Description   A shared power bank is the sharing economy business model (which has been booming in in recent years). A shared power bank is an publicly accessible charging station, which provides power bank to customers.   A common scenario would be a customer running low on battery on their mobile phone. Using a smartphone app they would locate a nearby charging station, for instance in a cafe. Each station has either six or twelve rechargeable batteries, which can be taken out of the box and connected to an iOS or Android device.   Features   Smartphone app to indicate where a nearby charging station is located Each station has either six or twelve rechargeable batteries   Block Diagram     Products     Category Name 1: MCU Product URL 1 Arm Cortex-M4|Kinetis K22 100 MHz 32-bit USB MCUs | NXP  Product Description 1 The Kinetis® K22 offers analog, communication, timing and control peripherals to meet diverse requirements   Category Name 2: Bluetooth Product URL 1 QN908x: Ultra-Low-Power Bluetooth Low Energy System on Chip (SoC) Solution | NXP  Product Description 1 QN908x integrates a Bluetooth Low-Energy radio, controller, protocol stack and profile software on a single chip, providing a flexible and easy to use Bluetooth Low Energy SoC solution.   Category Name 3: Peripherals Product URL 1 PCA9535A | NXP  Product Description 1 The PCA9535A is a low-voltage 16-bit General Purpose Input/Output (GPIO) expander with interrupt and reset for I²C-bus/SMBus applications.     Tools   Product Link FRDM-K22F: NXP Freedom Development Platform for Kinetis® K22 MCUs FRDM-K22F|NXP Development Platform|Kinetis® MCU | NXP  QN9080DK: A highly extensible platform for application development of QN908x QN9080DK: A highly extensible platform for application development of QN908x | NXP 

Demo   Virtualized Network Platforms demonstrates the capability of QorIQ® Layerscape processors in virtualized Customer Premises and Provider edge solutions using Open System Architecture and Open Standards like OF, ODP and OPNFV. NXP’s Layerscape processors represent the ideal union of processing power and hardware acceleration engines for SDN and NFV applications. Layerscape processors are SDN and NFV ready with Dynamic Service Chaining support which enables a customizable network, meaning operators can add new services more quickly than legacy equipment would allow. Dynamic VNFs provide end-to-end network virtualization and offload processing from edge to cloud. The Layerscape platform software includes 3rd party commercial applications like Trend Micro™ and optimized open source applications which take advantage of NXP’s integrated hardware acceleration engines, Data Path Acceleration Architecture (DPAA) and AIOP to accelerate the data plane. The platform is user programmable and supports standard APIs such as ODP for easy application portability.   Features Demonstration of an SDN and NFV-based Virtualized Network Platform that enables bi-directional, dynamic and on-demand service delivery – by connecting access appliances (wired and wireless) to edge appliances and showcases traffic flow from different virtual network functions.   The access equipment can virtualize network processing such as firewall, anti-virus, and deep packet inspection (DPI) to the bigger network equipment (edge appliances) and enable service providers to push services (network appliances) to the access equipment. This solution demonstrates an "intelligent edge" such as a vCPE, empowered by the dynamic re-distribution of network processing by the virtualized access platform. Service-chaining, Trend-Micro (DPI) and Quality of Service (QoS) are also demonstrated.   Demonstrates Docker® virtualization support on LS2085ARDB by running Docker-based virtual network function using SEC Hardware acceleration for showcasing Openssl benchmarking from vNF.   This Virtualized Customer Premise Equipment (vCPE) solution is implemented with Open-Contrail, OpenNFV, OpenStack, OpenDaylight, OpenFlow, OpenVswitch and runs on NXP's QorIQ Layerscape LS Series 64-bit ARM platform. Specific solutions include the QorIQ LS1043 Wireless Gateway and the LS2085 Virtualized Edge Appliance.

Demo Owner: Carlos Neri Want to learn how to create USB based speakers? In this video, you'll learn how you can build speakers to play any sound from any USB system using only TOWER K40X256, TWR-Audio and TWR- serial modules. Watch how you can increase and decrease volume as well as change the frequency on the fly without any audio distortion.     Features Entirely built on the K40X256 Tower system Features HID for volume control to the host USB Stack Featured NXP Products TWR-K40X256: Kinetis K40 Tower System Module TWR-SER: Serial (USB, Ethernet, CAN, RS232/485) Tower System Module TWR-SER2: Enhanced Serial (Dual Ethernet, High-Speed USB) Tower System Module TWR-AUDIO-SGTL: SGTL5000 Codec Tower System Audio Module TWR-ELEV: Tower System Elevator Module Links Tower System Modular Development Platform  

