For the KL03 in QFN pkg., should the center pad be grounded?

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For the KL03 in QFN pkg., should the center pad be grounded?

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Contributor II

The datasheet doesn't appear to address the question of how to handle the exposed center pad of the QFN packages for the KL03 MCUs.  Ground it?  Leave it floating?

Thanks,

Scott

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Senior Contributor II

Hello Scott,

I think that the Application Note AN1902​ is what you are looking for. It has relevant information regarding hardware considerations for the QFN packages. Please take a look specially in the section 4.2.2 Thermal/Electrical Pad Guidelines.

Best regards,

Earl Ramírez.

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NXP Employee
NXP Employee

Hi Scott,

yes the exposed center pad has to be grounded.

Best Regards,

Stano.

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Contributor II

Thank you!  Is this documented some place, and I just missed it?

Scott

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24 Views
Senior Contributor II

Hello Scott,

I think that the Application Note AN1902​ is what you are looking for. It has relevant information regarding hardware considerations for the QFN packages. Please take a look specially in the section 4.2.2 Thermal/Electrical Pad Guidelines.

Best regards,

Earl Ramírez.

/* If this post answers your question please click the Correct Answer button. */

View solution in original post