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It sounds almost like a tale: Every Year again all the Experts of the Embedded Market meet in a little old Town in the Forrest of Bavaria. They are coming from all nations in flying machines to see the latest inovation and talk to each other in a language filled with Buzz words only few might understand if they not belong to this totally Engineering group.... Also this Year Embedded World took place like always in end of February. I have been on a few times on Embedded Worlds now, but it is always great to go again. Every year there is something new to spot and I also enjoy to meet old friends and silicon vendors to discuss about the latest evolution/revolution. This Year I attended the Show for TechNexion and we showed our latest Products based on NXP's ARM chips, like our tiny PICO Modules which are also available with NXP i.MX6UL now and the ideal choice for multimedia applications or where not much space is available. With i.MX6 and i.MX7 options it ofers a nice scalability. Not to forget the fitting baseboard which makes us the HW provider of choice for NXP and Google for the Brillo OS Of Course we also showed our EDM Modules, the work horse of the industry. Reliable. Rugged. Open Source Standard. With 82mm x 60mm it's a small formfactor with a great scalability from Single to DualLite or Quad core. And of course also available with i.MX7 New have been our TEK-Series, a Series of ruggedized, fan-less, cable-less BoxPC's with a Modular approach so Customer can choose the right configuration from off-the-shelf components Also new have been our TEP-Seriees, which is a Series of HMI's ranging from 7" to 10" and 15", also based on the same modular, cable-free- fan-less approach like the TEK-Series. Embedded World has been very busy for us, but never less we found the time to record a video, introducing our Company (for the few who don't know about us yet..) and in the second half of the video having a detailed introduction of our new products. You can watch the video here: TechNexion Company Introduction (@Embedded-News.TV) or directly on YouTube here: TechNexion Company Introduction and Product presentation (@YouTube) Thanks all our visitors and Looking forward to see you again next year!! Any Questions in the meantime? Contact us!​
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Airbus connected factory to shorten Time To Market, Remy’s Martin connected bottle to avoid counterfeit, Schlindler’s elevator smart sensors to improve security, Cisco-IBM connected port in Colombia to enable predictive maintenance, these are some successful examples of B2B IoT creating value and business, and there are many more to come. MACKINSEY ASSESS THAT 70% OF POTENTIAL VALUE ENABLED BY IOT SHOULD COME FROM B2B! McKinsey Global Institute – “The internet of Things: mapping the value beyond the hype” – June 2015 A growing number of companies understand the potential of IoT for B2B markets and its trillions dollars’ revenue expected in 2020 (from 3 to 20 depending on sources and studies). That said, you don’t develop a bluetooth key ring the same way as a sensor designed to monitor temperature in a hot caustic reactor lost in the middle of nowhere and requiring 99,9% availability. While B2C IoT main challenges will remain business application and datamining, B2B brings an additional complexity to the device and its direct environment (gateway, other IoT devices, IT, etc). That is why we make a distinction between the “sexy” IoT focused on B2C and its challenges (marketing, business model, retention, etc.) and what we call the “serious IoT” which is more related to industrial and B2B stakes. This article is the first of a series where I aim to describe the whole process of IoT project development, from a business point of view as well as a technical point of view I will start with this first article by giving what I believe is the best methodology to start a BtoB or Industrial IoT project.   What are the challenges of serious IoT? What are the key success factors to launch a product? What to begin with and which steps to follow? THE FOUR PILARS TO SUCCEED IN AN IoT PROJECT Before I dig into the process to follow, let’s share some key success factors that I’ve identified in all the IoT projects I’ve seen and run: Design thinking As IoT is “hype”, many companies want IoT to launch a project and forget that simple saying: “no pain, no gain”. If there is no pain to be addressed with the project, it will certainly end up in the archive box of the data room. Design thinking allows to have a consumer-centric approach at each stage of the development and ensures your project/product relieves pain, brings a benefit for the customer (even if customer is internal). Master a wide range of technologies MacKinsey assess that system interoperability represent 40% of the potential value of IoT revenue. The “inter” of interoperability means that companies would need partners mastering many different technologies to have all layers/devices work together. In the embedded/IoT world, this can easily exceed 50 technologies (HW architectures, OS, radio & network protocols, frameworks, applications, etc.).  So the success of an IoT project, and more widely of an embedded project, is moving from a technical “silo” expertise to a system approach coupled with technical expertise. Designing the device itself also requires a wide range of expertise and a system approach to optimize the whole system based on business application requirements. Reliable partners (either for technologies or distribution channel) This is often called ‘open innovation’, a term that can freak out CEOs or CTOs. It is simply the fact that you build your project involving partners at each stage to create more value.  