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Demo Owner: Matt Hoover Embedded Planet's CEO Matt Hoover demonstrates the Wireless Sensor Gateway featuring i.MX6 applications processor at the FTF Americas 2014.       Features Bringing wireless sensor data tied to sensors that is brought into the i.MX6 based gateway via Verizon Cellular and  taken up to the cloud, then shown in a web portal Take the data from the field into the gateway via wire or wireless medium and take that data up to their server based system or a cloud based portal Featured NXP Products ARM® Cortex®-A9 Cores: i.MX 6 Series Multicore Processors Links NXP Connect - Embedded Planet  
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Overview This reference design shows the simplicity of a soft modem design, how few resources of the processor it takes, and how well it performs on USA average lines. This design omits the standard telecommunications Codec, instead of using PWM for output and ADC for input. Since both peripherals are readily available on one 56F8300/100 series device, along with more processing power than required from the single core, the design is a true one-chip, one-core system that includes telecommunications ability with room for even more system functionality. Ideal for advanced motion control, home appliances, medical monitoring, fire and security systems, power management, smart relays, and POS terminals. Features Hybrid architecture facilitates implementation of V.21 and V.22bis modem, control, and signal processing functions in one chip Consumes only 7.5 MIPS for the modem function - Only 15K words of Flash for the complete modem application and test harness High-performance, secured Flash memory eliminates the need for external storage devices Extended temperature range allows for operation of non-volatile memory in harsh environments Flash memory emulation of EEPROM eliminates the need for external non-volatile memory 32-bit performance with 16-bit code density On-chip voltage regulator and power management reduces overall system cost Off-chip memory expansion capabilities allow for glueless interfacing with the additional memory of external devices, without sacrificing performance Boots directly from Flash, providing additional application flexibility High-performance PWM with programmable fault capability simplifies design and promotes compliance with safety regulations PWM and ADC modules are tightly coupled to reduce processing overhead; only one of each is used by the modem General purpose input/output (GPIO) pins support application-specific needs Simple in-application Flash memory programming via Enhanced OnCE or serial communication Block Diagram Board Design Resources
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Demo This demonstration from Boundary Devices showcases one of the newest additions to the Single Chip System Module portfolio – the SCM-i.MX 6SoloX module with V-Link bus       The SCM-i.MX 6SoloX module with V-Link bus is a new type of single chip system module. It consists of: A base SCM-i.MX 6SoloX module that integrates NXP’s i.MX 6SoloX applications processor, NXP’s PF0100 power management IC, 512 MB LPDDR2, and system passive components (de-coupling capacitors and resistors) A custom signal interface on the top of the package that enables customers to design their own PCB or substrate that can vertically attach to the top of the base SCM-i.MX 6SoloX. This custom signal interface, or V-Link bus, brings out common I/O such as UART, GPIO, SPI, I2C, SDIO etc. Customers can design top boards that add connectivity, security or sensing functions The overall footprint of the solution is 15.5mm x 15.5mm SCM V-Link technology is ideal for handheld/space-constrained applications allowing customers to integrate vertically   Features Reduce overall hardware design time and bring products to market faster Shrink PCB area over current discrete solutions. Customers can add connectivity, sensing, security in a vertical integration fashion to further save on PCB area Reduces design complexity of integrating DDR memory and power management Get started with an evaluation board and Linux OS, early access program now available   NXP Recommends NXP Single Chip Modules – www.nxp.com/scm
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Demo This demo shows how the FRDM-K82F board along with an OV7670 Camera module can be utilized to create a USB web camera application. The demo application software is delivered as part of the KSDK software enablement. The FS USB video class demonstration can deliver images to PCs or tablets. Features: USB Video device class demonstration application included in Kinetis SDK Easy connection to PC or tablet  display and process video captured from the device FlexIO camera driver utilized to interface to OV7670 camera module _______________________________________________________________________________________________________ Featured NXP Products: ARM Cortex-M4 Cores|Kinetis K8x MCUs|NXP AN5275: Using FlexiO for Parallel Camera Interface AN5280: Using Kinetis FlexIO to drive a Graphical LCD _______________________________________________________________________________________________________
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This post entry provides a detailed description of how the Device-to-device communication demo was developed so that you can leverage this knowledge to integrate NFC into your own system. This document has been structured as follows:   Introduction Device-to-device communication demo functionality NFC for communication with a batteryless unit NFC for communication between two devices mounted in close proximity NFC for communication with a rotating part as a cable replacement solution Hardware details Base board based on CLRC663 plus Rotating disk based on NTAG I2C plus Application logic Reader module to rotating disk communication Rotating disk to reader module communication MCU code details NTAG I2C plus pass-through mode data exchange synchronization considerations Reader module MCU code NTAG_Device2DeviceDemo  application workflow Rotating disk MCU code NTAG_I2C _Explorer_01_LEDs_ButtonXample application workflow Video recorded session Available resources Introduction The Device-to-device communication demo shows how NFC can be used as a cable replacement between two units or devices. It is based on the CLRC663 plus NFC Frontend and the NTAG I 2 C plus connected tag solutions. It demonstrates how NFC is used for: Wireless communication with a batteryless unit. Wireless communication between two devices mounted in close vicinity that need to be completely isolated (e.g. dust or water proof). Wireless communication with a rotating part and as a cable replacement solution.   