Ara240 - LPDDR4 Memory Compatibility Guide

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The purpose of this document is to provide extended guidance for selection of compatible LPDDR4 memory devices that are supported by the Ara240 (aka Ara-2) processors. In all cases, it is strongly recommended to follow the DRAM layout guidelines outlined in the specific SoC requirement documents.

LPDDR4 - maximum supported densities

SoC	Max Data bus width	Maximum density	Number of Interfaces	Assumed memory organization	Notes
Ara240	64-bit	128Gb/16GB	2	Dual rank, Dual channel device with 17-row addresses	1

 

LPDDR4 - list of validated memories

The validation process is an ongoing effort - regular updates of the table are expected.

SoC	Density	Memory Vendor	Validated Memory Part#	Notes
Ara240	64Gb/(8GB) Total 128Gb/(16GB) (2 x 64Gb/8GB)	Micron	MT53E2G32D4DE-046 AUT:C  MT53E2G32D4DE-046 WT:C	-
	64Gb/(8GB) Total 128Gb/(16GB) (2 x 64Gb/8GB)	FORESEE	FLXC4008G-30	2
	64Gb/(8GB) Total 128Gb/(16GB) (2 x 64Gb/8GB)	BIWIN	BWMEDX32H2A-64-X	2
	16Gb/(2GB) Total: 32Gb/(4GB) (2 x 16Gb/2GB)	Micron	MT53E512M32D1ZW-046BAUT:B	-
	16Gb/(2GB) Total: 32Gb/(4GB) (2 x 16Gb/2GB)	SK Hynix	H54G46CYRQX053N	-
	32Gb/(4GB) Total 64Gb/8GB (2 x 32Gb/4GB)	SK Hynix	H54G56CYRB-X247 421Y	-
	16Gb/(2GB) Total: 32Gb/(4GB) (2 x 16Gb/2GB)	Samsung	K4F6E3S4HB-KHCL	-
	32Gb/(4GB) Total 64Gb/8GB (2 x 32Gb/4GB)	ISSI	IS43LQ32K01B	2
	32Gb/(4GB) Total 64Gb/8GB (2 x 32Gb/4GB)	Samsung	K4UBE3D4AB-MGCL	-
	8Gb/(1GB) Total 16Gb/2GB (2 x 8Gb/1GB)	Winbond	W66DP2RQQAHJ	2

Note: This device supports operation with LPDDR4 memories only. LPDDR4x operation is not supported. 
Dual‑mode memories that support both LPDDR4 and LPDDR4x are allowed as long as the device can operate in LPDDR4 mode, 
including using LPDDR4 I/O voltage levels and initialization sequences.

Note 1:

The numbers are based purely on the IP documentation for the DDR Controller and the DDR PHY, on the settings of the implementation parameters chosen for their integration into the SoC, SoC reference manual and on the JEDEC standards JESD209-4C (LPDDR4). Therefore, they are not backed by validation, unless said otherwise and there is no guarantee that an SoC with the specific density and/or desired internal organization is offered by the memory vendors. Should the customers choose to use the maximum density and assume it in the intended use case, they do it at their own risk.

Note 2:

The memory part number did not undergo full JEDEC verification however, it passed all functional testing items.

Note 3:

Memory devices with binary densities (e.g., 1 GB, 2 GB, 4 GB) are preferred because they simplify memory management by aligning with system addressing schemes and reducing software complexity.

Note 4:

All memory parts are in production unless stated otherwise. Checked May 2026

Note 5:

The processor does not support BYTE Mode (x8) memories.