Dr. Todd Hubing of Clemson University shares his vast expertise regarding the impact of transmission line design on EMC performance of electronic control systems. In automotive systems, the wiring harnesses play a key role in coupling electronic noise to and from the components. Shielding and filtering the wiring harness and connector generally are not viable options, so it is important to address cable coupling issues with proper board-level design practices. This session will cover various cable-coupling mechanisms and grounding strategies. It also will include the options available at the board level for ensuring automotive components don't put excessive noise on the harness and that noise on the harness doesn't affect the proper operation of the component circuitry.

Introduce how to rapidly enable the Android OS based platform development including BSP source code downloading, development environment setup, how to build and burn an image for your own board, how to get support in an efficient way. 

This session will cover some simple definitions of ESD and EOS while explaining the important differences in the energy involved and the resulting damage. The session will also review PCB design techniques for improving system robustness.

This session provides an introduction to the new QorIQ LS1 family, the first family of devices in the QorIQ LS series based on dual ARM® Cortex®-A7 cores. You will receive an overview of the LS1 processors--advantages, differentiators and capabilities for networking and industrial applications. Presented by: You Peng

As technology becomes more closely integrated into all aspects of human life, the microcontroller is essential to delivering the human-to-machine interface, or HMI. Kinetis MCUs based on ARM® Cortex®-M cores integrate a number of HMI capabilities. This session will detail the input and output capabilities of Kinetis MCUs spanning from simple push buttons to advanced displays. You will receive an overview of how to meet the HMI requirements for your next embedded design.

Functional Safety is one of the key technical trends of automotive application. The developer may encounter great challenges without IC suppliers’ strong support on functional safety ready products and relevant enablement and knowledge. Freescale SafeAssure program will greatly relief designers’ difficulties on ECU development targeting compliance with ISO26262. Details on using functional safety manual and dynamic FMEDA to design safety ECU are discussed in this session.

Based on the FRDM-K22F board and a versatile new Arduino-compatible Shield, this course discusses how to implement: Internet of Things applications using Kinetis K2 and pre-certified Wi-Fi (TiWi-C-W) and BLE (SaBLE-x) wireless modules from LS Research. Streaming to the Cloud using TiWiConnect LIFT software protocol (dramatically simplified software development). Sensor and I/O expansion using 3rd-party Pmod-compatible (I2C and SPI) boards interfaced to Freescale Freedom boards. Fast time-to-market for your IoT product using accelerated software development and pre-certified wireless modules.

Connected and smart devices have been part of many visions for the last decade, but we are closer to the tipping point now than ever before. Part of this tipping point is related to enabling the explosion in the wearables market. In this session, we will define the wearables market, identify the key challenges and needs related to this market and discuss technologies that will spur innovation and growth. We'll walk through the new Wearables Reference Platform (WaRP) board which incorporates a hybrid architecture with an i.MX application processor and a Kinetis MCU to provide flexibility and scalability. WaRP also incorporates sensor and wireless technologies from Freescale for further capabilities. WaRP board is a collaboration between Freescale and development partners to enable you to take the concept beyond the marketing buzz to an end product. Presented by Robert Thompson Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-HCW-T1031

Kinetis Driver Libraries are foundations for all higher level software for Kinetis MCUs, making it even easier to develop MCU applications. This lecture and demo session will dive into the internals of the libraries exploring board configurations, clock management, the hardware abstraction layer, peripheral driver usage, the USB stack, RTOS integration and more. Presented by Li Sen and Chen Xinyu Presented at DwF Kinetis MCUs Based on ARM® Technology - Tianjin - 19 March 2015 Session ID: APF-DES-T1016

The material presented will focus on the basic principles and physics of electromagnetic energy.  It will be presented in easy to understand language with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help to design PCBs that will be more robust and have better electromagnetic compatibality performance. This is not rocket science, but an easy to understand application of PCB geometry.

Automotive integrated circuits are requiring high temperature and high voltage application environments. High temperature and high voltage impose severe constraints on the design of IC interconnect and the materials used in the assembly and packaging processes. The use of fine gauge copper wire bonding has been growing very rapidly in consumer, portable, and industrial electronics. Freescale has made significant inroads in introducing and accelerating the adoption of fine gauge copper wire in the high reliability automotive space. The molding compounds were studied and reformulated to accommodate high voltage up to 65V. This presentation will discuss key learnings in copper wire bonding process and molding compound formulation development, and present an exciting update on Freescale strategy on gold to copper wire conversion.

Use Kinetis software development kit (KSDK) to enable 802.15.4 connectivity for multiple MCU platforms. This training will describe key features of MCR20A stand-alone transceiver, and hands-on training KSDK and 802.15.4 software stack to migrate connectivity applications across Kinetis MCUs. After joining this session, the attendee will be able to add 2.4GHz connectivity to their design using multiple Kinetis platforms like FRDM-K64F, FRDM-KL43 and FRDM-KL46.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

Freescale is making automotive development easy with Kinetis MCUs. Kinetis EA series MCUs for automotive allow fast time to market with simple tools, an extensive development environment and automotive grade qualification across -40 to 125 °C temperature ranges. Freescale Automotive portfolio overview (S32, S12, MagniV, Kinetis EA) and ecosystem.

During this session you will learn about the principal requirements of key classes of sensor applications, Freescale’s sensor portfolio and learn to help solve problems with Freescale sensors.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

This session will provide an introduction to the Freescale MQX™ RTOS. 

Performance requirements increase in order to process the massive amount of data coming from image and radar sensors, because when we ask electronic systems to take the place of the driver in a potential crash situation, the car BETTER BE safe, secure, reliable and dependable. Freescale ADAS solutions are designed from the outset to be ROBUST, EFFICIENT, and FLEXIBLE. The S32V234, is the first automotive vision SoC with the requisite reliability, safety and security measures to automate and co-pilot a self-aware car. Leveraging a host of automotive-grade technologies, the S32V takes the industry toward an era where cars can capture data, process it and actually share control with drivers in critical situations. This capability establishes the essential bridge from the current “assist” era toward the fully autonomous vehicles of tomorrow.

Presented by Istone Presented at DwF Digital Networking Shenzhen - January 28, 2015