P1016 spec says that the QUICC engine periodically polls its Rx/Tx rings and if a BD is not empty, checks the ownership flag and moves to the next step. How does the user application trigger/control the QE to start polling? For TX BD ring, (after configured) QE will periodically poll the ring and process the BD that is not empty and then move to next BD. When a BD is actually transmitted, a "transmission complete" event (and interrupt if enabled) will be generated, so the BD/Buffer can be released. For RX BD ring, (after configured) QE will pre-fetch a BD and then process the BD when data is received. When a packet (frame) is received, a "received" event (and interrupt if enabled) will be generated, so the BD/Buffer can be released/processed. If no empty BD is available during the pre-fetch, an "out-of-BD" error will be reported. Is there any suggested approach to determining the tx/rx ring buffer sizes on the peripherals that interface to the UCC? How can I decide on the ring size? The bandwidth would be 45 Mbps. The MTU on the serial interface can range up to 16k Bytes. Even if MTU could be 16K bytes, the average frame could be much smaller. Find out the average frame size and pick up a buffer size that is bit larger than the average frame size. This usually creates a good balance of efficiency between processing time and memory usage. It is much more efficient in terms of processing time to process a frame of 16K in one BD/Buffer of 16K size than in 16 BDs/Buffers of 1K size. However, if all buffers are 16K size while 90% of the frames are 1K, most memory is wasted. Generally, the ring size should be equal to the number of BD’s required to accommodate the largest possible frame size + 4 extra BDs. However, over here the bandwidth is relatively high (45M) and could be quite bursty. Hence we would suggest starting with "TWO largest possible frame size + 4 extra BDs"

Does P1025 support 16 bits DDR3? I found DDR_SDRAM_CFG{DBW] can be set to 16bits. But no 16bits DDR3 feature is claimed? Theoretically the DDR controller supports 16 bit mode. But the mode has not been tested/verified/validated in P1025. We recommend you to not use 16 mode of P1025. “In asynchronous mode, the memory bus clock speed must be less than or equal to the CCB clock rate which in turn must be less than the DDR PLL rate." Is this statement correct for P1025? No it is not correct. The correct statement is " In asynchronous mode, if the ratio of the DDR data rate to the CCB clock rate is greater than 3 :1 ( i.e. DDR=3:CCB=1 ), than the DDR performance monitor statistic accuracy cannot be guaranteed."

Does P1016/P1025 come with SerDes clocks enabled? Will P1016/P1025 remain in reset if the SERDES is enabled and no SerDes reference clock is available? Yes, P1016/P1025 comes with SerDes clocks enabled. However, P1016/P1025 doesn't wait for SERDES PLL lock for it to come out of reset. For P1016/P1025, which jitter spec (tCLK_DJ, tCLK_TJ or tCLK_DJ+tCLK_TJ) should the buffer and oscillator require to meet? The input jitter at the SD_REF CLK input is specified, Buffer vendor will have to provide jitter at the output in pk-to-pk terms so that it can be compared with the Tj at SD_REF CLK input What is the relationship between RMS jitter and peak-to-peak jitter in P1016/P1025? How can I calculate the RMS jitter value from our peak-to-peak jitter value (42 ps and 86 ps)? RMS jitter is only valid for Random (Gaussian distribution) jitter. This rms value is then converted to pk-to-pk value and added to Deterministic jitter (pk-to-pk) for finding the total jitter (in pk-to-pk). For SD_REF CLK, the HW specs state the value for Total jitter (in peak to peak ps) and Deterministic jitter (in peak to peak ps). rms value for Rj can be referred from PCI Express™ Jitter and BER Revision 1.0. Converting the rms to pk-to-pk is not going to help here because the buffer datasheet states the additive phase jitter. This is measured by integrating the phase noise over the frequency band of interest. DDR. “In asynchronous mode, the memory bus clock speed must be less than or equal to the CCB clock rate which in turn must be less than the DDR PLL rate." Is this statement correct for P1025? No it is not correct. The correct statement is " In asynchronous mode, if the ratio of the DDR data rate to the CCB clock rate is greater than 3 :1 ( i.e. DDR=3:CCB=1 ), than the DDR performance monitor statistic accuracy cannot be guaranteed."