Device-to-device communication demo functionality The purpose of the demo is to illustrate how to enable device-to-device communication via NFC. It consist of: A base board of 14x12 cm, which embeds the CLRC663 plus NFC reader IC for the RF field generation. A sensor embedded on a separate, rotating sensor disk of 8 cm diameter, which embeds the NTAG I 2 C plus connected tag.   The base board and the rotating sensor disk communicate via NFC and optionally, a tablet display can be connected via a Bluetooth Low Energy (BLE) connection (the BLE connection is beyond the scope of this post entry).     NFC for communication with a batteryless unit The first scenario demonstrates the use of NFC for communication with a batteryless unit or sensor. Energy from the RF field generated by an NFC reader can be harvested to power up small devices so that a battery or other power supply no longer needs to be included.   In this demo, only the base board is powered using a 5V supply input (e.g. USB battery bank) while the rotating disk electronics are powered using only the harvested energy from the RF field generated by the base board. To maximize energy transfer and avoid possible interference caused by the electronics, both the rotating disk and base board antennas are placed on the edges. In the following video, you can observe how as soon as the base board is supplied, it starts generating an RF field and automatically. Then,  all the electronics on the rotating disk are powered and its LED turns GREEN.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/f54/f54337d597118_12181097.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb54387b9f NFC for communication between two devices mounted in close proximity The second scenario demonstrates the use of NFC for communication between two devices mounted in close proximity. For instance, any machine or device where sensors are inside or in close vicinity and the sensor needs to be completely sealed (e.g. waterproof, dustproof, etc).   In this demo, the bidirectional communication between the two units is demonstrated using push buttons, which light up LEDs on the opposite unit. For the base board to rotating disk communication direction: While action button 1 is pressed, the LED on the rotating disk turns BLUE. While action button 2 is pressed, the LED on the rotating disk turns RED. While action button 1 and button 2 are pressed, the LED on the rotating disk turns WHITE.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/912/912db3bd13b06_12160248.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb54387c99 With the other way around, for the rotating disk to base board communication direction: While action button 3 is pressed, a pattern on the LED circle will appear.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/d0b/d0b0072da0120_12160391.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb54387e98   NFC for communication with a rotating part as a cable replacement solution The third and last scenario demonstrates the use of NFC to communicate wirelessly with two moving parts where cables may break. For instance, any solution consisting of a main unit and a sensing part recording mechanical-stress readings on moving parts.   In this demo, the accelerometer on the rotating disk continuously sends its coordinates to the base board, which lights up a specific LED according to the calculated angle between the two units. In the following video, you can see that the LED circle "follows" the movement of the rotating disk.   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/c0e/c0e3daf347aed_12160349.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb5438709a   Hardware details This section shows the architecture and main components of the base board and rotating disk.  The PCB schematics are attached at the end of this post entry.   Base board based on CLRC663 plus The disk has been dismounted so you can better appreciate the different components of the base board. The base board is driven by an LPC11U68 MCU, which is a low-cost Cortex-M0 USB solution, with 256 kB of flash memory, up to 80 GPIOs and several host interfaces (more details on the LPC11U68 product website).   From the LPC11U68 MCU, some of the GPIOs are used to connect the action buttons and the 12 LEDs of the circle, an SPI port is used to connect the CLRC663 plus NFC Frontend and, a USART port is used for connecting a BLE chip based on NXP's QN9021 chip.     The NFC functionality is provided by our CLRC663 plus reader IC, an NXP high performance multi-protocol reader. It is the evolution of CLRC663, with a larger LPCD detection range, more output power (2x times higher transmitter current), larger temperature operating range and pin-to-pin compatibility with the former version.   Rotating disk based on NTAG I 2 C plus The rotating disk is based on NXP solutions as well. This PCB board is driven by an LPC11U24 MCU, which is a low-cost Cortex M0 32 bit MCU, with 32 kB of flash memory, up to 40 GPIOs and several host interfaces (more details on the LPC11U24 product website).   From the LPC11U24 MCU, some of the GPIOs are used to connect the action button 3 and the RGB LED. In addition, an I 2 C interface port is shared to connect a temperature sensor, the accelerometer and the NTAG I 2 C plus.     The NTAG I 2 C plus is a family of connected NFC tags that combines a memory, a passive NFC interface with a contact I 2 C interface.  Functionally, the NTAG I 2 C plus behaves as a dual port memory. Therefore, the data can pass from an external NFC device to the embedded system. In addition, to this dual interface solution, it has more features: A field detection pin, to send a wake up signal The Energy harvesting, to power external devices The SRAM, a memory without writing cycles limitation The pass-through mode, for fast data exchange between interfaces Several memory access management settings from both NFC and I2C interfaces And an originality signature, to protect against clones.   Application logic This section describes how data is exchanged between the reader module (base board) and the rotating disk using NTAG I 2 C plus as a bridge (pass-through mode) between the two embedded systems.   