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The documentation is the V2 version has added some FAQs for development based on NXP's i.MX 6UL/6ULL ARM Cortex-A7 processors. MYIR provides a series of i.MX 6UL/6ULL based products including SoM, SBC, development board and HMI display panel.   MYS-6ULX | NXP i.MX 6UL / 6ULL SBC Board for IoT and Industry Applications  MYC-Y6ULX CPU Module | NXP i.MX 6UL, i.MX 6ULL SOM | ARM Cortex-A7 Processor    MYD-Y6ULX | NXP i.MX 6UL, i.MX 6ULL Development Board / SOM, ARM Cortex-A7 Processor MYD-Y6ULX-HMI Development Board | NXP i.MX 6UL/6ULL Board for HMI Applications    MYD-Y6ULX-CHMI Display Panel | NXP i.MX 6UL/6ULL based 7-inch HMI Solution MYIR is pleased to share the experience with more developers. 
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Windows Embedded Compact 7 Board Support Package for Freescale(R) Semiconductor’s Smart Applications Blueprint for Rapid Engineering (SABRE) Platform for Smart Devices based on the i.MX 6 Quad processor iWave Systems, a genuine embedded service provider, announces the official release of Windows Embedded Compact 7 Board Support Package (BSP) for Freescale(r) Semiconductor’s SABRE platform for smart devices based on the i.MX 6Quad applications processor. The BSP includes the advanced features which enable the Original Equipment Manufacturers (OEMs) to quickly prototype their solution around Freescale’s i.MX 6 series processor together with the flexibility and robustness offered by Windows Embedded Compact 7. With BSP support and customization offered by iWave, OEMs can build the advanced embedded devices with reduced cost and an early time to market approach. The BSP is targeted for Freescale’s SABRE platform for smart devices which is powered by the i.MX 6Quad applications processor and MMPF0100 Freescale PMIC. The BSP provides support for the advanced multimedia and connectivity options that can be used in high-performance and cost effective consumer, industrial and medical devices. The Windows Embedded Compact 7 BSP release for the SABRE platform supports the major features sets such as storage, networking, display and multimedia. Also the BSP can be quickly customized for the specific need of the customer, which results in quick time to market and lowers the overall development cost. BSP also includes the premium features such as Multimedia framework and OpenVG/OpenGL ES for graphics processing which utilizes the Video Processing Unit (VPU) and Graphics Processing Unit (GPU) capabilities of i.MX 6 series processors. These features make the BSP package ideal for rich multimedia and high-end 3D graphics-based devices such as consumer, industrial and medical tablets and IVI systems. The BSP supports SATA 3.0 and Standard SD/SDIO for storage, Ethernet for networking and LVDS/HDMI 1080p for display options. It also includes the driver for VPU to support the hardware based media compression and decompression (Codec) for industry standard media formats such as H.264, MPEG-4 and H.263 for multimedia applications. Windows Embedded Compact 7 brings in real-time computing capabilities along with support for multi-processing with Symmetric Multi-Processing (SMP), extended RAM support and rich user interface support with Microsoft Silverlight for Windows Embedded. Windows Embedded Compact 7 also provides the developers with rich tools for rapid application development and debugging, which creates a powerful software environment for the development of embedded applications. For more details please visit: http://www.iwavesystems.com/product/board-support-packages/wec7-on-i-mx6-sabre-sdp/wec7-on-i-mx6-sabre-sdp.html “We are pleased to launch Windows Embedded Compact 7 on Freescale’s SDP which supports the major feature sets such as Storage, Networking, Display & Multimedia” says M A Mohamed Saliya, Managing Director, iWave Systems. “Our solution enables faster and easier customization for optimising the product development cycle time, ensuring the best quality.” “We are excited to work with our Windows Embedded partner iWave Systems to help OEMs bring high performing, reliable and differentiated devices based on Windows Embedded Compact 7 to market more quickly”, said Steven Bridgeland, product manager for Windows Embedded at Microsoft. “Working together with iWave Systems continues to be at the forefront of innovation in specialized devices, creating new opportunities to develop innovative connected devices for intelligent systems across the enterprise and industrial applications.” “iWave’s feature rich WEC7 BSP for Freescale’s SABRE platform for smart devices based on i.MX 6Quad is highly helpful for quick prototyping and this BSP can be customized for any end product in very short possible time.   iWave has vast expertise in WinCE BSP and in-house technical support for various Freescale processors from  i.MX27, i.MX51, i.MX53 to i.MX 6 series, this has been beneficial to many of our product customers as iWave reference designs have helped streamline their cycle time”. Ken Obuszewski, Director of i.MX Product Marketing of Freescale’s Microcontroller Group About iWave Systems: iWave systems brings the expertise of building Windows Embedded based solutions on latest ARM platforms, with deep technical expertise in providing the Board Support Packages(BSP) for various ARM core platforms such as from Freescale and Texas Instruments. The BSP completely confronts to the Microsoft’s PQOAL (Production quality OEM Adaption layer) specification which follows layer based architecture for separating the OEM specific code from generic part of the code.