As P1025RM.pdf shows, one can multiplex some pins such as, LAD8/GE_PA0 multiplexing. My design uses LOCAL BUS (nor flash) and UTOPIA at the same time. Can I design my product like this in view of pin multiplexing? LAD8 must be used as local bus pin. For UTOPIA, this pin serves as PA0, which is UTOPIA TX address 4. Usually this UTOPIA signal can be not-used. P1025 Reference Manual chapter 12.5.1.2 states that LAD [0:15] can carry both A [0:15] and A [16:31] via ABSWAP setting switching. How can I use it to skip LAD8 to address local bus device? ABSWAP is not used dynamically. It should be set either 0 or 1 but not be switched from time to time. In this case only A [16:31] (from LAD) is available when ABSWAP is used (set to 1). In this case this can only be used if customer requires 16 bit or fewer address lines. In P1025/P1016, for UTOPIA pins UPC1_RxADDR [2:4]/UPC1_TxADDR [2:4], each signal has two pins described in p1025RM. Based on this, can I use any one of the pins LAD08 or MDVAL for UPC1_TxADDR [4]? For LAD08, I'll assign this pin for LOCAL BUS. Yes, you can use any one of the 2 pins for these signals using PMUXCR register. UPC1_TxADDR [4] can be either the one multiplexed with LAD08 or MDVAL. You can assign LAD08 pin for LOCAL BUS. Also remind you that, UPC1_TxADDR 4] is MSB, if only 4-bit UTOPIA address is needed, just use UPC1_TxADDR [0:3] and this LAD08/UPC1_TxADDR[4] pin can be configured as LAD08 by clearing PMUXCR[QE1] bit to 0. In P1025/P1016, I saw that LOE/ LGPL2/ LFRE in the same line, but in P1016EC.pdf, only LGPL2 is present in B14-pin description and I cannot find LOE/LFRE. Can LOE/LFRE (GPCM read enable) signal use B14-pin? LOE/LFRE (GPCM read enable) signal can use B14-pin. For LGPLx pins, we only put the LPGLx in our hardware spec. You can find all other multiplexed function from P1025/P1016 reference manual.

Usually, when I turn on the option of "reset target on launch" CW resets CPU again while connecting to CPU. With P1015, CodeWarrior (CW) does not connect to CPU when the option is on, only when I disable the option, CW can connect to CPU. What could be the problem? . "Reset target on launch" asserts HRESET to the target, thereby resetting the hardware. In most cases this is a required step, but where you don't want to assert HRESET or where your Target Initialization (.cfg) file does this for you with the "reset 1" command, you can do without this option enabled. "P10xx-P20xxRDB_P1011_jtag.txt" JTAG Configuration file is required by 8.8 CW PA for all single-core P10xx processors. Please load the “P20xxRDB_P1011_jtag.txt" JTAG Configuration file in your USB TAP configuration panel you mentioned about. 1) Set MACCFG1[Rx_Flow] && MACCFG1[Tx_Flow] to 1 2) Set RCTRL[LFC] to 1.

How can I ensure that Ethernet flow control is turned on through the register setting in P1015? Please try the below steps to enable Ethernet flow control: 1) Set MACCFG1[Rx_Flow] && MACCFG1[Tx_Flow] to 1 2) Set RCTRL[LFC] to 1. Setting the flow control bits Rx_Flow and Tx_Flow means that the MAC can detect and act on PAUSE flow control frames, receive and transmit respectively. There are two ways you can confirm or see them in action: 1) Software sending a PAUSE frame through TCTRL[TFC_PAUSE] 2) Changing some hidden FIFO threshold registers, such that the FIFO is about to overflow and that triggers eTSEC logic to send a PAUSE.

Can the P1015 eSPI controller address 4-byte (32-bit) addressable EEPROMs in any situation? Yes, eSPI controller addresses 4-byte addressable EEPROMs in any situation. For P1015, is it possible to boot from a 4-byte EEPROM using the on-chip ROM? No. The software in the on-chip ROM only supports 16-bit addressable or 24-bit addressable EEPROMs.