Reader module to rotating disk communication In this demo, the reader module sends data to the rotating disk when any of its two action buttons are pressed. The NTAG I 2 C plus is configured in pass-through mode and the SRAM memory is used as conduit between the twto units.  The figure below illustrates a simplified representation of NTAG I 2 C plus memory seen from the NFC perspective (organized in pages of 4 bytes each). The red area represents the EEPROM memory while the yellow one represents the SRAM memory location. While the button 1 is pressed: The GPIO 4 of the LPC11U68 is in high level. The CLRC663 plus writes one byte into the SRAM memory (last page, value = 0x01). The LPC11U24 on the rotating disk reads the SRAM. The LPC11U24 changes the GPIO 18 status to high level. The RGB LED turns blue.   The operation that takes place while button 2 is pressed is pretty similar. Basically, it changes: the data written by the CLRC663 plus in the SRAM and the GPIO activated by the LPC11U24 on the rotating disk. More precisely, the steps are: The GPIO 5 of the LPC11U68 is in high level. The CLRC663 plus writes one byte into the SRAM memory (last page, value = 0x02). The LPC11U24 on the rotating disk reads the SRAM. The LPC11U24 changes the GPIO 16 status to high level and sets GPIO 18 to low level. The RGB LED turns red.     In the same way, while the two buttons are pressed at the same time: The LPC11U68 detects that GPIO 4 and 5 are in high level The CLRC663 plus programs a different value on the last SRAM byte (0x03). The LPC11U24 on the rotating disk reads the SRAM. The LPC11U24 sets to high the three GPIOs (16,17,18) controlling the RGB LED. The RGB LED turns white The key message is that: what it is written in the SRAM controls the behavior of the rotating disk LED, demonstrating wireless data exchange between the two embedded systems.   Rotating disk to reader module communication In this demo, the rotating disk keeps sending data to the reader module for as long as it is powered by the RF field. Precisely, it continuously sends the disk position (via the accelerometer axis coordinates) and the measured temperature value. Additionally, an extra byte is sent while the button 3 is pressed. The actual steps are: First, the LPC11U24 MCU triggers a read operation to the temperature sensor and accelerometer. The temperaturre reading occupies 2 bytes while the accelerometer axis coordinates occupy 6 bytes. This data is transfered the LPC11U24 via the I 2 C shared bus. The LPC11U24 writes these 8 bytes into the SRAM in page addresses 0xFD, 0xFE and 0xFF (see the figure below). The CLRC663 plus reads the SRAM when the LPC11U24 has finished writing it. With the read information, the LPC11U68 base board MCU calculates the angle and sets the appropriate GPIO to high level. Since the LED circle contains 12 LEDs, the base board is able to represent position changes of 30 degrees (360º / 12 LEDs).   As mentioned, this data transfer keeps going for as long as the disk is powered. The key concept here is that the LED circle operation is directly controlled by the disk position and the axis coordinates which are exchanged via the NTAG I 2 C plus SRAM at any given moment. To illustrate this, the disk is rotated 90 º clockwise. The steps that take place are: The LPC11U24 MCU triggers the next reading command, the accelerometer axis coordinates have changed to different ones representing the new disk position (in red in the memory map figure below). The LPC11U24 writes into the SRAM again these 8 bytes (now with the updated accelerometer axis coordinates) The CLRC663 plus reads the SRAM when the LPC11U24 has finished writing it. With this new reading, the LPC11U68 MCU recalculates the angle and applies a different GPIO configuration (which leads to a different LED turned on in the circle).     Last, while button 3 is pressed: The LPC11U24 GPIO 12 is set to high value. The LPC11U24 checks GPIO 12 pin status before writing into the SRAM. While it is high level, it adds an additional byte into the SRAM (third byte on page 0xFF- value=0x01). The CLRC663 plus reads the SRAM, getting the latest data from the moving part. With the current firmware, while the third byte on page address 0xFF is set to 0x01, the LPC11U68 performs a LED pattern activating all the GPIOs simultaneously (all the LEDs are ON).     MCU code details This section explains the firmware implementation details for both the base board (CLRC663 plus) and the rotating disk (NTAG I 2 C plus). Before going into the firmware implementation details, a few considerations for data exchange synchronization when using the NTAG I 2 C plus pass-through mode are explained.   NTAG I 2 C plus pass-through mode data exchange synchronization considerations In the demo, the pass-through mode is used to exchange data between the base board and the rotating disk. The pass-through mode provides the SRAM for data communication and the mechanisms for the synchronization of the data transfer. This signalling can be done through the field detection pin or by polling the equivalent registers over the I 2 C interface. For the NFC to I 2 C direction, the synchronization can be done: By checking the SRAM_I2C_READY register to learn if new data has been written by the RF interface. By checking the filed detection pin changing from HIGH to LOW voltage.   For I 2 C interface to NFC direction, the synchronization can be done: By checking the SRAM_RF_READY register to learn if new data has been written by the I 2 C interface. By checking the filed detection pin changing from LOW to HIGH voltage.   The following table includes register bits which can be used for communication synchronization. In addition, there is a dedicated application note providing more details on how NTAG I 2 C plus can be used for bidirectional data communication.   Register bit Use PTHRU_ON_OFF Detects if the pass-through mode is still enabled (gets reset in case of RF or I2C power down). TRANSFER_DIR Defines the data flow direction for the data transfer. I2C_LOCKED Detects if memory access is currently locked to I2C. RF_LOCKED Detects if Memory access is currently locked to RF. SRAM_I2C_READY Detects if there is data available in the SRAM buffer to be fetched by the I²C side. SRAM_RF_READY Detects if there is data available in the SRAM buffer to be fetched by the RF interface. RF_FIELD_PRESENT Shows if a RF field strong enough to read the tag is there.   