Should I tie "UART_RTS_B01" to "0" while configuring signals sampled at reset in P1011? If eTSEC1 is required in RGMII mode then the POR configuration pins should be set to {EC_MDC,TSEC1_TXD0,TSEC1_TXD7} = {010} and if eTSEC3 is required in RGMII mode then {UART_RTS0,UART_RTS1,TSEC_1588_ALARM_OUT2} = {101} As all above signals default POR value is 1, you have to specify the signals that should be externally pull-down through a resistor when ever logic zero is required

When setting the ABSWP bit (in LBCR) in P1020, are the address bytes swapped or just mirrored? Also, can you confirm that the LBCR [ABSWP] affect every device (chip select) being used by the local bus except for the NAND Flash? By setting ABSWP bit (i.e. ABSWP=1), if address=0x12345678. Then LAD [0:15] = 0x7856 and LA[16:31]=0x5678. LBCR [ABSWP] affect every device (chip select) being used by the local bus except for the NAND Flash What is NAND Flash controller speed and size for P1011? AeLBC can work at 83 MHz. At minimum twc, it can be equal to 2 LCLK i.e. half the frequency of LCLK. The maximum page size supported by eLBC is 2K. If I use one mck to drive all 5 ddr3-chips in P1011, can I use the leveling function? Also, which topology do you recommend for this? Yes, writing leveling function should be used to compensate the additional flight time skew delay between different chips introduced by fly-by topology. However, we do not recommend routing the clock in fly-by topology while address, command and control signals routed by other topology. For more detail of JEDEC DDR3 routing topology, please visit [www.JEDEC.org]. Is a 32-bit data interface the only way to control whether or not ABSWP applies (i.e. ABSWP affects 8 and 16-bit data interfaces but does not affect 32-bit data interfaces)? ABSWP also affects 32-bit interface and it is not advisable to set ABSWP for 32 bit interface as only 16 LSB address gets visible on LAD[0:15] and zeroes are output on the LAD[16:31].

Referring to P1011 IBIS model, there are models of various pin type. Could you please provide brief description on each model name shown below (Extracted from P1010 IBIS file)? 1) DDR related inputs: ddr2_drvr_18, ddr2_drvr_35, ddr2_rcvr_150, ddr2_rcvr_50, ddr2_rcvr_75, ddr2_rcvr_noterm, ddr3_drvr_17, ddr3_drvr_40, ddr3_rcvr_120, ddr3_rcvr_60, ddr3_rcvr_noterm 2) opdalg_out, pouv_out, rx_pzctl, tx_pzctl, ptrmr100_cm 3) v180_in_wb, v330_in_wb, v250_wb, v250_in_wb, v180_wb, v330_wb For DDR related models: Model name shows DDR type and driver impedance. For example, ddr2_drvr_18 should be used for DDR2 and 18 ohm drive strength. For opdalg_out, pouv_out, ptrmr100_cm, rx_pzctl, tx_pzctl - The pins using these models don't have any other choice of model. For v180_in_wb, v330_in_wb, v250_wb, v250_in_wb, v180_wb, v330_wb - These should be chosen for the interfaces with LVCMOS I/Os like eLBC. The numbers in the name depict the voltage level, e.g. v180_in_wb is applicable for 1.8V receiver. For other models - Those are not utilized directly for any pin so user can ignore them.

For a single eTSEC, I am wiring two external devices via both its parallel interface and SGMII I/F at same time, and either of interfaces actually used will be determined by POR configuration pins. Is this usage possible? Yes. Please ensure that you all the related POR config pins are properly driven.

I would like to put pull-down on TRST- signal rather than using a gate to tie to HRESET- (and then switch the gate out for debug). What value of pull-down should I choose so that it will not interfere with USBTap JTAG operation. Does TRST- have an internal pullup? The TRST is active low signal in P1020, thus pulling it down will always keep JTAG in Reset position. For the proper working of SoC, The system must assert HRESET and TRST (Both active low), simultaneously. If there is no specific use-case which needs JTAG always in reset, then it is better to gate it with HRESET.

If SPI is not being used, how should SPI_CLK and SPI_MOSI be terminated in P1020/P1011? SPI_CLK and SPI_MOSI should be pulled up, if not used.

