required for image processing and intercommunication between multiple cameras and modules.
Automotive voltage regulator
CAN physical layer
High speed timers with input capture and output compare
Ultrasonic technology or cameras for the detection and avoidance of close objects
The S12ZVC platform, part of the S12 MagniV® mixed-signal MCU family, offers a low-cost, highly integrated solution that enables the design of smallest possible automotive CAN-termination nodes, while the family concept gives you scalability for platform design.
Fast multi-OS platform deployment via advanced full-chip hardware virtualization and domain protection. Incorporate vision and speech recognition interactivity via a powerful vision pipeline and audio processing subsystem.
The S32V234 MPU offers an Image Signal Processor (ISP), powerful 3D Graphic Processor Unit (GPU), dual APEX-2 vision accelerators, automotive-grade reliability, functional safety, and security capabilities for supporting computation intensive ADAS, NCAP front camera, object detection and recognition, surround view, and automotive image processing.