This demo shows a use case of the NXP QN9021 in the Zepp Bluetooth Smart sports sensor to send sensor data to smartphone app for data analysis and provide feedback to users     Features: Zepp Bluetooth Smart sports sensors are designed to monitor performance with a smartphone app for baseball, golf and tennis. Zepp allows you to get to know your swing or stroke inside and out through instant 3D and video analysis. Users can learn from the pros; capture your personal mechanics and compare your swing side-by-side to many of the world’s greatest athletes _________________________________________________________________________________________________________________________   Featured NXP Products: Ultra low power Bluetooth LE system-on-chip s|NXP _________________________________________________________________________________________________________________________   Other Helpful links: ZEPP _________________________________________________________________________________________________________________________

Video Link : 6084 Description: Teensy 3.1 and Teensy-LC are a complete USB-based development tools featuring respectively the Kinetis 32-bit Cortex-M4 K20 and Cortex-M0+ KL26 devices running @ 72 and 48 MHz. Teensy 3.1 is equipped with 256KB flash and 64KB RAM. Teensy-LC board is equipped with 62KB flash and 8KB RAM. Value Propositions * Very small footprint development tools * Very Low Cost dev tool * They are able to implement many different projects * Open source SDKs Teensy board with very high extended-Arduino compatible performance levels and libraries taking advantage of Kinetis features like low power modes and internal DMA. Libraries for LED (WS2811) and 16bit 44.1kHz audio quality is where Makers go when they need quality, performance and small size. FEATURES Hardware Specifications Specification Teensy LC Teensy 3.0 Teensy 3.1 & 3.2 Units Processor MKL26Z64VFT4 32 bit ARM Cortex-M0+ 48 MHz MK20DX128 32 bit ARM Cortex-M4 48 MHz MK20DX256 32 bit ARM Cortex-M4 72 MHz Flash Memory 62 128 256 kbytes RAM Memory 8 16 64 kbytes EEPROM 1/8 (emu) 2 2 kbytes I/O 46, 5 Volt 34, 3.3 Volt 34, 3.3V, 5V tol Analog In 8 14 21 PWM 9 10 12 UART,I2C,SPI 1,1,1 3,1,1 3,2,1 Price $24.00 $19.00 $19.80 USD Software Enablement Teensy 3.2 & 3.1: New Features https://www.pjrc.com/store/teensylc.html RECOMMENDED PRODUCTS Product Description Kinetis K Microcontroller Kinetis L Microcontroller RESOURCES Title Type PJRC (Teensy Official Website) Web Page

Demo Owner: Rick Dumont This demonstration shows 2 examples of AC/DC solutions for efficient fast battery charging. Firstly a slim 25W USB PD + QC adapter built with NXP latest chipset solution. The adapter will demonstrate a fully USB PD (Power Delivery) and QC (Quick Charge) compliant solution charging a true PD device (Apple macbook air / Google Pixel notebook or Google SP) or a QC smartphone (e.g. Samsung S6 edge). Secondly a compact 33W Direct Charging adapter built with NXP latest chipset solution. The adapter will demonstrate a fully compliant direct charging solution charging a true HiSilicon FSP device, supporting the FSP charging protocol like a Huawei smartphone Furthermore will be demonstrated the system configuration and debug features of the secondary controller by using NXP Graphical User Interface (GUI) and control board. Features: Best-in-Class overall efficiency – meets all DOE & EU-CoC regulations Smallest form factor / highest power density due to high efficiency High integration level & very low BOM cost - minimum number of external components Very flexible system due to on-chip DSP and memory – Fully meets USB-PD, QC, FSP/SCP protocols Main functionality (V & I & protections) configurable by programmability of key system parameters All protections integrated in hardware – OVP, OCP, OPP, OTP, various short circuit conditions Low cost and suitable packages for both reflow and wave soldering Optional tamper resistant authentication chip allowing own eco-system specific accessories _________________________________________________________________________________________________________________________________________ Featured NXP Products: 25W USB PD & QC reference application, including a:      - TEA1936 primary controller (DCM/QR)      - TEA1993 synchronous rectification controller      - TEA1905 secondary USB PD and QC controller 33W Direct Charge reference application, including a:      - TEA1936 primary controller (DCM/QR)      - TEA1998 synchronous rectification controller      - TEA1901 secondary Direct Charge controller NXP GUI w/ control board _________________________________________________________________________________________________________________________________________ C08

