NOTE: Always de-power the target board and the aggregator when plugging or unplugging smart sensors from the aggregator. The aggregator portion of the i.MX Power Profiling System sits between the "smart" current sensor boards and the host computer. It provides power and signal connections to each connected sensor board. The communication is done over I2C, where three I2C bus extenders (PCA9518) effectively provide a dedicated bus to each I2C device, to better allow for cabling.  More information will follow... A photo, layout images and schematic attached below.   MBED source for the FRDM-KL25Z is available here: 30848-KL25Z-AGGREGATOR    Smart Sensor Connections At each smart sensor header JP0-JP13, these are the connections provided: 5V: powers the 3.3V regulator on each sensor board 12V: all the gates of all the switching FETs are pulled pulled up to 12V GND: ground connection SCL/TX0: I2C clock line  SDA/RX0: I2C data line  SWD_CLK:  global line for triggering smart sensors to make measurements RESET_B:  global line for resetting all smart sensor boards SWD_IO_n: individual select line for each smart sensor I2C Bus Connection Three I2C bus extenders (PCA9518) provide buffered connections between the FRDM board and all the connected smart sensors. The bus extenders were added to allow for longer cables between the aggregator and the smart sensor boards. Each bus extender has five ports and along with connections that allow extending the bus to more bus extenders. Gate Supply The aggregator contains a boost regulator that boost the 5V input from the FRDM board to 12V. The boosted voltage is fed to each of the smart sensor headers. It's used by the smart sensor board to pull up the gates of the switching FETs above any of the rails under test by at least 4.5V in order to benefit from a lower Rds(on). Caution must be exercised with some older FRDM boards since the 5V from the USB connection passes through diodes with a maximum current of 200mA.  The boost regulator and the load presented by the smart sensor boards may exceed the diode's limit and damage it. (Yes, it's happened... two older FRDM-KL25Z boards were used during development. One of them failed with the diode shorted (~0.05 Ohms), so everything kept working. The other failed with a  short of ~45 Ohms, so it kind of worked but not really...) Application Code for Aggregator  To date, application code has only been developed for the FRDM-KL25Z board. The latest application code resides at: https://os.mbed.com/users/r14793/code/30848-KL25Z-AGGREGATOR/, with the latest binary attached below. SWD Programming of Smart Sensors  Connectors J5 and JP15 are provided as an adapter for programming the smart sensor boards via SWD. JP15 provides power to the smart sensor board, since they have no direct 3.3V input for the KL05Z. An SWD programmer (or suitably modified FRDM-KL05Z board) connects to J5. Both connections use 10-pin 0.05"-spaced ribbon cables. Additionally, when a smart sensor is connected to JP15, J6 provides access to the UART pins of the smart sensor (the I2C pins on the smart sensor also mux out the UART of the KL05Z). No hardware changes are necessary at all; changing the code running on the smart sensor is all that's required. In fact, during the initial prototyping of the smart sensors, the serial UART connection was used instead of I2C. Modify Aggregator To Use SWD Dongle To Program Smart Sensor:  Add a wire as shown on the bottom side of the aggregator board as shown below. This ties 3.3V on the aggregator to the debug header, enabling the voltage level translators on the dongle to communicate with the KL05Z on the smart sensor board.  

Sometime need standalone compile device tree. Only Linux headers and device tree directory are needed.         

Hello there. Here is a good way to use U-boot in an efficient way with custom scripts. The bootscript is an script that is automatically executed when the boot loader starts, and before the OS auto boot process. The bootscript allows the user to execute a set of predefined U-Boot commands automatically before proceeding with normal OS boot. This is especially useful for production environments and targets which don’t have an available serial port for showing the U-Boot monitor. This information can be find in U-Boot Reference Manual.   I will take the example load a binary file in CORTEX M4 of IMX8MM-EVK. In my case, I have the binary file in MMC 2:1 called gpio.bin and I will skip those steps because that is not the goal.   First, you need the u-boot-tools installed in your Linux machine: sudo apt install u-boot-tools   That package provide to us the tool mkimage to convert a text file (.src, .txt) file to a bootscript file for U-Boot.   Now, create your custom script, in this case a simple script for load binary file in Cortex M4: nano mycustomscript.scr  and write your U-Boot commands: fatload mmc 2:1 0x80000000 gpio.bin cp.b 0x80000000 0x7e0000 0x10000 bootaux 0x7e0000   Now we can convert the text file to bootscript with mkimage. Syntax: mkimage -T script -n "Bootscript" -C none -d <input_file> <output_file> mkimage -T script -n "Bootscript" -C none -d mycustomscript.scr LCM4-bootscript   This will create a file called LCM4-bootscript (Or as your called it).   A way to load this bootscript file to U-Boot is using the UUU tool, in U-Boot set the device in fastboot with command: u-boot=> fastboot 0 Then in linux with the board connected through USB to PC run the command: sudo uuu -b fat_write LCM4-bootscript mmc 2:1 LCM4-bootscript   Now we have our bootscript in U-Boot in MMC 2:1.   Finally, we can run the bootscript in U-Boot: u-boot=> load mmc 2:1 ${loadaddr} LCM4-bootscript 158 bytes read in 2 ms (77.1 KiB/s) u-boot=> source ${loadaddr} ## Executing script at 40400000 6656 bytes read in 5 ms (1.3 MiB/s) ## No elf image at address 0x007e0000 ## Starting auxiliary core stack = 0x20020000, pc = 0x1FFE02CD...   And the Cortex M4 booted successfully:    I hope this can helps to you.   Best regards.   Salas.  