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Timesys can help you build your custom BSP/SDK in minutes with FREE LinuxLink web edition   Use LinuxLink Web Edition to build a custom BSP/SDK for your board within a few minutes. Start your application development with the free version of our Eclipse-based TimeStorm IDE. Browse a sub-set of our vast documentation library. Get notified via email of any updates to the Linux kernel and middleware/packages for your BSP/SDK   Click here to start building your custom BSP/SDK.  
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In this demo, you can see how the low level BSP/driver expertise along with application development expertise of Adeneo Embedded can be combined to get the best results on a powerful platform like i.MX6 SABRE Platform For more information, contact: sales@adeneo-embedded.com
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Why Freescale Sabre Smart i.MX6 Solo X SD2 slot do not detect SD card insertion / removal while SD3 does? 1.   How SDIO detection works on i.MX6?      First, we checked how the i.MX6 CPU detect SDIO card insertion / removal.      Freescale i.MX6 Solo X Reference Manual (IMX6SXRM.pdf) Section 68.4.7 "Card Insertion and Removal Detection" says that;           "The uSDHC uses either the DATA3 pin or the CD_B pin to detect card      insertion or removal. When there is no card on the MMC/SD bus, the      DATA3 will be pulled to a low voltage level by default"     "When the DATA3 pin is not used for card detection (for example,      it is implemented in GPIO), the CD_B pin must be connected for card      detection. Whether DATA3 is configured for card detection or not,      the CD_B pin is always a reference for card detection." Based on this description, It seems that DATA3 is used for card detection. But it isn't. 2.  Implementation on Sabre i.MX6 SoloX We checked voltage on DATA3(PIN1) on both SD2 and SD3 slot when card is not inserted. Both were 3.3V. Neither SD2 nor SD3 DATA3 was "pulled to a low voltage level by default".      Then, we checked CD pin. In the case of SD3, it was 3.3V when card is not inserted, then fall to 0V when card is inserted. That cause card detection. In the case of SD2, CD pin was all time 0V. Sabre i.MX6SX Schematic confirms that CD pin of SD2 slot is not connected to anywhere (see attached image).                                                     Sabre SoloX SD2                                                                                                                                                               Sabre SoloX SD3 "CD(Card Detect)" is not a SDIO pin. SDIO has only 9pins, where 9 DAT2 1 DAT3 2 CMD 3 VSS1 (GND) 4 VDD 5 CLK 6 VSS2 (GND) 7 DAT0 8 DAT1 - CD (Card Detection) and WP (Write Protect) are function of SD slot connector, not function of SDIO bus. 3.  Implementation on Sabre i.MX6Q We checked i.MX6Q Sabre Smart. Again, DATA3 (pin1) voltage was 3.3V both on SD2 and SD3. Schematic shows there are register pattern prepared to pull down DATA3, but both R549 on SD3 and R667 SD3 are not populated (DNP) as default.                                                           Sabre i.MX6Q SD2                                                                                                                                                     Sabre i.MX6Q SD3  4.  Conclusion From this we can infer that Freescale reference design (Sabre i.MX6Q and i.MX6SX) do not use DATA3 for SDIO detection, as it appears to have been described in the reference manual. Both Sabre i.MX6Q and i.MX6SX solely relies on CD(Card Detect) signal from SDIO connector. In the case of SD2 slot on i.MX6SX, CD signal is not connected to anywhere.There where unpopulated DATA3 pull-down register pattern prepared on Sabre i.MX6Q, but it is omitted from i.MX6SX. Which makes card insertion / removal detection on Sabre i.MX6SX SD2 slot difficult.