Overview Remote virtual smartphones promise the same benefits as remote computer desktops and cloud-based gaming: low-cost client hardware, sandboxed user environments, and persistent user state. The way they work is that the physical smartphone runs only thin-client software and the smartphone application runs remotely on a server. To be economical, this server hosts multiple of these virtual smartphones, taking advantage of hardware virtualization support built into its processor. Slotted into the machine, an add-on GPU provides high-performance graphics. To reduce latency for real-time gameplay, the server is best located near the end-user in the edge of the mobile network. For virtual smartphones to be compatible with physical smartphones, Arm compatibility is required. At the 2020 Consumer Electronics Show, NXP demonstrated the Layerscape LX2160A processor hosting Redfinger’s cloud-based Android emulator and virtual smartphone. NXP’s processor integrates 16 CPU cores, enabling it to host 16 or more virtual smartphones. Games and other software execute with the same look and feel as if they were running locally on a smartphone. Like other Layerscape processors, the LX2160A delivers excellent performance per watt and is designed to work in high-temperature environments, such as being packed densely in a rack in a data center or deployed remotely at an edge-computing site. Although NXP designed it for stringent embedded applications, the LX2160A processor is powerful enough for servers—making it a great solution for Android emulation.     Block Diagram NXP Products Name of Product QorIQ LX2160A Development Board | NXP    Related Documents from Community Name of Document Discover i.MX: Industry-Leading Processor Solution for Media, Smart Home, Smart Industrial, Health/Medical and Broad Embedded Applications    Related Communities Name of Document Layerscape 

Flomio was able to take our SLN-POS-RDR and develop their first EASyPOS prototype in 2 short months! What is an EASyPOS? EASyPOS is an item level point of sale. A light weight terminal that connects wirelessly to the payment network to securely process transactions and unlock from products for consumers to take. EASyPOS is the first of it’s kind and though placing a POS on every item may seem impractical, it offers several advantages. For one the device is able to monitor it’s location with a high degree of accuracy, guiding shoppers directly to the products they seek and consistently delivering positive purchase experiences. Also, inventory accuracy is all but guaranteed so omnichannel commerce and other popular retail trends are supported. Finally, EASyPOS has lights and sound alerts to enable smart filtering and encourage impulse buys.     How do I use it? Using the EASyPOS is —in fact— “easy”. Follow these steps to complete your purchase: - Grab the product you want to purchase.  - Place your Contactless Payment credential on the surface of the contactless payment logo and wait for 4 LEDs to blink green. EASyPOS is now disarmed. - Slide apart the magnetic halves and remove your from your purchase.     How is it built? The EASyPOS was built by Flomio, an expert in mobile NFC device design. It operates at very low power while actively monitoring for payment engagements, remote notifications, tamper attacks, and location changes throughout the retail environment. Smaller than a deck of cards, the EASyPOS is a payments certifiable device leverages the hardened security and miniaturization advances of NXP Semiconductors. It’s split in two assemblies, the top hosting active components like the freakishly loud 90dB speaker and the bottom containing the wireless recharging power system.   Short Video: https://www.youtube.com/watch?v=FQrnTWPpRHE About Flomio, Inc. Disney’s Magic Band™ technology revolutionized their theme park business. Companies eager to “Disney-fy” their businesses without their own team of imagineers and billions to invest turn to Flomio, imagineers for the rest of us. Flomio creates proximity ID solutions that help enterprise clients and developers cross the chasm to the next web, the Internet of Things (IoT). Funded by TechStars, Flomio is fundamentally changing the way people engage with the spaces around them by making proximity ID simple to integrate, easy to deploy, and fun to use. Soon, 50 billion devices will regularly connect to the internet. Flomio’s platform empowers enterprise customers and developers to create applications that communicate with these devices. The future is ubiquitous connectivity. Flomio makes sure businesses take advantage of it.

This demo shows a demonstration of NXP's wireless charging reference design for a tablet computer.       Features Consumer and Automotive Applications Compliance with wireless power consortium QI standard Transfer efficiency Touch sensing Featured NXP Products WCT1000 Links Link to Wireless Charging Links to document page Block Diagram  

Demo The NXQ1TXH5 is a one-chip low power Qi transmitter, and it enables an ultra-low cost wireless charging transmitter dramatically reducing application cost while still providing latest WPC version 1.2 Qi compliant performance.   The NXQ1TXH5 demo is provided in an exciting form-factor with a backlight module on which Qi enabled phones can be charged. The demonstration shows the extremely low component count, which is interesting for professionals to understand, and at the same time showing a real-life eye-catching form-factor that draws non-technically skilled person attention. The demonstration challenges people to actually charge their phone and experience charging without wires.   One of the table modules is provided with a table-fan in which there is a Qi power receiver built-in. It can be used as a standby-demo to further draw attention to the demo, even when no phone is placed, and it avoids phones getting lost when there is no expert attending the demo.     The Qi wireless charging demo consists of a module that can be built into any table, using a 181mm round hole and it can simply be dropped into the hole. It is delivered with a universal mains power supply and hence easy to install. Below pictures show the Qi wireless charging table module demo, as well as dimensions to help building it into available infrastructure.   Demo / product features   Ultra low component count solution. Reducing application cost by 30-50% compared to other solutions Easy to layout on 2-sided PCB Excellent EMI behaviour without additional external filtering Ultra low standby power of 10 mW meeting 5-start smartphone charger standby rating High efficiency of 75% Excellent thermal behaviour due to NXPs proprietary low RDSon power silicon technology NXP Recommends   NXQ1TXH5 - Low cost version; contact your local sales representative for information on NXQ1TXL5