Reader module MCU code The MCU firmware was developed using our LPCXpresso platform, which provides a complete development environment for LPC MCU and LPC boards. In the source code, there are five project folders: The FreeRTOS project folder, which is an open source real-time operating system (RTOS) for embedded systems supporting many different architectures and compiler toolchains The Lpc_chip_11u6x_lib and nxp_lpcxpresso_11u68b project folders, which belong to the LPCOpen libraries supporting the LPC11U68 MCU and PCB board, the MCU chip integrated in the Explorer board. If you use another MCU, you should replace them by the specific LPCOpen libraries. The NTAG_Device2DeviceDemo  project folder, which implements the logic supporting the device-to-device communication demo for the reader module. The NxpNfcRdLib project folder, which is the NXP's NFC Reader Library software stack supporting the implementation of the demo, the contactless protocols, the LPC MCU host interfaces and the CLRC663 drivers.   The reader module MCU code leverages on the NFC Reader Library. The NFC Reader Library is a software stack for creating and developing contactless applications for NXP's NFC readers. This API facilitates the most common operations required in NFC applications such as: reading or writing data into contactless cards, exchanging data with other NFC-enabled devices and emulating cards.   In order to use the NFC Reader Library, a stack of components has to be built up from the bottom to the top layer. Precisely, the application requirements define which modules need to be enabled and which do not. For the reader module firmware: The FreeRTOS is used. The SPI is used as host interface. A CLRC663 plus reader IC is used. And, communication with NTAG I 2 C plus is needed ( ISO14443 Type A card and NFC Forum Type 2 Tag compliant)   As a result, the software components that need to be enabled within the NFC Reader Library are depicted in the following picture: NTAG_Device2DeviceDemo  application workflow The reader module firmware starts its execution as soon as it is connected to the power bank. The firmware initializes the GPIOs, the UART for the tablet connection and the NFC Reader Library for the contactless operation. After all these initializations, the firmware code generates a new thread in charge of dealing with the disk operation. In this separate thread, the discovery loop for detection of Type A and Type V cards is configured and started. After that, the firmware keeps listening until the NTAG I 2 C plus is detected (i.e. the disk is mounted). On detection, the operation with the rotating disk starts: The reader module waits until the SRAM is available for the RF interface. The SRAM is available for the RF interface while the pass-through mode is enabled (PTHROUGH_ON_OFF register is set) and the RF to I 2 C direction is set (TRANSFER_DIR register bit). The board buttons are checked and the SRAM is written with the corresponding information.   At this point, the program awaits to receive data from the rotating disk. For that, it keeps polling if new data was written in the SRAM by the I 2 C interface (SRAM_RF_READY register bit is set). If new data is available, the SRAM is read and the data is processed: The accelerometer axis coordinates are read, the angle is calculated and the appropriate LED on the circle is activated. While the button 3 is pressed, the MCU triggers the LED pattern on the circle. Optionally, if the tablet connection is established, data is also sent using the BLE channel.   The following figure depicts the reader module application workflow in detail:   Rotating disk MCU code The MCU firmware was also developed using the LPCXpresso platform.  In the source code, there are four project folders: The Lpc_chip_11uxx_lib and nxp_lpcxpresso_11u24h_board_lib project folders belong to the LPCOpen libraries supporting the LPC11U24 MCU and PCB board, the MCU chip integrated in the Explorer board. If you use another MCU, you should replace them by the specific LPCOpen libraries. The NTAG_I 2 C _API project folder is a library providing a set of functions and procedures that allow you to communicate with the NTAG I 2 C from the I 2 C interface. Among others, functions to perform memory operations on EEPROM, SRAM, registers and for enabling the pass through mode The NTAG_I 2 C _Explorer_01_LEDs_ButtonXample project folder implements the logic for the rotating disk of this demo.   NTAG_I 2 C _Explorer_01_LEDs_ButtonXample application workflow The rotating disk firmware starts its execution as soon as it harvests enough energy from the reader's module RF field. The first operation taken is to enable the pass-through mode. Then, the firmware stays on a loop for as long as it is energized.   In this loop, it sets the SRAM into RF to I 2 C direction (TRANSFER_DIR register bit) and waits until the base board has written data. After data has been written from the RF side, it reads the SRAM and checks the last byte: While the last byte value is 0x01, it means the button 1 is pressed and the firmware sets the RGB LED to blue While the last byte value is 0x02, it means the button 2 is pressed and the firmware sets the RGB LED to red While the last byte value is 0x03, it means the button 1 and 2 are pressed and the firmware sets the RGB LED to white.   After receiving data from the base board, it prepares to send data back. For that: it checks the button status, it reads the temperature value and the accelerometer position. Once all the data has been collected: It changes the SRAM to I 2 C to RF direction (TRANSFER_DIR register bit). It writes into the SRAM and waits until the RF has read the data (SRAM_RF_READY register is cleared).   This loop is repeated for as long as the disk is powered. The following figure depicts the rotating disk application workflow in detail:     Video recorded session On 9 March 2017, a live session explaining the device-to-device communication demo was recorded. You can watch the recording here:   http://wpc.08c9.edgecastcdn.net/0008C9/twistage-production/149/149fee5f5e282_12181079.mp4?d273d3b84ae78c6b0b40b4df7e407772944048591ee44914b69449116aeb5439ff51 Available resources   Schematics Please see attached in the separate attachment section below. Device-to-device demo source code Please see attached in the separate attachment section below. Quick-start guide for showing the demo Please see attached in the separate attachment section below Android app The android app can be used on a tablet or smart phone connected via BLE to this demo to show additional parameters, and to have a bigger screen for demonstrations. You find it in Google play ("device2devicedemo") and attached below.  