In some cases, such as mass production or preparing a demo. We need u-boot environment stored in demo sdcard mirror image.  Here is a way: HW:  i.MX8MP evk SW:  LF_v5.15.52-2.1.0_images_IMX8MPEVK.zip The idea is to use fw_setenv to set the sdcard mirror as the operation on a real emmc/sdcard. Add test=ABCD in u-boot-initial-env for test purpose. And use fw_printenv to check and use hexdump to double confirm it. The uboot env is already written into sdcard mirror(imx-image-multimedia-imx8mpevk.wic). All those operations are on the host x86/x64 PC. ./fw_setenv -c fw_env.config -f u-boot-initial-env Environment WRONG, copy 0 Cannot read environment, using default ./fw_printenv -c fw_env.config Environment OK, copy 0 jh_root_dtb=imx8mp-evk-root.dtb loadbootscript=fatload mmc ${mmcdev}:${mmcpart} ${loadaddr} ${bsp_script}; mmc_boot=if mmc dev ${devnum}; then devtype=mmc; run scan_dev_for_boot_part; fi arch=arm baudrate=115200 ...... ...... ...... splashimage=0x50000000 test=ABCD usb_boot=usb start; if usb dev ${devnum}; then devtype=usb; run scan_dev_for_boot_part; fi vendor=freescale hexdump -s 0x400000 -n 2000 -C imx-image-multimedia-imx8mpevk.wic 00400000 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |................| hexdump -s 0x400000 -n 10000 -C imx-image-multimedia-imx8mpevk.wic 00400000 5f a4 9b 97 20 6a 68 5f 72 6f 6f 74 5f 64 74 62 |_... jh_root_dtb| 00400010 3d 69 6d 78 38 6d 70 2d 65 76 6b 2d 72 6f 6f 74 |=imx8mp-evk-root| 00400020 2e 64 74 62 00 20 6c 6f 61 64 62 6f 6f 74 73 63 |.dtb. loadbootsc| 00400030 72 69 70 74 3d 66 61 74 6c 6f 61 64 20 6d 6d 63 |ript=fatload mmc| 00400040 20 24 7b 6d 6d 63 64 65 76 7d 3a 24 7b 6d 6d 63 | ${mmcdev}:${mmc| 00400050 70 61 72 74 7d 20 24 7b 6c 6f 61 64 61 64 64 72 |part} ${loadaddr| 00400060 7d 20 24 7b 62 73 70 5f 73 63 72 69 70 74 7d 3b |} ${bsp_script};| 00400070 00 20 6d 6d 63 5f 62 6f 6f 74 3d 69 66 20 6d 6d |. mmc_boot=if mm| ...... ...... ...... 00401390 76 3d 31 00 73 6f 63 3d 69 6d 78 38 6d 00 73 70 |v=1.soc=imx8m.sp| 004013a0 6c 61 73 68 69 6d 61 67 65 3d 30 78 35 30 30 30 |lashimage=0x5000| 004013b0 30 30 30 30 00 74 65 73 74 3d 41 42 43 44 00 75 |0000.test=ABCD.u| 004013c0 73 62 5f 62 6f 6f 74 3d 75 73 62 20 73 74 61 72 |sb_boot=usb star| 004013d0 74 3b 20 69 66 20 75 73 62 20 64 65 76 20 24 7b |t; if usb dev ${| 004013e0 64 65 76 6e 75 6d 7d 3b 20 74 68 65 6e 20 64 65 |devnum}; then de| flash the sdcard mirror into i.MX8MP evk board emmc to check uuu -b emmc_all imx-boot-imx8mp-lpddr4-evk-sd.bin-flash_evk imx-image-multimedia-imx8mpevk.wic  The first time boot, the enviroment is already there.  How to achieve that: a. fw_setenv/fw_printenv: https://github.com/sbabic/libubootenv.git Note: Please do not use uboot fw_setenv/fw_printenv Compile it on the host x86/x64 PC. It is used on host. b. u-boot-initial-env Under uboot, make u-boot-initial-env Note: Yocto deploys u-boot-initial-env by default c. fw_env.config  imx-image-multimedia-imx8mpevk.wic 0x400000 0x4000 0x400000 0x4000 are from uboot-imx\configs\imx8mp_evk_defconfig CONFIG_ENV_SIZE=0x4000 CONFIG_ENV_OFFSET=0x400000 Now, you can run  ./fw_setenv -c fw_env.config -f u-boot-initial-env