Vital signs patient monitoring module using K60 Family MCU. Medical grade device, meets stringent safety / regulatory requirements Multi channel, real time data collection and processing:  Electrocardiogram, blood pressure, blood oxygenation etc. Usable as bed-side unit or part of distributed patient monitoring system This Project of Interest If You: Are interested in industrial medical products Are interested in real time analysis of live sensor data Description The module was developed as main functional part of portable patient monitor. It has a compact design, and unified serial interface to the host unit.  We developed it as a single board PC designed for main patient monitor application hosting and system purposes. The module provides comprehensive solution for patient vital signs monitoring. It has simplified connections, requiring only a power connection and a single data connection to the host or the distributed monitoring system. The design also meets the safety requirements for galvanic isolation of the patient. Kinetis K60 Family MCU was used as a core of this module, for data acquisition, signal preprocessing (digital filtration), data analysis and system tasks including extended supervisor functionality (with additional NIBP reserve/alarm system). The module has the following features: Module can be used in a bed-side unit, or part of a distributed monitoring system 7-lead electrocardiogram (ECG) (3-lead capable mode without RLD); Respiration rate (transimpedance on ECG lead I or lead II); SpO2 (oxygen saturation) using Nellcor OxiMax™ technology NIBP (noninvasive blood pressure) with patient adaptive fast measure mode for continuous monitoring, STAT mode; Body temperature, 2 channels Optional IBP (invasive blood pressure) up to 4 channels. This module meets all IEC safety requirements and is CE certified (as a part of patient monitor). Full Listing of Products/Components Protected by NDA IoT Physical Modules Sensors ECG / Respiration Blood oxygenation Blood pressure: invasive, non-invasive Body temperature Kinetis K60 MCU used for: Data acquisition Signal preprocessing and filtering Analysis, result output Supervisory functions Alarm generation IoT System Capabilities Under NDA

Cellular Freedom Quickly move sensor data to the cloud using the FRDM-K64F End-Device certified Skywire cellular modems provide a path to production Complete mbed code provided This Demo Is Probably of Interest If You: Need a quick proof of concept Have to demonstrate cellular connectivity to a customer or client Don’t want to build your own Thing for your IoT demo Differentiation - This Demo Highlights End-Device certified modems require no Carrier certifications to use on the cellular network XBee R footprint makes your design futureproof Global options for devices deployed or moved anywhere in the world Description The NXP FRDM-K64F is the development board for the NXP Kinetis series, providing an affordable, flexible way to build prototypes. For applications requiring cellular connectivity, the NimbeLink Sensor Shield plugs into the FRDM-K64F development board and, in turn, accepts a plug-in NimbeLink Skywire end-device certified cellular modem, providing quick cellular access. This first-in-the-industry plug-in cellular solution is easier and more compact than USB or other modem connection options, and the pre-certified Skywire embedded modem eliminates the cost and complexity of obtaining carrier certifications. The NimbeLink shield comes with four integrated MEMS sensors for easy proof-of-concept development. Sensors include an accelerometer, a temperature sensor, an atmospheric pressure sensor, light sensor, a humidity sensor, an accelerometer and two pushbutton switches. The shield also provides headers similar to those on an Arduino board. These accept any of hundreds of compatible expansion boards allowing the addition of capabilities like GPS, screens, motor controllers, and more. The NimbeLink Sensor Shield requires 5-12vdc power and accepts a variety of antennas. Full Listing of Products/Components Note: For full listing or additional information for Products/Components used in this demo see "This Demo's IoT Highlights" in Left Column. Note: If you aren't looking at this demo in the IoT Solutions Center, please use below link to access NXP IoT Solutions Center: https://community.freescale.com/community/iot-center/demos/skywire-m2mmanager-demo What this Demo is All About Video Link : 4994 IoT Physical Components Gateways Boards/Modules: FRDM-K64F Software: ARM mbed End User Products: NimbeLink Sensor Shield and Skywire Modem Wireless Connectivity End-Device certified Skywire cellular modem Sensors MEMS accelerometer, temperature, humidity and pressure sensors. Light sensor, potentiometer and pushbutton switches. Cloud Infrastructure/Services Verizon ThingSpace IoT System Capabilities Cloud/App Communications/Interworking See the data from your Sensor Shield in the cloud using the Verizon ThingSpace portal on any connected device. IoT Development Capabilities Embedded Platforms NimbeLink can help you customize your cellular product design to take advantage of the latest NXP advances in technology. IoT Product Type Product/Component Vendor Research or Procure This Product/Component End User Hardware Skywire Sensor Shield Commercial Skywire Sensor Shield End User Hardware Skywire end-device certified cellular modem Commercial Skywire Modem

