The datasheet doesn't appear to address the question of how to handle the exposed center pad of the QFN packages for the KL03 MCUs. Ground it? Leave it floating?
Thanks,
Scott
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Hello Scott,
I think that the Application Note AN1902 is what you are looking for. It has relevant information regarding hardware considerations for the QFN packages. Please take a look specially in the section 4.2.2 Thermal/Electrical Pad Guidelines.
Best regards,
Earl Ramírez.
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Hello Scott,
I think that the Application Note AN1902 is what you are looking for. It has relevant information regarding hardware considerations for the QFN packages. Please take a look specially in the section 4.2.2 Thermal/Electrical Pad Guidelines.
Best regards,
Earl Ramírez.
/* If this post answers your question please click the Correct Answer button. */