Can you give detailed information about P1011/20 clock in sources - SYSCLK, DDCCLK and eTSEC_Clock_125? Do these CLOCK source in support Spread Spectrum? What about SD_REF_CLK/SD_REF_CLK#? The spread spectrum parameters table in P1020 HW Spec is valid for SYSCLK and DDRCLK. Spread spectrum clock is not supported for EC_GTX_CLK125 (RGMII). For SERDES, SD_REF_CLK/SD_REF_CLK_B are designed to work with a spread spectrum clock (+0 to –0.5% spreading at 30–33 KHz rate is allowed), assuming both ends have same reference clock. For better results, a source without significant unintended modulation should be used. Please note that since SGMII doesn't support spread spectrum, if SGMII is used on any SERDES lane, spread spectrum should not be applied to SERDES REF Clock.

For P1020, having a target to achieve the max frequency on local bus what are the requirements on the clock that have to be met? You should pay close attention to the platform clock PLL filtering to minimize jitter. In general keep the bus as short as possible and the trace lengths matched for timing to meet the mentioned Hardware spec requirements.

If unused, how do I terminate following pins in P1011/P1020: SDHC_DATA[0:2], SDHC_DAT3, SPI_CS[0:3]/SDHC_DAT[4:7] and SPI_CS0_B/SDHC_DATA4? All the 3 pins SDHC_DATA[0:2], SDHC_DAT3 and SPI_CS[0:3]/SDHC_DAT[4:7] should be don't care if not used. Please leave SPI_CS0_B.SDHC_DATA4 as floating when not used. I have designed my P1011 board based on the older hardware spec, and found that AVDD_CORE0 and AVDD_CORE1 were swapped in newer hardware spec. At this time, it is difficult to cut the pattern for the current AVDD_CORE1. So 1.0V power applied to AVDD_CORE1 though core 1 is not used. Does this cause any problem? If AVDD_CORE1 is powered in single core device, there'll be no problem. But if AVDD_CORE0 is not powered in single core device, the device may not boot up. How should I handle pin W26,F16 pins in P1020? Just let them "NC", or need connect them to AVdd? If AVDD_CORE1 is not powered up i.e. connected to 1.0V, the single core p101x device cannot be boot up. Please implement the AVDD circuit at this stage.

Do you have any additional info on the USB VBUSCLMP pin. The manual says that it is the divided down Vbus. What is the divisor? The P1010 RDB schematic has a diode protecting this pin. What are the critical specifications for the diode? The diode was supposed to be used for in OTG mode. Since the USB phy in P1010 doesn't support OTG, you may choose to ignore it. The VBUS operates at 5V. But VBUSCLMP operates at 3.3V. So you should implement a potential divider to bring down 5V to 3.3V as shown in RDB. In case using on-chip USB PHY, low-speed mode is not supported at all? Or it can be supported if operating in "Host" mode? Low-speed mode (LS) is supported in Host mode but not in device mode. Can you tell me whether USB internal PHY on P1010 supports UTMI+ Level3 or not? UTMI+ Level3 is supported in P1010 Please advise how power supply to USB port should be controlled when using on-chip USB PHY. Without controlling through IFC bus (via CPLD) like P1010RDB schematic, is there other way to control for it? DRVVBUS should be used to control the external VBUS supply. By mistake this signal has been shown as a ULPI signal in P1010 RM because of which P1010RDB designer have not used it for externals VBUS control. About USBVDD1_8(J21,K21), on HWspec Table1 Notes 20 says that "20.This pin should be connected to Vss through 1μF.No need to supply power to this pin. 1.8V output may be observed on this pin during normal working conditions." Is it okay to tie J21 and K21 pins together and connect to Vss via a "single" 1uF capacitor? Or 1uF cap is required for each pin respectively? It should be okay to combine both the pins and connecting to Vss via single 1uF capacitor. If the whole USB (controller and PHY) is not used, user still needs to supply USBVDD3_3 power, Right? What is the reason?  Yes it is required to provide USBVDD3_3 even if USB controller and PHY are not used at all. This is a requirement from design to keep the logic in a sane state. If the whole USB is not used, does user need to follow power sequencing of USBVDD3_3, assuming USBVDD3_3 supply needs to be present? Following the sequence between USBVDD3_3 and other 3.3V supplies is not required. It is must to provide supply to USBVDD3_3 even if the USB PHY is not used. A suggestion, if USB PHY is not used customer can supply this pin with the same regulator which would be used to supply other 3.3V supply pins of SoC. Make sure that the ramp rate constraint is still followed for USBVDD3_3.