As IoT impacts every single bloc of the business model (distribution channel, revenue mode, communication, key activities, key resources, etc.), not a single company can have every related asset internally. So finding the right partners, and sharing value with them, is key to manage and roll-out the project Agile approach This is another “buzz” word. But it is not so obvious for companies not coming from the software industry or coming with a pure embedded software mindset and its 'waterfall approach'. IoT sees many new comers discovering the software challenges, and trying to apply their regular development processes (V cycle for example) to the IoT project. That is the best way to burn it in endless discussions on product scope, spend a lot of money on redeveloping things, and delaying your project launch forever. WHERE AND HOW TO START YOUR IoT PROJECT? Now you’re thinking: “Hmm, interesting, thanks Mr Consultant for this completely un-operational advice. But that doesn’t help me to start”. Don’t you leave now, here is the practical part! These are the first steps to follow when you want to manage an IoT project: 1. START WITH ''WHY'' As Simon Sinek would say, you’d better start with the “why” before launching any useless project. So, why do I want to launch an IoT project? Do I want to launch something that makes my company look trendy and innovative? Do I want to save cost by optimizing my business processes (maintenance, operation, production, etc.)? Do I want to enable new business models into my company offer, thanks to the IoT opportunities (renting vs selling, data value, new services, service vs product, etc.)? Do I want incremental innovation to refresh some of my products? Do I want to use the project as a Trojan horse to digitalize my company? Over the past few years, I have seen all of these motivations among management teams, and all of them are fine. But, you cannot pursue all those goals at the same time, and you certainly won’t design the same project depending on the choice you make. As we say in French “choisir, c’est renoncer” which would translate into something like “Choosing is giving up”. So take time to clearly state your motivations and then select one that needs to guide your focus in the coming months. 2. DESIGN USE CASES AND MAKE ASSUMPTIONS  Easier said than done, but first forget about technology/product, and just think about what IoT could allow in your environment and to which customer this could be most valuable. Draw several customer “journeys” and see where innovation could be used as painkiller or gain creator. Let’s take the example of a maintenance scenario. The idea is the allow remote action for on field devices. For instance, coffee machines installed into gas stations all over Europe. In that case, ask yourself how IoT could make maintenance more efficient? Try to assess time gain, money gain, and security gain and quantify it. Let’s say you identified that among 1000 machines installed, you have a high chance of having 5 customer claims per week and therefore 5 diagnosis to be done per week. Can IoT help you run the diagnosis remotely? Can IoT help you solve the problem remotely? In that case, will that save all on site trips? How much money would that save for the company operating the machines? Knowing that, you can start building a first draft of business models making assumptions: how much of that value can you take? What is the business model you can build around that? How much will it affect your customer process? Have you got the right distribution channel to sell this new offer? Which key assets and activities would you need to bridge the gap between current status and this innovation? 3. GET OUT THE BUILDING Use cases and key assumptions in your pocket, you will now need to go and meet potential customers and partners. The more you share, the more your project will evolve to a credible scenario. Who in your existing base can be your early adopters? Who are your customer having the pain you ease at the highest level (and it is even better if they try to solve it themselves with a workaround). In our example of remote maintenance, they would have some artisanal webcam system on each site to see the machine state and detect some issues without any on-site intervention. Once you’ve identified 5 to 10 contacts, go out and meet them, and try to understand several things : the high level stakes, the problem they have on the field, the way they have tried to solve it, the change process and stakeholder, and then (and only then) you can present your innovation and collect feedbacks. A few slides are enough to present. There is no need for a prototype or any bigger investment. You will be amazed on the quantity of information you can collect that way. And remember something: don’t listen to what people say, look at (or try to understand) what they actually do. 4. BUSINESS MODEL AND FUNCTIONAL SPECIFICATIONS You had your first iteration, congratulations! You wrote down assumptions, you went on the ground to test them, and you collected valuable insights from your targeted customers. Maybe your assumptions proved fully wrong, then go back to stage 2! Otherwise, lucky you, you can write down a v1 of the business model and define your product functional specifications better. This is where you can start defining features, functionalities, prices, offers, channels, technical constraints, cost, financial figures, etc. At the end of this stage you will have some kind of a business plan, a sales pitch, functional specifications, and maybe even technical specifications for your IoT project. 