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iWave now has released the official Yocto BSP for its i.MX 6 Qseven modules (iW-RainboW-G15M-Q7) and i.MX 6 development kit variants. The release is based on Linux 3.10.17 kernel and supports the following features; i.MX6 ARM Cortex A9 Quad, Dual, Dual Lite & Solo CPU 1GB DDR3 RAM (Quad, Dual, Dual Lite CPU version)/ 512MB DDR3 (Solo CPU version) Freescale PMIC SPI NOR Flash (default boot) eMMC Flash (default OS storage) Data UART uSD slot Standard SD slot USB 2.0 Host USB 2.0 device 10/100/1000 Ethernet PCIex1 Port SATA Port CAN Port LVDS display port (Dual) PWM for backlight HDMI Port with Audio 7”TFT LCD with capacitive touch Hardware Codecs (Encode/Decode) 2D/3D Graphics CMOS CSI camera port MIPI CSI camera port AC97 Audio In/Out Console UART RTC (i.MX6 Internal) I2C Port Sensors Watchdog GPIOs This release supports single BSP, Binary image & MFG tool for all the four i.MX6 CPU version (Quad/Dual/Dual Lite/Solo) based Qseven SOMs. Besides the Linux Yocto BSP support, Android Jelly Bean and Windows Embedded Compact 7 (WEC7) board support packages are also supported for the i.MX6 Qseven modules (Rainbow G15M-Q7) by iWave. More details about the i.MX6 Qseven modules (Rainbow G15M-Q7) hardware & software features can be found in the i.MX6 Qseven SOM product page. For further information or enquiries please write to mktg@iwavesystems.com
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iWave's i.MX6 Quad/Dual development kit Rainbow-G15D integrates all standard interfaces into a highly integrated Nano ITX form factor that can be utilized across multiple Embedded PC, Systems and Industrial Designs. It has got all the necessary functions that the embedded application demands. i.MX6 Quad/Dual development kit is supported with Windows Embedded Compact 7 Board Support Package which includes all the major peripherals and devices supported by i.MX6 CPU. With UART debug, CAN and Ethernet, this BSP provides efficient debug and communication support. With SD/MMC, USB and SATA, this BSP provides efficient storage interfaces. The OpenGL and OpenVG provides rich graphics which is further accelerated by the 2D and 3D hardware accelerator of i.MX6 processor. The user can develop rich graphical user interface with Silverlight 3.0 and Expression Blend. Active sync is also available to synchronize the device. iWave Systems has implemented dual display feature on Rainbow G15D which displays the same clone content on two different LVDS display panels. Here we have two LVDS LCDs of XGA resolutions displaying the WEC7 desktop in Rainbow G15D platform. Two 10.4” LVDS LCDs are connected to the i.MX6 Quad CPU. Now you are viewing 1080p MPEG4 video playback on both the LCD screens. Video: http://www.youtube.com/watch?v=BlVOPSjjJq8 Video Link : 1413
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The FSL Community BSP 1.6 has been released featuring several updates including: Yocto Project 1.6 support Integration of 3.10.17-1.0.0 GA release for i.MX6 platforms U-Boot 2014.01 Linux Kernel 3.14 For the detailed announcement, please check: https://lists.yoctoproject.org/pipermail/meta-freescale/2014-May/008490.html
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Inverse Path is proud to announce the USB armory project, an open source hardware design, implementing a flash drive sized computer for security applications. The USB armory is a compact USB powered device that provides a platform for developing and running a variety of applications. The security features of the USB armory System on a Chip (SoC), combined with the openness of the board design, empower developers and users with a fully customizable USB trusted device for open and innovative personal security applications. The USB armory hardware is supported by standard software environments and requires very little customization effort. In fact vanilla Linux kernels and standard distributions run seamlessly on the tiny USB armory board. The capability of emulating arbitrary USB devices in combination with the SoC speed, the security features and the flexible and fully customizable operating environment, makes the USB armory the ideal platform for all kinds of personal security applications. The Inverse Path team, with the help of the open source community, will develop applications that fully explore the potential of the USB armory board. The USB armory will be available for pre-order soon. Delivery of the device before the end of 2014 is planned. Target applications: mass storage device with advanced features such as automatic encryption, virus scanning, host authentication and data self-destruct OpenSSH client and agent for untrusted hosts (kiosk) router for end-to-end VPN tunnelling, Tor password manager with integrated web server electronic wallet (e.g. pocket Bitcoin wallet) authentication token portable penetration testing platform low level USB security testing Key features: Freescale i.MX53 ARM® Cortex™-A8 800Mhz, 512MB DDR3 RAM USB host powered (<500 mA) device with compact form factor (65 x 19 x 6 mm) ARM® TrustZone®, secure boot + storage + RAM microSD card slot 5-pin breakout header with GPIOs and UART customizable LED, including secure mode detection excellent native support (Android, Debian, Ubuntu, FreeBSD) USB device emulation (CDC Ethernet, mass storage, HID, etc.) Open Hardware & Software http://inversepath.com/usbarmory
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Technologic Systems carries a full spectrum of off-the-shelf products powered by the NXP/Freescale i.MX 6 ARM CPU including single board computers, computer-on-modules, and touch panel PCs.  Read about it in their iMX6 Boards, Modules, and Touch Panels Portfolio​ page.  The portfolio features off-the-shelf products: TS-4900 High Performance WiFi & Bluetooth Enabled 1 GHz i.MX6 Computer-on-Module TS-7970 WiFi & Bluetooth Enabled 1 GHz i.MX6 Single Board Computer TS-TPC-7990 7" Capacitive or Resistive Touch Panel PC TS-TPC-8950-4900 10'' High Performance Mountable Touch Panel PC TS-8550 TS-SOCKET Development Baseboard All i.MX6 products come with a choice of Linux, Windows, Android, or QNX operating system, have a plethora of industry standard connections, industrial temperature ranges, and long lifecycle guarantee.  If an off-the-shelf solution doesn't quite match your needs, custom hardware and software engineering services are also available. Thanks, Derek Hildreth eBusiness Manager Technologic Systems www.embeddedarm.com About Technologic Systems Technologic Systems has been in business for 32 years, helping more than 8000 OEM customers and building over a hundred COTS products that have never been discontinued. Our commitment to excellent products, low prices, and exceptional customer support has allowed our business to flourish in a very competitive marketplace. We offer a wide variety of single board computers, computer-on-modules, touch panel computers, PC/104 and other peripherals, and industrial controllers that satisfy most embedded project requirements. We also offer custom configurations and design services. We specialize in the ARM and X86 architectures, FPGA IP-core design, and open-source software support, providing advanced custom solutions using hardware-software co-design strategies.