Section 4.4.3.11 in Reference Manual states, "Note that if SGMII mode is not selected on eTSEC1, then it is configured to be in RGMII mode." Yet the MAC is coming up disabled, not RGMII. How can I configure eTSEC1 in RGMII mode in this case? It is not possible to configure eTSEC1 in RGMII mode once it's configured in SGMII mode via POR configs. TSEC1 MAC appears to be disabled when set to mode "11" Table 4-19. Looking at the Table 15-17, it appears if I have them set ECNTRL fields and MACCFG2[I/F] fields for interface mode RGMII, with cfg_io_ports[0:1] = 11, then that should set TSEC1 to RGMII properly, with 2 independant PCIe X1 ports on SerDes SD2. Is that correct? DEVDISR[TSEC1] is 0 at reset. DEVDISR[TSEC2] = n => if PCIe is configured as x4 or SERDES is disabled, DEVDISR[TSEC2] will be disabled. DEVDISR[TSEC3]= n => if TSEC1 is used in MII, TSEC3 can be used only in SGMII. if PCIe is configured as x4 or SERDES is disabled, DEVDISR[TSEC3] = 1. Which P1010 TBI PHY register bit(s) should be used to determine SGMII link status? Is this the Remote Fault and Link Status bits of the P1010 TBI Status Register (SR) which is documented in section 15.5.4.1.2 of the P1010 Reference Manual?  Yes, this is the register (SR) which indicates link status and the above mentioned bits (Link Status/Remote Fault) are used to determine SGMII link status. The meaning of Remote Fault flag is that the PHY is not hearing (code group alignment is lost) the local end (MAC) and is sending this alarm towards the local end in hope the opposite direction works. This flag indicates unstable communication. Try reading it several times since each read clears it. If it reappears, there is something really wrong or misconfigured. The PHY normally shouldn't propagate this flag from the cable side, but check with its' documentation for the case. Read the PHY status through the management interface (MDIO) to check the status of the external link (the MIIMSTAT register). How does the P1010 TBI PHY register access work? Is only the local TBI PHY accessible from a given eTSEC's MDIO register interface or does assigning all TBI PHYs the same address result in collisions? P1010 TBI PHY register are read and written through the eTSEC MDIO registers just like external PHY registers. The address of each TBI PHY is set in the memory mapped TBIPA—TBI PHY address register. The uBoot TSEC device driver assigns the address 0x1f to all three TBI PHYs in the P1010 in their respective TBIPA registers. For the internal TBI block this is controlled by the TBIPA register for each eTSEC block. The reset value of this register is 0x0, which is not a valid PHY address. Therefore this register must be initialized for each TBI (thus SGMII) port in the system. For external PHY devices the address is typically a pin strapping option, so the designer must ensure that the PHY addresses of the external phys are different from any internal TBI that may be sharing that management interface.

P1010 has only a single pair of MCK signal, while my device has four Chip Select signals. In a scenario connecting a lot of memory devices under four CS, can the single pair of MCK really drive all of memory devices which are connected by fly-by topology on each CS? In case of P1010 (which has only one MCK), is it really practical to connect DDR3 memory devices under all of four CS? Would it be necessary to use "external CLK buffer" in such a case using four CS? P1010 was designed for low-cost systems, and as such some of the pins seen on other QorIQ devices (CKE2/3, ODT2/3) were removed to save on cost. For a single-rank, fly-by topology, only one CS would be used. If more ranks were needed, this would be addressed with stacked memories (DDR3 devices that take up to four CS signals). How does one set up the P1010 or P1014 for a 16 bit data bus size? To set the data bus width, you need to set DDR_SDRAM_CFG[DBW] bits of the register given in section 9.4.1.7, Page-9-20 of P1010RM Rev-B. Is it allowed to use four chip-selects with P1010? In my understanding, one ODT signal should be used and be controlled per chip-select? However P1010 has two MODT. P1010 is designed to use only one chip select with discrete DDR3 DRAM. This requires one CS, one ODT, and one CKE with one clock pair. Additional CS/ODT/CKE are designed for using stacked die DDR3 DRAMs. The four CS, two ODT & CKE, are useful if dual or quad stacked die discrete DDR3 DRAM were used. For the write leveling, does the P1010 use DQ[0,8,16,24] or use all DQ bit to drive status back to the DDR controller? P1010 DDR controller can support the write leveling status on any of the data bits within the data byte from a JEDEC standard DDR3 SDRAM.