5. POC, POC, POC  That is one of the hardest part of any innovative project: build a Proof Of Concept and test it. Questions are: what are the key features/attributes that I need to test to prove that my concept makes sense for customers? How can I do that as cheap as possible in order to keep my budget for the real product? You’ll need to be very smart, or pay some smart provider, to be able to degrade your end vision so much to just keep the key attributes you want to test. If we go back to the remote maintenance example, can you build some basic software on a Raspberry Pie Board connected to the machine, coupled with a basic web interface that give critical information on the machine, for instance power consumption, run time, temperature, etc. Even if the final product won’t be using raspberry, if you want the web interface to be embedded into an app, and if you want to have twice as much indicators, just focus on the key elements. And test. Doing so, you’ll allow your customer to see real progress, to feel involved in the development process, and to influence the final outcome. And on your side you will collect key information that would take months or even years to collect if you had done it on the real product. A Proof Of Concept can be a functional prototype, or a design prototype, or both. That is pretty much depending on the project and again on the key attributes/functionalities you want to test. 6. ANOTHER LOOP TO COME Congratulation, you’ve made another loop. You are about to become expert in so called “iterative development”! If you don’t feel so, don’t worry as you’ll have many other loops following the same process: make assumptions, test, measure, learn, adjust and make new assumptions, test, measure … Each loop will allow you to adjust the business model, the functional specifications, the customer engagement and go further into your product development. The complete ''Lean startup process'' The key is to keep in mind that your goal here is not to have the perfect product. It is just to be able to learn as much as possible in each loop while spending as less as possible. Make as many loops as you can until you reach a satisfying v1 product brief. But that is for chapter 2… Originally Written on WITEKIO Technical Blog by Samir Bounab, Chief Sales Officer, WITEKIO 15 September 2017
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2016 May 16 - 19 we will again be at the NXP Technology Forum. Formerly called ftf it is now the NXPFTF 2016 TechNexion will be there and show our latest small Modules or chat with you about our Software and where to get it. Of course we are also looking forward to see all the new cool things we are expecting NXP to show. Being exited to have our tiny PICO Module scaling from Cortex-A7 i.MX6 Ultralite over Cortex-A9 single/dual lite/quad or with the NXP i.MX7 solo and dual (both Cortex-A7) but also introducing our other solutions. I'm sure there are a lot of customer which will find our EDM solution the perfect fir for their needs: We are looking forward to meet yo and all the other amazing people and exchange our ideas! For sure it will be a great event, also if now under a slightly different name, but that's still ok  FTF, here we come!! Register here: http://www.nxp.com/support/classroom-training-events/nxp-ftf-tech-forum:NXP-FTF-TECH-FORUM-HOME nxpftftechforum​
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The complete tutorial / FAQs are uploaded to http://www.myirtech.com/faq.asp?selectm=class&anclassid=6&nclassid=90  The tutorial / FAQs are based on MYIR’s NXP i.MX6UL/6ULL series products but are also applicable to similar products from other companies. MYIR hopes these are useful to you. MYIR’s NXP i.MX6UL/6ULL series products:  MYS-6ULX Single Board Computer MYD-Y6ULX Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-HMI Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-CHMI Display Panel How to connect Ubuntu to the Internet? Run Oracle VM VirtualBox (this is what I am using, you may use other VirtualBox). Open the settings in the supervisor, choose network, enable network connection, connection type: bridge network card, the name of the interface: Select by actual occurrence. If you want ubuntu to use fixed IP, you may set it up in “Ubuntu/etc/network/interface”. Reference: # interfaces(5) file used by ifup(8) and ifdown(8) auto lo iface lo inet loopback auto enp0s3 iface enp0s3 inet static address 192.168.30.109 netmask 255.255.255.0 getway 192.168.30.1   How to transfer files between Windows PC and the development board? The board and PC should be connected to the same network. Install tftpd64.exe software on the PC. Current Directory, choose the path to upload files. Server interface, choose the IP of PC. Execute “tftp 192.168.1.153 -g -r test.sh” in Xshell when downloading files to the board. Execute “tftp 192.168.1.153 -p -r test.sh” when upload files from the board to PC. 3-3-1 tftpd64 Server configuration How to transfer files between Ubuntu and the development board? The board and Ubuntu should be connected to the same network. Execute scp file to transfer files: “scp -r /home/roy/rs485 root@192.168.1.223:/home/root”. Tips: this command means copy folder ubuntu/home/roy/rs485 to directory /home/root of board with IP 192.168.1.223.