  Question: How can we generate an ARM DS5 DStream format DDR initialization script using the DRAM Register Programming Aid?  Answer: Some RPAs include a  "DStream .ds file" tab for the ARM DS5 debugger specific commands. The i.MX6UL/ULL/ULZ DRAM Register Programming Aids for example already has this supported. However, the user can easily create  the .ds format from the existing .inc format. The basic steps to convert .inc files to .ds format are as follows: 1)  Replace the one instance of setmem /16 with mem set 2)  In that same line, replace 0x020bc000 = with 0x020bc000 16 3)  Use a Replace All command to change setmem /32 with mem set 4)  Use a Replace All command to change = with 32 5)  Use a Replace All command to change // with # 6)  Save as a .ds file.   Question: When using a 528MHz DRAM Controller interface with a DDR memory of a faster speed bin, which speed bin timing options should one use? Answer: For example, let’s assume our MX6DQ design is using a DDR3 memory from a DDR3-1600 speed bin.  However, the maximum speed of the MMDC interface for the MX6DQ using DDR3 is 528MHz.  Should we use the 1600 speed bin (800MHz clock speed) or the 1066 speed bin (533MHz clock speed)?  In short, the user should use the timings rated for the maximum speed (frequency) with which you are running, in this case DDR3-1066 (533MHz).  In some cases, like when using the MX6DL, the maximum DDR frequency is 400MHz.  In this case, you would want to try and use 800 timings found in the AC timing parameters table.  However, most DDR3 devices have speed bin tables that may go only as low as 1066, in which case you would use the closest speed bin to your operational frequency (i.e. the 1066 speed bin table).     Question: Some timing parameters may specify a min and max number, which should I use? Answer: In most cases, you will want to choose the minimum timings.  Some DRAM controllers may have a tRAS_MAX timing parameter, in which case you would obviously use the maximum tRAS parameter given in the DRAM data sheet. Also, for timing parameters tAONPD and tAOFPD, we also want to use the maximum values given in the DDR3 data sheet. These represent the maximum amount of time the DDR3 device takes to turn on or off the RTT (termination), therefore, we should wait at least this amount of time before issuing any commands or accesses.   Question: Some timing parameters state things like “Greater of 3CK or 7.5ns”; which should I use? Answer: This depends on your clock speed.  Say you are running at 533MHz.  At 533MHz, 7.5ns equates to 4CKs.  In this case, 7.5ns at 533MHz is GREATER than 3CK, so we would use the 7.5ns number, or 4CKs. At 400MHz, 7.5ns equates to 3CKs.  In this case, we’d simply use 3CKs.   Question: I have a design that will throttle the DDR frequency (dynamic frequency scaling).  At full speed, I plan to run at 533MHz, and then I plan to throttle down to say 400MHz whenever possible.  Do I need to re-calculate my 400 MHz timing parameters that were initially set for 533MHz? Answer: It is not necessary to re-calculate timing parameters for 400MHz, and you can re-use the ones for 533MHz.  The timings at 533 MHz are much tighter than 400 MHz, and the key here is to NOT violate timings.  Also, it may be a bit of a hassle maintaining two sets of timing parameters, especially if later in the design, you swap DDR vendors that might require you to re-calculate some timing parameters.  It’s easier to do it once and to come up with a combined worse-case timing parameters for 533MHz, which you know will work at 400MHz.  But, if you don’t mind maintaining two sets of timing parameters, and really want to optimize timings down to the last pico-second for 400MHz, then knock yourself out.   Question: Can I use these Register programming aids for both Fly by and T- Topology ? Answer Yes The DDR register programming aid is agnostic to the DDR layout. The same spreadsheet works for both topologies. We recommend running write leveling calibration for both topologies and the values returned by the Write Leveling routine from the Freescale DDR stress test should be incorporated back to the customer specific initialization script. The DDR stress test also has a feature whereby it evaluates the write leveling values returned from calibration and increments WALAT to 1 if the values exceed a defined limit. The DDR stress test informs the user when the Write Additional latency (WALAT) exceeds the limit and should be increased by 1, and reminds the user to add it back in the customer specific initialization script if required.   WALAT - 0 00000000 WALAT: Write Additional latency. Recommend to clear these bits. Proper board design should ensure that the DDR3 devices are placed close enough to the MMDC to ensure the skew between CLK and DQS is less than 1 cycle.     Question: Can I use the DEFAULT Register programming aid values for MDOR when using an Internal OSC instead of the recommended 32.768 KHZ XTAL ? Answer No, NXP recommends reprogramming these values based on the worse case frequency (Max clock) of the internal OSC of the device to guarantee JEDEC timings are met. Please refer to Internal Oscillator Accuracy considerations for the i.MX 6 Series for more details  