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iWave Systems launched Industry's latest i.MX 6 processor based Digital Signage Solution. Digital Signage enables users to display their messages more dynamically and effectively. Dynamic images are more appealing and can convey considerably more information than static ones can. iWave’s new Digital Signage Solution integrates all standard interfaces into a single board with ultra compact yet highly integrated platform that can be utilized across multiple Digital Signage like Meeting Room Signage, Digital Menu Boards, e-Posters, Network Media Players and other Commercial Displays. Freescale i.MX6 Processor based Digital Signage Solution from iWave Systems iWave’s Digital Signage Solution is based on ARM Cortex™-A9 core i.MX6 Q/D/DL/S processor which can operate up to 1GHz with 2D and 3D graphics processors, 1080p video processing, and integrated power management. The platform is designed to support extended temperature, which can operate from -20C to +85C temperature range. The board comes with industrially standardized Pico-ITX (100 x 72mm) form factor. The Digital Signage application was demonstrated on Pico ITX box with Android ICS OS. The application provides the features of updating the content from remote web browser, playback of video content, image, HTML web pages and scrolling text messages. More details about the digital signage solution can be found in the following links; iWave’s i.MX6 based Digital Signage Solution iWave's RainboW-G15S | iWave Systems Website: www.iwavesystems.com E-mail: mktg@iwavesystems.com
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NXP i.MX 8X SoC, quad-core ARM Cortex-A35, 1.2GHz Integrated 2D/3D GPU and 4K VPU Up to 4GB LPDDR4 and 64GB eMMC 2x MIPI-DSI / LVDS, up-to 1080p60 Certified dual-band WiFi 802.11ac, BT 4.2 2x GbE, PCIe, 4x USB, 3x CAN-FD, 96x GPIO Yocto Linux - BSP and ready-to-run images Industrial temperature range: -40° to 85° C 10-year availability CompuLab's CL-SOM-iMX8X is a miniature System-on-Module board designed for integration into industrial embedded applications. Bringing out the full capabilities of the NXP i.MX8X SoC, CL-SOM-iMX8X provides high performance and versatile connectivity in a miniature (36 x 68 mm) form-factor. CL-SOM-iMX8X Detailed Spec CL-SOM-iMX8X Development Kit CL-SOM-iMX8X Online Pricing
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以下代码摘抄自:uboot 2009源码中board/Freescale/mx6q_sabreauto/flash_header.S #include <config.h> #include <asm/arch/mx6.h> #ifdef CONFIG_FLASH_HEADER #ifndef CONFIG_FLASH_HEADER_OFFSET # error "Must define the offset of flash header" #endif #define CPU_2_BE_32(l) \ ((((l) & 0x000000FF) << 24) | \ (((l) & 0x0000FF00) << 😎 | \ (((l) & 0x00FF0000) >> 😎 | \ (((l) & 0xFF000000) >> 24)) #define MXC_DCD_ITEM(i, addr, val) \ dcd_node_##i: \ .word CPU_2_BE_32(addr) ; \ .word CPU_2_BE_32(val) ; \ .section ".text.flasheader", "x" b _start .org CONFIG_FLASH_HEADER_OFFSET ivt_header: .word 0x402000D1 /* Tag=0xD1, Len=0x0020, Ver=0x40 */ app_code_jump_v: .word _start reserv1: .word 0x0 dcd_ptr: .word dcd_hdr boot_data_ptr: .word boot_data self_ptr: .word ivt_header app_code_csf: .word 0x0 reserv2: .word 0x0 boot_data: .word TEXT_BASE image_len: .word _end_of_copy - TEXT_BASE + CONFIG_FLASH_HEADER_OFFSET plugin: .word 0x0 dcd_hdr: .word 0x40D802D2 /* Tag=0xD2, Len=90*8 + 4 + 4, Ver=0x40 */ write_dcd_cmd: .word 0x04D402CC /* Tag=0xCC, Len=90*8 + 4, Param=0x04 */ #include <config.h> #include <asm/arch/mx6.h> #ifdef CONFIG_FLASH_HEADER #ifndef CONFIG_FLASH_HEADER_OFFSET # error "Must define the offset of flash header" #endif #define CPU_2_BE_32(l) \ ((((l) & 0x000000FF) << 24) | \ (((l) & 0x0000FF00) << 😎 | \ (((l) & 0x00FF0000) >> 😎 | \ (((l) & 0xFF000000) >> 24)) #define MXC_DCD_ITEM(i, addr, val) \ dcd_node_##i: \ .word CPU_2_BE_32(addr) ; \ .word CPU_2_BE_32(val) ; \ .section ".text.flasheader", "x" b _start .org CONFIG_FLASH_HEADER_OFFSET ivt_header: .word 0x402000D1 /* Tag=0xD1, Len=0x0020, Ver=0x40 */ app_code_jump_v: .word _start reserv1: .word 0x0 dcd_ptr: .word dcd_hdr boot_data_ptr: .word boot_data self_ptr: .word ivt_header app_code_csf: .word 0x0 reserv2: .word 0x0 boot_data: .word TEXT_BASE image_len: .word _end_of_copy - TEXT_BASE + CONFIG_FLASH_HEADER_OFFSET plugin: .word 0x0 dcd_hdr: .word 0x40D802D2 /* Tag=0xD2, Len=90*8 + 4 + 4, Ver=0x40 */ write_dcd_cmd: .word 0x04D402CC /* Tag=0xCC, Len=90*8 + 4, Param=0x04 */ 我的疑问是上面代码标红的部分的意义是什么?确切的说,IMX6Q既然规定了IVT在不同的boot devices中的偏移地址,比如我的应用场景是emmc,偏移地址是0x400(1K),那么我的uboot镜像完全可以按照:IVT+uboot本体的格式来构建,这样一来当使用mfg工具烧写uboot镜像时就可以用以下的命令来执行: <CMD state="Updater" type="push" body="$ dd if=$FILE of=/dev/mmcblk0 bs=512 seek=2 ">write U-Boot to sd card</CMD> 而不是默认的命令(跳过uboot.bin前0x400的字节): <CMD state="Updater" type="push" body="$ dd if=$FILE of=/dev/mmcblk0 bs=512 seek=2 skip=2">write U-Boot to sd card</CMD> 这样看,那么flash_header.S前面的0x400字节是不是多余的呢,还是有什么特别的用处,如果直接把这种uboot.bin烧写到emmc的0x400处(不跳过uboot.bin前0x400的字节,即b _start, .org CONFIG_FLASH_HEADER_OFFSET),那是不是就直接会调整到_start函数开始执行,而不会进行DCD相关的配置?
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iWave Systems Technologies, successfully demonstrated the MIPI camera on its latest i.MX6 Qseven development kit. The Leopard’s 5M pixel MIPI CSI Camera module part LI-OV5640-MIPI-AF is integrated with the latest revision of iWave i.MX6 Q7 evaluation board and the sensor supports the following features. Sensor: OV5640 (CMOS image sensor) Active array Size: 2592x1944 Image transfer rates; 1080p@30fps, 720p@60fps Module Connector: AXK824145   The camera is interfaced with the i.MX6 processor through MIPI CSI interface. The Linux 3.0.35 and Android 4.0.4 BSP support is available for this display with iWave’s i.MX6 development kit. The i.MX6 development board integrated with this MIPI camera is available for shipping now. About i.MX6 Qseven Development Board: The Development Platform incorporates Qseven compatible i.MX6x SOM which is based on Freescale's iMX 6 Series 1.2GHz multimedia focused processor and Generic Q7 compatible Evaluation Board. This platform can be used for quick prototyping of any high end applications in verticals like Automotive, Industrial & Medical. Being a nano ITX form factor with 120mmx120mm size, the board is highly packed with all necessary on-board connectors to validate complete iMX6 CPU features. About i.MX6 Qseven System On Module (SOM): iW-RainboW-G15M is Freescale's i.MX6 based Qseven compatible CPU module for faster and multimedia focused applications. The module has on-board expandable 1GB DDR3 RAM, micro SD slot and optional eMMC flash. With the extreme peripheral integration, the module supports industry latest high performance interfaces such as, PCIe Gen2, Gigabit Ethernet, SATA 3.0, HDMI 1.4 and SDXC etc. About iWave Systems: iWave has been an innovator in the development of “Highly integrated, high-performance, low-power and low-cost i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs”. iWave helps its customers reduce their time-to-market and development effort with its products ranging from System-On-Module to complete systems. The i.MX6 Pico ITX SBC is brought out by iWave in a record time of just 5 weeks. Furthermore, iWave’s i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs have been engineered to meet the industry demanding requirements like various Embedded Computing Applications in Industrial, Medical & Automotive verticals. iWave provides full product design engineering and manufacturing services around the i.MX SOMs to help customers quickly develop innovative products and solutions. For more details: i.MX6 Q7 Development Kit | iWave Systems email: mktg@iwavesystems.com