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Future_Electronics_Panel_Interface_ModuleIMG00641 Added by Iain Galloway (Future) on June 22, 2010 at 11:21am   The Future Electronics Panel Interface Module (PIM) allows rapid integration and evaluation of TTL and LVDS LCD panels with the various i.MX EVKs. Easily customized cables provide the ability to mate with LCDs from multiple manufacturers.  
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i.CORE M6UL Based on Freescale™ i.MX 6UltraLite processor, a high performance, ultra-efficient processor family featuring an advanced implementation of a single ARM™ Cortex™-A7 core, which operates at speeds up to 528 MHz. The new ENGICAM GEA M6UL module is suitable for cost effective HMI applications requiring high performance CPU. i.CORE M6UL Cores Cortex-A5 @ 528 MHz core, NEON MPE co-processor and VFPC  Memories 128MB 32bit DDR3-800 256MB SLC NAND Flash Graphics and Multimedia 1x Parallel LCD 18bit output Touch screen Peripherals 2x SD Card interface USB OTG HS, USB HS HOST, Uart, I2C, I2S 4x ADC inputs Up 2x Ethernet 10/100 Dimensions Standard SODIMM footprint 67,4x31.9 mm PCB size Very Low Profile Module EDIMM pin compatible ENGICAM - GEA M6UL
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This 1-minute video highlights Windows Embedded Compact 2013 running on the Device Solutions Opal i.MX53 Development Kit.  This new version has many performance and productivity enhancements over Windows Embedded Compact 7.  The port was done by Guruce.com.
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e-con Systems designed & implemented a reliable Machine to Machine (M2M) solution for mobile phone tower monitoring based on eSOMiMX6, an NXP-Freescale iMX6 SOM. Read further to know the challenges faced and how the team executed the system. M2M Solution for Cellphone Tower Monitoring​ Customer Requirement: System to monitor several parameters such as, temperature, smoke, power source, door open, diesel level etc. in the cell phone tower and remotely monitor them through cloud. The system should monitor and raise alarm when the values exceeded the threshold limit; it should send a text message to the authorities. Challenges: The main challenge in designing the system started with the electrical & electronics and high noise with ESD & EMI signals. It was very important to design the system in such a way that it could interact with the sensors and at the same time, should not be affected by radiated or conducted electromagnetic disturbance. The system cable faced high ESD & EFT injections & the temperature had to be maintained under 25° to power up the system. Approach: e-con Systems designed an architecture based on eSOMiMX6 system on modules that is highly reliable. The system was proposed to extract the information about the tower & communicate the same with cloud. Amazon cloud based web services was used on the cloud side to monitor various parameters & to send the alerts. Base board implemented with eSOMiMX6 interacted with all sensors, collected the information and same would be transmitted via a GPRS unit or Ethernet or wireless unit. Depending on the availability, system selected one path & EMI/EMC/ESD events protected the path of information collection. Power saving modes was designed keeping in mind product power consumption & the total power used when running in diesel generator. The product was tested in-house with simulated tower environment for 2 weeks (24/7) continuously. All issues were identified and addressed. e-con Systems worked with the customers at all levels to get the necessary certification approval. Conclusion: Customer is now successfully selling the robust product in the market. The tower monitoring business is now highly profitable as breakdowns were brought down to nearly zero
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Digi Logo Added by Mike Rohrmoser on July 29, 2010 at 7:37pm  
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Future_Electronics_Panel_Interface_ModuleIMG00641 Added by Iain Galloway (Future) on June 22, 2010 at 11:22am The Future Electronics Panel Interface Module (PIM) allows rapid integration and evaluation of TTL and LVDS LCD panels with the various i.MX EVKs. Easily customized cables provide the ability to mate with LCDs from multiple manufacturers.  