This post entry provides a detailed description of how a Bluetooth Low Energy (BLE) pairing solution via NFC was developed using two of our reference development boards: The NTAG I 2 C plus kit for Arduino pinout The Freedom KW41Z board. This document has been structured as follows: NFC for easy one-tap pairing solution NFC pairing is one popular feature you can find in cameras, speakers, printer, routers, wearables and many more. Just bringing two NFC-enabled devices close together is all it takes to create a connection. Just to mention a few of examples, with just a swipe you can: Connect your phone to a wireless speaker. Connect your new devices to the home network. Connect accessories to the control unit. In all these scenarios… NFC and Bluetooth are a perfect combination, since the pairing process with NFC becomes: Faster compared to the traditional pairing methods. Easier, reducing technical support More reliable, making sure you connect to the right device. The technical basis for this “tap to connect” process is provided in the NFC Connection Handover specification running atop the NFC Forum protocol stack. It defines a framework of messages and data containers that allow bootstrapping of alternative (i.e., other than NFC) carrier connections in a standardized way. For this reason, NFC pairing solution offers a unified user experience and interoperability across different manufacturers.  NFC solutions to implement secure simple pairing There are two types of solutions recommended to add NFC pairing functionality to designs: NFC static pairing with NTAG 213 The first solution is embedding an NTAG 213 NFC label. In such a case, the pairing credentials need to be previously loaded in to the tag memory as well as in the device MCU during manufacturing. NFC dynamic pairing with NTAG I2C plus The second solution is embedding an NTAG I 2 C plus tag. In such a case, the pairing credentials can be dynamically updated by the device MCU during the product lifetime. In addition, other features such as an automatic wake-up field detection signal are possible. Precisely, the combination of a passive NFC interface with a contact I2C interface allows the product to behave as a tag and be read via NFC and to connect to a host or application processor via  I 2 C. In addition, NDEF messages can be generated and updated by the host MCU depending on the application requirements. Later, these NDEF messages can be read by any NFC phone, including iOS devices with the latest OS version. Hardware setup Mapping the previous diagram to the demo hardware, we have: The NTAG I 2 C plus tag, using the Arduino pinout kit The MCU, using Kinetis KW41Z. The applicatiob logic, which updates the NDEF contents based on different use cases. Some details about the hardware used in the next sections: Kinetis KW41Z The Kinetis KW41Z is a high integrated chip with multi-protocol radio features enabling Bluetooth Low Energy (BLE) and 802.15.4 radio protocols such as Thread. KW41Z has as large memory of 512KB that can support multiple radio protocols running in a single application instace and implements nine low-power modes and a wide operating voltage range (0.9V/4.2V), for optimum current consumption. Finally, the software support package includes: BLE, Thread and 802.15.4 generic network stacks, several sample demo apps, support for RTOS and full integration in MCUXpresso. The Kinetis KW41Z evaluation is supported with the FRDM-KW41Z development board. The board main components are: a reference crystal, an accelerometer, an Arduino header, some LEDs and buttons, a JTAG and OpenSDA connectors,and an external flash memory. NTAG I2C plus kit for Arduino pinout The NTAG I 2 C plus Arduino kit consist of two PCBs stacked together: The upper PCB is the antenna board with the connected tag The lower PCB is an interface adaptor board to the Arduino pinout. This kit can be used to connect and evaluate the NTAG I 2 C plus  into many popular MCUs with Arduino compliant headers, for example:  Kinetis (e.g. KW41Z, i.MX (e.g. UDOO Neo, i.MX 6UL, i.MX 6 ULL, i.MX 7D) and LPC MCUs (e.g. LPCXpresso MAX, V2 and V3 boards). The kit support package includes several software examples, including the BT pairing example based on KW41Z.  The OM29110ARD is a generic interface board which offers support for connection to any PCB implementing Arduino connectors. It exposes: 3.3V and 5V power supply pins. I 2 C , SPI and UART host interfaces. Generic GPIOs (e.g. to be used for field detect, interrupts, reset pins or others) As such, it allows the NTAG I 2 C plus to be plugged into Arduino devices seamlessly. Once the NTAG I 2 C plus  board is stacked on the KW41Z, the pining routing between the two boards is as follows. It uses:  The  I 2 C  interface pins. The 3.3V supply pin. One GPIO is routed for the field detection pin. The Vout, for the energy harvesting pin. The ground reference. BLE pairing with NFC on KW41Z and NTAG I2C plus This section details how the Bluetooth Low Energy (BLE) pairing with NFC on KW41Z and NTAG I 2 C plus works. The following block diagram is a simplified representation of the demo that shows: The Bluetooth and NFC interfaces The buttons and LEDs involved in the process. Starting BLE advertising After SW4 is pressed: The application goes from IDLE to searching mode, advertising the BLE device The LED 3 starts blinking in RED color. Writing BLE pairing NDEF message Once the BLE advertising is activated, the next step is for the KW41 to write the pairing message into the NTAG I 2 C  plus memory. After SW3 is pressed: The KW41 uses the  I 2 C interface with the NTAG I 2 C plus to load a pre-defined NDEF message with the BLE pairing details. At the same time, the LED 4 is set to GREEN. Pairing with the BLE device While the LED 4 is set to green, the BLE pairing message is exposed through the NTAG I 2 C plus  RF interface. During this interval, any NFC-enabled device: Can read out the NDEF pairing message. Pass the BT credentials to the Android system or the host processor. And automatically create a Bluetooth link according to the exchanged network credentials. In case of an Android system, no third-party implementation is needed on this part as long as the pairing message follows the NFC Forum specifications. Writing default NDEF message Once the pairing information is read out of the NTAG I²C plus, the KW41Z removes the pairing content and turns back to normal operation mode. In addition, in this specific demo, the NDEF pairing message is programmed to remain in the NTAG I²C plus memory for only ten seconds. After these 10 seconds: The green LED is switched off. And the pairing NDEF message is overwritten by the default NDEF about the NTAG I²C plus demo app. Video The following video shows how the Bluetooth Low Energy (BLE) pairing with NFC on KW41Z and NTAG I 2 C plus works. How to integrate NTAG I2C plus into FRDM-KW41Z hid_device sample project In this section, we describe, step by step, how NFC is integrated in an existing default demo application taken from the KW41Z support package.   