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Demo FXTH87 tire pressure monitor sensor solution for heavy trucks integrates a pressure sensor, 8-bit MCU, RF transmitter and a dual axis accelerometer into a single package. This demo will show the highest pressure range of 100–1500 kPa with tightest pressure offset.   1500 kPa Range Tire Pressure Monitoring Sensor Smallest footprint,  Low-power consumption, large customer memory size Pressure sensor, 8-bit microcontroller, RF transmitter, Accelerometer     Featured NXP Product FXTH8715|TPMS|Pressure Sensor|NXP   Other Tire Pressure Monitoring System (TPMS)|NXP
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This demo will provide three modes to show the CAPWAP offloading capability of QorIQ platform. mode Iis the core-through mode which can be implemented by the CAPWAP stack to send the CAPWAP stack packets; Mode II is the offloading-mode which demonstrates the CAPWAP Encapsulation/De-capsulation capability of the SoC, and can be used in the AC case; Mode III is the net-bridge mode which is the basic usage for EAP which bridge the packets from PCIE to SEC and FM for offloading CAPWAP manipulation, the bridge is zero-memory copy in order to get high performance data. Together with the throughput data, this demo will help the customer to evaluate the EAP design with QorIQ platform.   Features QorIQ T1 processors handle secure WLAN tunnels with offload engines instead of CPU cycles CAPWAP tunneling firmware performs extra tasks (frag/ reassembly) and interfaces to the Linux user Highly efficient bridging to WLAN radios ensures maximum WLAN performance CAPWAP fragmentation and reassembly Featured NXP  Products T1040 Block Diagram
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Demo NXP has a full range of high power LDMOS drivers and finals for cellular base stations. Our cellular LDMOS portfolio delivers industry leading performance with powerful and efficient products targeting rapidly growing frequencies and regions in the world. This demo wall features new devices that cover all cellular bands from 575 to 2400 MHz Products A2V09H300-04N 48 V LDMOS Solution • Frequency 720-960 MHz • Final Doherty performance at 8 dB OBO • Gain 19.5 dB • Efficiency 53% • Peak power 56 dBm • OM-780-4 package A2V07/09H400-04N 48 V LDMOS Solution • Frequency 575–960 MHz • Final Doherty performance at 8 dB OBO o Gain 18 dB o Efficiency 53% • Peak power 57.5 dBm • OM-780-4 package A2V07/08/09H525-04N 48 V LDMOS Solution • Frequency 575–960 MHz • Final Doherty performance at 8 dB OBO o Gain 18.7 dB o Efficiency 53% • Peak power 58.5 dBm • OM-1230-4L package A2T23H200W23S 28 V LDMOS Solution • Frequency 2300–2400 MHz • Final Doherty performance at 8 dB OBO o Gain 15.5 dB o Efficiency 50% • Peak power 55 dBm • ACP-1230-4L2S package A3T18H360W23S 28 V LDMOS Solution • Frequency 1805–1880 MHz • Final Doherty performance at 8 dB OBO o Gain 17.5 dB o Efficiency 53% • Peak power 55.5 dBm • ACP-1230-4L2S package A3T21H450W23S 28 V LDMOS Solution • Frequency 2110-2200 MHz • Final Doherty performance at 8 dB OBO o Gain 15.5 dB o Efficiency 49.5% • Peak power 57.4 dBm • ACP-1230-4L2S package
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  Overview The TRIAX demo board was built to combine many of the demos available for accelerometer applications. The TRIAX demo board will enable you to see how Our accelerometers can add additional functionality to applications in many different industries. By thinking of accelerometer applications in terms of the measurements that are performed, they can be grouped into 5 sensing functions – Tilt, Motion, Positioning, Shock and Vibration. The RD1986MMA6260Q reference design is a two accelerometer solution which is achieved by using the MMA6260Q (x and y-axis device) and the MMA1260D z-axis accelerometer. Archived content is no longer updated and is made available for historical reference only.   Features Accelerometers:  MMA6260Q, MMA1260D Packages:  Quad Flat No-Lead (QFN) 6x6x1.98m and SOIC 16 G Range:  +/- 1.5 G Sensitivity:  1200 mV / G Microprocessor:  MC68HC908KX8 Demonstrates Consumer Accelerometer Applications High-performance M68HC08 architecture Option to allow use of external clock source or external crystal/ceramic resonator SCI Interface User Inputs:  1 Pushbutton Outputs:  Piezohom, Serial Port Connection Design Resources
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The attached document describes how to optimize LCD display performance on RT10xx platform. The content include RT10xx configuration and Emwin setting with LCD parameters. Products Product Category NXP Part Number URL MCU i.MX RT1060 i.MX RT1060 MCU/Applications Crossover MCU | Arm® Cortex®-M7, 1MB SRAM | NXP  MCU i.MX RT1050 i.MX RT1050 MCU/Applications Crossover MCU| Arm® Cortex-M7, 512KB SRAM | NXP  SDK Software Software Development Kit https://mcuxpresso.nxp.com/en/select    Tools NXP Development Board URL MIMXRT1060-EVK i.MX RT1060 Evaluation Kit | NXP  MIMXRT1050-EVK i.MX RT1050 Evaluation Kit | NXP  Was this helpful to you?