Do we have an internal pull up on LA20 pin in P1015E? According to hardware spec for P1015/P1024, LA20 pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down resistor. Assuming that I did not include a pull up or pull down and assuming no device was asserting LA20--what state do we sample at POR? If LA20 is left floating at POR, would one read the SVR for P1015E (80ED0211) OR P1011E (80ED0011)? According to hardware spec for P1015/P1024, LA20 pin "must be pulled down with a 4.7K resistor". So the default in case that a design doesn't include an external pull (as required by the spec) is for it to sample as a '1'. Leaving the pin NC (floating) at POR is effectively an out of spec configuration.

For P1015, does DDRCLK and PCIe (SerDes) ref clock support a spread spectrum reference? DDRCLK and PCIe (SerDes) ref clock support spread spectrum. Please note that since SGMII doesn't support spread spectrum, if SGMII is used on any SERDES lane, spread spectrum should not be applied to SERDES REF clock. What are the DDRCLK and PCIe (SerDes) reference clock spread spectrum parameters for P1015?  DDRCLK and PCIe (SerDes) reference clock are designed to work with a spread spectrum clock (+0 to –0.5% spreading at 30–33 KHz rate is allowed), assuming both ends have same reference clock. For better results, a source without significant unintended modulation should be used.

Can a spread spectrum clock be used for the 66.66 Mhz DDR clock of the P1023? If so what percentage spread is allowed and what modulation frequency? Yes, a spread spectrum clock can be used for 66.66 Mhz DDR clock. Please refer to below table for details: Spread Spectrum Clock Source Recommendations Parameter Min Max Unit Frequency modulation — 60 kHz Frequency spread — 1.0  % For P1023 package, which is the GTX clock pin for TSEC1 and TSEC2? According to the P1023 ballmap, V21 is the GTX clock pin of TSEC1 and T19 is the GTX clock pin of TSEC2.

Please specify the DDR read only and write only counters for P1023. Event 19 counts DDR reads only while event 27 counts DDR writes only in P1023. How are DDR errors cleared in the ESUMR reg (bit 8)? Do they need to re-init the DDR? You need to clear the ERR_DEFECT [MBE] bit (write 1 to clear). After that the ESUMR bit 8 will be cleared.

Please confirm that a PCIe lane on the P1023 can be enabled after POR (configured off in h/w but turned on in s/w). If so how this would be implemented? It is possible to control PCIe Lane turned on through s/w. You can control this through SRDSCR2 [0:7]. Through this control you can power -up or power- down individual lanes separately What is the difference between two strap options for PCIe ports - 0b00 or 0b11? In terms of PCIe, options 0b00 and 0b11 are redundant, but in terms of SGMII, they are different 0b00 - 2 lanes are for PCIe; the remaining 2 lanes are powered down 0b11 - 2 lanes are for PCIe; the remaining 2 lanes are for SGMII 0b01 - 3 lanes are for PCIe; the remaining 1 lane is powered down 0b10 - 3 lanes are for PCIe; the remaining 1 lane is for SGMII When SGMII is not used, the corresponding lane(s) should be powered down to save power.

For P1013/P1022, when I am using a DDR controller with a 64-bit interface with a 32-bit memory sub system, which lanes should I use? When a 64-bit DDR interface is configured in a 32-bit data bus width, lanes [0:3] (MDQ [0:31]) will be used.