Important: If you have any questions or would like to report any issues with the DDR tools or supporting documents please create a support ticket in the i.MX community. Please note that any private messages or direct emails are not monitored and will not receive a response. i.MX 6/7 Series Family DDR Tools Overview This page contains the latest releases for the i.MX 6/7 series DDR Tools. The tools described on this page cover the following i.MX 6/7 series SoCs: i.MX 6DQP (Dual/Quad Plus) i.MX 6DQ (Dual/Quad) i.MX 6DL/S (Dual Lite/Solo) i.MX 6SoloX i.MX 6SL i.MX 6SLL i.MX 6UL i.MX 6ULL/ULZ i.MX 7D/S i.MX 7ULP The purpose of the i.MX 6/7 series DDR Tools is to enable users to generate and test a custom DRAM initialization based on their device configuration (density, number of chip selects, etc.) and board layout (data bus bit swizzling, etc.). This process equips the user to then proceed with the bring-up of a boot loader and an OS. Once the OS is brought up, it is recommended to run an OS-based memory test (like Linux memtester) to further verify and test the DDR memory interface. The i.MX 6/7 series DDR Tools consist of: DDR Register Programming Aid (RPA) DDR Stress test _________________________________________________________ i.MX 6/7 Series DDR Stress Test The i.MX 6/7 Series DDR stress test tool is a Windows-based software tool that is used as a mechanism to verify that the DDR initialization is operational prior for use in u-boot and OS bring-up. The DDR Stress Test tool can be found here: i.MX 6/7 DDR Stress Test Tool Note that the DDR Stress test tool supports all of the above i.MX SoCs, however, some of the supported i.MX SoCs named in the tool support multiple i.MX SoCs as follows: MX6DQ – when selected, this supports both i.MX 6DQ and i.MX 6DQP (Plus) MX6DL – when selected, this supports both i.MX 6DL and i.MX 6S (i.MX 6DLS family) MX6ULL – when selected, this supports both i.MX 6ULL and i.MX6 ULZ MX7D – when selected, this supports both i.MX 7D and i.MX 7S _____________________________________________________________________________ i.MX 6/7 Series DDR Register Programming Aid (RPA) The i.MX 6/7 series DDR RPA (or simply RPA) is an Excel spreadsheet tool used to develop DDR initialization for a user’s specific DDR configuration (DDR device type, density, etc.). The RPA generates the DDR initialization script for use with the DDR Stress Test tool. For a history of the previous versions of an RPA, refer to the Revision History tab of the respective RPA. To obtain the latest RPAs, please refer to the following links: i.MX 6DQP i.MX6DQP Register Programming Aids i.MX 6DQ i.MX6DQ Register Programming Aids i.MX 6DL/S i.MX6DL Register Programming Aids i.MX 6SoloX i.MX6SX Register Programming Aids i.MX 6SL i.MX6SL Register Programming Aids  i.MX6SLL i.MX6SLL Register Programming Aids i.MX 6UL/ULL/ULZ i.MX6UL/ULL/ULZ DRAM Register Programming Aids i.MX7D i.MX7D DRAM Register Programming Aids i.MX 7ULP i.MX7ULP DRAM Register Programming Aids _____________________________________________________________________________ DRAM Register Programming Aids FAQ    