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Description This is a very simple dodge the objects game. You are going to control a spaceship nave with the pushbuttons, one is use for up and the other to down, using the GPIO capabilities of the MCU. The on-board capacitive touch pad acts as start button and the game will prints in a terminal application as Tera term or also you can use an SSD1306 OLED display via SPI, the next picture show a block diagram of the project. Video Requirements LPC845 Breakout Board MCUXpresso IDE SDK_2.6.0_LPC845BREAKOUT LPC845_Spaceship.zip Micro USB cable Terminal Emulator (Tera Term, Putty) OLED Display from Adafruit (optional) Block Diagram NXP Product Link LPC84X LPC84x 30MHz|Arm® Cortex®-M0+|32-bit Microcontrollers (MCUs) | NXP  LPC845-BRK LPC845 Breakout Board for LPC84x family MCUs | NXP 
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Overview The 56F8300 (56800E core) family of Digital Signal Controllers (DSCs) is well suited for UPS design, combining the DSP's calculation capability with MCU controller features on a single chip. Offers many dedicated peripherals, including Pulse Width Modulation (PWM) units, Analog-to-Digital Converters (ADC), timers, communication peripherals (SCI, SPI, CAN), on-board Flash and RAM Online Uninterruptible Power Supplies (OUPS) provides continuous power to the load during power outage or glitches caused by power source switching Ideal for computers, office equipment, communication systems and medical life support Features Single-device solution: Combines MCU functionality and DSP processing power TCP/IP network communication for remote control and monitoring Bidirectional AC/DC conversion High input power factor with Direct PFC and lower power pollution to the power grid Battery management to extend battery life and lower maintenance costs Power source and load conditioning can be monitored in real time TCP/IP network communication for remote control and monitoring Bypass operation during overload or service maintenance Expedites time-to-market using out-of-the-box software components Block Diagram Board Design Resources
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Demo NXP has released the 1500 W MRF1K50H and MRF1K50N. The industry’s highest power transistors for ISM, FM broadcast and sub-GHz aerospace applications. These are pin-compatible so can be situated on the same PCB as existing solutions on the market Demo / product features MRF1K50H 1.5 kW LDMOS Transistor 1–500 MHz, 1500 W CW 74% efficiency 23.5 dB gain Extremely rugged  (65:1 VSWR) MRF1K50N 1.5 kW LDMOS Transistor 1–500 MHz, 1500 W CW 73% efficiency 23 dB gain 30% lower thermal resistance compared to ceramic package Extremely rugged  (> 65:1 VSWR) NXP Recommends MRF1K50H MRF1K50N
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Demo NXP has developed a whole vehicle multi-layered approach to vehicle security.  This demo will demonstrate the NXP security products in action, and show the 4 steps to securing an automotive electrical architecture, and how these 4 steps provide a barrier to the recent public vehicle hacks.   Features: Try to hack a typical automotive network. Enable and disable NXPs security layers to see how they work to protect the vehicle. Demonstrates various NXP security IP, including: A700x family secured MCUs, MPC5748G connected gateway and HSM/CSE security engines. ___________________________________________________________________________________________________________________________   NXP Recommends MPC5748G|NXP A700x|NXP   ___________________________________________________________________________________________________________________________      
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Demo         This was a super fun project to work on and is popular around the office and on the road.  Now I have two of these for a truly amazing barrage of Nerf darts!  It's also always a lot of fun to tear things down and the Nerf gun had some cool plastic work and the shooting mechanism is more simple than what I originally guess.  But I digress, this post is about how you can build one of these yourself.  Please leave any questions or comments in the section below and I will try to answer and make refinements to this guide as we go.   The shopping list (aka Bill of Materials or BOM)   If you shop around you might be able to find better prices or substitute parts.   Type Part Qty Price URL UBEC HKU5 1 $             5.33 http://www.hobbyking.com/hobbyking/store/__16663__HobbyKing_HKU5_5V_5A_UBEC.html LiPo TURNIGY 2200mAh 3S 20C 1 $             7.89 http://www.hobbyking.com/hobbyking/store/__8932__Turnigy_2200mAh_3S_20C_Lipo_Pack.html Servo S5030DX 1 $           28.63 http://www.hobbyking.com/hobbyking/store/__18862__Hobbyking_S5030DX_Digital_MG_Servo_X_Large_HV_164g_0_20s_30kg.html Servo HK15138 1 $             3.12 http://www.hobbyking.com/hobbyking/store/__16269__HK15138_Standard_Analog_Servo_38g_4_3kg_0_17s.html Relay PCB COM-11041 1 $             3.95 https://www.sparkfun.com/products/11041 Relay Components Various 1 $             3.00 https://www.sparkfun.com/wish_lists/36307 Nerf Gun Nerf Dart Tag Swarmfire Blaster 1 $           44.99 http://www.toysrus.com/product/index.jsp?productId=11267568 Controller FRDM-K64F 1 $           29.00 FRDM-K64F | mbed Servo Arm Double Servo Arm X-Long 1 $             3.20 http://www.hobbyking.com/hobbyking/store/__19468__CNC_Alloy_Double_Servo_Arm_X_Long_Futaba_.html