Routing the DDR Memory Channel To help ensure the DDR interface is properly optimized, Freescale recommends routing the DDR memory channel in this specific order: 1. Data 2. Address/command/control 3. Clocks Note: The address/command, control, and data groups all have a relationship to the routed clock. Therefore, the effective clock lengths used in the system must satisfy multiple relationships. It is recommended that the designer perform simulation and construct system timing budgets to ensure that these relationships are properly satisfied. Routing DDR3 Data Signals The DDR interface data signals (MDQ[0:63], MDQS[0:8], MDM[0:8], and MECC[0:7]) are source-synchronous signals by which memory and the controller capture the data using the data strobe rather than the clock itself. When transferring data, both edges of the strobe are used to achieve the 2x data rate. An associated data strobe (DQS and DQS) and data mask (DM) comprise each data byte lane. This 11-bit signal lane relationship is crucial for routing (see Table 1). When length-matching, the critical item is the variance of the signal lengths within a given byte lane to its strobe. Length matching across all bytes lanes is also important and must meet the t DQSS parameter as specified by JEDEC. This is also commonly referred to as the write data delay window. Typically, this timing is considerably more relaxed than the timing of the individual byte lanes themselves: Table 1: Byte Lane to Data Strobe and Data Mask Mapping Data Data Strobe Data Mask Lane Number MDQ[0:7] MDQS0, MDQS0 MDM0 Lane 0 MDQ[8:15] MDQS1, !MDQS1 MDM1 Lane 1 MDQ[16:23] MDQS2, !MDQS2 MDM2 Lane 2 MDQ[24:31] MDQS3, !MDQS3 MDM3 Lane 3 MDQ[32:39] MDQS4, !MDQS4 MDM4 Lane 4 MDQ[40:47] MDQS5, !MDQS5 MDM5 Lane 5 MDQ[48:55] MDQS6, !MDQS6 MDM6 Lane 6 MDQ[56:63] MDQS7, !MDQS7 MDM7 Lane 7 MECC[0:7] MDQS8, !MDQS8 MDM8 Lane 8 DDR Signal Group Layout Recommendations Table 2 lists the layout recommendations for DDR signal groups and the benefit of following each recommendation: Table 2: DDR Signal Groups Layout Recommendations Recommendation Benefit Route each data lane adjacent to a solid ground reference for the entire route to provide the lowest inductance for the return currents Provides the optimal signal integrity of the data interface Note: This concern is especially critical in designs that target the top-end interface speed, because the data switches at 2x the applied clock When the byte lanes are routed, route signals within a byte lane on the same critical layer as they traverse the PCB motherboard to the memories Helps minimize the number of vias per trace and provides uniform signal characteristics for each signal within the data group Alternate the byte lanes on different critical layers Facilitates ease of break-out from the controller perspective, and keeps the signals within the byte group together

The on-chip ROM code does not set up any local access windows (LAWs). Access to the CCSR address space or the L2 cache does not require a LAW. It is the user’s responsibility to set up a LAW through a control word address/data pair for the desired target address and execution starting address (which is typically in either DDR or local bus memory space). Required Configurations for SD Card/MMC Booting The configuration settings required to boot from an SD card/MMC are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0111. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). Booting from the eSDHC interface can occur from different SD card slots if multiple SD card slots are designed on the board. In this case, ensure the appropriate SD card/MMC is selected For example, on the P5010 board, bit 7 of the SW8 is used to select which SD/MMC slot is used. If SW8[7] = 1, an SD card/MMC must be put to the external SD card/MMC slot (J1). TIP The polarity of the SDHC_CD signal should be active-low.  Required Configurations for EEPROM Booting The configuration settings required to boot from an EEPROM are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0110. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). The eSPI chip select 0 (SPI_CS[0]) must be connected to the EEPROM that is used for booting. No other chip select can be used for booting. This is because during booting, the eSPI controller is configured to operate in master mode. Booting from the eSPI interface only works with SPI_CS[0].