For P1013/22, what is the maximum bit rate clock for SSI? Is it really 12.285MHz or can it be run up to platform clock / 8? Maximum bit rate clock for SSI is as per hardware spec i.e. 12.285MHz. This is the maximum speed at which the SSI IP is guaranteed to work. From a system perspective it is possible to clock it at a higher speed, but for P1013 that is not supported. If platform clock is 400MHz, please use appropriate values of DIV2, PSR and PM to ensure that the bit rate clock for SSI does not exceed 12.285MHz. Can you please confirm that the P1022 ethernet input clock is actually 2 clocks: one for each eTSEC, with name TSECn_GTX_CLK125/GPIOm? The p1022 ballmap spreadsheet only shows one gtx_clk125 pin (like the 8536), but the current data sheet (Revision E) indicates there are two. The ball map shows only primary functions of a pin. By default both the eTSECs would share the same clock i.e TSEC1_GTX_CLK125 @Y29. If required, user can opt to use separate clock for eTSEC2 . The separate clock for eTSEC2 is multiplexed with TSEC_1588_TRIG_IN1@AH27 and can be configured using PMUXCR[6:7]. The SD card spec requires SD clock to supply for at least 74 clock cycles. On the other hand, the eSDHC controller in P1022 supplies about 13 SD clock cycles (with 180 degrees phase shift) at power up. Will SD card have any reliability issue by this fewer clock cycles than what is required by spec? No, SD card should not have the reliability issue. 74 clocks can be supplied by setting SYSCTL [INITA]. The 180 degree phase shift will not affect card or eSDHC IP block's operation. The phase shift is due to the synchronizer.

Does the PCIe controller go to D3 hot state automatically if the user does not configure any registers? Should the external device be in D3 hot state explicitly before P1022 goes to sleep mode? PCIe controller will not go to D3 hot state automatically. Software has to write Powerstate field of PMCSR register. If the downstream component is in D3 hot state, then permissible states for Upstream component are D0-D3hot. Refer Section 5.3.2 of Base specification 1.0a The Bus states are L1 or L2/L3 Ready if the power is going to be removed. The procedure for entry into these states is described in Section 5.3.2.1 and 5.3.2.3 What internal interrupt numbers are assigned to PCIe1 through PCIe3 in P1022? All PCIe interrupts in P1022 are error interrupts and are ORed with other error interrupts to result in "Error" which is mapped to #0 of the OPIC.