Servo Arm Heavy Duty Alloy Arm 1 $             5.63 http://www.hobbyking.com/hobbyking/store/__18350__Heavy_Duty_Alloy_1in_Servo_Arm_Futaba_Red_.html Servo Linkage Alloy Pushrod with Ball-Link 65mm 1 $             2.10 http://www.hobbyking.com/hobbyking/store/__25834__Alloy_Pushrod_with_Ball_Link_65mm.html Lazy Susan Shepherd 6 in. Lazy-Susan Turntable 1 $             4.49 http://www.homedepot.com/p/Shepherd-6-in-Lazy-Susan-Turntable-9548/100180572#.UYk5UqLql8E Metal Rod 3/8 in. x 36 in. Zinc Threaded Rod 1 $             2.87 http://www.homedepot.com/p/3-8-in-x-36-in-Zinc-Threaded-Rod-17340/202183465#.UYk5pqLql8E Frame 1/2 MDF 2ftx4ft 1 $           10.45 http://www.homedepot.com/p/1-2-in-x-2-ft-x-4-ft-Medium-Density-Fiberboard-Handy-Panel-1508108/202089097?N=btn1#.UYk6CqLql8E   The build   Two main pieces to construct in this phase.  The base turret and the actual hacking of the Nerf gun.   All your base.. The base of the turret is pretty rudimentary, lot's of room for improvement here.  I used 1/2 MDF and some carpentry skills.  Here is some instruction on how to build a MDF box.  Atop the box is a lazy Susan (ball bearing ring) so that the top-plate can rotate smoothly.  We considered leaving this element out, but worried that it would put to much strain on the servo.   On the subject of servos, a few tidbits of wisdom for you as you build this thing.  First, the left/right servo needs to be dead center of the lazy susan, if your off too much things will start to bind which is not good for your servo.  Second, I used large higher torque servos which cost a bit more, they might be overkill, but it certainly performs well.   I did a quick dimensionally accurate rendering of the design in Sketchup. Files are here.   Hacking the Nerf   Now for the fun stuff.   There is no shortage of screws with this Nerf Gun.  So get out your Phillips screwdriver and go to town. There are two electrical systems in the Nerf that we are going to tap into.  One is the power switch and the other is the electrical trigger. This is the electrical trigger.  The trigger goes to our relay, which is either on or off.  We did try at first to use a 7.2V R/C car battery, but the Nerf draws too much power and didn't fire.  Going up to a 11.1V LiPo fixed that right up. This is the power switch. In Nerfinator 1.0 everything was hardwired together, which prevented us from completely pulling the Nerf from the base and made repairs difficult to say the least.  Nerfinator 2.0 we put this handy connector which allowed us to completely and easily remove the Nerf from the base.  Shipping this thing around the country will take a toll on it!  On that subject, Nerf 1.0, stopped cycling to the next position for us at the Austin Mini Maker Faire.  After a through inspection of the operational mechanics inside the Nerf (really cool BTW) it was a little bitty spring that was causing the piston not to fully retract.  We replaced the spring with 1/2 a ballpoint pin spring and to our surprise it all worked again. Electrical Connection Diagram   Added High-Level Block Diagram.  Need to add pinouts.  You'll have to read the code for now to figure it out.     Code   Mbed was the programming tool of choice for this build.   Receive Side (RX) - The receiver is the base side.  This one takes input from the remote and controls the servo movement. NerfGun_nRF24L01P_RX - a mercurial repository | mbed Transmit Side (TX) - The transmitter is the remote side.  This one senses the users movement (accelerometer) and sends that data to the base station. NerfGun_nRF24L01P_TX - a mercurial repository | mbed   Finishing Touches   In the first passes of this build we just used a bare development board as the remote control.  We found that when given the remote they would not orientate it properly, so 3D Printed Controller STL files   Development Team John McLellan - Amplification/Motivation Clark Jarvis - Software/Hardware Iain Galloway and Angus Galloway - Design and print of controller FRDM_case_sunday_PART_REV_001.STL.zip
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NFC-enabled Audio System Tap-to-pair has become a common habit when connecting an NFC-enabled smartphone conveniently to a wireless speaker. Bringing this experience to the next level, even a multi-speaker audio system can be set up with NFC. If all speakers are equipped with an NFC chip, you simply tap one speaker to another to establish the connection. That’s what we call a true wireless stereo system - and it works with any phone, no matter if it is NFC-enabled. The same can be done with NFC-headsets. Features: Tap-to-pair to connect an NFC-enabled smartphone conveniently to a wireless speaker or headphone Easy integration into any OS environment ___________________________________________________________________________________________________________________________ Featured NXP Products: PN7210|NXP http://www.nxp.com/products/:PN7120A0EV NFC multi-speaker and headset audio system Speaker Version Tap-to-pair has become a common habit when connecting an NFC-enabled smartphone conveniently to a wireless speaker. Bringing this experience to the next level, even a multi-speaker audio system can be set up with NFC. If all speakers are equipped with an NFC chip, you simply tap one speaker to another to establish the connection. That’s what we call a true wireless stereo system - and it works with any phone, no matter if it is NFC-enabled. Headset version Same use case can be shown with