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Below are the patches to support SDIO-UART 8987 M2 module on mek_8q M2 port. After applying the patches, PCIe chip can't be recognized on M2 port. Revert the patches if want to use PCIe chip. Patches are from Andy Duan. --- a/board/freescale/imx8qm_mek/imx8qm_mek.c +++ b/board/freescale/imx8qm_mek/imx8qm_mek.c @@ -373,6 +373,7 @@ int board_init(void) #if defined(CONFIG_USB) && defined(CONFIG_USB_TCPC)         setup_typec(); #endif +       sc_pm_set_resource_power_mode(-1, SC_R_BOARD_R3, SC_PM_PW_MODE_ON); #ifdef CONFIG_SNVS_SEC_SC_AUTO         { --- a/arch/arm64/boot/dts/freescale/imx8qm-mek.dts +++ b/arch/arm64/boot/dts/freescale/imx8qm-mek.dts @@ -151,6 +151,11 @@     };   + usdhc3_pwrseq: usdhc3_pwrseq { +  compatible = "mmc-pwrseq-simple"; +  reset-gpios = <&lsio_gpio1 13 GPIO_ACTIVE_LOW>; + }; +   epdev_on: fixedregulator@100 {    compatible = "regulator-fixed";    pinctrl-names = "default", "sleep"; @@ -159,8 +164,6 @@    regulator-min-microvolt = <3300000>;    regulator-max-microvolt = <3300000>;    regulator-name = "epdev_on"; -  gpio = <&lsio_gpio1 13 0>; -  enable-active-high;   };     reg_fec2_supply: fec2_nvcc { @@ -1036,6 +1039,22 @@   status = "okay";  };   +&usdhc3 { +        pinctrl-names = "default", "state_100mhz", "state_200mhz"; +        pinctrl-0 = <&pinctrl_usdhc3>,<&pinctrl_usdhc3_gpio>; +        pinctrl-1 = <&pinctrl_usdhc3>,<&pinctrl_usdhc3_gpio>; +        pinctrl-2 = <&pinctrl_usdhc3>,<&pinctrl_usdhc3_gpio>; +        bus-width = <4>; + pinctrl-assert-gpios = <&lsio_gpio4 9 GPIO_ACTIVE_HIGH>; + pinctrl-assert-gpios = <&lsio_gpio4 10 GPIO_ACTIVE_HIGH>; + mmc-pwrseq = <&usdhc3_pwrseq>; + pm-ignore-notify; + keep-power-in-suspend; + non-removable; + cap-power-off-card; +        status = "okay"; +}; +  &i2c0 {   #address-cells = <1>;   #size-cells = <0>; @@ -1540,7 +1559,6 @@    fsl,pins = <     IMX8QM_PCIE_CTRL0_WAKE_B_LSIO_GPIO4_IO28  0x04000021     IMX8QM_PCIE_CTRL0_PERST_B_LSIO_GPIO4_IO29  0x06000021 -   IMX8QM_USDHC2_RESET_B_LSIO_GPIO4_IO09   0x06000021    >;   };   @@ -1618,7 +1636,26 @@     IMX8QM_USDHC1_DATA1_CONN_USDHC1_DATA1   0x00000021     IMX8QM_USDHC1_DATA2_CONN_USDHC1_DATA2   0x00000021     IMX8QM_USDHC1_DATA3_CONN_USDHC1_DATA3   0x00000021 -   IMX8QM_USDHC1_VSELECT_CONN_USDHC1_VSELECT  0x00000021 +   IMX8QM_USDHC1_VSELECT_CONN_USDHC1_VSELECT               0x00000021 +  >; + }; + + pinctrl_usdhc3_gpio: usdhc3grpgpio { +  fsl,pins = < +   IMX8QM_USDHC2_VSELECT_LSIO_GPIO4_IO10   0x00000021 +   IMX8QM_LVDS1_I2C0_SDA_LSIO_GPIO1_IO13   0x06000021 +   IMX8QM_USDHC2_RESET_B_LSIO_GPIO4_IO09   0x06000021 +  >; + }; + + pinctrl_usdhc3: usdhc3grp { +  fsl,pins = < +   IMX8QM_USDHC2_CLK_CONN_USDHC2_CLK         0x06000041 +   IMX8QM_USDHC2_CMD_CONN_USDHC2_CMD         0x00000021 +   IMX8QM_USDHC2_DATA0_CONN_USDHC2_DATA0     0x00000021 +   IMX8QM_USDHC2_DATA1_CONN_USDHC2_DATA1     0x00000021 +   IMX8QM_USDHC2_DATA2_CONN_USDHC2_DATA2     0x00000021 +   IMX8QM_USDHC2_DATA3_CONN_USDHC2_DATA3     0x00000021    >;   };   @@ -1680,13 +1717,11 @@     pinctrl_wlreg_on: wlregongrp{    fsl,pins = < -   IMX8QM_LVDS1_I2C0_SDA_LSIO_GPIO1_IO13  0x06000000    >;   };     pinctrl_wlreg_on_sleep: wlregon_sleepgrp{    fsl,pins = < -   IMX8QM_LVDS1_I2C0_SDA_LSIO_GPIO1_IO13  0x07800000    >;   };  