      The i.MX6UL/LL/LZ processor supports 2 USB OTG interfaces, USB OTG1 and USB OTG2, and each USB interface can be configured as a device, host or dual role mode. On the EVK board of i.MX6UL/LL, USB OTG1 is designed as dual role mode, and USB OTG2 is designed as HOST mode. This is sufficient for most customers.       However, in actual applications, we may need 2 USB HOSTs, and at the same time, we don’t want to use MicroUSB to USB TYPE-AF cable for Host-Device mode conversion. Therefore, the design of the USB circuit needs to meet such requirements: 1. USB device mode We need a USB device to download the linux image to the flash or SD card on the board. 2. 2 USB HOSTs When the system is working normally, we need the board to support 2 USB HOST. i.MX6UL/LL/LZ has only 2 USB ports. How to design to meet this requirement without increasing the USB HUB? The following scheme is used as a reference, and I hope it will be helpful to customers with similar requirement:        The logic and application description of this Diagram:: Default—device mode In the process of debugging the software, we need to use the USB OTG interface to download the linux image, so it must work in device mode. What we need to do is: (1). Pull USB OTG ID up to 3.3V (2). The USB OTG D+/D- signal is switched to the MicroUSB connector. (3). The USB OTG VBUS is provided with 5V power from the external PC USB HOST. Usage:        -Use a jumper for Pin 1 and Pin2, USB OTG ID pin will be pulled up to High.        With the operation, SEL pin of USB Muxer is High, and USB signals are switched to port B, and USB differential signals are connected to MicroUSB connector. At the same time, MIC2026-1YM output is disabled. The USB OTG1 VBUS pin of CPU is supplied by VBUS of MicroUSB connector, that is to say, supplied by PC USB HOST.        In this mode, software engineer can use it to download images to flash on board. Normal Work—Host mode After the software debugging is completed, two HOSTs are needed on the board. At this time, we need to switch the USB OTG1 from device to HOST mode. What we need to do is: (1). Pull USB OTG1 ID down to LOW (2). The USB OTG D+/D- signal is switched to the USB Type-AF connector. (3). Board should supply 5V power for USB device connected USB Type-AF connector. Usage:        -Use a jumper for Pin 2 and Pin3, USB OTG ID pin will be pulled down to Low.        With the operation, USB OTG1 ID pin is pulled down to Low, SEL pin of USB Muxer is also LOW, USB signals are switched to Port A, and connected to USB type-AF connector. At the same time, MIC2026-1YM is enabled , OUTA will output 5V , which will supply USB device connected on USB type-AF connector.   [Note] Users need to pay attention to. When using the jumper with PIN1/2/3, the board needs to be powered off. In other words, when switching between device and host, you need to switch off the power, then power on, and restart the board. The solution can also be used for i.MX processors with USB 2.0 interface.   NXP CAS team Wedong Sun 01/15/2021

[中文翻译版] 见附件   原文链接： https://community.nxp.com/docs/DOC-343372 

[中文翻译版] 见附件   原文链接： https://community.nxp.com/docs/DOC-343046 

[中文翻译版] 见附件   原文链接： https://community.nxp.com/docs/DOC-343344 

This document shows the steps for the creation of Archlinux and kernel 4.18.5 on the UDOO board. Required material: UDOO board, Ubuntu 16.04 and SD card. Firts we need u-boot (universal bootloader), for that reason we need update the host. $ sudo apt-get update Then we need the file *.img and SPL for the file system $ wget http://os.archlinuxarm.org/os/imx6/boot/udoo/SPL $ wget http://os.archlinuxarm.org/os/imx6/boot/udoo/u-boot.img Kernel 4.18.5 and file system: $ sudo mkdir archlinux $ wget http://os.archlinuxarm.org/os/ArchLinuxARM-armv7-latest.tar.gz $ sudo tar -xzvf  ArchLinuxARM-armv7-latest.tar.gz $ sudo rm -rf *.tar.gz You must have the following files Now  We are going to burn the memory, we need a 16Gb of space: We need to make sure it is empty Then partitions: $ sudo fdisk /dev/sdc O, P, N, P, 1 space, 8192 default, W At the end the sdc is partition, then create the filesystem partition $ sudo mkfs.ext4 /dev/sdc1 The working directory $ sudo mkdir mnt mount the partition 1 $ sudo mount /devsdc1 mtn/ Now we where the kernel and filesystem are and copy all the file in mnt: $ sudo cp -vr * ~/mnt/ Once it finish we execute $ sync then unmount the partition of sdc1: $ sudo umount mnt/ Now is moment to load the SPL and u-boot: and $ sync we retire the sd and turn on the board. Now you are on ArchLinux. user: alarm                  root: Root Pass: alarm                 pass: root Now the firts thing we must do it is upgrade the keys: $ pacman -key --init $ pacman -key --populate archlinuxarm $ pacman -Syyuu We can add another user: $ useradd - m -g user  -s /bin/bash user_name $ passwd user_name $ paman -S sudo $ visudo Root ALL= (ALL) ALL user_name ALL=(ALL) ALL $ exit For the graphic we are going to install the xorg: $ sudo pacman -S xorg-server $ sudo pacman -S xorg-apps Now we can execute startx and observe the windows of xorg $ startx To have a windows gestor: $ sudo pacman -S sddm $ sudo pacman -S plasma kde-applications $ sudo systemctl enable sddm Reboot and you are ArchLinux graphics windows