FRDM-KW41Z startup In the board website, there are very clear instructions on how to get started www.nxp.com/demoboard/FRDM-KW41Z. For instance: How to test KW41Z. How to get the tools, in our case: MCUXpresso, and the SDK for KW41Z. How to import, build and runn the examples included in the SDK for KW41Z, in our case: the ones inside the wireless_examples folder Importing FRDM-KW41Z SDK and hid_device sample project After that, we import the FRDM-KW41Z SDK and we import the sample project used as a basis for adding NTAG I 2 C plus support, this is the hid_device example located under the wireless/Bluetooth folder. Importing NTAG I2C plus middelware The NTAG I 2 C plus  middleware can be easily imported as a new folder in the project tree using the MCUXpresso File / Import menu. Once imported, the internal structure of the middleware should have this structure: HAL_I2C: The HAL_I2C files support access to the Kinetis I 2 C interface. HAL_ISR:  The HAL_ISR files support the interrupt handling and callback registration for the Kinetis MCU. HAL_NTAG: The HAL_NTAG source files provide an API that allow you to communicate with the NTAG chip and implements the NTAG command set to perform memory access operations from the I 2 C interface.  For instance, this API can be used to perform: Read / Write memory operations on EEPROM and SRAM (for example, to read data, you just need to indicate the memory address and length of the data to be read) Read / Write access to NTAG I 2 C plus registers (for example, you just need to indicate the register macro to be read). Functions for enabling the pass-through mode and handling the data exchange between interfaces (setting the data transfer direction is as easy as using this function). HAL_TMR: The HAL_TMR files support access to the timing hardware of the Kinetis MCU. Adding / changing GPIO pin settings All pin and GPIO settings are defined within the pin_mux.c file. For our application, the I 2 C pins need and a GPIO for the field detection need to be enabled.  Regarding the host interface: the I 2 C  pins for NTAG communication are configured using the BOARD_InitI2C() function, it sets the required I 2 C  port (port 0 for this MC) and set the right mode for the clock (SCL) and data (SDA) lines. Regarding the field detection: it is defined within the source code even though it is not used so far. It is left defined for future use. Within the pin_mux.c file, there are other functions which initialize; for instance, the buttons, LEDs, etc. These functions are called during the hardware initialization. NTAG I2C plus software and hardware initialization We move to the main_application, where some pieces of code need to be added. All code that has been added, is inside the #ifdef NTAG_I2C clause. First, we added: The I 2 C_driver and the ntag_app header files . The ntag_handle handler declaration. Then, the HW initialization is performed calling I2C_initDevice and the NFC_Initdevice() function is called to fill the  ntag_handle software handler. HID_device demo extensions The BLE demo application is written in the hid_device.c file and the whole behavior is handled in this file. The C-code printout in the blue box  below shows the content of the BleApp_HandleKeys() function, which handles the BLE activity and the changes made related to the NFC use case. Similarly, all new code additions are within the #ifdef NTAG_I2C clause. Mainly, the BleApp_HandleKeys() function function was extended to: Copy the pairing NDEF message to the NTAG I 2 C plus chip when the button SW3 is pressed. Set the LED 3 to green while the pairing NDEF message is available. Start a timer counter from the moment the SW3 button is pressed In addition, when the time counter is expired (expiration was defined to 10 seconds): The memory content of the NTAG I 2 C plus chip is overwritten by default NDEF message. The LED 3 is set to off. NDEF message for BLE pairing definition The last part missing to cover the NFC integration into the KW41Z refers to the files created within the application to declare the NDEF pairing and NDEF messages. The NFC Data Exchange Format (NDEF) is the NFC Forum specification defining an interoperable, common data format for information stored in NFC tags and NFC devices. The spec also details how to enable tags to deliver instructions to an NFC device so that the device will perform a specific action when a particular tag is read (open a browser, initiate a phone call, pairing, etc.). Every NDEF message can be automatically processed by any NFC device and execute the appropriate action without requiring the installation of any customized software / application and independently of the hardware manufacturer. There are several NDEF record formats that you can use in your implementation. Each NDEF record indicates to the application processor which kind of payload the message carries. In our demo app, the default NDEF message used belongs to a smart poster record and the NDEF pairing message, follows the protocol defined in the NFC Forum connection handover specification. Going to the source code, two application files for the NDEF handling were created: The app_ntag.h declares the two NDEF messages used in this demo. The app_ntag.c, implements a function which writes the NDEF message into the tag. As mentioned, the NDEF used for this BLE pairing was built according to the Connection Handover and BT secure simple pairing specifications and rules. On the image below, we copied the declaration of the NDEF pairing message. This is actually the hex bytes that are written into the tag memory. To highlight son relevant parts: We find the capability container and the NDEF TLV. These two fields are used by the NFC device to detect if the tag is loaded with NDEF formatted data into a Type 2 tag (like the NTAG I 2 C plus). After that, we find the record type name. This is the MIME type for the Bluetooth out of band pairing (written in its ASCII representation). It is followed by the device Bluetooth MAC address, and the complete local name (Freescale HID). The terminator TLV In case you are interested to know more about the NDEF message structure, you can check the NFC Forum specifications The data (MAC address 00:04:9F:00:00:04 & device name FSL_HID) read by the NFC device is sent to the Bluetooth controller to establish the Bluetooth connection. Default NDEF message definition  The NDEF used as thedefault_ndef message consist of two records: The first record was built according to the SmartPoster specification from the NFC Forum, which describe how to store a plain message followed by an URL. The second record is what is called Android Application record. On the image below, we copied the declaration of the NDEF default message. To highlight son relevant parts:   As the NDEF BLE message, the first data fields we find correspond to the container and the NDEF TLV structure for a Type 2 Tag. Then, we find the smart poster record, which includes a text field. In this example, it codes the text “NTAG I2C Explorer”  and a URI field which codes a the NTAG Explorer kit website URL. After that, we find the Android application record, which is used to automatically launch the app  or, if the app is not installed, redirect the user to Google Play. Finally, the terminator TLV. After 10 seconds, the application removes the BLE pairing NDEF and replaces it by the above described NDEF message. This can be easily demonstrated by tapping the phone after these 2 seconds, and validate that the NTAG I 2 C plus demo is automatically opened. Video recorded session   Available resources BLE pairing with NFC on KW41 and NTAG I 2 C plus source code www.nxp.com/downloads/en/snippets-boot-code-headers-monitors/SW4223.zip NTAG I 2 C plus kit for Arduino pinout www.nxp.com/demoboard/OM23221ARD FRDM-KW41Z board www.nxp.com/demoboard/FRDM-KW41Z

