Hi,
We do not specify a maximum heatsink mounting force. We recommend to use thermal vias and a large ground pad under the EP to spread heat to the PCB. This is the primary intended method for thermal dissipation. If in your application a heatsink must be mounted on top, JEDEC recommends ≤20N for small QFN packages.
BRs, Tomas
Hi,
We do not specify a maximum heatsink mounting force. We recommend to use thermal vias and a large ground pad under the EP to spread heat to the PCB. This is the primary intended method for thermal dissipation. If in your application a heatsink must be mounted on top, JEDEC recommends ≤20N for small QFN packages.
BRs, Tomas