Maximum force for applying heatsink

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Maximum force for applying heatsink

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jeroenvanandel
Contributor I

What is the maximum force for the following components:

PMIC:  PCA9450CHNY & PCA9450AAHNY:  56 HVQFN  package

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TomasVaverka
NXP TechSupport
NXP TechSupport

Hi,

We do not specify a maximum heatsink mounting force. We recommend to use thermal vias and a large ground pad under the EP to spread heat to the PCB. This is the primary intended method for thermal dissipation. If in your application a heatsink must be mounted on top, JEDEC recommends ≤20N for small QFN packages.

BRs, Tomas

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TomasVaverka
NXP TechSupport
NXP TechSupport

Hi,

We do not specify a maximum heatsink mounting force. We recommend to use thermal vias and a large ground pad under the EP to spread heat to the PCB. This is the primary intended method for thermal dissipation. If in your application a heatsink must be mounted on top, JEDEC recommends ≤20N for small QFN packages.

BRs, Tomas