This demo shows the temperature monitor solution. We will show the logger ADK (starter kit) and various form factors from current customers (pcbs, labels). NHS3100 can be used for all goods where temperature control is essential for the quality guarantee: pharmaceuticals, medical goods, fruits, cut flowers, chemicals, fish and meat. Demo / product features Single chip solution for pharmaceutical and perishable temperature monitoring Easy integration into final design solution (NHS3100 + battery + NFC antenna) Accurate temperature sensors Large logging space NXP Recommends Temperature logger - NHS3100 Smart Pharma

Demo New S32V234 silicon demonstrating the MIPI CSI camera connection with execution of ISP algorithm and comparison with original camera image. New ADAS solution for vision, sensor fusion and surround view application Quad-core ARM® Cortex®-A53 processor, CogniVue APEX™, Vivante GC3000 GPU, and advanced memory bus system architecture Integrated ISP for camera video input and filtering Featured NXP Product S32V230 Family of Processors for Advanced Dri|NXP Other Advanced Driver Assistance Systems (ADAS)|NXP

    Features QorIQ Processing Platforms BSC9131 SoC based LTE small cell Zero intrusion by fitting in a lamppost’s existing photocell socket Avoids costly site acquisition and lengthy planning procedures Backhaul agnostic – Fiber, copper, PoE wireless P2P Trust architecture provides secure computing environment Block Diagram