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MYIR launches a 7-inch HMI display panel with capacitive touch screen, the MYD-Y6ULX-CHMI, which runs Linux on NXP’s i.MX6 ULL ARM Cortex-A7 processor, is specially designed for HMI system like POS, intelligent access control and more other applications. It provides many peripheral interfaces and much software resources. Know more at MYD-Y6ULX-CHMI | 7-inch HMI Display Solution based on NXP i.MX 6UL/6ULL-Welcome to MYIR 
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iWave's PICO-ITX board embedded with i.MX6 Quad core processor loaded with Yocto-Dora 1.5.3 now is capable of capturin g and streaming full HD (1080p) video from an on-board camera. Not only it can stream 1080p full HD video to a destined host machine, it is also capable of streaming two 1080p (2 streams) simultaneously at 24fps. In some of the use case scenario, user may want to stream two streams of different resolutions like 1080p and 720p simultaneously. Where high resolution on faster network and low resolution on low bandwidth network, in such use case scenario it is possible to stream multiple streams at various resolutions. The differentiating feature in this system is, it can encode and stream multiple streams simultaneously at maximum 1080p resolution or lesser.  The maximum streaming achieved on all i.MX system earlier was VGA. The possible application of this system could be surveillance and streaming server at full HD resolution. Dual Video Streaming using i.MX6 Dual Pico-ITX Single Board Computer Imagine a system which has two independent displays and can run different content from the embedded computer at the same time. iWave has developed this system with i.MX 6 processor based PICO-ITX platform running Yocto-Dora(1.5) is now equipped with such feature. The system can decode and play two different HD (1080p@24fps) videos at the time using two LVDS displays. For further information or enquiries please write to mktg@iwavesystems.com
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iWave has now enabled the new Hotspot feature in Android ICS 4.0.4 on iMX6 Qseven board. Internet Sharing is one of the most popular concepts in wireless communication today. A device having Data Pack can share its internet connectivity with other devices, this feature is known as 'Hotspot'. By enabling Hotspot in i.MX6 Q7 evaluation board we can use the board an Access Point. Once the Device is enabled with Hotspot, all other devices (we'll call it as client devices) within the minimum coverage range will get Network SSID in their Available wireless network's list. Once connected, client devices will be provided with the internet access. Android allows tethering only if the device is provided with mobile data pack or through Ethernet. So, the Board is connected to internet using Ethernet. As security is the major consideration in wireless communication, Hotspot feature is provided with following security modes. WPA2-PSK is more secure -                      (i)Open, (ii)WPA-PSK and (iii)WPA2-PSK Implementation of Non Standard Android feature – Simultaneous Wi-Fi Station-Hotspot modes: Basic android architecture does not support simultaneous operation of Station mode and Hotspot. Now iWave is providing support for simultaneous working of Station and Hotspot, which allows sharing the available Wi-Fi connectivity, with its client devices. This feature supports, Device(iWave iMX6 Qseven development board) works as a Wi-Fi Access Point(Standard android feature) Device works as a Wi-Fi Client (Standard android feature) Device works simultaneously as a Wi-Fi AP and a client(Non-standard android feature) A Wi-Fi mobile or tablet connects to Device's Access Point(AP) Device (As a client) connects to a public AP Device bridges the two connections and enables the Wi-Fi mobile to connect to the public AP Board acts as an Access Point by enabling Hotspot feature. Then the board will act as client by switching on Wi-Fi feature and connecting to an Access Point which is connected to internet. Pros and cons: Pros: Internet connectivity sharing is possible. Hotspot is provided with Open, WPA-PSK, WPA2-PSK security modes. Network range is up to 10m. Device can act as station and as SoftAP simultaneous. Cons: Number of client devices supported is limited to 10. For further information or enquiries please write to mktg@iwavesystems.com or visit www.iwavesystems.com
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The wait is over! Toradex announces the launch of its latest technical support feature, the Toradex Community, an online community that aims to provide customers a unique platform to stay connected with the Toradex engineers. Toradex, which has always provided extensive free and direct technical support from development engineers, recognizes that many of its customers often have similar queries. By providing an online community where anyone may post a query and by publicly listing down the engineers’ responses, Toradex anticipates that the entire community will stand to benefit from the collective knowledge available via the forum. “We invested a lot of time to understand what information our customers most wanted access to and how to deliver it in a simplified, user friendly and timely manner. With the launch of the Toradex Community platform, our aim is to create an even more connected and responsive support system for our customers, while enabling easy access to information. We invite you to be a part of this ever-growing community constituted by our embedded enthusiasts.” said Roman Schnarwiler, CTO, Toradex. The community will serve to provide its members with sustainable solutions and key insights from our experienced engineers who will be answering queries related to the usage of Toradex products in a wide variety of embedded applications. Furthermore, it will complement the exhaustive information available on the Toradex Developer Center, which is a resourceful website that brings all of Toradex’s developer resources together at one place. For an overview about all our available support channels, please check our support page. About Toradex: Toradex is a leading vendor of ARM based System on Modules (SOMs) that can be used for diverse embedded applications. Powered by Freescale® i.MX 6 & Vybrid™, NVIDIA® Tegra, and other leading processors, the SOM families offer a wide range of options in terms of price, performance, power consumption and interfaces. Complemented with the long-term availability of 10+ years for its products, Toradex stands out in the embedded computing market with free lifetime product maintenance, pin-compatible product families for scalable designs, direct premium technical support, and transparent pricing with direct online sales. Founded in 2003 and headquartered in Horw, Switzerland, the company’s network stretches across the globe with additional offices in the USA, Vietnam, China, India, Japan, and Brazil. For more information, visit https://www.toradex.com. For media queries, please contact: Lakshmi Naidu: lakshmi.naidu@toradex.com
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i.mx233 Computer on Module Added by Lucas Loizaga on August 1, 2010 at 5:03pm First 3D image of our i.mx233 SODIMM CoM!  