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The MYC-Y6ULX CPU Module is designed by MYIR, which is an embedded controller board based on NXP’s i.MX 6UL / 6ULL ARM Cortex-A7 processor capable of running at 528MHz. The MYD-Y6ULX development board is built around the MYC-Y6ULX CPU Module, it is a complete evaluation platform for your prototype and reference design. Compared with MYS-6ULX board which is released by MYIR earlier, the MYC-Y6ULX CPU Module is better suited for your next embedded design to accelerate your pace to market and reduce cost. Typical applications are for Industry Control, Communications, HMI, Smart Healthcare, Internet of Things (IoT), etc.              The MYD-Y6ULX development board is delivered with necessary cable accessories including one 12V/2A power adapter, one net cable of 1.5m length, one Micro USB cable, one 4G LTE antenna, one WiFi antenna and one product disk. I noticed that the MYD-6ULX board has one USB based Mini PCI-e interface for 4G module. MYIR has provided 4G antenna but the 4G module is only as an option. Measuring only 37mm by 39mm, the MYC-Y6ULX CPU Module is a highly integrated controller board for the MYD-Y6ULX development board populated on an expansion board which measures 105mm by 140mm and extend a rich set of peripherals through headers and connector like Serial ports, USB, Ethernet, CAN, Micro SD card, WiFi module, LCD, Touch screen, Camera, Audio as well as a Mini PCIe interface for optional USB based 4G LTE module. The function block diagram for the MYD-Y6ULX development board is show as below:    We can see the hardware peripherals and interfaces from the image below: All the on-board components are placed on the top side of the board, we can see only some through-holes on the bottom side of the board. On the MYD-Y6ULX board, there is a 2.4G WiFi module which is based on Broadcom 43362 chipset. The WiFi module is connected to the board through SDIO interface and provides full function of 802.11b/g/n. Its antenna uses the SMA antenna interface reserved on the board. But please note if the MYC-Y6ULX CPU Module is using eMMC and the board will not support WiFi as the eMMC will reuse the same SDIO interface with WiFi module. On the MYD-Y6ULX board, there is a USB based Mini PCIe interface for 4G LTE module. MYIR has provided Linux driver and example for using Quectel EC20 LTE module on the MYD-Y6ULX board. So, if the EC20 4G LTE module can meet your requirement, you can take it as a priority to save development time. Near the Mini PCIe interface, there is a standard SIM card interface.   There is one CSI interface, one expansion header and one Micro SD card interface near the Mini PCIe interface. Though the i.MX 6UL/6ULL processor can support up to 24-bit parallel camera interface, many signals have reused due to rich peripherals on MYD-Y6ULX board, so the CSI interface on MYD-Y6ULX is an 8-bit parallel camera interface. The expansion header can support 12 GPIOs at most to bring out I2C, UART, SPI, etc. There are two USB Host ports, Reset/Power/User buttons and one 3-pin debug header on the MYD-Y6ULX board. The i.MX 6UL/6ULL processor has two USB controllers, both of which can support USB OTG function. One MYIR’s MYD-Y6ULX board, one USB has brought out through Micro USB interface and can support OTG; another USB has extended 4 USB Host through SMSC USB2514BI-AEZ USB Hub chip, of the four USB Host, two are used as USB Host ports, one is used for 4G LTE module and the rest one is not used.   The MYD-Y6ULX base board is designed to be powered by DC 12V through a jack, and the internal power management circuit on-board supplies 5V, ISO 5V, 3.8V, 3.3V, 1.8V, 3V (RTC) voltage for the board. The part TLV62130 DC/DC convertor is selected to use for 12V to 5V and 12V to 3.8V conversions, supporting 3A output currency at the most. The DC/DC convertor can increase the power efficiency and reduce power consumption of the board. The part RT9018 is used as LDO regulator for 5V to 3.3V and 3.3V to 1.8V conversions. The LDO regulator can provide smaller power ripple than the DC/DC convertor. The RTC battery input is an optional input. When the system is powered down, if the RTC does not need to work, it is not require to provide this power rail.  