NFC headset, with smartphone being connected to the first headset by simply tapping to the smartphone, and then tap the 2 headset together to share the audio content to the second headset. Features: Speaker Version Traditional push button pairing NFC pairing Action for pairing Push sync button as long as requested in the user manual Touch the 2 speakers together Connection time for bluetooth pairing Usually at least 10 to 30 sec 1 second Connection repeatability Varied from environment Sometimes fails Always repeatable Usual issues Can connect to wrong bluetooth device if there are multiple ones nearby No error possibility Scalability Adding a 3rd speaker or more requires again same manual action As easy as before Unpairing Must follow carefully the user manual, risk is that speaker can stay connected or wrong one be disconnected Touch the 2 speakers together Headset version Share immediately your music with your friend, or neighbour in public transportation, by simply tapping both headset No need to connect your friend or neighbour’s phone to your phone, simply tap both headset Disconnect/unpaired by tapping again both headset
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The Attach demo consists of a 3 board stack up using the Arduino connectors on the Kinetis FRDM-KL26Z board. The demo runs from a Li Ion polymer battery and consists of 1x FRDM-KL26Z board, 1x FRDM-BATT board (including battery and loudspeaker) and 1x Arduino LCD touch screen board. The code builds using either CodeWarrior V10.6 or IAR EWARM V7.20.2. The software uses eGUI to drive the Arduino LCD and runs demos for the following Sensors - FXOS8700 (combined 3-axis Accelerometer and Magnetometer) and FXAS21000 (3-axis MEMs Gyro). The demo also includes 7-element eCompass code for which full source code is available. Finally, the board also uses the MC34673 1.2A charger for Li Ion batteries, charging is accomplished via either of the USB ports on the FRDM-KL26Z. All datasheets, schematics, source code and bill of materials are included in the zip archive. NOTE: software update which now includes 10-element eCompass software and Kalman filtering code creating a far more accurate eCompass solution. Recommended Products Product Link Freedom Development Platform for Kinetis® KL16 and KL26 MCUs (up to 128 KB Flash) FRDM-KL26Z|Freedom Development Platform|Kinetis® MCU | NXP 
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Demo This demo showcases a bluetooth headset using NXP’s Near Field Magnetic Induction device NxH2280, enabling truly wireless streaming of voice, audio and data. The demo is built using the NxH2280 Application Development Kit for hearables Features: very power efficient audio and data streaming from ear-to-ear: HQ audio < 2.5 mW works through human body with ultra-low absorption: SAR is 100 times lower than Bluetooth ensures reliable and private communication _______________________________________________________________________________________________________ Featured NXP Products: NxH2280: Near Field Magnetic Induction radio|NXP LPC1102: low power, space efficient microcontroller|NXP NT3H1101: Energy harvesting NFC Forum Type 2 Tag for bluetooth simple pairing|NXP _______________________________________________________________________________________________________ Picture of demo: implemented using headphone shells Picture of NxH2280 ADK C11
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Overview This thermostat reference design is an example of how a thermostat can be built taking advantage of the features of the NXP® MC9S08LL MCU, which has a very flexible LCD module that allows driving an 8x24 LCD and power saving modes while keeping track of the time and the LCD information and a 12-bit analog to digital converter. Features Low-power battery (2 AA) operation Small Glass (2-4 uA) Large Glass (7-9 uA) Support for two LCD displays 8x24 mode for greater flexibility 2x26 mode optimized for lowest power Standard HVAC connectivity Temperature sensors Programmable heat/cool temp Block Diagram Board Design Resources
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Demonstrating the Low voltage level driver motor product line.       Features Features FRDM-KL25Z MCU and FRDM-17510-EVB motor driver Battery-ready KL25Z ARM® Cortex™-M0+ processor MPC17510 motor driver 2.0 V to 15 V / 3.8 A peak operation   Featured NXP Products KL2x |Kinetis KL2x USB MCUs|NXP Engine and DC Motor Control|NXP     Tools   Product Link Freedom Development Platform for Kinetis® KL14, KL15, KL24, KL25 MCUs FRDM-KL25Z|Freedom Development Platform|Kinetis® MCU | NXP  MPC17510: H-Bridge, Brushed DC Motor Driver, 2-15V, 3.8A, 200kHz H-Bridge DC Motor Driver 2-15V 3.8A 200kHz | NXP  Freedom Expansion Board - MPC17510, H-Bridge, Brushed DC Motor Driver, 2.0V-15.0V, 1.2A https://www.element14.com/community/docs/DOC-75609/l/freedom-expansion-board--mpc17510-h-bridge-brushed-dc-motor-driver-…  NXP Stepper Motor/Dual DC Motor Shield NXP Stepper Motor/Dual DC Motor Shield | Mbed  KL25Z-MPC17510_candy_dispenser KL25Z-MPC17510_candy_dispenser - This is code used for the stand-alone FSL candy... | Mbed  FRDM-KL25Z FRDM-KL25Z | Mbed  Training Hands-On: Drive a Stepper Motor Using NXP's Motor Drivers and Kinetis Development Tools https://community.freescale.com/servlet/JiveServlet/previewBody/106138-102-1-27793/ftf-ind-f1303.pdf   Related Stepper Motor/Dual DC Motor Shield  | mbed
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