The document descript how to use the win32diskimager to create bootable sdcard.  How to resize sdcard mirror rootfs partition. Ex: fsl-image-validation-imx-imx6qpdlsolox.sdcard

[中文翻译版] 见附件   原文链接： https://community.nxp.com/docs/DOC-341566 

[中文翻译版] 见附件   原文链接： i.MX Create Android SDCard Mirror 

i.MX6 Quad/6Dual/6SoloLite Errata ERR006282: ROM code uses non-reset PFDs to generate clocks which may lead to random boot failures This PDF contains information about an issue affecting i.MX 6Quad/6Dual/6SoloLite Phase Fractional Dividers (PFDs) and boot. This erratum will be included in the next update of the i.MX6x Silicon Errata documentation but is being provided here for reference until then.

Starting from $52, the VAR-SOM-MX6 sets the bar for unparalleled design flexibility. The VAR-SOM-MX6 ensures scalable and simplified development, while also extending the product lifecycle. Thanks to four CPU core assembly options, customers can apply a single System on Module in a broad range of applications to achieve short time-to-market for their current innovations, while still accommodating potential R&D directions and marketing opportunities.     VAR-SOM-MX6 CPU: Freescale iMX6 Key features include: Freescale i.MX6 1.2GHz Quad / Dual / Single core Cortex-A9       2GB DDR3, 1GB SLC NAND Flash       Full HD 1080p video encoding/decoding capability       Vivante GPU providing 2D/3D acceleration       Simultaneous multiple display support       Gigabit Ethernet       TI WiLink™ 6.0 single-chip connectivity solution (Wi-Fi, Bluetooth®)       PCI-Express 2.0, S-ATA 3.0       Camera interface       USB 2.0: Host, OTG       Audio In/Out       Dual CAN Bus This versatile solution's -40 to 85°C temperature range and Dual CAN support is ideal for industrial applications, while 1080p video and graphics accelerations make it equally suitable for intensive multimedia applications. The impressive scalability of the VAR-SOM-MX6 satisfies the needs of the most demanding future application requirements whether faster processing power, enhanced algorithms or improved graphics and video performance to name just a few. The VAR-SOM-MX6 is an all-round solution with broad connectivity and sophisticated video and acceleration graphic capabilities, delivering a range of middle to high end assembly options all from the same product. For more details, please see VAR-SOM-MX6 CPU: Freescale iMX6

When you do long test (days or weeks) test on i.MX board and your test fails, you often wants to know what has happen with a JTAG probe. The problem is when you have 50 boards running in parallel, you don't have the budget to have 50 JTAG debug probe. If you do a "hot plug" of your JTAG probe, you have roughly one chance out 2 to reset your board... so you'll have to wait another couple of hour to resee the problem. Anyway to have a reliable JTAG plug with no reset, it is really simple... cut the RESET line on your cable! then you'll still be able to "attach" to your i.MX. On the MEK board, with a 10-pin JTAG connector, you have the cut the cable line 10 of the ribbon cable: On the cable, cut the reset line like this: With my Lauterbach JTAG  probe, when I do a "hot plug" I never have a reset of my i.MX. BR Vincent

Important: If you have any questions or would like to report any issues with the DDR tools or supporting documents please create a support ticket in the i.MX community. Please note that any private messages or direct emails are not monitored and will not receive a response.   This is a detailed programming aid for the registers associated with MMDC initialization. The last sheet formats the register settings for use with ARM RealView ICE. It can also be used with the windows executable for the DDR Stress Test. This programming aid was used for internal NXP validation boards.