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Adeneo Embedded achieved the porting of a Irrlicht 3D engine demo application onto a Phytec i.MX6 development board. Check out the cool features of the demo on the video ! Don't forget to subscribe, comment and share
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Added by eric on November 4, 2011 at 1:52am Hi~~We're HW provider. contact with me. eric@campro-cctv.com
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Launched on Kickstarter on Monday 20 April 2015 – Funded in 80 minutes The groundbreaking Single Board Computer reached its 15k goal on Kickstarter in 80 minutes. UDOO Neo merges the world of Arduino™ and Raspberry Pi with wireless connectivity and 9-axis motion sensors, providing a complete and easy solution to free your imagination, make your objects alive and create new smart devices and appliances from scratch. Campaign Link: bit.ly/UdooNEO On Monday 20 April 2015 SECO USA Inc. launched UDOO Neo on Kickstarter at 11 o’clock in EST time, raising the 15k USD dollar goal in just 80 minutes. The first to be astonished by the overwhelmingly successful launch are UDOO Team members: “We felt immediatly a great interest for the NEO, but we weren’t expecting such enthusiast reaction. This confirms that we’re in the right direction: people are eager to get involved in the Internet of Things computing, and UDOO NEO seems their perfect companion” declares Maurizio Caporali, NEO’s product manager. UDOO Neo is a credit-card size (59.3mm x 85mm - 3.35" x 2.33"), low-cost, low-power consumption, open-source hardware board, able to run Android or Linux and Arduino-compatible. It can be used as a fully-fledged computer, as an Arduino-compatible microcontroller or as an embedded computer to build new devices, smart objects and appliances. UDOO Neo comes in two versions: UDOO Neo Basic and UDOO Neo. UDOO Neo Basic has 512MB of RAM, one USB port, one micro USB OTG port, HDMI video output for LVDS and touchscreen, Wi-Fi module, Bluetooth 4.0 module (including Classic Bluetooth and Bluetooth 4.0), analog and digital camera connection, 54 GPIOs and MicroSD card for the operating system. In addition to all the features of UDOO Neo Basic, UDOO Neo has also a fast ethernet (10/100 Mbps), 9-axis motion sensors embedded, and it has 1GB of RAM instead of 512MB. UDOO Neo is the result of a joint effort between SECO (http://www.seco.com/en/welcome-seco) and Aidilab (http://aidilab.com/). SECO is a global leader in the B2B embedded market, with 36 years of experience in design and production of electronic embedded solutions. AidiLab is a design studio founded as a startup of the Interaction Design Lab (IDA) of Siena University (http://www.unisi.it/) thanks to passionate efforts of professors and students. It collaborates with SECO in the hardware and software development of UDOO, and manages the communication and the relation with the user base. “UDOO Neo is a new-generation single board computer, ready for Internet of Things applications thanks to its wireless connectivity and embedded sensors that no other board on the market features right now.” says Maurizio Caporali, Product Manager of UDOO Neo. UDOO needs the funds to keep the price low, this is the reason why it will be launched on Kickstarter. Right now, a $49 pledge is the minimum to get a UDOO Neo Basic and $59 to get a UDOO Neo. SECO aims to ship the boards to customers in September 2015. Contact info@udoo.org for further inquiries. www.udoo.org
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Only 2″X2″ Endless Possibilities. Solid-Run's CuBox-i is the second generation family of mini computers, based on the scalable Freescale i.MX6 family of system-on-chip (SoC) ranging from a single to quad Cortex-A9 processor cores, 2D/3D hardware graphics processing unit, video decoding and encoding acceleration hardware, HDMI 1080p 3D broad range of peripherals. Read more about CuBox-i
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