What is the maximum force for the following components:
PMIC: PCA9450CHNY & PCA9450AAHNY: 56 HVQFN package
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Hi,
We do not specify a maximum heatsink mounting force. We recommend to use thermal vias and a large ground pad under the EP to spread heat to the PCB. This is the primary intended method for thermal dissipation. If in your application a heatsink must be mounted on top, JEDEC recommends ≤20N for small QFN packages.
BRs, Tomas
Hi,
We do not specify a maximum heatsink mounting force. We recommend to use thermal vias and a large ground pad under the EP to spread heat to the PCB. This is the primary intended method for thermal dissipation. If in your application a heatsink must be mounted on top, JEDEC recommends ≤20N for small QFN packages.
BRs, Tomas