Demo NXP has comprehensive solutions for USB Type-C that covers USB power delivery (USB PD), security, signal integrity, and protection.  The video below shows complete end-to-end solution covering super speed USB data and video combined with USB PD and authentication.  Demo / Product features Complete USB Type-C End to End Solution USB Power Delivery & Display Port Alternative Mode USB PD AC/DC charger with Authentication   NXP Recommends Check all products associated with USB Type-C on below link: http://www.nxp.com/usb-type-c Training Introduction to the Next-Generation USB Type-C Connector and NXP’s End-to-End Solution 

Demo Owner Juan Antonio Gutierrez Rosas   Watch as the 2D-ACE display controller allows responsive and eye-catching graphics and keeps the system costs, power consumption and board size low.   Features Display control unit - Hardware 2D animation and composition engine Rich set of capabilities that allow to build engaging graphical content with MINIMUM CPU intervention Featured NXP Products Vybrid QorIQ Links Introduction to the Vybrid Tower System  

Demo This demo shows how the FlexIO peripheral can be utilized to connect directly to an RGB TFT display to deliver a rich graphical display. The demo uses the versatile Tower ecosystem to connect the TWR-K80F150M MCU board to the display. The demo is well documented by an Application note and associated software.       Features: Dynamic Graphical LCD (480x272) with 16bt RGB interface Images stored in fast external Serial NOR flash           FlexIO utilized to generate 16bit interface to TFT display with minimal CPU intervention   _______________________________________________________________________________________________________     Featured NXP Products Product Link Kinetis® K8x Secure Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core https://www.nxp.com/products/processors-and-microcontrollers/arm-microcontrollers/general-purpose-mcus/k-series-cortex-m4/k8x-secure:K8X-SCALABLE-SECURE-MCU?&cof=0&am=0 Tower® System Modular Development Board Platform https://www.nxp.com/design/development-boards/tower-development-boards:TOWER_HOME?&tid=vantower Kinetis® K80 MCU Tower® System Module TWR-K80F150M|Tower® System Board|Kinetis® MCUs | NXP    Application Notes AN5275.pdf AN5280.pdf AN5280SW.zip _______________________________________________________________________________________________________      

Description Near Field Communication (NFC) is used for real-time precision marketing based on time, local inventory and the individual when embedded in product displays or the products themselves. NFC is also becoming the preferred method for payment either in smartphones or smart payment cards. NXP secure MCUs and MPUs paired with our contact and contactless readers provide customers with state-of-the-art, comprehensive, pre-certified PCI and EMVCo payment acceptance capabilities that will ease the development process and speed time to market for payment solutions. SmartPOS will be the most important POS in the future. Customers can download authorized third-party software and connect to an acquiring system via cellular communication. It has both the security of traditional POS and the convenience of mPOS. Features Contact card interface (TDA8035) and contactless card interface (CLRC663) Supports the whole system to pass EMV Level 1/2 certification Magnetic Strip Card Reader (MSR) supports 1/2/3 tracker, which could be implemented by ADC module Tamper detection with more active pin pairs Integrated encryption module/accelerator High speed SPI interface to extend memory space Secure boot Code protection USB/UART/SPI communication ports, etc. Block Diagram Products Category Name 1 MCU and MPU Product URL 1 Arm Cortex-M4|Kinetis K21 120 MHz 32-bit USB MCUs | NXP  Product Description 1 The Kinetis K21 MCU features a hardware encryption coprocessor for secure data transfer and storage. Faster than software implementations and with minimal CPU loading. Supports a wide variety of algorithms - DES, 3DES, AES, MD5, SHA-1, SHA-256 Product URL 2 i.MX RT1170 Crossover MCU Family - First Ghz MCU with Arm® Cortex®-M7 and Cortex-M4 Cores | NXP  Product Description 2 i.MX RT1170 includes NXP’s EdgeLock™ 4A security subsystem, including secure boot and crypto engines Category Name 2 Card Reader Product URL 1 High integrated and low power smart card interface | NXP  Product Description 1 The TDA8035 is the cost efficient successor of the established integrated contact smart card reader IC TDA8024. It offers a high level of security for the card by performing current limitation, short-circuit detection, ESD protection as well as supply supervision. Product URL 2 CLRC663 plus | High-performance multi-protocol NFC frontend | NXP  Product Description 2 The CLRC663 plus is a high-performance NFC Frontend with low-power consumption. Is the perfect choice for NFC applications with high-performance requirements like access control, payment, gaming. Category Name 3 RTC Product URL 1 PCF2129 | NXP  Product Description 1 The PCF2129 is a CMOS Real Time Clock (RTC) and calendar with an integrated Temperature Compensated Crystal (Xtal) Oscillator (TCXO) and a 32.768 kHz quartz crystal optimized for very high accuracy and very low power consumption. Designs Products Links Linux Point of Sale (POS) Reader https://www.nxp.com/design/designs/linux-point-of-sale-pos-reader:SLN-POS-LRDR