The on-chip ROM code does not set up any local access windows (LAWs). Access to the CCSR address space or the L2 cache does not require a LAW. It is the user’s responsibility to set up a LAW through a control word address/data pair for the desired target address and execution starting address (which is typically in either DDR or local bus memory space). Required Configurations for SD Card/MMC Booting The configuration settings required to boot from an SD card/MMC are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0111. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). Booting from the eSDHC interface can occur from different SD card slots if multiple SD card slots are designed on the board. In this case, ensure the appropriate SD card/MMC is selected For example, on the P4080 board, bit 7 of the SW8 is used to select which SD/MMC slot is used. If SW8[7] = 1, an SD card/MMC must be put to the external SD card/MMC slot (J1). TIP The polarity of the SDHC_CD signal should be active-low.  Required Configurations for EEPROM Booting The configuration settings required to boot from an EEPROM are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0110. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). The eSPI chip select 0 (SPI_CS[0]) must be connected to the EEPROM that is used for booting. No other chip select can be used for booting. This is because during booting, the eSPI controller is configured to operate in master mode. Booting from the eSPI interface only works with SPI_CS[0].

Routing the DDR Memory Channel To help ensure the DDR interface is properly optimized, Freescale recommends routing the DDR memory channel in this specific order: 1. Data 2. Address/command/control 3. Clocks Note: The address/command, control, and data groups all have a relationship to the routed clock. Therefore, the effective clock lengths used in the system must satisfy multiple relationships. It is recommended that the designer perform simulation and construct system timing budgets to ensure that these relationships are properly satisfied. Routing DDR3 Data Signals The DDR interface data signals (MDQ[0:63], MDQS[0:8], MDM[0:8], and MECC[0:7]) are source-synchronous signals by which memory and the controller capture the data using the data strobe rather than the clock itself. When transferring data, both edges of the strobe are used to achieve the 2x data rate. An associated data strobe (DQS and DQS) and data mask (DM) comprise each data byte lane. This 11-bit signal lane relationship is crucial for routing (see Table 1). When length-matching, the critical item is the variance of the signal lengths within a given byte lane to its strobe. Length matching across all bytes lanes is also important and must meet the t DQSS parameter as specified by JEDEC. This is also commonly referred to as the write data delay window. Typically, this timing is considerably more relaxed than the timing of the individual byte lanes themselves: Table 1: Byte Lane to Data Strobe and Data Mask Mapping Data Data Strobe Data Mask Lane Number MDQ[0:7] MDQS0, MDQS0 MDM0 Lane 0 MDQ[8:15] MDQS1, !MDQS1 MDM1 Lane 1 MDQ[16:23] MDQS2, !MDQS2 MDM2 Lane 2 MDQ[24:31] MDQS3, !MDQS3 MDM3 Lane 3 MDQ[32:39] MDQS4, !MDQS4 MDM4 Lane 4 MDQ[40:47] MDQS5, !MDQS5 MDM5 Lane 5 MDQ[48:55] MDQS6, !MDQS6 MDM6 Lane 6 MDQ[56:63] MDQS7, !MDQS7 MDM7 Lane 7 MECC[0:7] MDQS8, !MDQS8 MDM8 Lane 8 DDR Signal Group Layout Recommendations Table 2 lists the layout recommendations for DDR signal groups and the benefit of following each recommendation: Table 2: DDR Signal Groups Layout Recommendations Recommendation Benefit Route each data lane adjacent to a solid ground reference for the entire route to provide the lowest inductance for the return currents Provides the optimal signal integrity of the data interface Note: This concern is especially critical in designs that target the top-end interface speed, because the data switches at 2x the applied clock When the byte lanes are routed, route signals within a byte lane on the same critical layer as they traverse the PCB motherboard to the memories Helps minimize the number of vias per trace and provides uniform signal characteristics for each signal within the data group Alternate the byte lanes on different critical layers Facilitates ease of break-out from the controller perspective, and keeps the signals within the byte group together