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iWave’s newest offering, the RainboW-G15D quad display set up based on iWave’s i.MX6 SOM provides four display support for advance applications. Four independent display interfaces are brought out via: Two LVDS Display interface, one 24bpp RGB LCD Display interface and one 1080p/720p HDMI interface. This solution built around Freescale’s i.MX6 Series 1.2GHz multimedia focused processor proves to be an ideal solution for automotive infotainment/ rear seat infotainment.
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Hello guys, this is digi international i.MX53 connect core dev board , i took three years weekends and spent lot of money on it, it's based on Qt and GStreamer , top of the line, have fun with the i.mx monsters, cheers daniele
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e-con Systems announces the launch of eSOMiMX7 System on Module. The eSOMiMX7 is based on NXP/Freescale i.MX7 processor. eSOMiMX7 is a ready to use System-On-Module using Solo / Dual core ARM® Cortex™ A7 @ 1GHz along with dedicated real time ARM® Cortex™ - M4 MCU. It encompasses eMMC Flash whose capacity ranges from 4GB to 64GB, LPDDR3 with capacity as high as 2GB. To cater to the customer's demand of a small SOM for building IoT Applications, Industrial HMI, Test and Measurement, Industrial HMI, eBook Reader and  Wearables, eSOMiMX7 is launched with a small form factor of 55mm x30mm. eSOMiMX7 is an ultra-low power system on module which consumes only 3mA current during the deep sleep mode. eSOMiMX7 System-On-Module is available with latest Linux Kernel version v4.9.11, latest Yocto rootfs version 2.2 and Free RTOS version 8. Pricing and Availability: The eSOMiMX7 at volumes is available at USD34 onwards and samples can be bought from the Webstore. Evaluation kit: Customers  willing to evaluate the eSOMiMX7, can evaluate using the EVM, Acacia - eSOMiMX7 development kit from e-con Systems' Webstore.
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This overview document gives a brief introduction of MYIR's MYD-Y6ULX development board which is a complete evaluation platform for NXP’s i.MX 6UltraLite / 6ULL processor family, which can operate at 528 MHz and features the most efficient ARM Cortex-A7 core, providing various memory interfaces and enhancing the flexibility and convenience of the board to connect peripheral devices. The board is ready to run Linux and supports industrial operating temperature range from -40 to +85 Celsius. The MYD-Y6ULX development board employs the MYC-Y6ULX CPU Module as the controller board by populating the CPU Module on its base board through 1.0mm pitch 140-pin stamp hole interface. The MYC-Y6ULX CPU Module is mounted with a shield cover and integrated with core components including i.MX 6UltraLite / 6ULL processor, 256MB DDR3, 256MB Nand Flash or optional 4GB eMMC and Ethernet PHY. The base board has extended rich peripherals through connectors and headers like Serial ports, USB, Ethernet, CAN, Micro SD card, WiFi module, LCD/Touch screen, Camera, Audio as well as a Mini PCIe interface for optional USB based 4G LTE module. It is a versatile platform and solid reference design delivered with necessary cable accessories and detailed documentations ideal for prototype and evaluation based on i.MX 6UL/6ULL solutions. MYIR offers three models of MYD-Y6ULX development boards with mainly different features as shown in below table. User can select model according to their own requirement. MYD-Y6ULX MYD-Y6ULG2-256N256D-50-I MYD-Y6ULY2-256N256D-50-C MYD-Y6ULY2-4E512D-50-C MYC-Y6ULX MYC-Y6ULG2-256N256D-50-I MYC-Y6ULY2-256N256D-50-C MYC-Y6ULY2-4E512D-50-C Processor MCIMX6G2CVM05AB MCIMX6Y2DVM05AA MCIMX6Y2DVM05AA RAM 256MB DDR3 256MB DDR3 512MB DDR3 Flash 256MB Nand Flash 256MB Nand Flash 4GB eMMC WiFi Support Support Cannot support Reuse SDIO with eMMC Working Temp. -40 to +85 Celsius 0 to +70 Celsius 0 to +70 Celsius WiFi Module can only support -20 to +65 Celsius.                                                                  Three Models of MYD-Y6ULX (default configurations)                                                              MYD-Y6ULX Development Board                                                                MYC-Y6ULX CPU Module
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