Can P1022 GPIO signals drive LEDs directly? What is the output current requirement (Iol / Ioh) for GPIO signals? Yes, P1022 GPIO signals can drive LEDs directly. When GPIO is driven HIGH, to maintain a voltage of 2.4V, no more than 2mA should be drawn from the IO and conversely to maintain a 0.4V when GPIO is driven LOW no more than 2mA should be sunk into the IO. Current limiting would have to be done through external resistors. Below are the current and voltage requirements: @3.3V Input high voltage VIH 2V Input low voltage VIL 0.8V Input current (OVIN = 0 V or OVIN = OVDD) IIN — ±40 μA2 Output high voltage (OVDD = min, IOH = –2 mA) VOH 2.4V Output low voltage (OVDD = min, IOL = 2 mA) VOL 0.4V @2.5V Input high voltage VIH 1.7V Input low voltage VIL 0.7V Input current (OVIN = 0 V or OVIN = OVDD) IIN — ±40 μA2 Output high voltage (OVDD = min, IOH = –2 mA) VOH 1.7V Output low voltage (OVDD = min, IOL = 2 mA) VOL 0.7V @1.8V Input high voltage VIH 1.2V Input low voltage VIL 0.6V Input current (OVIN = 0 V or OVIN = OVDD) IIN — ±40 μA2 Output high voltage (OVDD = min, IOH = –0.5 mA) VOH 1.35V Output low voltage (OVDD = min, IOL = 0.5 mA) VOL 0.4V Which registers are used to control the I/O states and data of GPIO1[], GPIO2[] and GPIO3[] signals when they are multiplexed as GPIO? Below registers are used to control the I/O states and data of GPIO1[], GPIO2[] and GPIO3[] signals: For GPIO1: Reg Correct Offset GPDIR : 0X000 GPODR : 0X004 GPDAT : 0X008 GPIER : 0X00C GPIMR : 0X010 GPICR : 0X014 For GPIO2: Reg Correct Offset GPDIR : 0X100 GPODR : 0X104 GPDAT : 0X108 GPIER : 0X10C GPIMR : 0X110 GPICR : 0X114 For GPIO3: Reg Correct Offset GPDIR : 0X200 GPODR : 0X204 GPDAT : 0X208 GPIER : 0X20C GPIMR : 0X210 GPICR : 0X214 P1022 Hardware Spec mentions that “USB1_STP pin must be set to the proper state during POR config”. Can you please elaborate on what could possibly be the proper setting for POR? USB1_STP is a personality pin with as yet undefined function when it is 1'b0. Please ensure that this pin is not pulled low during POR for P1022 and P1013. P1022EC revision F defines output delay time for eSDHC interface in table 52. Is there any specification regarding "output hold" time? If not, how should I consider about it? The min value of Output delay time becomes the output hold. ( Half clock period - |min khov| ) becomes the input hold for the receiver chip. How is the selection between eLBC and DIU signals done in P1022? Is it done through SPI signals? Why are SPI signals "-" in data phase of 16-bit GPCM? Selection between eLBC and DIU signals is done via PMUXCR [eLBC_DIU], and INDEPENDENTLY selection between eSPI, eLBC or eSDHC signals is done via PMUXCR[SPI_eLBC]. Thus for SPI signals user only needs to use PMUXCR[SPI_eLBC]. And for 32-bit GPCM user has to set BOTH PMUXCR[eLBC_DIU] and PMUXCR[SPI_eLBC]. Using the TDM interface in shared mode (Tx clk and sync are used for Tx and Rx), are pullups / pulldowns required for TDM_RCK and TDM_RFS in P1022? Actually the multiplexing happens at the SoC level and the selection of shared mode happens at the IP level, hence pins would not automatically revert to GPIO. It is recommended to be pulled to OVdd by 2k-10k. Can you please describe the procedure for timer soft reset and reconfiguration for P1022? Software must do the following before asserting TMR_CTRL[TMSR]: 1) Place the controller in graceful transmit stop (DMACTL[GTS]=1, wait for IEVENTGn[GTSC]=1) 2) Disable receive (MACCFG1[RX_EN]=0) Note: After setting timer soft reset (TMR_CTRL[TMSR]), software must leave the bit high for at least three 1588 reference clocks or tx_clk cycles, whichever is slower, before clearing the bit. How should I handle 2 CKSTP_OUT signals for P1022? Note 11 on Table 1 in the P1013EC states that these need a weak pullup resistor. However, Table 4-13 in the P1022RM shows that these 2 signal default to 1 (as part of cfg_rom_loc). Do these pins need pullups? The internal pull up for por_cfg pins is only for the duration when HRESET is asserted. So after POR pull up will be required. For handling this kind of a situation a tri state buffer with Enable tied to HRESET can be used. Add pull down at buffer input and pull up at buffer output. While HRESET is asserted, the pull down is visible on the buffer output. After HRESET deassertion, buffer output is tri stated and pull up on the output of buffer pulls up the CKSTP_OUT signal.

I would like to know if output signals of blocks which are not clocked during sleep mode are driven or not. For example, are eTSEC2 RGMII signals driven during sleep mode? Yes, they would be driven but there would be no activity on them. Please note that this is for "sleep" mode NOT "deep sleep" P1022 supports “Wake on LAN” from the Deep Sleep. If TSEC operates via SGMII it needs for SVDD,XVDD, SVDD2,VDD2, SDAVDD and SDAVDD2 (SGMII power). All these powers are switchable in the Deep Sleep. Can we leave these rails powered in the Deep Sleep and expect that the P1022 will support “Wake on LAN” via SGMII? Serdes is powered down during deep sleep, so Wake up on LAN is not supported for Deep Sleep in SGMII mode. Wake on LAN is supported for RGMII. Please note only eTSEC1 supports this feature. (Assuming eSTEC1 and eTSEC2 as the nomenclature) Are there any pull-downs for signals POWER_EN and ASLEEP on the P1022 board? Is BVDD switched off using POWER_EN? LOE has pull down via 4.7k ohms resistor as POR config. LWE has neither pull-up nor pull-down. Yes, BVdd is switched off using POWER_EN. What is the difference between P1022 and P1013 in terms of power dissipation and power management? In P1013 the Power supply pins for second core do need to be tied to their respective levels (although you can miss off the PLL filter for the unused core supply). So even when the second core is not used, it is powered. With TEST_SEL tied low (tie directly to ground) the second core is disabled and there should be no chance of accidental execution of code by second core.