Routing the DDR Memory Channel To help ensure the DDR interface is properly optimized, Freescale recommends routing the DDR memory channel in this specific order: 1. Data 2. Address/command/control 3. Clocks Note: The address/command, control, and data groups all have a relationship to the routed clock. Therefore, the effective clock lengths used in the system must satisfy multiple relationships. It is recommended that the designer perform simulation and construct system timing budgets to ensure that these relationships are properly satisfied. Routing DDR3 Data Signals The DDR interface data signals (MDQ[0:63], MDQS[0:8], MDM[0:8], and MECC[0:7]) are source-synchronous signals by which memory and the controller capture the data using the data strobe rather than the clock itself. When transferring data, both edges of the strobe are used to achieve the 2x data rate. An associated data strobe (DQS and DQS) and data mask (DM) comprise each data byte lane. This 11-bit signal lane relationship is crucial for routing (see Table 1). When length-matching, the critical item is the variance of the signal lengths within a given byte lane to its strobe. Length matching across all bytes lanes is also important and must meet the t DQSS parameter as specified by JEDEC. This is also commonly referred to as the write data delay window. Typically, this timing is considerably more relaxed than the timing of the individual byte lanes themselves: Table 1: Byte Lane to Data Strobe and Data Mask Mapping Data Data Strobe Data Mask Lane Number MDQ[0:7] MDQS0, MDQS0 MDM0 Lane 0 MDQ[8:15] MDQS1, !MDQS1 MDM1 Lane 1 MDQ[16:23] MDQS2, !MDQS2 MDM2 Lane 2 MDQ[24:31] MDQS3, !MDQS3 MDM3 Lane 3 MDQ[32:39] MDQS4, !MDQS4 MDM4 Lane 4 MDQ[40:47] MDQS5, !MDQS5 MDM5 Lane 5 MDQ[48:55] MDQS6, !MDQS6 MDM6 Lane 6 MDQ[56:63] MDQS7, !MDQS7 MDM7 Lane 7 MECC[0:7] MDQS8, !MDQS8 MDM8 Lane 8 DDR Signal Group Layout Recommendations Table 2 lists the layout recommendations for DDR signal groups and the benefit of following each recommendation: Table 2: DDR Signal groups Layout Recommendations Recommendation Benefit Route each data lane adjacent to a solid ground reference for the entire route to provide the lowest inductance for the return currents Provides the optimal signal integrity of the data interface Note: This concern is especially critical in designs that target the top-end interface speed, because the data switches at 2x the applied clock When the byte lanes are routed, route signals within a byte lane on the same critical layer as they traverse the PCB motherboard to the memories Helps minimize the number of vias per trace and provides uniform signal characteristics for each signal within the data group Alternate the byte lanes on different critical layers Facilitates ease of break-out from the controller perspective, and keeps the signals within the byte group together

The on-chip ROM code does not set up any local access windows (LAWs). Access to the CCSR address space or the L2 cache does not require a LAW. It is the user’s responsibility to set up a LAW through a control word address/data pair for the desired target address and execution starting address (which is typically in either DDR or local bus memory space). Required Configurations for SD Card/MMC Booting The configuration settings required to boot from an SD card/MMC are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0111. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). Booting from the eSDHC interface can occur from different SD card slots if multiple SD card slots are designed on the board. In this case, ensure the appropriate SD card/MMC is selected For example, on the P2040 board, bit 7 of the SW8 is used to select which SD/MMC slot is used. If SW8[7] = 1, an SD card/MMC must be put to the external SD card/MMC slot (J1). TIP The polarity of the SDHC_CD signal should be active-low.  Required Configurations for EEPROM Booting The configuration settings required to boot from an EEPROM are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0110. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). The eSPI chip select 0 (SPI_CS[0]) must be connected to the EEPROM that is used for booting. No other chip select can be used for booting. This is because during booting, the eSPI controller is configured to operate in master mode. Booting from the eSPI interface only works with SPI_CS[0].

Routing the DDR Memory Channel To help ensure the DDR interface is properly optimized, Freescale recommends routing the DDR memory channel in this specific order: 1. Data 2. Address/command/control 3. Clocks Note: The address/command, control, and data groups all have a relationship to the routed clock. Therefore, the effective clock lengths used in the system must satisfy multiple relationships. It is recommended that the designer perform simulation and construct system timing budgets to ensure that these relationships are properly satisfied. Routing DDR3 Data Signals The DDR interface data signals (MDQ[0:63], MDQS[0:8], MDM[0:8], and MECC[0:7]) are source-synchronous signals by which memory and the controller capture the data using the data strobe rather than the clock itself. When transferring data, both edges of the strobe are used to achieve the 2x data rate. An associated data strobe (DQS and DQS) and data mask (DM) comprise each data byte lane. This 11-bit signal lane relationship is crucial for routing (see Table 1). When length-matching, the critical item is the variance of the signal lengths within a given byte lane to its strobe. Length matching across all bytes lanes is also important and must meet the t DQSS parameter as specified by JEDEC. This is also commonly referred to as the write data delay window. Typically, this timing is considerably more relaxed than the timing of the individual byte lanes themselves: Table 1: Byte Lane to Data Strobe and Data Mask Mapping Data Data Strobe Data Mask Lane Number MDQ[0:7] MDQS0, MDQS0 MDM0 Lane 0 MDQ[8:15] MDQS1, !MDQS1 MDM1 Lane 1 MDQ[16:23] MDQS2, !MDQS2 MDM2 Lane 2 MDQ[24:31] MDQS3, !MDQS3 MDM3 Lane 3 MDQ[32:39] MDQS4, !MDQS4 MDM4 Lane 4 MDQ[40:47] MDQS5, !MDQS5 MDM5 Lane 5 MDQ[48:55] MDQS6, !MDQS6 MDM6 Lane 6 MDQ[56:63] MDQS7, !MDQS7 MDM7 Lane 7 MECC[0:7] MDQS8, !MDQS8 MDM8 Lane 8 DDR Signal Group Layout Recommendations Table 2 lists the layout recommendations for DDR signal groups and the benefit of following each recommendation: Table 2: DDR Signal Groups Layout Recommendations Recommendation Benefit Route each data lane adjacent to a solid ground reference for the entire route to provide the lowest inductance for the return currents Provides the optimal signal integrity of the data interface Note: This concern is especially critical in designs that target the top-end interface speed, because the data switches at 2x the applied clock When the byte lanes are routed, route signals within a byte lane on the same critical layer as they traverse the PCB motherboard to the memories Helps minimize the number of vias per trace and provides uniform signal characteristics for each signal within the data group Alternate the byte lanes on different critical layers Facilitates ease of break-out from the controller perspective, and keeps the signals within the byte group together

The on-chip ROM code does not set up any local access windows (LAWs). Access to the CCSR address space or the L2 cache does not require a LAW. It is the user’s responsibility to set up a LAW through a control word address/data pair for the desired target address and execution starting address (which is typically in either DDR or local bus memory space). Required Configurations for SD Card/MMC Booting The configuration settings required to boot from an SD card/MMC are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0111. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). Booting from the eSDHC interface can occur from different SD card slots if multiple SD card slots are designed on the board. In this case, ensure the appropriate SD card/MMC is selected For example, on the P1020 board, bit 7 of the SW8 is used to select which SD/MMC slot is used. If SW8[7] = 1, an SD card/MMC must be put to the external SD card/MMC slot (J1). TIP The polarity of the SDHC_CD signal should be active-low.  Required Configurations for EEPROM Booting The configuration settings required to boot from an EEPROM are as follows: Ensure that cfg_rom_loc[0:3] (Boot_Rom_Loc) are driven with a value of 0b0110. Only one core can be in booting mode. If your device has multiple cores, all other cores must be in a boot hold-off mode. The CPU boot configuration input, cfg_cpux_boot, should be 0, where x is from 1 to n (n = the number of cores). The eSPI chip select 0 (SPI_CS[0]) must be connected to the EEPROM that is used for booting. No other chip select can be used for booting. This is because during booting, the eSPI controller is configured to operate in master mode. Booting from the eSPI interface only works with SPI_CS[0].