Can you explain me the detailed description of bit functionality in field Error Capture ECC (ECE) for P1012/P1021? Following is the correct description of bits in Error Capture ECC (ECE): 0:7 -8-bit ECC for the 16 bits in beats 0 & 4 in 16-bit bus mode; should be ignored for 32-bit and 64-bit mode 8:15 -8-bit ECC for the 16 bits in beats 1 & 5 in 16-bit bus mode; should be ignored for 32-bit and 64-bit bus mode 16:23 -8-bit ECC for the 16 bits in beats 2 & 6 in 16-bit bus mode; for the 32 bits in beats 0 & 2 & 4 & 6 in 32-bit bus mode; should be ignored for 64-bit mode 24:31 -8-bit ECC for the 16 bits in beats 3 & 7 in 16-bit bus mode; for the 32 bits in beats 1 & 3 & 5 & 7 in 32-bit bus mode; should be used for every beat in 64-bit mode Bits 0:15 bits are not reserved in P1012/P1021. How can I support GPCM based Local Bus (like a boot NOR FLASH) on memory controller part with all 4 TDM ports in use due to pin mux restrictions in P1012/P1021? You can boot from GPCM as the pins as configured as eLBC signals by default. But if you intent to use them simultaneously, you cannot. You'll have to use some isolation logic on board to switch from one protocol to other. Is there a possibility to support higher density of DDR2/3 with P1021 at a later stage in design? For example JEDEC specifies 8Gbits density for DDR3. Yes, there is a possibility to support higher density devices in P1021. For a single discrete memory (single chip select), the max memory size that can be supported is 4GB. With a single chip-select we can support max of 4 GB, so with two chip-select we can support a maximum of 8 GB with two discrete devices. HW spec.

If boot sequencer is used with eSPI FLASH, can I enable it after boot sequencing is over in P1021? If I place config in eSPI FLASH, will it just overwrite whatever boot sequencer has done? Boot sequencer serves a different purpose. It runs before the core starts. Booting from an eSPI flash, the core has to be configured correctly and starts the Boot-ROM code on-chip. It runs after the boot sequencer if any. So you can enable eSPI FLASH if boot sequencer has done all the necessary configurations. Also, the configurations in an eSPI FLASH will overwrite any memory mapped registers. I want to run P1021 SPI in "SPI slave" mode. How should I configure SPI_SEL function for QE pin PB20? When you configure pins CPPARBx[SELn]=11 and CPDIRxB[DIRn] = 11, it will configure PB20 as SPI_SEL function.

For P1021 eTSEC, can I connect eTSEC RGMII with other vendor CPU/FPGA which also supports RGMII Ethernet MAC? In other words, the other side of eTSEC is not a PHY, but a MAC. You can definitely do that but you should remember to connect TX signals of P1021 to RX signals of another MAC and vice versa for MAC mode RGMII as shown below: P10xx_TXD [0:3] -> FPGA_RXD [0:3] P10xx_TX_CTL->FPGA_RX_CTL P10xx_TX_CLK->FPGA_RX_CLK P10xx_RXD [0:3]<-FPGA_TXD[0:3] P10xx_RX_CTL<-FPGA_TX_CTL P10xx_RX_CLK<-FPGA_TX_CLK Also, you have to take the clock delay into consideration. If I didn’t use RGMII, can MDIO/MDC and LVdd be configured at 3.3V for P1012/P1021? The LVdd bank can be operated at 2.5V (for RGMII) and 3.3V(MII/RMII). All the eTSEC IOs including MDIO and MDC can operate at both the voltages. I measured the rise/fall time for RMII interface (800ps) to be lower than P1012/P1021 hardware Spec requirement (min 1ns). Is that a problem? How can I rectify it? When a requirement/condition is specified in hardware spec, it means that we test/guarantee our device to work at that particular condition. For RMII, the hardware spec is inherited from the RMII spec, which states that the rise and fall time should be from 1ns to 5ns. The reason behind is that the RMII spec wants to simplify the layout requirement such that no termination or impedance matching is needed. Although it can be said that a faster rise/fall time is not likely to cause a failure, in order to meet the hardware spec and/or the RMII spec, below steps are recommended: 1. match impedance and add serial termination for the CLK, or 2. use a slower CLK source